TWM615245U - Memory with ceramic heat sink - Google Patents

Abstract

A memory body with a ceramic heat sink, comprising: a memory body, including a circuit board and a plurality of chips; a thermal conductive sheet, having a heating surface and a heating surface, the thermal conductive sheet is heated in a monolithic manner All of the exposed surfaces of all the chips attached to one side of the circuit board; and a ceramic heat sink, which is attached in a single piece to all of the heat-emitting surface of the thermal conductive sheet on the one side of the circuit board. The ceramic heat dissipation The area of the sheet covering the circuit board is not less than the area of the thermal conductive sheet covering the circuit board, so that the memory with ceramic heat sink of the invention has a thinner thickness while maintaining the heat dissipation effect.

Description

Memory body with ceramic heat sink

This creation is related to a main memory, especially a memory with a ceramic heat sink.

A plurality of electronic devices in a computer device, such as CPU, random access memory (DRAM, also known as main memory), storage device, display card, etc., are all set in the casing. Among them, heat dissipation for the main memory is extremely important. Once the main memory has a thermal crash, it will cause data errors and make the computer device unable to operate stably. If the main memory does not have a heat dissipation module to help extract heat, unless the environment is naturally air-cooled (the air flows naturally to take away the heat) or the effect of forced air cooling (the fan in the case is forced to blow away the heat) is strong enough. Otherwise, under strong conditions where the environment cannot be effectively and quickly dissipated, it will cause the multiple electronic parts on the main memory to accumulate heat for a long time, causing the electronic parts to age, even damage and cause the risk of system crashes .

At present, the radiator used in the consumer market is still aluminum radiator as a bulk solution. However, in recent years, the application of green environmental protection materials and the rapid development of science and technology have been promoted. 3C products continue to be designed with low profile and light weight.

Therefore, the purpose of this creation is to provide a memory with a ceramic heat sink that has a thinner thickness while maintaining the heat dissipation effect.

The technical means used in this creation to solve the problems of the conventional technology is to provide a memory with a ceramic heat sink, including: a memory body, including a circuit board and a plurality of chips, the two opposite sides of each chip are respectively Is a set surface and an exposed surface, each of the chips is set on the circuit board by the set surface; a thermal conductive sheet, the two opposite surfaces of the thermal conductive sheet are respectively a heating surface and a heating surface, wherein the heat conduction The heat-receiving surface of the thermal conductive sheet is attached to all the exposed surfaces of all the chips on one side of the circuit board in a single-piece manner, and the heat generated by a plurality of the chips is transferred to the exposed surface through the exposed surface The heat-receiving surface of the heat-conducting sheet continues to be transferred to the heat-out surface; and a ceramic heat sink, which is a piece of ceramic material, is attached to all of the heat-out surface of the heat-conducting sheet in a single piece, and the ceramic heat sinks The area of the sheet covering the circuit board is not less than the area of the thermal conductive sheet covering the circuit board.

In an embodiment of the present invention, a memory with ceramic heat sinks is provided. A plurality of the chips are arranged on two opposite sides of the circuit board, and there are two heat conducting fins and two ceramic heat sinks respectively. The heat-conducting fins are respectively attached to a plurality of the chips on the two side surfaces, and the two ceramic heat-dissipating fins are respectively attached to the two heat-conducting fins.

In an embodiment of the present invention, a memory with ceramic heat sink is provided, and the thickness of the ceramic heat sink is not greater than 3 mm.

In an embodiment of the present invention, a memory body with a ceramic heat sink is provided, and the ceramic heat sink is a silicon carbide ceramic heat sink.

In an embodiment of the present invention, a memory with ceramic heat sink is provided, and the range of the ceramic heat sink covering the circuit board does not exceed the circuit board.

In an embodiment of the present invention, a memory body with a ceramic heat sink is provided, and the thermal conductive sheet is made of silicone material.

The technical means used in the memory with ceramic heat sinks created by this invention utilizes the heat dissipation characteristics of ceramics that are superior to copper and aluminum in the same unit volume, and the heat dissipation effect can be achieved with the structure of the sheet. Therefore, the memory body with ceramic heat sinks of this invention occupies a smaller volume than the memory body with traditional aluminum heat sink fins, and is more suitable for the confined space in the case. In addition, the reduction in volume increases the distance between itself and the surrounding electronic components, which in turn makes it easier for air to circulate, and has a better heat dissipation effect. And because multiple chips use a common thermal fin and ceramic heat sink to dissipate heat, the heat dissipation effect of the multiple chips is more even.

The following describes the implementation of this creation based on Figures 1 to 3. This description is not intended to limit the implementation of this creation, but is a kind of embodiment of this creation.

As shown in FIGS. 1 and 2, a memory 100 with ceramic heat sinks according to the first embodiment of the present invention includes: a memory body 1, a thermal conductive sheet 2 and a ceramic heat sink 3.

The memory body 1 includes a circuit board 11 and a plurality of chips 12. The two opposite surfaces of each chip 12 are a setting surface 121 and an exposed surface 122 respectively. Each chip 12 is disposed on the circuit board 11 by the setting surface 121.

The connection interface 13 of the memory body 1 is a golden finger, which is connected to the computing device when the memory body 100 with ceramic heat sinks of the present invention is inserted into the corresponding connection part of the computing device.

The two opposite surfaces of the thermal conductive sheet 2 are respectively a heating surface 21 and a heating surface 22. The thermal conductive sheet 2 is attached to all of the circuit board 11 by the heating surface 21 of the thermal conductive sheet 2 in a single piece. The entire surface 122 of the wafer 12 is exposed. The heat generated by the plurality of wafers 12 is transferred to the heating surface 21 of the thermal conductive sheet 2 through the exposed surface 122 and is further transferred to the heating surface 22.

The ceramic heat sink 3 is a piece of ceramic material. The ceramic heat sink 3 is attached to the entire area of the heat output surface 22 of the thermal conductive sheet 2 on one side of the circuit board 11 in a single piece, and the area of the ceramic heat sink 3 covering the circuit board 11 is not less than that of the thermal conductive sheet 2 covering The area of the circuit board 11 is used to diffuse a small area of heat to a large area of the ceramic heat sink 3 to achieve a heat dissipation effect.

In this embodiment, the chip 12 is disposed on two opposite sides of the circuit board 11. Wherein, the entire range of the exposed surfaces 122 of all the chips 12 on one side of the circuit board 11 is attached by the thermally conductive sheet 2 so that the chip 12 and the thermally conductive sheet 2 have the largest contact area and have the best thermal conductivity.

In this embodiment, the thermal conductive sheet 2 is a single one. The heat receiving surface 21 of the thermal conductive sheet 2 is attached to all the chips on the same side of the circuit board 11. As shown in FIG. 2, in this embodiment, the thermal conductive sheet 2 is attached to four wafers 12. The thermal conductive sheet 2 is made of silicon material, and the thermal conductivity of the thermal conductive sheet 2 is 3.5, so that the high thermal conductivity of the silicon material can quickly transfer the heat emitted by the chip 12 attached to the heating surface 21. Furthermore, the thermal conductive sheet 2 is a soft material, and when the height of the plurality of wafers 12 is different, the thermal conductive sheet 2 can still be attached to the multiple wafers 12. In addition, the heat-conducting sheet 2 is made of an insulating material, so as to avoid interference caused by the current of the multiple chips 12 passing through the heat-conducting sheet 2.

In this embodiment, the ceramic heat sink 3 is a single one, which is attached to the entire range of the heat output surface 22 of the thermal conductive sheet 2, so that the thermal conductive sheet 2 and the ceramic heat sink 3 have the largest contact area and have the best The heat conduction efficiency. The ceramic heat sink 3 is a porous silicon carbide (SiC) ceramic heat sink with good thermal conductivity and heat dissipation performance, and silicon carbide is an electromagnetic wave absorbing material, so that the silicon carbide ceramic heat sink can absorb incident electromagnetic waves through absorption or interference mechanisms. Reduce its reflection, scattering and transmission, and have the effect of anti-electromagnetic interference (EMI). Furthermore, the ceramic heat sink 3 has characteristics including low thickness, insulation, and the like. The heat dissipation characteristics of the ceramic heat sink 3 are better than copper and aluminum under the same unit volume, and the heat dissipation effect can be achieved with the structure of the sheet body. In addition, in the confined space in the casing, the reduction in volume increases the distance between itself and the surrounding electronic components, which in turn makes it easier for air to circulate, and has a better heat dissipation effect. In addition, since the plurality of chips 12 use a common thermal conductive sheet 2 and a ceramic heat sink 3 to dissipate heat, the heat dissipation effect of the plurality of chips 12 is relatively even.

As shown in Figure 1, according to the memory 100 with ceramic heat sinks according to the first embodiment of the invention, the range of the ceramic heat sink 3 covering the circuit board 11 does not exceed the boundary of the circuit board 11, so as not to affect the ceramic heat sink. The installation of the memory 100 of the heat sink interferes with the surrounding electronic components.

According to the memory 100 with ceramic heat sink according to the first embodiment of the invention, the thickness of the ceramic heat sink is not more than 3 mm to ensure that there is enough space between the memory 100 with ceramic heat sink and the surrounding electronic components , For the air to circulate smoothly. Preferably, the total thickness of the thermal conductive sheet 2 and the ceramic heat sink 3 is not greater than 3 mm.

As shown in Fig. 3, the memory body 100a with ceramic heat sinks according to the second embodiment of the present creation has roughly the same structure as the memory body 100 with ceramic heat sinks of the first embodiment, except for the thermal conductive sheet 2 There are two ceramic heat sinks 3 respectively. One of the heat conducting sheets 2 is attached to all the chips 12 on one side of the circuit board 11, and the other heat conducting sheet 2 is attached to all the chips 12 on the other side of the circuit board 11. The two ceramic heat sinks 3 are attached to the two heat conducting fins 2 respectively to dissipate heat of all the chips 12 on the two sides of the circuit board 11.

The above descriptions and descriptions are only descriptions of the preferred embodiments of this creation. Those with ordinary knowledge of this technology should make other modifications based on the scope of patent application defined below and the above descriptions, but these modifications should still be made. It is the creative spirit of this creation and within the scope of the rights of this creation.

100: Memory with ceramic heat sink 100a: Memory with ceramic heat sink 1: Memory body 11: circuit board 12: chip 13: Connection interface 2: Thermal conductive sheet 21: heated surface 22: Hot noodles 3: Ceramic heat sink

[Figure 1] is a schematic top view showing a memory body with ceramic heat sinks according to the first embodiment of the invention; [Figure 2] is a schematic side view showing a memory body with ceramic heat sinks according to the first embodiment of the invention; [Figure 3] is a schematic side view showing the memory body with ceramic heat sinks according to the second embodiment of the present invention.

100: Memory with ceramic heat sink

1: Memory body

11: circuit board

12: chip

3: Ceramic heat sink

Claims (6)

A memory body with ceramic heat sink, including: A memory body including a circuit board and a plurality of chips, the two opposite surfaces of each chip are a setting surface and an exposed surface respectively, and each chip is disposed on the circuit board by the setting surface; A thermally conductive sheet, the two opposite surfaces of the thermally conductive sheet are respectively a heating surface and a heating surface, wherein the thermally conductive sheet is attached to one side of the circuit board by the heated surface of the thermally conductive sheet in a monolithic manner All of the exposed surfaces of all the wafers, the heat generated by a plurality of the wafers is transferred to the heating surface of the thermally conductive sheet through the exposed surface and continues to the heating surface; and A ceramic heat sink, which is a piece of ceramic material, is attached in a single piece to all of the heat-emitting surface of the thermally conductive sheet on one of the sides of the circuit board, and the ceramic heat sink covers the circuit board The area of is not less than the area of the thermal conductive sheet covering the circuit board. For example, the memory with ceramic heat sink of claim 1, wherein a plurality of the chips are arranged on two opposite sides of the circuit board, and there are two heat conducting fins and two ceramic heat sinks respectively, and the two heat conducting fins are attached respectively A plurality of the chips on the two side surfaces, and two of the ceramic heat sinks are attached to the two heat-conducting fins respectively. For example, the memory with ceramic heat sink of claim 1, wherein the thickness of the ceramic heat sink is not more than 3 mm. For example, the memory with ceramic heat sink of claim 1, wherein the ceramic heat sink is a silicon carbide ceramic heat sink. For example, the memory with ceramic heat sink of claim 1, wherein the range of the ceramic heat sink covering the circuit board does not exceed the boundary of the circuit board. For example, the memory with ceramic heat sink of claim 1, wherein the thermal conductive sheet is made of silicone material.

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