JP2017106672A - Heat radiator and manufacturing method of heat radiator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiator capable of reducing a manufacturing cost with a small number of components and without complicated work, eliminating a risk of leakage of heat medium introduced thereinside, being simply manufactured into an ultrathin shape, and excellent in a heat radiation effect.SOLUTION: A heat radiator includes an erected columnar part 18 formed so as to erect on a heat medium circulation space side 12a of a first plate-like member 12, and sealing connection parts 12b, 14b configured to overlap the first plate-like member 12 with a second plate-like member 14 in a sealed and connected state. The first plate-like member 12 and the second plate-like member 14 are overlapped with each other, and connected with the sealing connection parts 12b, 14b, and thereby a tip 18a of the erected columnar part 18 contacts with an inner wall 20a of a recess 20 for space formation to form a heat medium flow passage 22 in a heat medium circulation space 16.SELECTED DRAWING: Figure 1

Description

  In order to dissipate heat generated in various devices such as thin electronic devices such as smartphones and tablet PCs, batteries, inverters, motors, and LEDs, for example, the present invention is a heat dissipation device composed of a vapor chamber used in these various devices ( Hereinafter, it is simply referred to as “heat dissipating device”) and a method for manufacturing the heat dissipating device.

  Conventionally, such a heat radiating device forms a heat medium flow path composed of a plurality of heat medium spaces by extruding or brazing a metal such as copper or aluminum having high heat conductivity, and this heat medium. For example, it is produced by enclosing a heat medium such as water, acetone or alcohol in the space.

  However, in the case of copper, since it brazes by zinc welding, since the brazing material is a copper-zinc alloy, the thermal conductivity is lowered, so that the heat dissipation effect is lowered. For this reason, a heat dissipation device made entirely of aluminum has recently been used.

  For example, in a battery such as an electric vehicle, heat is generated at the time of charging or the like, so that the life of the battery is reduced or the traveling distance is reduced. For this reason, such a heat radiating device is arranged on the side of the battery.

  Also, in a DC-AC converter such as an inverter, since the efficiency of the inverter is reduced due to heat generation, such a heat dissipating device is disposed as a heat sink of the inverter.

  Further, in the motor, as the rotational speed increases, the motor generates heat, and the life of the motor is reduced. For this reason, such a heat dissipating device is disposed on the side of the motor.

  In portable electronic devices such as notebook computers, smartphones, and tablet PCs, the battery, CPU, and hard disk generate heat. Thereby, there exists a problem that the processing capability of a portable electronic device falls. For this reason, it is conceivable to arrange such a heat dissipating device on the side of a battery or the like.

  Furthermore, in recent years, LEDs have begun to be used in consideration of energy saving, for example, in factory ceilings and street lamps. In this case, for example, a 200 to 300 W high-power LED is used to illuminate a large facility, and the amount of heat generated is increased. It has been broken.

  However, conventionally, in a heat dissipation device for cooling such a high-power LED, a structure having a radial heat dissipation fin is used for the main body of the heat dissipation device. In addition to requiring installation space, its weight increases, a solid structure such as a ceiling is required, and the construction cost increases.

  Thus, a heat dissipation device required in various devices as described above is desired to be lightweight, compact, and thin.

  As such a conventional heat radiating device, for example, a heat radiating device as disclosed in Patent Document 1 (Utility Model Registration No. 3176281) has been proposed.

  FIG. 18 is an exploded perspective view of the heat dissipation device 100 of Patent Document 1. FIG. As shown in FIG. 18, the heat radiating device 100 of Patent Document 1 includes a heat radiating member main body 106 formed by, for example, extrusion molding and formed with a plurality of vertically long chambers 104 partitioned by a partition wall 102.

  A top cover 108 is attached to one end 106 a of the heat radiating member main body 106, and a bottom cover 110 is attached to the other end 106 b of the heat radiating member main body 106.

  Further, the top cover 108 is formed with a fitting recess 108a for fitting one end 106a of the heat radiating member main body 106 and forming a flow path for communicating the plurality of chambers 104 with each other. Yes.

  The bottom cover 110 is formed with a fitting recess 110 a into which the other end 106 b of the heat radiating member main body 106 is fitted.

  A tubular member 112 for introducing a heat medium is attached to the top cover 108 and communicates with the plurality of chambers 104 of the heat radiating member main body 106 through fitting recesses 108a for forming a flow path. It is configured as follows.

  Further, in Patent Document 2 (Utility Model Registration No. 3165314), Patent Document 3 (Japanese Patent Laid-Open No. 2004-11936), and Patent Document 4 (Japanese Patent Laid-Open No. 2001-66079), a plurality of stacked plates are used. A heat dissipating device including a heat dissipating member body having a shape is disclosed.

  FIG. 19 is an exploded perspective view showing an outline of the heat dissipation device 200 disclosed in Patent Documents 2 to 4, taking Patent Document 2 as an example of Patent Documents 2 to 4, and FIG. It is a partial expanded sectional view of the thermal radiation apparatus 200 of FIG.

  For convenience of explanation, FIGS. 19 and 20 show a plate-shaped heat radiating member body 206 composed of a pair of upper and lower upper heat radiating plate members 202 and a lower heat radiating plate member 204. A plurality of the heat radiating member bodies 206 are stacked to constitute the heat radiating device 200.

  As shown in FIGS. 19 and 20, the conventional heat dissipating device 200 includes a pair of upper and lower upper heat dissipating plate members 202 and a lower heat dissipating plate member 204.

  The upper heat radiating plate member 202 is formed with a channel forming recess 208, and a plurality of projecting portions 210 are provided in the channel forming recess 208 so as to be arranged at regular intervals. ing.

  Corresponding to this, the lower heat sink member 204 is formed with a flow path forming recess 212 corresponding to the flow path forming recess 208 of the upper heat sink member 202. And in this flow path formation recessed part 212, the several protrusion part 214 is protrudingly provided in the position corresponding to the protrusion part 210 of the upper side heat sink member 202 so that it may be arrange | positioned at fixed intervals. .

  Then, as shown in the enlarged view of FIG. 20, these upper radiator plate member 202 and lower radiator plate member 204 are connected to the protruding portion 210 of the upper radiator plate member 202 and the projection of the lower radiator plate member 204. The heat radiating member main body 206 in which a plurality of heat medium flow paths 216 are formed is configured by aligning and joining so as to be in contact with the installation portion 214.

  And although not shown in figure, the heat radiating device 200 is comprised by laminating | stacking this heat radiating member main body 206 with two or more.

  Further, in Patent Document 5 (Japanese Patent Application Laid-Open No. 2004-006563), a groove that forms a heat medium flow path is formed in one plate-like member, and the other plate-like member is joined to face the groove. A heat dissipation device having a structure for circulating a heat medium through a heat medium flow path formed by the above is disclosed.

  In Patent Document 6 (Japanese Patent Laid-Open No. 2009-283648), a recess for accommodating a heat pipe is formed in a comb-like plate-like member in plan view, and the heat pipe is accommodated in this recess, and the other plate A heat radiating device having a structure in which a heat pipe is sandwiched by joining shaped members is disclosed.

Further, in Patent Document 7 (Japanese Patent Laid-Open No. 2000-031680), there are two metal laminated plates, a first metal plate and a second metal plate, and a required shape such as a “Japanese character” shape. It has a pattern crimping part and a non-crimping part.
And the 2nd metal plate swells in trapezoid shape, and the flat wick which consists of a mesh, a braided wire, etc. is installed in the approximate center part of this trapezoid hollow part, and a flat wick is the 1st metal plate and 2nd. A heat dissipating device having a structure in which a hydraulic fluid is sealed in this trapezoidal cavity is disclosed.

Utility Model Registration No. 3176281 Utility Model Registration No. 3165314 JP 2004-11936 A JP 2001-66079 A JP 2004006563 A JP 2009-283648 A JP 2000-031680 A

  However, in the conventional heat dissipating device 100 of Patent Document 1, the heat dissipating member main body 106, the top cover 108, the bottom cover 110, and the tubular member 112 must be assembled, which increases the number of parts and requires complicated work. It becomes.

  Further, since the heat dissipating member main body 106, the top cover 108, the bottom cover 110, and the tubular member 112 are configured in this way, there is a possibility that the heat medium introduced into the inside may leak from the coupling portion of these members.

  Furthermore, in the heat radiating device 100 of Patent Document 1, since the heat radiating member main body 106 is formed by, for example, extrusion molding, the heat radiating member main body 106 in which the plurality of chambers 104 are formed, the thickness thereof increases. Become.

  Therefore, at most, for example, manufacturing a heat dissipation device having a thickness of about 2 mm is the limit. For example, it is difficult to manufacture an extremely thin heat dissipation device having a thickness of about 0.75 mm.

  Further, in the heat dissipating device 200 of the conventional Patent Documents 2 to 4, the upper heat dissipating plate member 202 and the lower heat dissipating plate member 204 are connected to the protruding portion 210 of the upper heat dissipating plate member 202 and the lower heat dissipating plate member 204. In order to accurately align so that the projecting portion 214 contacts, complicated work is required, and it is also difficult to perform accurate alignment.

For this reason, when the contact position of the protrusion part 210 and the protrusion part 214 has shifted | deviated, the heat-medium flow path 216 becomes uneven and a turbulent flow arises and the thermal radiation effect will fall.
Further, since it is necessary to overlap the protruding portion 210 of the upper heat radiating plate member 202 and the protruding portion 214 of the lower heat radiating plate member 204, there is a limit to reducing the thickness of the heat radiating member main body 206. .

  Moreover, in the heat radiating device 200 of patent document 2-patent document 4, since the heat radiating device 200 is comprised by laminating | stacking multiple heat radiating member main bodies 206, the heat radiating device 200 will enlarge and thickness will become large. End up.

  Furthermore, in the heat radiating device of Patent Document 5, a groove for forming a heat medium flow path must be formed in one plate-like member, which requires time and labor for processing, requires complicated work, and costs are low. It will be expensive.

  In addition, in the heat dissipation device of Patent Document 6, since the concave portion for accommodating the heat pipe is formed in the comb-like plate-like member in a plan view, the heat pipe is accommodated in the concave portion, and the other plate-like member is joined. Assembling requires time and effort, increases the number of parts, and increases the cost.

  Furthermore, in the heat radiating device of Patent Document 6, it is necessary to house the heat pipe in the concave portion for housing the heat pipe formed in the comb-shaped plate member, which increases the thickness and increases the size of the heat radiating device. It will end up.

  Furthermore, in the heat radiating device of Patent Document 7, it is necessary to install a flat wick between the two metal laminated plates of the first metal plate and the second metal plate, which increases the thickness and heat dissipation. The apparatus will be enlarged.

  In view of such a current situation, the present invention has a small number of parts, does not require complicated work, can reduce manufacturing costs, and there is no risk of leakage of a heat medium introduced inside, for example, a thickness of 0.75 mm. It is an object of the present invention to provide an extremely thin heat dissipating device having a thickness of about a simple value and to provide a heat dissipating device excellent in heat dissipating effect and a method of manufacturing the heat dissipating device.

The present invention has been invented in order to achieve the problems and objects in the prior art as described above.
A pair of a first plate member and a second plate member;
A heat medium circulation space formed to be sealed between the first plate-like member and the second plate-like member;
A heat medium sealed in the heat medium flow space;
A heat dissipation device comprising:
A standing columnar portion formed so as to stand on the heat medium flow space side of the first plate-like member;
A space-forming recess formed on the heat medium flow space side of the second plate-shaped member and constituting the heat medium flow space;
A sealing joint formed around the first plate-like member and the second plate-like member, for sealing and joining the first plate-like member and the second plate-like member in an overlapping manner; ,
By superposing the first plate-like member and the second plate-like member and joining them at the sealing joint, the tip of the upright columnar part and the inner wall of the space forming recess come into contact with each other. A heat medium flow path is formed in the medium circulation space.

In addition, the manufacturing method of the heat dissipation device of the present invention,
A pair of a first plate member and a second plate member;
A heat medium circulation space formed to be sealed between the first plate-like member and the second plate-like member;
A heat medium sealed in the heat medium flow space;
A method of manufacturing a heat dissipation device comprising:
In the first plate-like member, a standing columnar portion is formed so as to stand on the heat medium circulation space side,
Forming a recess for forming a space constituting the heat medium flow space on the heat medium flow space side of the second plate-shaped member;
By overlapping the first plate-like member and the sealing joint formed around the second plate-like member, and sealing and joining at the sealing joint,
A heat medium flow path is formed in the heat medium circulation space by bringing the tip of the standing columnar portion into contact with the inner wall of the space forming recess.

  By comprising in this way, a standing columnar part is formed in the 1st plate-shaped member so that it may stand up in the heat-medium distribution space side, A recess for forming a space that constitutes the medium distribution space is formed, and the first plate-like member and the sealing joint formed around the second plate-like member are overlapped and sealed and joined by the sealing joint. .

  Thereby, the front-end | tip of a standing columnar part and the inner wall of the recessed part for space formation can be contact | abutted, and a heat carrier channel can be formed in a heat carrier distribution space.

  Therefore, since the heat radiating device can be configured with only the first plate-like member and the second plate-like member, the number of parts is small, no complicated work is required, the manufacturing cost can be reduced, and the heat medium introduced inside leaks. There is no fear.

  In addition, since the heat radiating device can be constituted by only the first plate-like member and the second plate-like member, a compact heat radiating device can be provided and, for example, an extremely thin heat radiating with a thickness of about 0.75 mm can be provided. While being able to manufacture a device simply, the heat dissipation device excellent in the heat dissipation effect can be provided.

  Furthermore, the tip of the standing columnar part and the space are formed simply by overlapping the first and second plate-like members and the sealing joints formed around the second plate-like member and sealing and joining them at the sealing joints. The heat medium flow path can be formed in the heat medium circulation space by contacting the inner wall of the concave portion for use.

  For this reason, unlike the conventional heat dissipation device 200 of Patent Documents 2 to 4, it is not necessary to perform accurate alignment, the heat medium flow path is not uneven, turbulent flow does not occur, and a uniform flow Thus, the heat dissipation effect is not reduced.

  Moreover, the heat radiating device of the present invention is characterized in that a plurality of standing columnar portions are arranged at a predetermined interval.

  With this configuration, since the plurality of standing columnar portions are spaced apart from each other by a predetermined distance, a plurality of heat medium flow paths can be formed in the heat medium flow space. The heat dissipation effect by the heat medium flowing through the road is improved.

  Moreover, the heat radiating device of the present invention is characterized in that the plurality of standing columnar portions are arranged at a predetermined interval in the flow direction of the heat medium.

  With this configuration, since the plurality of standing columnar portions are arranged at a predetermined interval in the flow direction of the heat medium, a plurality of heat medium flow paths are formed in the heat medium flow direction, The heat dissipation effect by the heat medium flowing through the medium flow path is further improved.

  Further, the heat dissipation device of the present invention is characterized in that the plurality of standing columnar portions are arranged at a predetermined interval in a direction intersecting with the flow direction of the heat medium.

  With this configuration, the plurality of standing columnar portions are arranged at a predetermined interval in a direction intersecting with the flow direction of the heat medium, so that a plurality of columns are arranged in the direction intersecting with the flow direction of the heat medium. A heat medium flow path is formed, and the heat dissipation effect by the heat medium flowing through the heat medium flow path is further improved.

  In the heat dissipation device of the present invention, the standing columnar portion is a standing columnar portion formed so as to extend in the flow direction of the heat medium.

  With this configuration, the standing columnar portion is a standing columnar portion formed so as to extend in the flow direction of the heat medium. Therefore, the heat medium is guided in the flow direction along the standing columnar portion. Thus, no turbulent flow occurs, and the heat dissipation effect by the heat medium flowing through the heat medium flow path is further improved.

  Moreover, the heat dissipation device of the present invention is characterized in that the standing columnar portion is a standing columnar portion formed so as to extend in a direction intersecting with the flow direction of the heat medium.

  With this configuration, the heat medium is guided in the flow direction along the standing columnar portion formed so as to extend in a direction intersecting with the flow direction of the heat medium, so that turbulence does not occur, The heat dissipation effect by the heat medium flowing through the medium flow path is further improved.

  Further, the heat dissipation device of the present invention is characterized in that the pair of first plate-like members and second plate-like members are constituted by plate-like members formed in three dimensions.

  By comprising in this way, since a pair of 1st plate-shaped member and 2nd plate-shaped member are comprised from the plate-shaped member shape | molded in three dimensions, it became a three-dimensional solid shape A heat dissipation device can be provided, and versatility is improved.

In addition, the manufacturing method of the heat dissipation device of the present invention,
By pressing the first plate-shaped member, a standing columnar part is formed so as to stand on the heat medium circulation space side,
The second plate-shaped member is press-molded to form a space forming recess that constitutes the heat medium flow space.

  With this configuration, the standing plate-like portion can be formed so as to stand on the heat medium circulation space side only by press-molding the first plate-like member, and the second plate-like member can be formed. It is possible to form the space forming recess that constitutes the heat medium flow space simply by press molding.

  Therefore, the first plate-like member and the second plate-like member can be produced in a predetermined shape by press molding. As a result, the heat dissipation device can be easily manufactured, and the number of components is small and complicated. Work is unnecessary, the manufacturing cost can be reduced, and there is no possibility that the heat medium introduced inside leaks.

In addition, the manufacturing method of the heat dissipation device of the present invention,
By using a clad member made of a base material and a weld metal to the first plate member, and welding with the second plate member,
While joining the first plate member and the second plate member at the sealing joint,
The tip of the upright columnar part is joined to the inner wall of the space forming recess.

  By comprising in this way, the 1st plate-shaped member is welded with a 2nd plate-shaped member only by using the clad member which consists of a base material and a welding metal for a 1st plate-shaped member, and a 1st plate-shaped at a sealing junction part. While joining a member and a 2nd plate-shaped member, the front-end | tip of a standing columnar part and the inner wall of the recessed part for space formation can be joined.

  Therefore, for example, by simply putting the first plate-like member and the second plate-like member in a heating furnace and heating them, a heat radiating device can be easily produced, and no complicated work is required, resulting in a production cost. The first plate-like member and the second plate-like member are reliably joined, and there is no possibility that the heat medium introduced into the inside leaks.

In addition, the heat dissipation device of the present invention is
A pair of a first plate member and a second plate member;
A heat medium circulation space formed to be sealed between the first plate-like member and the second plate-like member;
A heat medium sealed in the heat medium flow space;
A heat dissipation device comprising:
A plate-shaped flow space forming plate member in which a heat medium flow space is formed is sandwiched and joined between the first plate member and the second plate member.

  Thus, the heat dissipation device is configured by simply sandwiching the plate-shaped circulation space forming plate member in which the heat medium circulation space is formed between the first plate member and the second plate member. be able to.

  Therefore, since the heat radiating device can be configured with only the first plate-like member, the second plate-like member, and the flow space forming plate-like member, the number of parts is small, no complicated work is required, and the manufacturing cost can be reduced. There is no risk of leakage of the heat medium introduced into.

  Moreover, since a heat radiating device can be comprised only with a 1st plate-shaped member, a 2nd plate-shaped member, and a distribution space formation plate-shaped member, while providing a compact heat radiating device, for example, thickness is about 0.75 mm. An extremely thin heat dissipating device can be easily manufactured, and a heat dissipating device excellent in heat dissipating effect can be provided.

  Further, the heat medium flow path is formed by simply sandwiching the plate-shaped flow space forming plate member in which the heat medium flow space is formed between the first plate member and the second plate member. be able to.

  For this reason, unlike the conventional heat dissipation device 200 of Patent Documents 2 to 4, it is not necessary to perform accurate alignment, the heat medium flow path is not uneven, turbulent flow does not occur, and a uniform flow Thus, the heat dissipation effect is not reduced.

  According to the present invention, the first columnar member is formed with the standing columnar portion so as to be erected on the heat medium circulation space side, and the heat medium circulation on the heat medium circulation space side of the second plate member. A space forming recess that constitutes the space is formed, and the first plate member and the hermetic joint formed around the second plate member are overlapped and sealed and joined by the hermetic joint.

  Thereby, the front-end | tip of a standing columnar part and the inner wall of the recessed part for space formation can be contact | abutted, and a heat carrier channel can be formed in a heat carrier distribution space.

  Therefore, since the heat radiating device can be configured with only the first plate-like member and the second plate-like member, the number of parts is small, no complicated work is required, the manufacturing cost can be reduced, and the heat medium introduced inside leaks. There is no fear.

  In addition, since the heat radiating device can be constituted by only the first plate-like member and the second plate-like member, a compact heat radiating device can be provided and, for example, an extremely thin heat radiating with a thickness of about 0.75 mm can be provided. While being able to manufacture a device simply, the heat dissipation device excellent in the heat dissipation effect can be provided.

  Furthermore, the tip of the standing columnar part and the space are formed simply by overlapping the first and second plate-like members and the sealing joints formed around the second plate-like member and sealing and joining them at the sealing joints. The heat medium flow path can be formed in the heat medium circulation space by contacting the inner wall of the concave portion for use.

  For this reason, unlike the conventional heat dissipation device 200 of Patent Documents 2 to 4, it is not necessary to perform accurate alignment, the heat medium flow path is not uneven, turbulent flow does not occur, and a uniform flow Thus, the heat dissipation effect is not reduced.

FIG. 1 is an exploded perspective view of a heat dissipation device of the present invention. FIG. 2 is a top view of the first plate-like member 12 of the heat dissipation device of the present invention as viewed from the heat medium flow space side 12a. FIG. 3 is a perspective view of the second plate-like member 14 as viewed from the heat medium flow space side 14a. FIG. 4 is a perspective view of the assembled heat dissipation device of the present invention. FIG. 5 is a cross-sectional view taken along line AA of the heat dissipation device of FIG. FIG. 6 is a top view of the first plate-like member 12 of the heat radiating device according to another embodiment of the present invention as viewed from the heat medium flow space side 12a. FIG. 7 is a top view of the first plate-like member 12 of the heat radiating device according to another embodiment of the present invention as viewed from the heat medium flow space side 12a. FIG. 8 is a top view of the first plate-like member 12 of the heat dissipation device according to another embodiment of the present invention as viewed from the heat medium flow space side 12a. FIG. 9A is a top view of the first plate-like member 12 of the heat dissipation device of another embodiment of the present invention as viewed from the heat medium flow space side 12a, and the upper surface of the heat dissipation device of another embodiment of the present invention. FIG. 10A is a top view of a heat dissipation device according to another embodiment of the present invention, FIG. 10B is a front view of a heat dissipation device according to another embodiment of the present invention, and FIG. It is a front view of the thermal radiation apparatus of another Example of invention. FIG. 11 is an exploded perspective view of a heat dissipation device according to another embodiment of the present invention. FIG. 12 is a top view of the distribution space forming plate member 24 of the heat dissipation device of the present invention. FIG. 13 is a perspective view of the assembled heat dissipation device of the present invention. FIG. 14 is a cross-sectional view taken along line AA of the heat dissipation device of FIG. FIG. 15A is a top view of the flow space forming plate member 24 of the heat dissipation device of another embodiment of the present invention, and FIG. 15B is the flow space formation of the heat dissipation device of another embodiment of the present invention. FIG. 15C is a top view of the plate-like member 24, and FIG. 15C is a top view of a heat dissipation device according to another embodiment of the present invention. FIG. 16 is an exploded perspective view of a heat dissipation device according to another embodiment of the present invention. 17A is a partially enlarged end view in the A direction in FIG. 16, and FIG. 17B is a partially enlarged end view in the B direction in FIG. FIG. 18 is an exploded perspective view of the heat dissipation device 100 of Patent Document 1. FIG. FIG. 19 is an exploded perspective view showing an outline of the heat dissipation device 200 disclosed in Patent Documents 2 to 4. 20 is a partially enlarged cross-sectional view of the heat dissipation device 200 of FIG.

Hereinafter, embodiments (examples) of the present invention will be described in more detail with reference to the drawings.
Example 1

  1 is an exploded perspective view of the heat dissipation device of the present invention, FIG. 2 is a top view of the first plate-like member 12 of the heat dissipation device of the present invention as viewed from the heat medium flow space side 12a, and FIG. FIG. 4 is a perspective view of the heat dissipation device of the present invention in an assembled state, and FIG. 5 is an AA line of the heat dissipation device of FIG. FIG.

In FIG. 1 to FIG. 5, reference numeral 10 indicates the heat dissipation device of the present invention as a whole.
In addition, in the heat radiating device 10 of the present invention, the thickness of each member is exaggerated for convenience of explanation, but the actual thickness is about 0.75 mm as a whole.

  As shown in FIGS. 1 to 5, the heat dissipation device 10 of the present invention includes a first plate-like member 12 that constitutes a pair of substrates, and a second plate-like member 14 that constitutes a lid. Yes.

  And as shown in FIG. 5, it forms in the inside between the 1st plate-shaped member 12 and the 2nd plate-shaped member 14, and seals a heat carrier inside. A heat medium distribution space 16 is provided.

  Moreover, as shown in FIGS. 1-2, the 1st plate-shaped member 12 is substantially rectangular shape by planar view, and the center part of the surface of the heat-medium distribution space side 12a of the 1st plate-shaped member 12 is shown. A plurality of standing columnar portions 18 are formed so as to project.

That is, in this embodiment, the plurality of substantially cylindrical columnar portions 18 are arranged in the vertical and horizontal directions (that is, the heat medium of the heat medium) so as to stand on the heat medium flow space side 12a of the first plate member 12. It is formed so as to be spaced apart by a certain distance in the flow direction and the direction intersecting the flow direction of the heat medium.
As will be described later, the arrangement shape of the upright columnar portions 18 can be appropriately changed according to the design, such as a circular shape, an elliptical shape, or a triangular shape in plan view.

  On the other hand, as shown in FIGS. 1 and 3, the second plate-like member 14 has the same shape as the first plate-like member 12 and has a substantially rectangular shape in plan view. Is the same as the first plate-like member 12.

And in the center part of the 2nd plate-shaped member 14, the heat-medium distribution | circulation space 16 is formed in the heat-medium distribution | circulation space side 14a so as to correspond to the standing columnar part 18 of the 1st plate-shaped member 12. A substantially rectangular space forming recess 20 is formed in plan view.
In the case of this embodiment, for convenience of explanation, the space forming concave portion 20 is formed in a substantially rectangular box shape. However, although not shown, the corner may be rounded and not angular. In addition, the shape can be appropriately changed in a plan view, such as a circular shape, an elliptical shape, or a triangular shape.

  Further, the first plate-like member 12 and the second plate-like member 14 are hermetically sealed around the first plate-like member 12 and the second plate-like member 14 so that the first plate-like member 12 and the second plate-like member 14 are overlapped and sealed. Portions 12b and 14b are respectively formed.

  As shown in the cross-sectional view of FIG. 5, the dimension of the depth D of the space forming recess 20 of the second plate member 14 is set so as to project the standing columnar portion 18 of the first plate member 12. The height is set to be approximately the same as the height H.

  And in order to assemble the heat radiating device 10 of this invention, as shown in FIG. 1, FIG. 4-5, the 1st plate-shaped member 12 and the 2nd plate-shaped member 14 were piled up, and sealing joining was carried out. It joins by part 12b, 14b.

  Thereby, the front end 18a of the standing columnar portion 18 and the inner wall 20a of the space forming recess 20 are in contact with each other, and a plurality of heat medium flow paths 22 are formed in the heat medium flow space 16. .

  In this case, as a method for producing the first plate-like member 12 having such a shape, a known metal forming method can be adopted, and the first plate-like member 12 is not particularly limited. It is desirable to form the standing columnar portion 18 so as to stand on the heat medium flow space side 12a by press molding the member 12.

  Moreover, as a method of producing the 2nd plate-shaped member 14 of such a shape, a well-known metal forming method can be employ | adopted, Although it does not specifically limit, For example, the 2nd plate-shaped member It is desirable to form the upright columnar portion 18 so as to stand upright on the heat medium flow space side 14a by press molding 14.

  With this configuration, the standing columnar portion 18 can be formed so as to stand on the heat medium flow space side 12a only by press-molding the first plate-like member 12, and the second The space forming recess 20 that forms the heat medium flow space 16 can be formed simply by press-molding the plate member 14.

  Therefore, the first plate-like member 12 and the second plate-like member 14 can be produced in a predetermined shape by press molding. As a result, the heat dissipation device 10 can be easily manufactured and the number of parts can be reduced. There are few, complicated work is unnecessary, manufacturing cost can also be reduced, and there is no possibility that the heat medium introduced inside leaks.

  Further, the material of the first plate-like member 12 and the second plate-like member 14 is not particularly limited, but is made of aluminum in consideration of lightness and possible contamination such as impurities. It is desirable to do.

  Furthermore, as a method of overlapping the first plate-like member 12 and the second plate-like member 14 and joining them at the sealing joints 12b and 14b, for example, a welding method such as welding or brazing is adopted. However, it is desirable to join by the following method.

  That is, the first plate-like member 12 and the second plate-like member 14 are made of a clad material, for example, the base material is Al-Mn (3000 series) aluminum, and the surface is Al-Si (4000 series). Using an aluminum clad material composed of aluminum, heating is performed, for example, in a heating furnace.

  As a result, the first plate-like member 12 and the second plate-like member 14 are joined by the sealing joint portions 12b and 14b, and the tip 18a of the standing columnar portion 18 and the inner wall 20a of the space forming recess 20 It will join at the contact part.

  In the case of this embodiment, the tip 18a of the standing columnar portion 18 and the inner wall 20a of the space forming recess 20 are also joined by welding.

  By configuring in this way, the standing columnar portion 18 is formed on the first plate member 12 so as to stand on the heat medium flow space side 12a, and the heat medium flow space of the second plate member 14 is formed. On the side 14a, a space forming recess 20 that constitutes the heat medium flow space 16 is formed, and the first plate member 12 and the sealed joint portions 12b and 14b formed around the second plate member 14 are provided. They are overlapped and sealed and joined at the sealing joints 12b and 14b.

  Thus, the heat medium flow path 22 can be formed in the heat medium flow space 16 by bringing the tip of the standing columnar portion 18 into contact with the inner wall 20 a of the space forming recess 20.

  Therefore, since the heat radiating device 10 can be configured by only the first plate-like member 12 and the second plate-like member 14, the number of parts is small, no complicated work is required, the manufacturing cost can be reduced, and the heat introduced into the interior can be reduced. There is no risk of media leakage.

  Moreover, since the heat radiating device 10 can be constituted by only the first plate-like member 12 and the second plate-like member 14, a compact heat radiating device 10 can be provided and, for example, the thickness is about 0.75 mm. The ultra-thin heat radiating device 10 can be easily manufactured, and the heat radiating device 10 having an excellent heat radiating effect can be provided.

  Further, the first plate member 12 and the sealing joint portions 12b and 14b formed around the second plate member 14 are overlapped and sealed and joined by the sealing joint portions 12b and 14b. The heat medium flow path 22 can be formed in the heat medium flow space 16 by bringing the tip 18 a of the columnar section 18 into contact with the inner wall 20 a of the space forming recess 20.

  For this reason, unlike the conventional heat dissipation device 200 of Patent Documents 2 to 4, it is not necessary to perform accurate alignment, the heat medium flow path is not uneven, turbulent flow does not occur, and a uniform flow Thus, the heat dissipation effect is not reduced.

In addition, since the height (thinness) D of the heat medium space 16 is approximately the same as the protruding height H of the standing columnar portion 18, it is advantageous for thinning.
For this reason, according to the heat radiating device 10 of the present invention, the conventional heat radiating measure is limited to manufacturing a heat radiating device having a thickness of about 2 mm, for example. It is possible to manufacture a very thin heat dissipation device having a thickness of 4 mm to 1.5 mm, preferably 0.5 mm to 1.0 mm, and more preferably, for example, a thickness of about 0.75 mm. is there.

  In addition, for example, the heat dissipation device 10 is very thin with a thickness of about 0.75 mm, and the size of the cross section of the heat medium flow path 22 formed in the heat medium flow space 16 is small, which can be quickly obtained by capillary action. And heat can be dissipated uniformly.

  In this case, the heat medium enclosed in the heat medium circulation space 16 is not particularly limited, and for example, water, acetone, alcohol, or the like can be used.

A method of enclosing such a heat medium in the heat medium circulation space 16 is not particularly limited.
For example, as shown in FIGS. 16 and 17, the sealing joint 14 b formed around the second plate member 14 is communicated with the space forming recess 20 that forms the heat medium circulation space 16. A semi-cylindrical communication groove 11 having a communication opening 11a may be formed.

As shown in FIGS. 16 and 17, the heat medium flow through the sealing joint 12 b of the first plate member 12 so as to correspond to the communication groove 11 of the second plate member 14. A semi-cylindrical communication groove 13 having a communication opening 13a for communicating with the space forming recess 20 forming the space 16 may be formed.
Then, by joining the sealing joint portion 12b of the first plate-like member 12 and the second plate-like member 14, the communication groove 13 of the first plate-like member 12 and the second plate-like shape The communication groove 11 of the member 14 is joined.

  Thereby, the tubular communication communicating with the space forming recess 20 forming the heat medium flow space 16 by the communication opening 11 a of the first plate member 12 and the communication opening 13 a of the second plate member 14. An opening is formed.

  Then, using this tubular opening, the inside of the space forming recess 20 forming the heat medium circulation space 16 is evacuated, the heat medium is sealed, and then this tubular communication opening is welded, for example, What is necessary is just to seal by well-known methods, such as.

Thus, the heat medium can be directly introduced into the heat medium circulation space 16 through the tubular communication opening.
Further, for example, a method of enclosing and welding in a heating furnace under an atmosphere of a heat medium can be employed.

  In this case, in this embodiment, as shown in FIG. 2, the plurality of standing columnar portions 18 are arranged in the vertical and horizontal directions (that is, the direction in which the heat medium flows and the direction in which the heat medium flows). It is formed so as to be spaced apart by a fixed interval.

  That is, since the plurality of standing columnar portions 18 are arranged at a predetermined interval in the flow direction of the heat medium, the plurality of heat medium flow paths 22 are formed in the flow direction of the heat medium. The heat radiation effect by the heat medium that circulates is further improved.

  Further, since the plurality of standing columnar portions 18 are arranged at a predetermined interval in the direction intersecting with the flow direction of the heat medium, the plurality of heat medium flow paths 22 are arranged in the direction intersecting with the flow direction of the heat medium. And the heat dissipation effect by the heat medium flowing through the heat medium flow path 22 is further improved.

  In this case, as shown in FIG. 2, the distance L1 between the flow directions of the heat medium of the plurality of standing columnar portions 18 and the direction intersecting the flow direction of the heat medium of the plurality of standing columnar portions 18. The distance L2 may be the same, or may be different as shown in FIG.

In this case, in the above embodiment, the shape of the standing columnar portion 18 is a plurality of standing columnar portions 18 having a substantially circular tube shape. However, the shape is not particularly limited and is not illustrated. Various shapes such as an actual cylindrical shape, a quadrangular prism shape, and an elliptical prism shape can be adopted.
However, it is desirable that the front end of the heat medium in the flow direction (portion to which the heat medium hits) has a shape in which R (R) is formed at least partially so as not to hinder the flow.

  In this case, as shown in FIG. 6A, only in the flow direction of the heat medium, or as shown in FIG. 6B, only in the direction crossing the flow direction of the heat medium, It is also possible to form a plurality of standing columnar portions 18.

  Further, in this embodiment, the plurality of standing columnar portions 18 are formed so as to be spaced apart from each other at regular intervals in the vertical and horizontal directions (that is, the direction in which the heat medium flows and the direction in which the heat medium flows). As shown in FIG. 7A, it is possible to form one standing columnar portion 18 so as to extend in the flow direction of the heat medium.

  Further, as shown in FIG. 7B, the plurality of standing columnar portions 18 may be standing columnar portions 18 formed so as to extend in the flow direction of the heat medium.

  With this configuration, the standing columnar portion 18 is the standing columnar portion 18 formed so as to extend in the flow direction of the heat medium. Therefore, the heat medium flows along the standing columnar portion 18. Guided in the direction, turbulent flow does not occur, and the heat dissipation effect by the heat medium flowing through the heat medium flow path 22 is further improved.

  Further, as shown in FIG. 8A, the standing columnar portion 18 may be a standing columnar portion 18 formed so as to extend in a direction intersecting the flow direction of the heat medium. As shown in FIG. 8B, the standing columnar portion 18 is formed so as to extend in the direction intersecting with the flow direction of the heat medium and the standing columnar portion 18c formed so as to extend in the flow direction of the heat medium. You may comprise from the standing standing columnar part 18d.

  By configuring in this way, the heat medium is guided in the flow direction along the standing columnar portion 18 formed so as to extend in the direction intersecting the flow direction of the heat medium, and turbulence is not generated. The heat dissipation effect by the heat medium flowing through the heat medium flow path is further improved.

  Furthermore, as shown in FIG. 9 (A), the standing columnar portions 18 can be arranged in a staggered manner, and as shown in FIG. 9 (B), a plurality of heat medium flow spaces 16 are provided. It is also possible to constitute an integral heat dissipation device 10 in which the space forming recess 20 that constitutes is disposed.

In the case of FIG. 9B, although not shown, a plurality of (in FIG. 9B, 12 in FIG. 9B) communicating with each of the heat medium circulation spaces 16 as in the embodiments of FIGS. It is only necessary to form a tubular opening portion including the communication opening portion 11 a of the first plate-like member 12 and the communication opening portion 13 a of the second plate-like member 14.
Although not shown, a tubular opening comprising a communication opening portion 11a of one first plate member 12 communicating with one heat medium flow space 16 and a communication opening portion 13a of the second plate member 14 is provided. While forming a part, you may provide the communicating path which connects the heat-medium distribution | circulation space 16 mutually.

  Further, as shown in FIG. 10 (A), the heat radiation device 10 having an irregular shape can be obtained in a plan view, and the shape is not limited to the rectangular shape as in the above embodiment, and any shape is possible. The shape can correspond to the object to be radiated.

  Furthermore, as shown in FIGS. 10B and 10C, the pair of first plate-like member 12 and second plate-like member 14 are, for example, substantially U-shaped in front view, You may comprise from the plate-shaped member shape | molded (folded) three-dimensionally, such as substantially S shape.

  By comprising in this way, since a pair of 1st plate-shaped member 12 and 2nd plate-shaped member 14 are comprised from the plate-shaped member shape | molded in three dimensions, it is three-dimensionally three-dimensionally Thus, the heat dissipation device 10 can be provided, and can be applied to an object to be radiated in any shape, and versatility is improved.

Although not shown, it goes without saying that, for example, screw holes, mounting brackets, and the like may be formed in the sealed joint portions 12b and 14b in order to attach to the object to be radiated.
(Example 2)

  FIG. 11 is an exploded perspective view of a heat dissipation device according to another embodiment of the present invention, FIG. 12 is a top view of the distribution space forming plate member 24 of the heat dissipation device of the present invention, and FIG. FIG. 14 is a perspective view of the assembled state, and FIG. 14 is a cross-sectional view taken along line AA of the heat dissipation device of FIG.

  The heat dissipating device 10 of this embodiment has basically the same configuration as the heat dissipating device shown in FIGS. Is omitted.

  In the heat dissipation device 10 of this embodiment, each includes a pair of flat plate-like first plate members 12 and a second plate member 14.

  And as shown in FIG. 13, it forms in the inside between the 1st plate-shaped member 12 and the 2nd plate-shaped member 14, and seals a heat medium. A heat medium distribution space 16 is provided.

  Moreover, as shown in FIGS. 11 to 14, a plate-shaped circulation space forming plate shape in which a heat medium circulation space 16 is formed between the first plate member 12 and the second plate member 14. The member 24 is sandwiched and joined.

  That is, in the heat radiating device 10 of this embodiment, as shown in FIG. 12, the circulation space forming plate member 24 has a plurality of through holes 26 for forming the heat medium circulation space 16 extending in the flow direction. It is formed at a constant interval in the direction intersecting the direction.

  Thus, the plate-shaped circulation space forming plate member 24 in which the heat medium circulation space 16 (through hole 26) is formed is sandwiched between the first plate member 12 and the second plate member 14. Only by doing, the thermal radiation apparatus 10 can be comprised.

In this case, although not shown, as in the embodiment of FIGS. 16 and 17, communication of a plurality of (three in FIG. 11) first plate-like members 12 for communication with each of the heat medium circulation spaces 16. What is necessary is just to form the tubular opening part which consists of the opening part 11a and the communication opening part 13a of the 2nd plate-shaped member 14. FIG.
Although not shown, a tubular opening comprising a communication opening portion 11a of one first plate member 12 communicating with one heat medium flow space 16 and a communication opening portion 13a of the second plate member 14 is provided. While forming a part, you may provide the communicating path which connects the heat-medium distribution | circulation space 16 mutually.

  Therefore, since the heat radiating device 10 can be configured with only the first plate member 12, the second plate member 14, and the flow space forming plate member 24, the number of components is small, complicated work is unnecessary, and the manufacturing cost is also low. It can be reduced and there is no risk of leakage of the heat medium introduced inside.

  Moreover, since the heat radiating device 10 can be constituted only by the first plate-like member 12, the second plate-like member 14, and the flow space forming plate-like member 24, the compact heat radiating device 10 can be provided. An extremely thin heat dissipation device 10 having a thickness of about 0.75 mm can be easily manufactured, and the heat dissipation device 10 having an excellent heat dissipation effect can be provided.

  Furthermore, the plate-shaped circulation space forming plate member 24 in which the heat medium circulation space 16 (through hole 26) is formed is simply sandwiched between the first plate member 12 and the second plate member 14. Thus, the heat medium flow path 22 can be formed.

  For this reason, unlike the conventional heat dissipation device 200 of Patent Documents 2 to 4, it is not necessary to perform accurate alignment, the heat medium flow path is not uneven, turbulent flow does not occur, and a uniform flow Thus, the heat dissipation effect is not reduced.

  In this case, the shape of the heat medium flow space 16 (through hole 26) of the flow space forming plate member 24 is not particularly limited, and for example, FIG. 7A and FIG. As shown in FIGS. 15 (A) and 15 (B), the shape corresponding to the shape of the heat medium circulation space 16 formed in the above-described Example 1 is used. Various heat medium distribution spaces 16 (through holes 26) can be formed.

  Further, as in the first embodiment, a known metal forming method can be adopted as a method for producing the distribution space forming plate member 24, and is not particularly limited. It is desirable to form the heat medium flow space 16 (through hole 26) by press-molding the plate member 24.

  Further, the material of the distribution space forming plate member 24 is not particularly limited, but it is preferable that the distribution space forming plate member 24 is made of aluminum in consideration of lightness and the possibility of a decrease in thermal conductivity due to brazing.

  Further, as in the first embodiment, as a method of joining the first plate member 12, the second plate member 14, and the flow space forming plate member 24, for example, a welding method such as welding or brazing. However, it is desirable to join by the following method.

  In this case, as in the first embodiment, the first plate member 12, the second plate member 14, and the flow space forming plate member 24 are made of a clad material, for example, a base material made of Al-Mn (3000 series). ), And an aluminum clad material whose surface is made of Al-Si (4000) aluminum, and is heated in a heating furnace, for example.

  Thereby, the 1st plate-shaped member 12, the 2nd plate-shaped member 14, and the distribution space formation plate-shaped member 24 can be joined.

  In this case, the heat medium enclosed in the heat medium circulation space 16 is not particularly limited, and for example, acetone, alcohol, or the like can be used.

  The method for encapsulating such a heat medium in the heat medium circulation space 16 is not particularly limited, and for example, a method of encapsulating and welding in a heating furnace under the atmosphere of the heat medium may be adopted. it can.

  Further, although not shown in the drawing, as in FIG. 9B of the first embodiment, integral heat dissipation is performed using the integrated flow space forming plate member 24 in a form in which a plurality of flow space forming plate members 24 are combined. It is also possible to configure the device 10.

In the second embodiment, as in the embodiment of FIG. 9B, when an integrated distribution space forming plate member 24 in a form in which a plurality of distribution space forming plate members 24 are combined is illustrated. However, as in the embodiment of FIGS. 16 and 17, a plurality of (12 in FIG. 9B) communication openings of the first plate-like members 12 for communicating with each of the heat medium circulation spaces 16. What is necessary is just to form the tubular opening part which consists of the part 11a and the communication opening part 13a of the 2nd plate-shaped member 14. FIG.
Although not shown, a tubular opening comprising a communication opening portion 11a of one first plate member 12 communicating with one heat medium flow space 16 and a communication opening portion 13a of the second plate member 14 is provided. While forming a part, you may provide the communicating path which connects the heat-medium distribution | circulation space 16 mutually.

  Further, similarly to the first embodiment, although not shown, the heat radiation device 10 can be an irregular shape in a plan view, and the first plate-like member 12, the second plate-like member 14, and the flow space formation are formed. The plate-like member 24 may be constituted by a plate-like member molded in three dimensions.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to this, and various modifications can be made without departing from the object of the present invention.

  In order to dissipate heat generated in various devices such as thin electronic devices such as smartphones and tablet PCs, batteries, inverters, motors, LEDs, etc., the present invention is a heat dissipation device composed of a vapor chamber used in these various devices. Can be applied.

DESCRIPTION OF SYMBOLS 10 Heat radiation apparatus 11 Communication groove | channel 11a Communication opening part 12 Plate-shaped member 12a Heating medium distribution | circulation space side 12b Sealing junction part 13 Communication groove | channel 13a Communication opening part 14 Plate-shaped member 14a Heating medium distribution | circulation space side 14b Sealing bonding part 16 Heat medium Distribution space 18 Standing columnar portion 18a Tip 18c Standing columnar portion 18d Standing columnar portion 20 Space forming recess 20a Inner wall 22 Heat medium flow path 24 Distribution space forming plate member 26 Through hole 100 Heat dissipating device 102 Partition wall 104 Chamber 106 Heat dissipation Member body 106a End portion 106b End portion 108 Top cover 108a Fitting recess 110 Bottom cover 110a Fitting recess 112 Tubular member 200 Heat dissipating device 202 Upper heat dissipating plate member 204 Lower heat dissipating plate member 206 Heat dissipating member main body 208 Flow path forming recess 210 Projecting portion 212 Channel-forming recess 214 Projecting portion 216 Heat medium channel L1 Away L2 distance

Claims (10)

A pair of a first plate member and a second plate member;
A heat medium circulation space formed to be sealed between the first plate-like member and the second plate-like member;
A heat medium sealed in the heat medium flow space;
A heat dissipation device comprising:
A standing columnar portion formed so as to stand on the heat medium flow space side of the first plate-like member;
A space-forming recess formed on the heat medium flow space side of the second plate-shaped member and constituting the heat medium flow space;
A sealing joint formed around the first plate-like member and the second plate-like member, for sealing and joining the first plate-like member and the second plate-like member in an overlapping manner; ,
By superposing the first plate-like member and the second plate-like member and joining them at the sealing joint, the tip of the upright columnar part and the inner wall of the space forming recess come into contact with each other. A heat dissipation device, characterized in that a heat medium flow path is formed in the medium circulation space.   The heat dissipating device according to claim 1, wherein the plurality of standing columnar portions are arranged at a predetermined interval.   The heat dissipating device according to claim 2, wherein the plurality of standing columnar portions are arranged at a predetermined interval in the flow direction of the heat medium.   The heat dissipating device according to any one of claims 2 to 3, wherein the plurality of standing columnar portions are arranged at a predetermined interval in a direction intersecting with a flow direction of the heat medium.   5. The heat dissipation device according to claim 1, wherein the standing columnar portion is a standing columnar portion formed so as to extend in a flow direction of the heat medium.   The heat dissipation device according to any one of claims 1 to 5, wherein the standing columnar portion is a standing columnar portion formed so as to extend in a direction intersecting with a flow direction of the heat medium.   The heat dissipation device according to any one of claims 1 to 6, wherein the pair of first plate-like members and second plate-like members are constituted by plate members formed in a three-dimensional manner. . A pair of a first plate member and a second plate member;
A heat medium circulation space formed to be sealed between the first plate-like member and the second plate-like member;
A heat medium sealed in the heat medium flow space;
A method of manufacturing a heat dissipation device comprising:
In the first plate-like member, a standing columnar portion is formed so as to stand on the heat medium circulation space side,
Forming a recess for forming a space constituting the heat medium flow space on the heat medium flow space side of the second plate-shaped member;
By overlapping the first plate-like member and the sealing joint formed around the second plate-like member, and sealing and joining at the sealing joint,
A method of manufacturing a heat radiating device, characterized in that a heat medium flow path is formed in a heat medium circulation space by bringing a tip of the standing columnar portion into contact with an inner wall of a space forming recess. By pressing the first plate-shaped member, a standing columnar part is formed so as to stand on the heat medium circulation space side,
The method for manufacturing a heat radiating device according to claim 8, wherein the second plate-shaped member is press-molded to form a space forming recess that constitutes the heat medium flow space. By using a clad member made of a base material and a weld metal to the first plate member, and welding with the second plate member,
While joining the first plate member and the second plate member at the sealing joint,
The method for manufacturing a heat dissipation device according to any one of claims 8 to 9, wherein a tip of the upright columnar portion and an inner wall of the space forming recess are joined.

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