CN211210323U - Quick heat dissipation device of evaporator - Google Patents

Quick heat dissipation device of evaporator Download PDF

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Publication number
CN211210323U
CN211210323U CN201922482416.2U CN201922482416U CN211210323U CN 211210323 U CN211210323 U CN 211210323U CN 201922482416 U CN201922482416 U CN 201922482416U CN 211210323 U CN211210323 U CN 211210323U
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China
Prior art keywords
panel
wall
heat dissipating
wall panel
board surface
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CN201922482416.2U
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Chinese (zh)
Inventor
徐启峰
梁政仁
陈志玮
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Long Da Chang Co ltd
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Long Da Chang Co ltd
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Priority to CN201922482416.2U priority Critical patent/CN211210323U/en
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Abstract

A fast heat dissipation device of an evaporator comprises at least one heat dissipation element, wherein the heat dissipation element is formed by assembling an outer wall plate and an inner wall plate together: the interior of the external wall panel is provided with a half-open first evaporation area; the inner wall board is internally provided with a second evaporation area which is half open, and the inner wall board is concavely provided with a notch; the inner wall board is attached to one side of the outer wall board to assemble the heat dissipating element, the first evaporation area and the second evaporation area are communicated at the notch to form a gas concentration area, and the heat dissipating elements are arranged, combined or integrated into a heat dissipating module in the same direction and sealed inside a casing to serve as the heat dissipating structure of the evaporator.

Description

Quick heat dissipation device of evaporator
Technical Field
The utility model relates to a quick heat abstractor of evaporimeter for carry out liquid, gas conversion and reach the heat radiation structure of radiating effect with the water in inside.
Background
In recent years, the heat productivity of electronic components is rapidly increasing with the sophistication of semiconductor technology, and how to improve the heat dissipation capability of electronic components and maintain the normal operation of the components becomes a very important engineering subject.
In the prior art, a direct air cooling technology which is used in large quantity cannot meet the heat dissipation requirements of a plurality of electronic elements with high heat flux, besides the air cooling technology, the direct air cooling technology has the heat dissipation effect by utilizing liquid-gas conversion of water bodies, the technology provides two groups of soaking devices and two groups of communicated pipe bodies, one group of soaking devices are used for evaporating and taking away absorbed heat, the other group of soaking devices are used for condensing and cooling to return to a loop which outputs cooling water bodies for heat dissipation circulation, the pressure in the two groups of soaking devices is different, so that the water bodies can be automatically conveyed back and forth, most of the inside of the soaking devices are only simple fins or flow channel designs for the water bodies to circulate in the soaking devices, and the liquid-gas conversion benefit of the water bodies in the inside is limited.
Therefore, the design and improvement of the structure of the flow channel inside the evaporator increase more space for water evaporation and gas concentration, improve the liquid-gas conversion benefit, and improve the structure composition at the same time, so as to assemble the multi-piece parts, reduce the difficulty in manufacturing the part structure, and improve the convenience and production benefit of the assembly operation, thus being the solution of the rapid heat dissipation device of the evaporator.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a quick heat abstractor of evaporimeter, including an at least radiating element, this radiating element is assembled jointly by an outer wallboard and an interior wallboard and forms: the external wall panel is provided with a first panel surface, a second panel surface and a third panel surface respectively, wherein the second panel surface is positioned on one side edge of the first panel surface, the third panel surface is positioned on the other side edge of the first panel surface, and a preset included angle is formed between the second panel surface and the first panel surface and between the second panel surface and the third panel surface and the first panel surface respectively, so that a half-open first evaporation area is formed inside the external wall panel; the inner wallboard is provided with a fourth board surface, a fifth board surface and a sixth board surface, the fifth board surface is positioned on one side edge of the fourth board surface, the sixth board surface is positioned on the other side edge of the fourth board surface, and a preset included angle is formed between the fifth board surface and the sixth board surface and the fourth board surface respectively, so that a half-open second evaporation area is formed inside the inner wallboard, and a notch is concavely arranged in the middle position of the fifth board surface and the fourth board surface close to the inner side; the inner wall board is attached to one side of the outer wall board to assemble the heat dissipating element, the first evaporation area and the second evaporation area are communicated at the notch to form a gas concentration area, and the heat dissipating elements are arranged, combined or integrated into a heat dissipating module in the same direction and sealed inside a casing to serve as the heat dissipating structure of the evaporator.
In a preferred embodiment, the outer wall panel is formed by integrally molding or fixedly connecting the first panel, the second panel and the third panel, and the inner wall panel is formed by integrally molding or fixedly connecting the fourth panel, the fifth panel and the sixth panel.
In a preferred embodiment, the second panel has a recess at each of two ends thereof, and the notch allows the fifth panel and the fourth panel to form a protrusion at each of the two ends thereof, wherein the protrusions are disposed in the recesses to facilitate the inner wall board to be tightly attached to one side of the outer wall board.
In a preferred embodiment, the thickness of the outer wall panel is the same as the thickness of the inner wall panel.
In a preferred embodiment, the width of the evaporation zone of the first evaporation zone and the second evaporation zone is 1 to 5 times the thickness of the external wall panel.
In a preferred embodiment, the minimum height of the notch on the inner wall panel is 0.1-0.8 times of the total height of the outer wall panel.
In a preferred embodiment, a plurality of first protrusions and second protrusions are formed at the upper end of the inner wall plate at the position where the upper end of the gap is concavely formed, the first protrusions are formed by extending a predetermined length from the upper end of the inner wall plate to the side edge, the second protrusions are formed by extending a predetermined length from the upper end of the inner wall plate to the other side edge, and the first protrusions and the second protrusions are staggered with each other, so that the upper end of the inner wall plate forms a continuous bow shape.
Drawings
Fig. 1 is a three-dimensional exploded view of the heat dissipation module of the heat dissipation device of the present invention.
Fig. 2 is a schematic perspective exploded view of a heat dissipation element of the heat dissipation device of the present invention.
Fig. 3 is a schematic cross-sectional view of a heat dissipation element of the heat dissipation device of the present invention.
Fig. 4 is a schematic cross-sectional view of a heat dissipation module of the heat dissipation device of the present invention.
Fig. 5 is a perspective view of the heat dissipation module of the heat dissipation device of the present invention combined with a condenser.
Fig. 6 is a schematic diagram of a heat dissipation profile of a heat dissipation module of the heat dissipation device of the present invention.
Fig. 7 is a schematic view of a local section of a heat dissipation module of the heat dissipation device of the present invention.
Fig. 8 is a perspective view of a heat dissipation element according to a second embodiment of the heat dissipation device of the present invention.
Fig. 9 is a schematic plan view of a heat dissipation element according to a second embodiment of the heat dissipation device of the present invention.
Fig. 10 is a schematic partial sectional view illustrating a heat dissipation module according to a second embodiment of the heat dissipation device of the present invention.
Description of the reference numerals
1 Heat dissipation element
10 Heat sink
11 external wall panel
111 first plate surface
112 second plate surface
113 third panel
114 first evaporation zone
115 groove
12 inner wall board
121 fourth plate surface
122 fifth board surface
123 sixth plate surface
124 second evaporation zone
125 gap
126 convex part
127 first bump
128 second bump
13 gas concentration zone
2 outer cover
3 Heat source
4 heat radiation fin
5-way pipe
6 condenser
T1 external wall panel thickness
T2 inner wallboard thickness
Width of evaporation zone of T3
Total height of H1
H2 lowest height.
Detailed Description
Other technical matters, features and effects of the present invention will become apparent from the following detailed description of preferred embodiments, which proceeds with reference to the accompanying drawings.
Referring to fig. 1 to 4, a perspective view and a sectional view of an internal structure of a fast heat dissipation device of an evaporator according to the present invention are shown, and the fast heat dissipation device at least includes a heat dissipation element 1, wherein the heat dissipation element 1 is formed by assembling an outer wall panel 11 and an inner wall panel 12 together;
the external wall panel 11 is formed by integrally forming or fixedly connecting a first panel 111, a second panel 112 and a third panel 113, wherein the second panel 112 is located on one side of the first panel 111, the third panel 113 is located on the other side of the first panel 111, and the second panel 112 and the third panel 113 respectively form an included angle of 90 degrees (the included angle can be set to 60-120 degrees) with the first panel 111, so that a half-open first evaporation area 114 is formed inside the external wall panel 11, and a groove 115 is respectively concavely formed at two ends of the second panel 112 near the outside;
the inner wall panel 12 is formed by integrally forming or fixedly connecting a fourth panel surface 121, a fifth panel surface 122 and a sixth panel surface 123, the fifth panel surface 122 is located on one side edge of the fourth panel surface 121, the sixth panel surface 123 is located on the other side edge of the fourth panel surface 121, and the fifth panel surface 122 and the sixth panel surface 123 respectively form an included angle of 90 degrees (the included angle may be set to 60-120 °) with the fourth panel surface 121, so that a second evaporation area 124 with a half open type is formed inside the inner wall panel 12, a notch 125 is concavely formed in the middle position of the fifth panel surface 122 and the fourth panel surface 121 near the inner side, and the notch 125 respectively forms a convex portion 126 at two end positions of the fifth panel surface 122 and the fourth panel surface 121 near the outer side;
each protrusion 126 is disposed in each groove 115, so that the inner wall panel 12 can be attached to one side of the outer wall panel 11 to assemble the heat dissipation element 1, and the first evaporation area 114 and the second evaporation area 124 are communicated at the gap 125 to form a gas concentration area 13;
the heat dissipation elements 1 can be arranged, combined or integrated into a heat dissipation module 10 in a direction, and the heat dissipation module 10 is installed in a housing 2 and sealed to be used as a heat dissipation structure of an evaporator capable of being matched with a condenser.
Referring to fig. 5 to 7, in use, a predetermined amount of water in the heat dissipation module 10 is located in the first evaporation area 114 and the second evaporation area 124 respectively, the rear section of the bottom surface of the shell 2 can lock a heating source 3 (such as electronic products like CPU, etc.), the shell 2 can be provided with a heat dissipation fin 4 and a through pipe 5, the through pipe 5 is further connected to a condenser 6, when the heat source 3 generates heat, the heat generated by the heat source 3 can be guided into the housing 2 to the heat dissipation module 10, so that the water in the first evaporation area 114 and the second evaporation area 124 is heated and then evaporated, the high temperature gas evaporated into gaseous state is concentrated in the gas concentration area 13, and then enters the condenser 6 through the through pipe 5 under the influence of negative pressure, and relatively, the high temperature gas enters the condenser 6 to be cooled and then becomes water again, and then flows back to the heat dissipation module 10 through the through pipe 5.
Referring to fig. 2 and 3, in the present embodiment, the external wall panel 11 and the internal wall panel 12 are configured with a predetermined size ratio, wherein the internal wall panel thickness T2 of the internal wall panel 12 is equal to the external wall panel thickness T1 (similarly, the thicknesses of the fourth panel 121, the fifth panel 122 and the sixth panel 123 are equal to each other, i.e., the internal wall panel thickness T2) based on the external wall panel thickness T1 of the external wall panel 11 (the thicknesses of the first panel 111, the second panel 112 and the third panel 113 are all the same, i.e., the external wall panel thickness T1); the width T3 of the evaporation zone between the first evaporation zone 114 and the second evaporation zone 124 is 1-5 times the thickness T1 of the external wall panel; based on the total height H1 of the external wall panel 11, the minimum height H2 of the notch 125 recessed on the internal wall panel 12 is 0.1-0.8 times (including 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7 and 0.8) of the total height H1.
The utility model discloses a quick heat abstractor of evaporimeter, please refer to fig. 8 and 9, for the second embodiment, the upper end that the notch 125 department is concavely equipped with in this interior wallboard 12 is formed with a large amount of first lugs 127 and second lug 128 respectively, this first lug 127 is formed by this interior wallboard 12 upper end towards the side extension a predetermined length, and second lug 128 is formed by this interior wallboard 12 upper end towards another side extension a predetermined length, and each first lug 127 and each second lug 128 stagger each other, make the top surface of this interior wallboard 12 form continuous bow word form, therefore, the sheltering from of each first lug 127 and each second lug 128 can be effectual when the water becomes gaseous in this first evaporation zone 114 and this second evaporation zone 124 internal rotation, let gaseous can be more quick to this gaseous concentrated district 13 circulation, promote the efficiency of circulation.
The utility model provides a quick heat abstractor of evaporimeter, when comparing each other with other prior art, its advantage as follows:
1. the heat dissipation element is divided into the outer wall plate and the inner wall plate, so that more space for water evaporation and contact area are formed in the heat dissipation module, heat energy in the heat dissipation module can be quickly conducted to a water body, and the heat conduction efficiency of the heat dissipation module is improved.
2. The water is divided into the first evaporation area or the second evaporation area, and the water can be evaporated more quickly by respective heating, so that the evaporation benefit is improved.
3. The gas of evaporation can be concentrated respectively in each gas concentration district earlier, and this easily forms great pressure, consequently, when gas is sent out, can be more quick send out to the less condenser of pressure, promotes the efficiency of gas and water circulation.
4. The heat dissipation element is divided into the external wall plate and the internal wall plate, and the multi-piece assembly can reduce the complexity of the structure, further reduce the difficulty in manufacturing and the incidence rate of defects in manufacturing, thereby improving the convenience and production benefit of assembly operation and reducing the technical cost of developing a mold.
It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Claims (10)

1. The utility model provides a quick heat abstractor of evaporimeter which characterized in that, it includes at least one radiating element, and this radiating element is assembled jointly by an outer wallboard and an interior wallboard and is formed:
the external wall panel is respectively provided with a first panel surface, a second panel surface and a third panel surface, wherein the second panel surface is positioned on one side edge of the first panel surface, the third panel surface is positioned on the other side edge of the first panel surface, and a preset included angle is formed between the second panel surface and the first panel surface and between the second panel surface and the third panel surface and the first panel surface respectively, so that a half-open first evaporation area is formed inside the external wall panel;
the inner wallboard is provided with a fourth board surface, a fifth board surface and a sixth board surface, the fifth board surface is positioned on one side edge of the fourth board surface, the sixth board surface is positioned on the other side edge of the fourth board surface, and a preset included angle is formed between the fifth board surface and the sixth board surface and the fourth board surface respectively, so that a half-open second evaporation area is formed inside the inner wallboard, and a notch is concavely arranged in the middle position of the fifth board surface and the fourth board surface close to the inner side;
the inner wall board is attached to one side of the outer wall board to assemble the heat dissipating element, the first evaporation area and the second evaporation area are communicated at the notch to form a gas concentration area together, and the heat dissipating elements are arranged, combined or integrated into a heat dissipating module in the same direction.
2. The fast heat dissipating device of an evaporator as claimed in claim 1, wherein the outer wall panel is formed by integrally molding or fixedly connecting the first panel, the second panel and the third panel.
3. The fast heat dissipating device of claim 1, wherein the inner wall is formed by integrally molding or fixedly connecting the fourth panel, the fifth panel and the sixth panel.
4. The fast heat dissipating device of an evaporator as claimed in claim 1, wherein a groove is formed at each of the two ends of the second panel near the outer side, and the notch forms a protrusion at each of the two ends of the fifth panel and the fourth panel near the outer side, and each protrusion is disposed in each groove to tightly attach the inner wall panel to one side of the outer wall panel.
5. The rapid heat dissipating device of an evaporator of claim 1, wherein the outer wall panel has an outer wall panel thickness equal to an inner wall panel thickness of the inner wall panel.
6. The rapid heat dissipation device of claim 1, wherein the width of the first evaporation zone and the second evaporation zone is 1 to 5 times the thickness of the outer wall panel.
7. The fast heat dissipating device of an evaporator as claimed in claim 1, wherein the minimum height of the notch formed in the inner wall panel corresponds to 0.1 to 0.8 times of the total height of the outer wall panel.
8. The rapid heat dissipating device of an evaporator as claimed in claim 1, wherein a plurality of first protrusions and second protrusions are formed at the upper end of the inner wall plate, respectively, the first protrusions are formed by extending a predetermined length from the upper end of the inner wall plate toward one side, and the second protrusions are formed by extending a predetermined length from the upper end of the inner wall plate toward the other side.
9. The rapid heat dissipating device of an evaporator of claim 8, wherein the first protrusions and the second protrusions are offset from each other such that the upper end of the inner wall panel forms a continuous bow shape.
10. The rapid heat dissipating device according to claim 8, wherein each of the first protrusions and each of the second protrusions are formed at a position of the inner wall panel where the upper end of the notch is recessed.
CN201922482416.2U 2019-12-31 2019-12-31 Quick heat dissipation device of evaporator Active CN211210323U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922482416.2U CN211210323U (en) 2019-12-31 2019-12-31 Quick heat dissipation device of evaporator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922482416.2U CN211210323U (en) 2019-12-31 2019-12-31 Quick heat dissipation device of evaporator

Publications (1)

Publication Number Publication Date
CN211210323U true CN211210323U (en) 2020-08-07

Family

ID=71888501

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922482416.2U Active CN211210323U (en) 2019-12-31 2019-12-31 Quick heat dissipation device of evaporator

Country Status (1)

Country Link
CN (1) CN211210323U (en)

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