JP2003291240A - Plate laminate, hollow laminate using the plate laminate, and part using the hollow laminate - Google Patents

Plate laminate, hollow laminate using the plate laminate, and part using the hollow laminate

Info

Publication number
JP2003291240A
JP2003291240A JP2002100375A JP2002100375A JP2003291240A JP 2003291240 A JP2003291240 A JP 2003291240A JP 2002100375 A JP2002100375 A JP 2002100375A JP 2002100375 A JP2002100375 A JP 2002100375A JP 2003291240 A JP2003291240 A JP 2003291240A
Authority
JP
Japan
Prior art keywords
plate
hollow
laminated material
laminate
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002100375A
Other languages
Japanese (ja)
Other versions
JP4100497B2 (en
Inventor
Kinji Saijo
謹二 西條
Kazuo Yoshida
一雄 吉田
Shinji Osawa
真司 大澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
Original Assignee
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd filed Critical Toyo Kohan Co Ltd
Priority to JP2002100375A priority Critical patent/JP4100497B2/en
Publication of JP2003291240A publication Critical patent/JP2003291240A/en
Application granted granted Critical
Publication of JP4100497B2 publication Critical patent/JP4100497B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plate laminate in which a plurality of plates are laminated and bonded, a junction controlling part is formed in a prescribed pattern between a pair of facing plates to form at least one junction controlling part in the laminate, and or more spots of the conjunction controlling part are to be used as openings, a hollow laminate using the plate laminate, and a part using the hollow laminate. <P>SOLUTION: The junction controlling part is formed in the prescribed pattern between the facing plates 12 to form the plate laminate 20. The junction controlling part of the laminate 20 is expanded to form the hollow laminate 10 having a hollow part 11, and a part of the hollow part is used as an opening part to produce the part. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明が属する技術分野】本発明は、複数枚のプレート
材を積層接合し、少なくともいずれか一対の対向するプ
レート材間に所定のパターンで接合抑止部を形成し、接
合抑止部の1箇所または複数箇所が開口予定部となるよ
うなプレート積層材、およびプレート積層材を用いた中
空積層材、および中空積層材を用いた部品に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method in which a plurality of plate materials are laminated and bonded, and a bonding inhibiting portion is formed in a predetermined pattern between at least one pair of opposing plate materials. The present invention relates to a plate laminated material having a plurality of planned opening portions, a hollow laminated material using the plate laminated material, and a component using the hollow laminated material.

【0002】[0002]

【従来の技術】パーソナルコンピュータなどのコンピュ
ータ機器においては、その高性能化が急速に進められて
おり、この高性能化を実現していくために、MPUなど
から発生する熱を効率よく放熱させる放熱器や熱交換器
などの冷却装置部品が必要とされている。
2. Description of the Related Art In computer equipment such as a personal computer, the performance thereof is being rapidly improved, and in order to realize this performance improvement, heat generated by an MPU or the like is efficiently dissipated. Cooler components such as heat exchangers and heat exchangers are needed.

【0003】このような冷却装置部品の1つとして、例
えば特開平10−185465号報で開示されているよ
うなプレート型ヒートパイプなどが提案されている。こ
のプレート型ヒートパイプは、アルミニウム合金材を複
数枚積層圧着し、積層境界面に蛇行した細径のトンネル
をロールボンド法により形成し、そのトンネル内にヒー
トパイプ作動液としてフロン134a等を封入してい
る。図1および図2に示すように、このプレート型ヒー
トパイプ1は2枚の金属薄板3、4を積層し熱間圧延に
て接合して、予め圧着防止剤を所定のパターンで塗布し
未圧着となった境界面のパターン部を膨管して前記蛇行
した細径のトンネル2を形成しており、単位幅あたりの
蛇行ターン数を格段に増加させることにより放熱性能を
向上させるものである。
As one of such cooling device parts, for example, a plate type heat pipe as disclosed in JP-A-10-185465 has been proposed. In this plate type heat pipe, a plurality of aluminum alloy materials are laminated and pressure-bonded to each other, and a tunnel having a small diameter meandering on the lamination boundary surface is formed by a roll bond method, and a Freon 134a as a heat pipe working fluid is enclosed in the tunnel. ing. As shown in FIGS. 1 and 2, this plate-type heat pipe 1 is formed by laminating two metal thin plates 3 and 4 and joining them by hot rolling, and applying a pressure-preventing agent in a predetermined pattern in advance and not pressing. The patterned portion of the boundary surface is expanded to form the narrow meandering tunnel 2, and the heat radiation performance is improved by significantly increasing the number of meandering turns per unit width.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上記の
ような従来のロールボンド法により形成した冷却装置部
品では、熱間圧延により金属薄板を接合するため母材の
変形が大きく、トンネルの形状を精度良く形成できない
ばかりでなく、接合面における異種金属間の合金化等に
より接合強度が低下する等の問題点も生じている。
However, in the cooling device component formed by the conventional roll bonding method as described above, the deformation of the base material is large because the thin metal plates are joined by hot rolling, and the shape of the tunnel is accurate. Not only is it difficult to form well, but there are also problems such as a decrease in bonding strength due to alloying between dissimilar metals on the bonding surface.

【0005】本発明は、上記のような技術的背景に鑑
み、軽量化や薄型化を可能とするプレート積層材、およ
びプレート積層材を用いた中空積層材、および中空積層
材を用いた部品を提供することを課題とする。
In view of the above technical background, the present invention provides a plate laminated material which can be made lighter and thinner, a hollow laminated material using the plate laminated material, and a component using the hollow laminated material. The challenge is to provide.

【0006】[0006]

【課題を解決するための手段】前記課題に対する第1の
解決手段として本発明のプレート積層材は、複数枚のプ
レート材を積層接合してなるプレート積層材であって、
少なくともいずれか一対の対向するプレート材間に所定
のパターンで接合抑止部を形成し、前記接合抑止部の1
箇所または複数箇所が開口予定部となる構成とした。ま
た好ましくは、前記積層接合が、前記プレート材の接合
面を予め活性化処理した後、活性化処理面同士が対向す
るように当接して重ね合わせて冷間圧接してなる構成と
した。さらに好ましくは、前記活性化処理が、不活性ガ
ス雰囲気中でグロー放電を行わせて、前記プレート材の
接合予定面側をそれぞれスパッタエッチング処理する構
成とした。
As a first solution to the above-mentioned problems, a plate laminated material of the present invention is a plate laminated material obtained by laminating and joining a plurality of plate materials,
A joining inhibiting portion is formed in a predetermined pattern between at least one pair of opposing plate materials, and
The structure is such that a part or a plurality of parts are planned opening parts. Further, preferably, the laminated joining is configured such that after the joining surfaces of the plate materials are previously subjected to activation treatment, they are brought into contact with each other so that the activation treated surfaces face each other and are overlapped and cold pressed. More preferably, in the activation treatment, glow discharge is performed in an inert gas atmosphere, and sputter etching treatment is performed on the joining surface side of the plate material.

【0007】前記課題に対する第2の解決手段として本
発明の中空積層材は、前記プレート積層材の接合抑止部
に所定形状の中空部を形成してなる構成とした。
As a second means for solving the above-mentioned problems, the hollow laminated material of the present invention has a constitution in which a hollow portion having a predetermined shape is formed in the joint inhibiting portion of the plate laminated material.

【0008】前記課題に対する第3の解決手段として本
発明の部品は、1箇所または複数箇所の開口部を有する
前記中空積層材を用いてなる構成とした。
As a third means for solving the above-mentioned problems, the component of the present invention is constituted by using the hollow laminated material having one or a plurality of openings.

【0009】[0009]

【発明の実施の形態】以下に、本発明の実施形態を説明
する。図3は、本発明の中空積層材の一実施形態を示す
概略平面図であり、一本の細長いトンネル状の中空部1
1が蛇行した例を示す。なお図中11aは、開口部であ
る。図4は、本発明の中空積層材の一実施形態を示す概
略断面図であり、2枚のプレート材12、13の少なく
ともいずれか一方例えばプレート材12に凹部16を設
けることにより中空部を形成した例を示す。図5は、本
発明の中空積層材の他の実施形態を示す概略断面図であ
り、2枚のプレート材12、13の少なくともいずれか
一方例えばプレート材12に薄肉加工を施すことにより
凹部16を設けて中空部を形成した例を示す。図6は、
本発明の中空積層材のさらに他の実施形態を示す概略断
面図であり、3枚のプレート材12、13、14のうち
中間に位置するプレート材12に貫通部17を設けるこ
とにより中空部を形成した例を示す。図7は、本発明の
中空積層材のさらに他の実施形態を示す概略断面図であ
り、中空部を形成するプレート材のいずれか一方の側を
プレート材12、14からなる2層の積層材で構成した
例を示す。図8は、本発明の中空積層材のさらに他の実
施形態を示す概略断面図であり、中空部を形成するプレ
ート材の双方の側をプレート材12、14およびプレー
ト材13、15からなるそれぞれ2層の積層材で構成し
た例を示す。図9は、本発明の中空積層材のさらに他の
実施形態を示す概略断面図であり、2重構造の中空部を
有する形態を示す。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. FIG. 3 is a schematic plan view showing an embodiment of the hollow laminated material of the present invention, in which one elongated tunnel-shaped hollow portion 1 is provided.
An example in which 1 meanders is shown. In the figure, 11a is an opening. FIG. 4 is a schematic sectional view showing an embodiment of the hollow laminated material of the present invention. At least one of the two plate materials 12 and 13, for example, the plate material 12 is provided with a concave portion 16 to form a hollow portion. Here is an example. FIG. 5 is a schematic cross-sectional view showing another embodiment of the hollow laminated material of the present invention. At least one of the two plate materials 12 and 13 such as the plate material 12 is thinned to form the recess 16 therein. An example in which a hollow portion is formed by providing is shown. Figure 6
It is a schematic sectional drawing which shows further another embodiment of the hollow laminated material of this invention, A hollow part is provided by providing the penetration part 17 in the plate material 12 located in the middle among the three plate materials 12, 13, and 14. As shown in FIG. The example formed is shown. FIG. 7 is a schematic cross-sectional view showing still another embodiment of the hollow laminated material of the present invention, which is a two-layer laminated material including plate materials 12 and 14 on one side of the plate material forming the hollow portion. An example configured with is shown below. FIG. 8 is a schematic cross-sectional view showing still another embodiment of the hollow laminated material of the present invention, in which both sides of the plate material forming the hollow portion are composed of plate materials 12 and 14 and plate materials 13 and 15, respectively. An example constituted by a two-layer laminated material is shown. FIG. 9 is a schematic cross-sectional view showing still another embodiment of the hollow laminated material of the present invention, showing a form having a hollow portion having a double structure.

【0010】プレート材12の材質としては、中空積層
材を製造可能な素材であれば特にその種類は限定され
ず、中空積層材の用途により適宜選択して用いることが
できる。例えば、常温で固体である金属(例えば、A
l、Fe、Ni、Cu、Zn、Pd、Ag、Sn、P
t、Auなど)やこれらの金属のうち少なくとも1種類
を含む合金(例えば、JISに規定の合金など)あるい
はこれらの金属や合金を少なくとも1層有する積層体
(例えば、クラッド材、メッキ材、蒸着膜材など)など
を適用することができる。さらに上記の金属や合金は、
アモルファス体であっても構わない。また高分子材料や
高分子材料に上記の金属や合金を積層した積層体なども
用いることができる。中空積層材の用途が熱交換器など
であれば、熱伝導性に優れた金属であるCu、Al、N
iなどやこれらの金属のうち少なくとも1種類を含む合
金あるいはこれらの金属や合金を少なくとも1層有する
積層体などを適用することができる。
The material of the plate material 12 is not particularly limited as long as it is a material capable of producing a hollow laminated material, and can be appropriately selected and used according to the application of the hollow laminated material. For example, a metal that is solid at room temperature (for example, A
l, Fe, Ni, Cu, Zn, Pd, Ag, Sn, P
t, Au, etc.), alloys containing at least one of these metals (eg, alloys specified in JIS, etc.), or laminates having at least one layer of these metals or alloys (eg, clad material, plating material, vapor deposition). Membrane material etc.) can be applied. Furthermore, the above metals and alloys
It may be an amorphous body. Further, a polymer material or a laminated body in which the above metal or alloy is laminated on the polymer material can also be used. If the application of the hollow laminated material is a heat exchanger or the like, Cu, Al, N, which are metals having excellent thermal conductivity,
i or the like, an alloy containing at least one of these metals, or a laminate having at least one layer of these metals or alloys can be applied.

【0011】JISに規定の合金としては、例えば、鉄
鋼材料では、合金鉄、構造用鋼、圧力容器鋼、薄鋼板、
ステンレス鋼、耐熱鋼、超合金、磁気材料など、Cu系
合金では、例えばJIS H 3100に記載の無酸素
銅、タフピッチ銅、りん脱酸銅、丹銅、黄銅、快削黄
銅、すず入り黄銅、アドミラルティ黄銅、ネーバル黄
銅、アルミニウム青銅、りん青銅、白銅など、Al系合
金では、例えばJIS H4000あるいは4160に
記載の1000系、2000系、3000系、5000
系、6000系、7000系など、Ni系合金では、例
えばJIS H4551に記載の常炭素ニッケル、低炭
素ニッケル、ニッケル−銅合金、ニッケル−銅−アルミ
ニウム−チタン合金、ニッケル−モリブデン合金、ニッ
ケル−モリブデン−クロム合金、ニッケル−クロム−鉄
−モリブデン−銅合金、ニッケル−クロム−モリブデン
−鉄合金、ニッケル−鉄合金、ニッケル−クロム−鉄合
金などを適用することができる。
Examples of alloys defined in JIS include iron alloy steel, structural steel, pressure vessel steel, thin steel sheet,
For Cu-based alloys such as stainless steel, heat-resistant steel, superalloys and magnetic materials, for example, oxygen-free copper, tough pitch copper, phosphorous deoxidized copper, brass, brass, free-cutting brass, tin-containing brass described in JIS H 3100, For Al-based alloys such as Admiralty brass, Naval brass, aluminum bronze, phosphor bronze, and white copper, for example, 1000 series, 2000 series, 3000 series, 5000 described in JIS H4000 or 4160.
Examples of Ni-based alloys such as those based on JIS H4551 include normal carbon nickel, low carbon nickel, nickel-copper alloys, nickel-copper-aluminum-titanium alloys, nickel-molybdenum alloys, nickel-molybdenum alloys. -Chromium alloy, nickel-chromium-iron-molybdenum-copper alloy, nickel-chromium-molybdenum-iron alloy, nickel-iron alloy, nickel-chromium-iron alloy, etc. can be applied.

【0012】またプレート材12の厚みも中空積層材の
用途により適宜選定して用いることができる。例えば、
5〜1000μmである。5μm未満の場合にはプレー
ト材としての製造が難しくなり、1000μmを超える
と中空積層材しての製造が難しくなる。好ましくは、1
0〜500μmである。なおプレート材12は概略平板
であればよく多少の凹凸や湾曲などがあってもよい。
The thickness of the plate material 12 can be appropriately selected and used depending on the application of the hollow laminated material. For example,
It is 5 to 1000 μm. When it is less than 5 μm, it becomes difficult to manufacture it as a plate material, and when it exceeds 1000 μm, it becomes difficult to manufacture it as a hollow laminated material. Preferably 1
It is 0 to 500 μm. It should be noted that the plate member 12 may be a substantially flat plate and may have some irregularities or curves.

【0013】プレート材13、14、15の材質や厚み
などの寸法や形状は、プレート材12に適用できるもの
であれば特に限定されず、中空積層材の用途により適宜
選定して用いることができ、プレート材12と同じでも
よいし異なっていてもよいし、互いに同じでも異なって
いてもよい。
The size and shape of the plate materials 13, 14, 15 such as material and thickness are not particularly limited as long as they can be applied to the plate material 12, and can be appropriately selected and used according to the application of the hollow laminated material. The plate material 12 may be the same as or different from each other, or may be the same as or different from each other.

【0014】本発明の中空積層材は、例えば図4に示す
ように、2枚のプレート材12、13の対向面に所定の
パターンの接合抑止部を形成するように、接合抑止剤な
どを塗布して活性化処理を行った後積層接合してプレー
ト積層材20を製造した後、必要により所定の大きさに
切り出し、このプレート積層材20の接合抑止部をエア
ーなどによる金型膨管などにより膨らませて中空部11
を形成することによって製造することができる。
For example, as shown in FIG. 4, the hollow laminated material of the present invention is coated with a bonding inhibitor or the like so as to form a bonding inhibiting portion having a predetermined pattern on the opposing surfaces of the two plate materials 12 and 13. After performing the activation process, the plate-laminated material 20 is manufactured by laminating and joining, and then cut to a predetermined size if necessary, and the joining-inhibiting portion of the plate-laminating material 20 is blown by a mold expansion tube such as air. Inflated and hollow part 11
Can be manufactured by forming.

【0015】本発明の中空積層材の製造方法について以
下に説明する。まず図7、図8で用いられる2層の積層
材、すなわちプレート材12、14やプレート材13、
15からなる積層材の製造方法について説明する。図1
0に示す積層材製造装置50において、巻き戻しリール
62から巻き戻されたプレート材12を、活性化処理装
置70で活性化処理する。同様にして巻き戻しリール6
4から巻き戻されたプレート材14を、活性化処理装置
80で活性化処理する。活性化処理された面同士が当接
するように、プレート材12、14を圧接ユニット60
で冷間圧接して積層接合してプレート積層材20を製造
し、巻き取りロール66で巻き取る。また必要により、
巻き取りロール部の代わりに所定の大きさに切り出す切
り出し工程を設けても良い。このようにして2層の積層
材を製造することができる。
The method for producing the hollow laminated material of the present invention will be described below. First, the two-layer laminated material used in FIGS. 7 and 8, that is, the plate materials 12 and 14 and the plate material 13,
A method of manufacturing the laminated material composed of 15 will be described. Figure 1
In the laminated material manufacturing apparatus 50 shown in FIG. 0, the plate material 12 rewound from the rewind reel 62 is activated by the activation processing device 70. Similarly, rewind reel 6
The plate material 14 unwound from No. 4 is activated by the activation processing device 80. The plate members 12 and 14 are pressed against each other so that the activated surfaces come into contact with each other.
Then, the plate laminated material 20 is manufactured by cold pressure welding and laminating and joining, and is wound by the winding roll 66. If necessary,
Instead of the take-up roll unit, a cutting process for cutting into a predetermined size may be provided. In this way, a two-layer laminated material can be manufactured.

【0016】活性化処理は、以下のようにして実施す
る。すなわち、活性化処理装置70に投入されたプレー
ト材12をアース接地した一方の電極A(電極ロール7
2)と接触させ、絶縁支持された他の電極B(電極7
4)との間でスパッタエッチングによる活性化処理を行
う。同様にして活性化処理装置80に投入されたプレー
ト材14をアース接地した一方の電極A(電極ロール8
2)と接触させ、絶縁支持された他の電極B(電極8
4)との間でスパッタエッチングによる活性化処理を行
う。活性化処理は、10〜1×10−3Paの極低圧不
活性ガス雰囲気好ましくはアルゴンガス中で、電極A、
B間に1〜50MHzの交流を印加してグロー放電を行
わせ、グロー放電によって生じたプラズマ中に露出され
る電極Aの面積が、実効的に電極Bの面積の1/3以下
となるように、スパッタエッチング処理する。なお不活
性ガス圧力が1×10−3Pa未満では安定したグロー
放電が行いにくく高速エッチングが困難であり、10P
aを超えると活性化処理効率が低下する。印加する交流
は、1MHz未満では安定したグロー放電を維持するの
が難しく連続エッチングが困難であり、50MHzを超
えると発振し易く電力の供給系が複雑となり好ましくな
い。また効率よくエッチングするためには電極Aの面積
を電極Bの面積より小さくする必要があり、実効的に1
/3以下とすることにより充分な効率でエッチング可能
となる。
The activation process is carried out as follows. That is, the one electrode A (electrode roll 7) in which the plate material 12 put in the activation processing device 70 is grounded
2) The other electrode B (electrode 7) which is brought into contact with and insulated and supported.
4) and the activation treatment by sputter etching are performed. Similarly, the electrode A (electrode roll 8
2) Another electrode B (electrode 8) which is brought into contact with and insulated and supported.
4) and the activation treatment by sputter etching are performed. The activation treatment is carried out by using the electrode A in an extremely low pressure inert gas atmosphere of 10 to 1 × 10 −3 Pa, preferably argon gas.
An alternating current of 1 to 50 MHz is applied between B to cause glow discharge, and the area of the electrode A exposed in the plasma generated by the glow discharge is effectively 1/3 or less of the area of the electrode B. Then, the sputter etching process is performed. When the inert gas pressure is less than 1 × 10 −3 Pa, stable glow discharge is difficult to perform, and high-speed etching is difficult.
If it exceeds a, the activation treatment efficiency will decrease. If the applied alternating current is less than 1 MHz, it is difficult to maintain stable glow discharge and continuous etching is difficult, and if it exceeds 50 MHz, oscillation is likely to occur and the power supply system is complicated, which is not preferable. In addition, the area of the electrode A needs to be smaller than the area of the electrode B in order to perform the etching efficiently.
By setting the ratio to / 3 or less, etching can be performed with sufficient efficiency.

【0017】積層接合は、以下のようにして実施する。
すなわち、プレート材12、14の活性化処理された面
が対向するようにして両者を当接して重ね合わせて圧接
ユニット60で冷間圧接することにより積層接合を達成
することできる。この際の積層接合は、低温度・低圧延
率下で可能であり、熱間圧接や高圧延率の圧接における
ようなプレート材ならびに積層接合部に組織変化や合金
化、破断等といった悪影響を軽減または排除することが
可能である。このときプレート材の温度T(℃)は、0
℃<T≦300℃であることが好ましい。0℃以下では
大掛かりな冷却装置が必要となり、300℃を超えると
接合部が合金化し接合強度が低下するため好ましくな
い。また圧延率R(%)は、0.1%≦R≦30%であ
ることが好ましい。0.1%未満では充分な接合強度が
得られず、30%を超えると変形が大きくなり加工精度
上好ましくない。
The laminated joining is carried out as follows.
That is, it is possible to achieve laminated bonding by bringing the plate materials 12 and 14 into contact with each other so that the activated surfaces thereof face each other, superposing them, and cold-pressing them with the press-contacting unit 60. Lamination joining at this time can be performed at low temperature and low rolling rate, reducing adverse effects such as microstructural change, alloying, fracture, etc. on plate materials and laminated joints such as in hot pressure welding and high rolling rate pressure welding. Or it can be eliminated. At this time, the temperature T (° C) of the plate material is 0
It is preferable that the temperature is <T ≦ 300 ° C. If the temperature is lower than 0 ° C, a large-scale cooling device is required, and if the temperature exceeds 300 ° C, the joint is alloyed and the joint strength is lowered, which is not preferable. The rolling ratio R (%) is preferably 0.1% ≦ R ≦ 30%. If it is less than 0.1%, sufficient bonding strength cannot be obtained, and if it exceeds 30%, deformation becomes large, which is not preferable in terms of processing accuracy.

【0018】次に図3に示す中空積層材の製造方法につ
いて、接合抑止剤を用いた場合を例に取り説明する。図
3に示される中空積層材10において、11は中空部で
ある。この中空部11は、次のようにして形成すること
ができる。図4に示すように、まず2枚のプレート材1
2、13の対向面に中空部形状に対応した所定のパター
ンの接合抑止部を形成するように、少なくとも一方のプ
レート材に接合抑止剤などを塗布する。例えば図10に
示した積層材製造装置50において、プレート材14の
代わりにプレート材13を用い、プレート積層材20の
代わりにプレート積層材として、活性化処理装置70、
80の少なくともいずれか一方の前に、すなわち巻き戻
しリールと活性化処理装置の間に、所定パターンの接合
抑止剤を印刷する工程や装置を設けることにより、巻き
戻されたプレート材に接合抑止剤を所定パターンで塗布
することが可能となる。接合抑止剤の塗布はパターン印
刷などにより行うことができる。接合抑止剤としては、
例えばコロイド状グラファイトを主成分とするインキな
どを用いることができる。接合抑止剤の塗布厚さは、そ
の後に施す活性化処理により消失しない程度の厚さか、
または積層接合時に接合抑止部が接合されない程度にし
ておくことができる。
Next, the method for manufacturing the hollow laminated material shown in FIG. 3 will be described by taking the case of using a bonding inhibitor as an example. In the hollow laminated material 10 shown in FIG. 3, 11 is a hollow part. The hollow portion 11 can be formed as follows. As shown in FIG. 4, first, two plate materials 1
At least one of the plate materials is coated with a bonding inhibitor so as to form a bonding inhibition portion having a predetermined pattern corresponding to the shape of the hollow portion on the opposing surfaces of 2 and 13. For example, in the laminated material manufacturing apparatus 50 shown in FIG. 10, the plate material 13 is used instead of the plate material 14, and the plate laminated material is used instead of the plate laminated material 20.
By providing a step or a device for printing a bonding inhibitor having a predetermined pattern in front of at least one of 80, that is, between the rewinding reel and the activation processing device, the bonding inhibitor can be applied to the unwound plate material. Can be applied in a predetermined pattern. The application of the bonding inhibitor can be performed by pattern printing or the like. As a bonding inhibitor,
For example, an ink containing colloidal graphite as a main component can be used. The coating thickness of the bonding inhibitor should be such that it does not disappear due to the activation treatment applied afterwards.
Alternatively, it may be set such that the joining suppressing portion is not joined at the time of stacking and joining.

【0019】その後プレート材12、13の対抗面に活
性化処理装置70、80で活性化処理を行い、プレート
材12、13の活性化処理された面が対向するようにし
て両者を当接して重ね合わせて圧接ユニット60で冷間
圧接して積層接合し、プレート積層材20を製造するこ
とができる。このように積層接合することにより、接合
抑止剤の付着していなかった部分のみが圧接され、接合
抑止剤の付着していた部分には接合抑止部が形成され
る。その後、必要により所定の大きさに切り出して本発
明の接合抑止部を有するプレート積層材20を製造する
ことができる。またプレート積層材20の接合部に表裏
面を貫くような貫通孔を設けてもよい。なお接合抑止剤
の印刷工程や装置は、活性化処理装置の後に、すなわち
活性化処理装置と圧接ユニットの間に設置してもよい。
Thereafter, the opposing surfaces of the plate materials 12 and 13 are activated by the activation processing devices 70 and 80, and the two surfaces are brought into contact with each other so that the activated surfaces of the plate materials 12 and 13 face each other. The plate laminated material 20 can be manufactured by stacking and laminating them by cold pressure welding with the pressure welding unit 60. By laminating and joining in this manner, only the portion to which the joining inhibitor is not attached is pressure-contacted, and the joining inhibitor is formed to the portion to which the joining inhibitor is attached. Then, if necessary, the plate laminated material 20 having the joining inhibiting portion of the present invention can be manufactured by cutting it into a predetermined size. Further, a through hole penetrating the front and back surfaces may be provided in the joint portion of the plate laminated material 20. The printing process and the device of the bonding inhibitor may be installed after the activation processing device, that is, between the activation processing device and the pressure contact unit.

【0020】本発明の中空積層材は、上記のようにして
製造されたプレート積層材を、必要により切り出して、
プレート積層材の接合抑止部に開口部11aから圧縮空
気などを送り込み、必要により金型などを用いて、プレ
ート材の少なくとも一方の面を膨らませたものである。
このようにして中空部11が形成される。また必要によ
り、中空部内を洗浄し余分な接合抑止剤を除去してもよ
い。以上のようにして本発明の中空部11を有する中空
積層材10を製造することができる。なお複数の開口部
は膨管の後に形成してもよいし、膨管前にプレート積層
材の状態で開口予定部を有していてもよい。
The hollow laminated material of the present invention is obtained by cutting out the plate laminated material produced as described above, if necessary.
Compressed air or the like is sent from the opening 11a to the joint-inhibiting portion of the plate laminated material, and at least one surface of the plate material is inflated by using a mold or the like if necessary.
In this way, the hollow portion 11 is formed. Further, if necessary, the inside of the hollow portion may be washed to remove an excessive bonding inhibitor. As described above, the hollow laminated material 10 having the hollow portion 11 of the present invention can be manufactured. Note that the plurality of openings may be formed after the expansion tube, or may have a predetermined opening in the plate laminated material before the expansion tube.

【0021】また前記の圧接ユニットを、プレス加工装
置などと置き換えることによっても積層接合が達成され
る。さらに接合抑止剤印刷後またはスパッタエッチング
処理後に、プレート材などを所定の大きさに切り出した
後積層し、プレス加工を行うことも可能である。また先
にプレート材などを所定の大きさに切り出した後に、ス
パッタエッチング処理・接合抑止剤印刷を行って、積層
しプレス加工を行うことも可能である。なお切り出した
後にスパッタエッチング処理をする場合は、プレート材
を絶縁支持された一方の電極Aとし、アース接地した他
の電極Bとの間で活性化処理を行うこともできる。
Laminated joining can also be achieved by replacing the above pressure contact unit with a press working device or the like. Further, after printing the bonding inhibitor or after the sputter etching treatment, it is possible to cut a plate material or the like into a predetermined size, laminate the same, and press the plate material. Further, it is also possible to first cut a plate material or the like into a predetermined size, perform sputter etching treatment / bonding inhibitor printing, and stack and press. In the case where the sputter etching process is performed after cutting, the plate member may be the one electrode A which is insulated and supported, and the activation process may be performed with the other electrode B grounded.

【0022】図4に示す中空積層材は、図10に示す積
層材製造装置50において、圧接ユニット60の圧接ロ
ール面に接合抑止部の所定パターンに対応した例えば窪
みなどの非圧接部を設けることによってプレート積層材
20を製造し、このプレート積層材20を膨管すること
によっても製造することができる。なお接合抑止剤など
を併用してもよい。
In the laminated material manufacturing apparatus 50 shown in FIG. 10, the hollow laminated material shown in FIG. 4 is provided with a non-pressure contact portion such as a recess corresponding to a predetermined pattern of the joint inhibition portion on the pressure contact roll surface of the pressure contact unit 60. It is also possible to manufacture the plate laminated material 20 by using the above method and to inflate the plate laminated material 20. In addition, you may use a joint inhibitor etc. together.

【0023】図5に示すような中空積層材は、少なくと
もいずれか一方のプレート材に所定パターンの薄肉加工
を施すことによって凹部を形成することで、接合抑止部
となすものである。すなわち予め薄肉部が形成されたプ
レート材を図10に示す積層材製造装置に装填して積層
接合を施すか、あるいは巻き戻しリールと活性化処理装
置の間に薄肉加工の工程や装置を設けることにより、巻
き戻されたプレート材に薄肉加工を施したうえで積層接
合を施して中空積層材を製造することができる。さらに
このようにして製造された中空積層材に、必要により膨
管などの加工を施してもよい。
In the hollow laminated material as shown in FIG. 5, at least one of the plate materials is thinned in a predetermined pattern to form a concave portion, thereby forming a joint inhibiting portion. That is, a plate material on which a thin portion is formed in advance is loaded into the laminated material manufacturing apparatus shown in FIG. 10 to perform laminated joining, or a thin-wall processing step or apparatus is provided between the rewind reel and the activation processing apparatus. Thus, the rewound plate material can be thin-walled and then laminated and joined to manufacture a hollow laminated material. Further, the hollow laminated material produced in this manner may be subjected to processing such as an expansion tube if necessary.

【0024】図6に示すような中空積層材は、所定パタ
ーンの貫通孔を有するプレート材の貫通孔を、他のプレ
ート材で塞ぐことにより中空部を形成するものであり、
この貫通孔が接合抑止部となる。さらにこのようにして
製造された中空積層材に、必要により膨管などの加工を
施してもよい。
The hollow laminated material as shown in FIG. 6 forms a hollow portion by closing a through hole of a plate material having a predetermined pattern of through holes with another plate material.
This through hole serves as a joint inhibiting portion. Further, the hollow laminated material produced in this manner may be subjected to processing such as an expansion tube if necessary.

【0025】図7、8に示すような中空積層材は、図1
0に示す積層材製造装置50において、プレート材1
2、13の代わりに2層のプレート積層材20を用いる
ことにより製造することができる。例えば、図8に示す
ような中空積層材では、中空部の両側に用いる積層材と
して銅板12、13にそれぞれアルミニウム板14、1
5を積層接合した2層の積層材を用いてもよい。これに
より中空部内に水などの液体や気体が存在する場合に銅
板を内側に用いて耐食性を高めたり、銅−アルミニウム
の積層材を用いて銅板のみの場合よりも軽量化を図った
り比強度を高めたりすることができる。また銅板の厚さ
を0.01〜0.1mmとすることが好ましい。0.0
1mm未満では充分な耐食性が得られず、0.1mmよ
り厚くなれば重くなりすぎるとともに強度面から積層接
合して補強する必要もなくなる。またアルミニウム板の
厚さは0.05〜1.0mmとすることが好ましい。
0.05mm未満では充分な強度を得られず、1.0m
mより厚くなれば重くなりすぎるため好ましくない。
The hollow laminated material as shown in FIGS.
In the laminated material manufacturing apparatus 50 shown in FIG.
It can be manufactured by using a two-layer plate laminated material 20 in place of 2, 13. For example, in the hollow laminated material as shown in FIG. 8, as the laminated materials used on both sides of the hollow portion, aluminum plates 14 and 1 are provided on copper plates 12 and 13, respectively.
You may use the laminated material of 2 layers which laminated | stacked and joined 5. With this, when a liquid or gas such as water is present in the hollow portion, a copper plate is used on the inside to enhance corrosion resistance, and a copper-aluminum laminated material is used to achieve weight reduction or specific strength compared to the case where only the copper plate is used. It can be raised. Further, the thickness of the copper plate is preferably 0.01 to 0.1 mm. 0.0
If it is less than 1 mm, sufficient corrosion resistance cannot be obtained, and if it is thicker than 0.1 mm, it becomes too heavy and it is not necessary to laminate and reinforce from the viewpoint of strength. The thickness of the aluminum plate is preferably 0.05-1.0 mm.
If it is less than 0.05 mm, sufficient strength cannot be obtained and 1.0 m
If it is thicker than m, it becomes too heavy, which is not preferable.

【0026】本発明の中空積層材では、図9に示すよう
に、中空部の一部が多重構造を有していてもよい。この
ような中空部は、内側の中空部を膨管した後外側の中空
部を膨管する多段膨管であってもよいし、同時に膨管し
てもよい。このとき内側の中空部の膨管圧力を外側より
高くすることにより達成することが可能である。また中
空部は同形状であってもよいし異形状であってもよい
し、内側と外側の開口部は同一箇所または別々の箇所の
いずれに設けてもよい。
In the hollow laminated material of the present invention, as shown in FIG. 9, a part of the hollow portion may have a multiple structure. Such a hollow part may be a multi-stage expansion tube in which the inner hollow part is expanded and then the outer hollow part is expanded, or simultaneously expanded. At this time, it can be achieved by making the inflation tube pressure of the inner hollow portion higher than that of the outer portion. The hollow portions may have the same shape or different shapes, and the inner and outer openings may be provided at the same location or different locations.

【0027】さらに本発明の部品は、1箇所または複数
箇所の開口部を有する中空積層材を用いたものである。
複数箇所の開口部を有する部品では、中空部内部で部分
的連通している形態や非連通である形態などが可能であ
る。例えば、2つの開口部を有し、中空部内部で連通し
ているものは、一体型の配管などとして利用することが
できる。このような一体型の配管を用いることで、通常
の配管よりも中空部を形成する部分に加わる振動を抑制
することなどが可能である。多重構造の中空部を有する
ものは熱交換器部品などにも用いることができる。また
2つの開口部を有していても中空部内部で非連通である
ものは、2系統のプレート型ヒートパイプなどに用いる
ことができる。なお1箇所の開口部を有する部品は、1
系統のプレート型ヒートパイプなどに用いることができ
る。
Furthermore, the component of the present invention uses a hollow laminated material having openings at one or a plurality of locations.
In the case of a component having a plurality of openings, it is possible to have a form in which the hollow part is in partial communication or a non-communication form. For example, a pipe having two openings and communicating with each other inside the hollow portion can be used as an integrated pipe or the like. By using such an integrated pipe, it is possible to suppress the vibration applied to the portion forming the hollow portion as compared with the normal pipe. Those having a hollow portion having a multiple structure can also be used for heat exchanger parts and the like. Moreover, even if it has two openings, it can be used for a two-system plate heat pipe or the like that is not in communication inside the hollow portion. It should be noted that the number of parts having one opening is one
It can be used for a plate type heat pipe of a system.

【0028】プレート型ヒートパイプは、中空積層材を
作成した後、中空積層材の開口部11aを通じてヒート
パイプ作動体を所定量封入し、内部を所定の圧力、例え
ば、真空状態、減圧状態または大気圧程度などにして開
口部を溶接等の方法を用いて密封することにより製造す
ることができる。ヒートパイプ作動体としては取り扱い
の容易な液体、特に脱フロン化の観点等から、水、純水
または超純水を用いることができる。またこのようにし
て製造されたヒートパイプにおいては、中空部11内の
幅方向両側部に毛細管力によるヒートパイプ作動体の引
き込み部などが形成できるため、保持姿勢に影響される
ことなく放熱性能を発揮することが可能となる。
In the plate-type heat pipe, after the hollow laminated material is prepared, a predetermined amount of the heat pipe actuating body is enclosed through the opening 11a of the hollow laminated material, and the inside is subjected to a predetermined pressure, for example, a vacuum state, a reduced pressure state or a large pressure. It can be manufactured by setting the pressure to about atmospheric pressure and sealing the opening using a method such as welding. As the heat pipe actuating body, a liquid that is easy to handle, particularly water, pure water or ultrapure water can be used from the viewpoint of dechlorofluorocarbon conversion. In addition, in the heat pipe manufactured in this way, since the lead-in portion of the heat pipe actuating body due to the capillary force can be formed on both sides in the width direction inside the hollow portion 11, the heat dissipation performance is not affected by the holding posture. It is possible to demonstrate.

【0029】[0029]

【実施例】以下に、実施例を図面に基づいて説明する。
プレート材12、13として厚み100μmの無酸素銅
板を用いた。無酸素銅板に所定のパターンでインキを塗
布し、無酸素銅板とともに積層材製造装置50にセット
し、真空槽52内の活性化処理ユニット70および80
でスパッタエッチング法によりそれぞれ活性化処理し
た。次に圧接ユニット60を用いて、これら活性化処理
された無酸素銅板を、活性化処理面同士を重ね合わせて
圧接して積層接合してプレート積層材20を製造した。
次にプレート積層材20を所定の大きさに切り出して2
カ所の開口予定部を形成し、エアー膨管を行って2カ所
の開口部が連通する中空積層材10を製造した。さらに
中空積層材10の接合部18に部分的に貫通孔を設けて
一体型配管を製造した。
Embodiments Embodiments will be described below with reference to the drawings.
As the plate materials 12 and 13, 100 μm-thick oxygen-free copper plates were used. Ink is applied to the oxygen-free copper plate in a predetermined pattern and set in the laminated material manufacturing apparatus 50 together with the oxygen-free copper plate, and the activation processing units 70 and 80 in the vacuum tank 52 are set.
Were activated by the sputter etching method. Next, the pressure-bonding unit 60 was used to laminate the activation-treated oxygen-free copper plates so that the activation-treated surfaces were superposed on each other, and were pressure-bonded to each other to produce a plate laminated material 20.
Next, the plate laminated material 20 is cut into a predetermined size, and 2
A hollow laminated material 10 in which two openings are communicated with each other was manufactured by forming openings to be opened at one location and performing an air expansion tube. Further, a through hole was partially provided in the joint portion 18 of the hollow laminated material 10 to manufacture an integrated pipe.

【0030】[0030]

【発明の効果】以上説明したように本発明のプレート積
層材は、複数枚のプレート材を積層接合してなるプレー
ト積層材であって、少なくともいずれか一対の対向する
プレート材間に所定のパターンで接合抑止部を形成し、
接合抑止部の1箇所または複数箇所が開口予定部となる
ものである。また本発明の中空積層体は、接合抑止部が
中空部となるものである。さらに本発明の部品は、1箇
所または複数箇所の開口部を有する中空積層材を用いた
ものである。このため接合部に悪影響を及ぼすことがな
く、薄い金属板を低圧延率で接合が可能であるので形状
の高精度化および軽量薄形化を実現でき、各種の部品に
好適に用いることができる。
As described above, the plate laminated material of the present invention is a plate laminated material formed by laminating and joining a plurality of plate materials, and has a predetermined pattern between at least one pair of opposing plate materials. To form a joint deterrent
One or more places of the joining inhibiting portion are the planned opening portions. Further, in the hollow laminate of the present invention, the joint inhibiting portion is a hollow portion. Furthermore, the component of the present invention uses a hollow laminated material having openings at one or more locations. For this reason, it is possible to bond thin metal plates at a low rolling rate without adversely affecting the bonded part, so that it is possible to realize high precision of shape and weight reduction, and it is suitable for various parts. .

【図面の簡単な説明】[Brief description of drawings]

【図1】従来のプレート型ヒートパイプの概略平面図の
一実施例である。
FIG. 1 is an example of a schematic plan view of a conventional plate-type heat pipe.

【図2】従来のプレート型ヒートパイプの概略断面の一
実施例である。
FIG. 2 is an example of a schematic cross-section of a conventional plate heat pipe.

【図3】本発明の中空積層体の概略平面図の一実施形態
である。
FIG. 3 is an embodiment of a schematic plan view of a hollow laminate of the present invention.

【図4】本発明の中空積層体の概略断面図の一実施形態
である。
FIG. 4 is an embodiment of a schematic cross-sectional view of a hollow laminate of the present invention.

【図5】本発明の中空積層体の概略断面図の他の一実施
形態である。
FIG. 5 is another embodiment of the schematic cross-sectional view of the hollow laminate according to the present invention.

【図6】本発明の中空積層体の概略断面図のさらに他の
一実施形態である。
FIG. 6 is still another embodiment of the schematic cross-sectional view of the hollow laminate of the present invention.

【図7】本発明の中空積層体の概略断面図のさらに他の
一実施形態である。
FIG. 7 is another embodiment of the schematic cross-sectional view of the hollow laminate of the present invention.

【図8】本発明の中空積層体の概略断面図のさらに他の
一実施形態である。
FIG. 8 is still another embodiment of the schematic cross-sectional view of the hollow laminate according to the present invention.

【図9】本発明の中空積層体の概略断面図のさらに他の
一実施形態である。
FIG. 9 is another embodiment of the schematic cross-sectional view of the hollow laminate according to the present invention.

【図10】本発明に用いるプレート積層材の製造装置の
概略断面図の一実施形態である。
FIG. 10 is an embodiment of a schematic cross-sectional view of a plate laminated material manufacturing apparatus used in the present invention.

【符号の説明】[Explanation of symbols]

1 中空体 2 トンネル 3 金属薄板 4 金属薄板 5 接合部 6 膨管部 10 中空積層材 11 中空部(トンネル) 11a 開口部 12 プレート材 13 プレート材 14 プレート材 15 プレート材 16 凹部 17 貫通孔 18 接合部 19 接合部 20 プレート積層材 21 中空部(トンネル) 50 積層材製造装置 52 真空槽 60 圧接ユニット 62 巻き戻しリール 64 巻き戻しリール 66 巻き取りロール 70 活性化処理装置 72 電極ロール 74 電極 80 活性化処理装置 82 電極ロール 84 電極 A 電極A B 電極B 1 hollow body 2 tunnel 3 metal sheets 4 metal sheets 5 joints 6 Expansion tube 10 Hollow laminated material 11 Hollow part (tunnel) 11a opening 12 Plate material 13 Plate material 14 Plate material 15 Plate material 16 recess 17 Through hole 18 joints 19 joints 20 plate laminated material 21 Hollow part (tunnel) 50 Laminated material manufacturing equipment 52 vacuum chamber 60 pressure welding unit 62 Rewind reel 64 rewind reel 66 winding roll 70 Activation processing device 72 electrode roll 74 electrodes 80 Activation processor 82 electrode roll 84 electrodes A electrode A B electrode B

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F100 AB17 AR00A AR00C BA03 BA07 BA10A BA10C DB01B DD27B EC01 JJ01 JJ10 5E322 DB08    ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4F100 AB17 AR00A AR00C BA03                       BA07 BA10A BA10C DB01B                       DD27B EC01 JJ01 JJ10                 5E322 DB08

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 複数枚のプレート材を積層接合してなる
プレート積層材であって、少なくともいずれか一対の対
向するプレート材間に所定のパターンで接合抑止部を形
成し、前記接合抑止部の1箇所または複数箇所が開口予
定部となることを特徴とするプレート積層材。
1. A plate laminated material obtained by laminating and joining a plurality of plate materials, wherein a joint inhibiting portion is formed in a predetermined pattern between at least one pair of opposing plate materials. A plate laminated material characterized in that one or a plurality of places are to be openings.
【請求項2】 前記積層接合が、前記プレート材の接合
面を予め活性化処理した後、活性化処理面同士が対向す
るように当接して重ね合わせて冷間圧接してなることを
特徴とする請求項1に記載のプレート積層材。
2. The laminated bonding is characterized in that after the bonding surfaces of the plate materials are preliminarily activated, they are brought into contact with each other so that the activation surfaces face each other, and they are superposed and cold-pressed. The plate laminated material according to claim 1.
【請求項3】 前記活性化処理が、不活性ガス雰囲気中
でグロー放電を行わせて、前記プレート材の接合予定面
側をそれぞれスパッタエッチング処理することを特徴と
する請求項2に記載のプレート積層材。
3. The plate according to claim 2, wherein in the activation treatment, glow discharge is performed in an inert gas atmosphere, and sputter etching treatment is performed on each of the joining surface sides of the plate material. Laminated material.
【請求項4】 前記プレート積層材の接合抑止部に所定
形状の中空部を形成してなることを特徴とする中空積層
材。
4. A hollow laminated material, characterized in that a hollow portion having a predetermined shape is formed in a joint inhibiting portion of the plate laminated material.
【請求項5】 1箇所または複数箇所の開口部を有する
前記中空積層材を用いてなることを特徴とする部品。
5. A component comprising the hollow laminated material having openings at one or a plurality of locations.
JP2002100375A 2002-04-02 2002-04-02 Plate laminate, hollow laminate using plate laminate and plate heat pipe Expired - Lifetime JP4100497B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002100375A JP4100497B2 (en) 2002-04-02 2002-04-02 Plate laminate, hollow laminate using plate laminate and plate heat pipe

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Publication Number Publication Date
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Country Link
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017106672A (en) * 2015-12-10 2017-06-15 Leading Edge Associates株式会社 Heat radiator and manufacturing method of heat radiator
KR20180050930A (en) * 2016-11-07 2018-05-16 부경대학교 산학협력단 Method and apparatus for manufacturing heat spreader
JP2019082309A (en) * 2017-10-27 2019-05-30 新光電気工業株式会社 Loop type heat pipe and method for manufacturing loop type heat pipe
JP7464097B2 (en) 2018-06-29 2024-04-09 大日本印刷株式会社 Vapor chamber, electronic device, and method for manufacturing vapor chamber

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5960193A (en) * 1982-09-30 1984-04-06 Nippon Alum Mfg Co Ltd:The Heat exchanging element plate and manufacture thereof
JPH01224184A (en) * 1988-03-02 1989-09-07 Toyo Kohan Co Ltd Method and device for manufacturing clad metal plate
JPH08210790A (en) * 1995-02-01 1996-08-20 Mitsubishi Shindoh Co Ltd Heat pipe and its manufacture method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5960193A (en) * 1982-09-30 1984-04-06 Nippon Alum Mfg Co Ltd:The Heat exchanging element plate and manufacture thereof
JPH01224184A (en) * 1988-03-02 1989-09-07 Toyo Kohan Co Ltd Method and device for manufacturing clad metal plate
JPH08210790A (en) * 1995-02-01 1996-08-20 Mitsubishi Shindoh Co Ltd Heat pipe and its manufacture method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017106672A (en) * 2015-12-10 2017-06-15 Leading Edge Associates株式会社 Heat radiator and manufacturing method of heat radiator
KR20180050930A (en) * 2016-11-07 2018-05-16 부경대학교 산학협력단 Method and apparatus for manufacturing heat spreader
JP2019082309A (en) * 2017-10-27 2019-05-30 新光電気工業株式会社 Loop type heat pipe and method for manufacturing loop type heat pipe
JP6999452B2 (en) 2017-10-27 2022-01-18 新光電気工業株式会社 Loop type heat pipe and loop type heat pipe manufacturing method
JP7464097B2 (en) 2018-06-29 2024-04-09 大日本印刷株式会社 Vapor chamber, electronic device, and method for manufacturing vapor chamber

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