TWM615245U - Memory with ceramic heat sink - Google Patents
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- TWM615245U TWM615245U TW110204578U TW110204578U TWM615245U TW M615245 U TWM615245 U TW M615245U TW 110204578 U TW110204578 U TW 110204578U TW 110204578 U TW110204578 U TW 110204578U TW M615245 U TWM615245 U TW M615245U
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Abstract
一種具有陶瓷散熱片的記憶體,包含:一記憶體本體,包括一電路板及複數個晶片;一導熱片,具有一受熱面以及一出熱面,導熱片以單片的方式而藉由受熱面貼附於電路板其中一面的所有晶片之外露面的全部;以及一陶瓷散熱片,以單片的方式貼附於電路板的所述其中一面的導熱片之出熱面的全部,陶瓷散熱片的覆蓋於電路板的面積不小於導熱片覆蓋於電路板的面積,使得本創作之具有陶瓷散熱片的記憶體在維持散熱效果的情況下具有較薄的厚度。A memory body with a ceramic heat sink, comprising: a memory body, including a circuit board and a plurality of chips; a thermal conductive sheet, having a heating surface and a heating surface, the thermal conductive sheet is heated in a monolithic manner All of the exposed surfaces of all the chips attached to one side of the circuit board; and a ceramic heat sink, which is attached in a single piece to all of the heat-emitting surface of the thermal conductive sheet on the one side of the circuit board. The ceramic heat dissipation The area of the sheet covering the circuit board is not less than the area of the thermal conductive sheet covering the circuit board, so that the memory with ceramic heat sink of the invention has a thinner thickness while maintaining the heat dissipation effect.
Description
本創作相關於一種主記憶體,特別是相關於一種具有陶瓷散熱片的記憶體。This creation is related to a main memory, especially a memory with a ceramic heat sink.
在計算機裝置中的複數電子裝置,例如CPU、隨機存取記憶體 (DRAM,又稱主記憶體)、儲存裝置、顯示卡等皆是設置於機殼中。其中,用於主記憶體的散熱極為重要。因主記憶體一旦發生熱當機的問題,將會導致資料發生錯誤進而使計算機裝置無法穩定運作。若主記憶體無散熱模組協助導出熱能,除非所處的環境自然空冷(空氣自然流動來帶走熱能)或是強制空冷(機殼內風扇強制吹動帶走熱能)的效果夠強,要不然在所處的環境不佳而無法有效及快速散熱的強況下,將會使主記憶體上的複數電子零件長時間累積熱能,造成電子零件老化,甚至有損壞及造成系統當機的風險。A plurality of electronic devices in a computer device, such as CPU, random access memory (DRAM, also known as main memory), storage device, display card, etc., are all set in the casing. Among them, heat dissipation for the main memory is extremely important. Once the main memory has a thermal crash, it will cause data errors and make the computer device unable to operate stably. If the main memory does not have a heat dissipation module to help extract heat, unless the environment is naturally air-cooled (the air flows naturally to take away the heat) or the effect of forced air cooling (the fan in the case is forced to blow away the heat) is strong enough. Otherwise, under strong conditions where the environment cannot be effectively and quickly dissipated, it will cause the multiple electronic parts on the main memory to accumulate heat for a long time, causing the electronic parts to age, even damage and cause the risk of system crashes .
目前消費市場所使用的散熱器仍屬鋁製散熱器為大宗做為解決方案。但近年來提倡綠色環保材料應用與科技日新月異下,3C產品不斷以低薄、輕量化為設計主軸,散熱器也必須發展至此階段也需配合產品的微薄化與輕巧化。At present, the radiator used in the consumer market is still aluminum radiator as a bulk solution. However, in recent years, the application of green environmental protection materials and the rapid development of science and technology have been promoted. 3C products continue to be designed with low profile and light weight.
因此,本創作的目的即在提供一種具有陶瓷散熱片的記憶體,在維持散熱效果的情況下具有較薄的厚度。Therefore, the purpose of this creation is to provide a memory with a ceramic heat sink that has a thinner thickness while maintaining the heat dissipation effect.
本創作為解決習知技術之問題所採用之技術手段係提供一種具有陶瓷散熱片的記憶體,包含:一記憶體本體,包括一電路板及複數個晶片,各個該晶片的兩相反面係分別為一設置面及一外露面,各個該晶片藉由該設置面而設置於該電路板;一導熱片,該導熱片的兩相反面係分別為一受熱面及一出熱面,其中該導熱片以單片的方式而藉由該導熱片的該受熱面貼附於該電路板其中一面的所有該晶片之該外露面的全部,複數個該晶片所產生的熱經由該外露面而傳送至該導熱片的受熱面並繼續傳送至該出熱面;以及一陶瓷散熱片,為陶瓷材料的片體,以單片的方式貼附於該導熱片之該出熱面的全部,該陶瓷散熱片的覆蓋於該電路板的面積不小於該導熱片覆蓋於該電路板的面積。The technical means used in this creation to solve the problems of the conventional technology is to provide a memory with a ceramic heat sink, including: a memory body, including a circuit board and a plurality of chips, the two opposite sides of each chip are respectively Is a set surface and an exposed surface, each of the chips is set on the circuit board by the set surface; a thermal conductive sheet, the two opposite surfaces of the thermal conductive sheet are respectively a heating surface and a heating surface, wherein the heat conduction The heat-receiving surface of the thermal conductive sheet is attached to all the exposed surfaces of all the chips on one side of the circuit board in a single-piece manner, and the heat generated by a plurality of the chips is transferred to the exposed surface through the exposed surface The heat-receiving surface of the heat-conducting sheet continues to be transferred to the heat-out surface; and a ceramic heat sink, which is a piece of ceramic material, is attached to all of the heat-out surface of the heat-conducting sheet in a single piece, and the ceramic heat sinks The area of the sheet covering the circuit board is not less than the area of the thermal conductive sheet covering the circuit board.
在本創作的一實施例中係提供一種具有陶瓷散熱片的記憶體,複數個該晶片設置於該電路板的相對二側面,且該導熱片與該陶瓷散熱片分別有二個,二個該導熱片分別貼附於該二側面的複數個該晶片,二個該陶瓷散熱片分別貼附於該二個該導熱片。In an embodiment of the present invention, a memory with ceramic heat sinks is provided. A plurality of the chips are arranged on two opposite sides of the circuit board, and there are two heat conducting fins and two ceramic heat sinks respectively. The heat-conducting fins are respectively attached to a plurality of the chips on the two side surfaces, and the two ceramic heat-dissipating fins are respectively attached to the two heat-conducting fins.
在本創作的一實施例中係提供一種具有陶瓷散熱片的記憶體,該陶瓷散熱片的厚度不大於3mm。In an embodiment of the present invention, a memory with ceramic heat sink is provided, and the thickness of the ceramic heat sink is not greater than 3 mm.
在本創作的一實施例中係提供一種具有陶瓷散熱片的記憶體,該陶瓷散熱片為碳化矽陶瓷散熱片。In an embodiment of the present invention, a memory body with a ceramic heat sink is provided, and the ceramic heat sink is a silicon carbide ceramic heat sink.
在本創作的一實施例中係提供一種具有陶瓷散熱片的記憶體,該陶瓷散熱片的覆蓋於該電路板的範圍為不超出該電路板。In an embodiment of the present invention, a memory with ceramic heat sink is provided, and the range of the ceramic heat sink covering the circuit board does not exceed the circuit board.
在本創作的一實施例中係提供一種具有陶瓷散熱片的記憶體,該導熱片為矽膠材料。In an embodiment of the present invention, a memory body with a ceramic heat sink is provided, and the thermal conductive sheet is made of silicone material.
經由本創作之具有陶瓷散熱片的記憶體所採用之技術手段,利用陶瓷在相同單位體積優於銅和鋁的散熱特性,以片體的結構即能達到散熱的效果。因此,本創作之具有陶瓷散熱片的記憶體相較於具有傳統鋁製散熱鰭片的記憶體佔據較小的體積,而更為適用於機殼內的受限空間。此外,體積的縮小使得自身與周遭電子元件的間距增加,進而使空氣更容易流通,而具有較佳的散熱效果。且因多個晶片是以共同的導熱片及陶瓷散熱片進行散熱,使得多個晶片的散熱效果較為平均。The technical means used in the memory with ceramic heat sinks created by this invention utilizes the heat dissipation characteristics of ceramics that are superior to copper and aluminum in the same unit volume, and the heat dissipation effect can be achieved with the structure of the sheet. Therefore, the memory body with ceramic heat sinks of this invention occupies a smaller volume than the memory body with traditional aluminum heat sink fins, and is more suitable for the confined space in the case. In addition, the reduction in volume increases the distance between itself and the surrounding electronic components, which in turn makes it easier for air to circulate, and has a better heat dissipation effect. And because multiple chips use a common thermal fin and ceramic heat sink to dissipate heat, the heat dissipation effect of the multiple chips is more even.
以下根據第1圖至第3圖,而說明本創作的實施方式。該說明並非為限制本創作的實施方式,而為本創作之實施例的一種。The following describes the implementation of this creation based on Figures 1 to 3. This description is not intended to limit the implementation of this creation, but is a kind of embodiment of this creation.
如第1圖及第2圖所示,依據本創作的第一實施例的一具有陶瓷散熱片的記憶體100,包含:一記憶體本體1、一導熱片2以及一陶瓷散熱片3。As shown in FIGS. 1 and 2, a
記憶體本體1包括一電路板11及複數個晶片12,各個晶片12的兩相反面係分別為一設置面121及一外露面122,各個晶片12藉由設置面121而設置於電路板11。The
記憶體本體1的連接介面13為金手指,是在本創作的具有陶瓷散熱片的記憶體100插入計算裝置的對應連接部時,而與計算裝置連接。The
導熱片2的兩相反面係分別為一受熱面21及一出熱面22,其中導熱片2以單片的方式而藉由導熱片2的受熱面21貼附於電路板11其中一面的所有晶片12之外露面122的全部。複數個晶片12所產生的熱經由外露面122而傳送至導熱片2的受熱面21並繼續傳送至出熱面22。The two opposite surfaces of the thermal
陶瓷散熱片3為陶瓷材料的片體。陶瓷散熱片3以單片的方式貼附於電路板11的其中一面的導熱片2之出熱面22的全部範圍,陶瓷散熱片3的覆蓋於電路板11的面積不小於導熱片2覆蓋於電路板11的面積,以將小範圍的熱擴散到大範圍的陶瓷散熱片3而達到散熱效果。The
在本實施例中,晶片12設置於電路板11的相對二側。其中,電路板11的一側的所有晶片12的外露面122的全部範圍受導熱片2貼附,以使晶片12與導熱片2之間具有最大的接觸面積而有最佳的導熱效率。In this embodiment, the
在本實施例中,導熱片2為單一個。導熱片2的受熱面21貼附於電路板11同一側的所有晶片。如第2圖所示,在本實施例中,導熱片2為貼附到四個晶片12。導熱片2為矽膠材料,導熱片2的導熱係數為3.5,以利用矽膠材料的高導熱係數將受熱面21貼附之晶片12所發出的熱迅速的傳出。再者,導熱片2為軟質的材料,在多個晶片12的高度有落差時,導熱片2仍能貼附到多個晶片12。此外,導熱片2為絕緣的材料,以避免多個晶片12的電流通過導熱片2而產生干擾。In this embodiment, the thermal
在本實施例中,陶瓷散熱片3為單一個,貼附於導熱片2的出熱面22的全部範圍,以使導熱片2與陶瓷散熱片3之間具有最大的接觸面積而有最佳的導熱效率。陶瓷散熱片3為多孔質的碳化矽(SiC)陶瓷散熱片,而具有良好的導熱及散熱性能,且碳化矽為電磁波吸收材料,使得碳化矽陶瓷散熱片能將入射電磁波利用吸收或干涉機制而降低其反射、散射與透射,而具有抗電磁干擾(EMI)的效果。再者,陶瓷散熱片3具有包括低厚度、絕緣等的特性。陶瓷散熱片3的散熱特性在相同單位體積下優於銅和鋁,以片體的結構即能達到散熱的效果。此外,於機殼內的受限空間中,體積的縮小使得自身與周遭電子元件的間距增加,進而使空氣更容易流通,而具有較佳的散熱效果。且因多個晶片12是以共同的導熱片2及陶瓷散熱片3進行散熱,使得多個晶片12的散熱效果較為平均。In this embodiment, the
如第1圖所示,依據本創作的第一實施例的具有陶瓷散熱片的記憶體100,陶瓷散熱片3的覆蓋於電路板11的範圍為不超出電路板11之邊界,以免影響具有陶瓷散熱片的記憶體100之裝設干涉到周遭的電子元件。As shown in Figure 1, according to the
依據本創作的第一實施例的具有陶瓷散熱片的記憶體100,陶瓷散熱片的厚度不大於3 mm,以確保具有陶瓷散熱片的記憶體100與周遭的電子元件之間留有足夠的空間,以供空氣順暢地流通。較佳地,導熱片2與陶瓷散熱片3的厚度之總和不大於3 mm。According to the
如第3圖所示,依據本創作的第二實施例的具有陶瓷散熱片的記憶體100a,其結構與第一實施例的具有陶瓷散熱片的記憶體100大致相同,差別在於:導熱片2與陶瓷散熱片3分別有二個。其中一個導熱片2貼附於電路板11的其中一側面上的所有晶片12,另一個導熱片2貼附於電路板11的另一側面上的所有晶片12。二個陶瓷散熱片3分別貼附於二個導熱片2,以對電路板11二側面的所有晶片12進行散熱。As shown in Fig. 3, the
以上之敘述以及說明僅為本創作之較佳實施例之說明,對於此項技術具有通常知識者當可依據以下所界定申請專利範圍以及上述之說明而作其他之修改,惟此些修改仍應是為本創作之創作精神而在本創作之權利範圍中。The above descriptions and descriptions are only descriptions of the preferred embodiments of this creation. Those with ordinary knowledge of this technology should make other modifications based on the scope of patent application defined below and the above descriptions, but these modifications should still be made. It is the creative spirit of this creation and within the scope of the rights of this creation.
100:具有陶瓷散熱片的記憶體
100a:具有陶瓷散熱片的記憶體
1:記憶體本體
11:電路板
12:晶片
13:連接介面
2:導熱片
21:受熱面
22:出熱面
3:陶瓷散熱片
100: Memory with
[第1圖]為顯示根據本創作的第一實施例的具有陶瓷散熱片的記憶體的俯視示意圖; [第2圖]為顯示根據本創作的第一實施例的具有陶瓷散熱片的記憶體的側視示意圖; [第3圖]為顯示根據本創作的第二實施例的具有陶瓷散熱片的記憶體的側視示意圖。 [Figure 1] is a schematic top view showing a memory body with ceramic heat sinks according to the first embodiment of the invention; [Figure 2] is a schematic side view showing a memory body with ceramic heat sinks according to the first embodiment of the invention; [Figure 3] is a schematic side view showing the memory body with ceramic heat sinks according to the second embodiment of the present invention.
100:具有陶瓷散熱片的記憶體 100: Memory with ceramic heat sink
1:記憶體本體 1: Memory body
11:電路板 11: circuit board
12:晶片 12: chip
3:陶瓷散熱片 3: Ceramic heat sink
Claims (6)
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TW110204578U TWM615245U (en) | 2021-04-23 | 2021-04-23 | Memory with ceramic heat sink |
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TW110204578U TWM615245U (en) | 2021-04-23 | 2021-04-23 | Memory with ceramic heat sink |
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TWM615245U true TWM615245U (en) | 2021-08-01 |
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