JP2006220382A - Plate piping body and component using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plate piping body having a hollow piping body in at least one part, and to provide a component using the plate piping body. <P>SOLUTION: This plate piping body 20 is produced by forming recessed parts that are hollow piping parts in at least one metal plate 22 of a plurality of metal plates, laminating the other metal plates 24, and joining them such that all or a part of the recessed parts is closed. Alternatively, the plate piping body is produced by forming the recessed parts in at least one part of one metal plate, laminating the other portions of the metal plate by bending, and joining all or a part of the recessed parts is closed. The component such as a thermal diffusion plate is produced by use of the plate piping body as a microheat pipe or the like. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plate pipe body in which a concave portion for forming a pipe portion is formed on a flat metal plate and laminated, and a component using a plate pipe body that can be used for a heat exchanger or the like.

In recent years, with the development of electronic devices, the mounting density of electronic components mounted on electronic substrates and the like has increased, and the use of packages having a size comparable to the size of semiconductor elements and the increase in density such as bare chip mounting of semiconductor elements The mounting method which aims at is progressing. Under such circumstances, how to protect the semiconductor element from the heat generation of the element itself has become a problem, and means for exhaust heat and the like are often discussed. In response to these problems, various heat diffusion techniques such as heat pipes have been proposed. Patent Documents 1 and 2 disclose a technique related to a hollow laminate that can be applied to a heat pipe or a heat sink having a tunnel-shaped hollow portion therein, and Patent Document 3 applies excessive heat or pressure. A technique for joining metal plates together is disclosed.
JP 2002-151537 A JP 2002-219582 A JP-A-1-224184

  It is an object of the present invention to provide a plate pipe body in which a concave portion for forming a pipe portion is provided on a flat metal plate, and a component using a plate pipe body that can be used for a heat exchanger or the like. And

  As a first solution to the above-mentioned problem, the plate piping body of the present invention is provided with a pipe-shaped recess in at least one of the plurality of metal plates, and other such that the recess is completely or partially closed. A hollow pipe having a predetermined shape is formed by being laminated and bonded to a metal plate. Alternatively, at least a part of one metal plate is provided with a pipe-shaped recess, and is laminated on the other part of the metal plate so as to completely or partially close the recess so that a hollow pipe having a predetermined shape is formed. Is formed. Further, the plate pipe body has a configuration in which the distance in the height direction of the hollow part is larger than the distance in the width direction of the hollow part in the cross-sectional shape of at least a part of the hollow pipe. Alternatively, the stacking is performed by press-contacting the plurality of metal plates by providing a non-pressurizing portion on the pressure-contact surface of the pressure-contacting device so as to correspond to the hollow pipe having the predetermined shape.

  As a second means for solving the above problems, the component of the present invention is configured to use the plate pipe body. Moreover, it was set as the structure applied to either a heat pipe, gas piping, a printed wiring board, an IC package, an interposer, and a MEMS use.

  In the present invention, as will be described below, the plate pipe body of the present invention is provided with a pipe-shaped recess in at least one of a plurality of metal plates (or at least a part of one metal plate). The hollow pipe having a predetermined shape is formed by being laminated on another metal plate (or other part of the metal plate) so as to completely or partially close the recess. These parts use plate piping. For this reason, heat pipes and heat sinks used for heat conduction and heat diffusion, printed wiring boards for the purpose of exhaust heat and heat dissipation, IC packages, interposers, CSPs (chip size packages or chip scale packages) and BGAs (ball grid arrays) ), And various MEMS (micro electro mechanical systems) applications.

  Hereinafter, embodiments of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing an embodiment of a plate piping body of the present invention, and shows an example in which two metal plates 22 and 24 are laminated. The metal plate 22 is a flat metal plate provided with a recess, and the metal plate 24 is not provided with a recess. In addition, in the plate piping body of this invention, the structure which provided the recessed part facing both metal plates can also be manufactured.

  As a metal plate used in the present invention, when a plurality of metal plates are used, at least one of the metal plates is a material that can be provided with a recess, and other metal is used so as to completely or partially close the recess. The material is not particularly limited as long as it is a material capable of producing a plate pipe body by stacking plates to form a hollow pipe having a predetermined shape, and can be appropriately selected depending on the use of the plate pipe body. In addition, when a single metal plate is used, a pipe-shaped recess is provided at least in part, and other portions of the metal plate are folded so as to completely or partially close the recess. The material is not particularly limited as long as it is a material capable of producing a plate pipe body by being laminated to form a hollow pipe having a predetermined shape, and can be appropriately selected and used depending on the use of the plate pipe body. For example, it is a metal that is solid at room temperature, an alloy containing at least one of these metals, or a laminate having at least one layer of these metals or alloys. The metal plate may be a plate material such as an electrolytic foil or a rolled foil, a plate material obtained by previously laminating a film material by plating or vapor deposition, or a laminate such as a clad material. The laminate may be subjected to diffusion treatment or the like.

  Examples of the metal that is solid at room temperature include Al, Mg, Fe, Ni, Co, Cu, Zn, Pb, Ti, Nb, W, Ag, Pt, Au, and Mo. The alloy containing at least one of these metals can include, for example, an alloy specified in JIS. In addition to alloy steel and stainless steel, in Cu-based alloys, oxygen-free copper, tough pitch copper, Phosphorus deoxidized copper, red brass, brass, free-cutting brass, tin-containing brass, admiralty brass, naval brass, aluminum bronze, bronze, etc. For Al alloys, 1000 series, 2000 series, 3000 series, 5000 series, 6000 series In the case of Ni-based alloys such as 7000 series, ordinary carbon nickel, low carbon nickel, nickel-copper alloy, nickel-copper-aluminum-titanium alloy, nickel-molybdenum alloy, nickel-molybdenum-chromium alloy, nickel-chromium-iron- There are molybdenum-copper alloy, nickel-chromium-molybdenum-iron alloy, and the like. An alloy layer such as an intermetallic compound can also be used. The laminate having at least one layer of these metals and alloys is, for example, a clad material, a plating material, a vapor deposition film material, etc., and the number of layers is not particularly limited.

  The thickness of the metal plate used for this invention will not be specifically limited if a plate piping body can be manufactured, It can select suitably according to the use of a plate piping body. For example, it is 5 to 500 μm. If the thickness is less than 5 μm, it is difficult to maintain sufficient mechanical strength. If the thickness exceeds 500 μm, the weight of the plate piping body becomes heavy or the manufacture becomes difficult. Preferably, it is 10-200 micrometers.

  A manufacturing method using the activated bonding method will be described with respect to the manufacturing of the plate pipe body 20 shown in FIG. When forming a hollow pipe using a plurality of metal plates, first, a forming process for providing a concave portion having a predetermined shape to be a pipe portion is performed on at least one metal plate. Next, a plurality of these metal plates are loaded into the vacuum chamber and transferred to the activation processing device in the vacuum layer and installed in a state where the surfaces to be processed are arranged facing each other or aligned in an appropriate position such as vertical or horizontal. Holding and fixing, activation processing is performed on the side to be bonded of each metal plate. Next, the activated surfaces of the metal plates are opposed to each other and pressed, so that a plurality of metal plates are joined and laminated to produce a plate pipe body having a hollow pipe having a predetermined shape. In this case, when the device that holds the metal plate also serves as the pressure welding device, the joining process is performed by pressing while being installed or held after the activation process, and when the device that holds the metal plate also does not serve as the pressure welding device, the pressing device. It can achieve by carrying out pressure welding by conveying to a pressure welding apparatus. Furthermore, the bonding process may be performed in the vacuum layer, or if the activation surface is not deactivated again due to oxidation or adsorption, the bonding process is performed by removing it from the vacuum layer for a relatively short time. May be.

The activation process is performed as follows. That is, the metal plates 22 and 24 loaded in the vacuum chamber are brought into contact with one of the electrodes A that are insulated and supported, and 10 to 1 × 10 ⁻³ Pa between the other electrode B that is grounded. In an extremely low pressure inert gas atmosphere, an alternating current of 1 to 50 MHz is applied to perform glow discharge, and each of the metal plates 22 and 24 that are in contact with the electrode A exposed to the plasma generated by the glow discharge is scheduled to be joined. Sputter etching is performed so that the area on the surface side is effectively 1/3 or less of the area of the electrode B. As the inert gas, helium, argon, neon, xenon, krypton, or a mixture containing these can be used. Preferred is helium or argon. If the inert gas pressure is less than 1 × 10 ⁻³ Pa, stable glow discharge is difficult to perform and high-speed etching is difficult, and if it exceeds 10 Pa, the activation treatment efficiency decreases. If the alternating current applied is less than 1 MHz, it is difficult to maintain a stable glow discharge, and continuous etching is difficult, and if it exceeds 50 MHz, oscillation tends to occur and the power supply system becomes complicated, which is not preferable. In order to perform etching efficiently, the area of each of the metal plates 22 and 24 in contact with the electrode A needs to be effectively smaller than the area of the electrode B. Etching becomes possible.

  Thereafter, the activated metal plates 22 and 24 are laminated and joined. Laminate joining can be achieved by bringing the metal plates 22 and 24 into contact with each other in such a manner that the surfaces to be joined face each other and performing cold pressure welding with an overlap pressure welding apparatus. Lamination bonding at this time can be performed at a low temperature, and adverse effects such as structural changes and formation of alloy layers at the metal plates 22 and 24 and the bonded portion can be reduced or eliminated. When T is the temperature (° C.) of the metal plates 22 and 24, a good pressure contact state is obtained at 0 ° C. <T <300 ° C. If it is 0 ° C. or lower, a special cooling device is required, and if it is 300 ° C. or higher, adverse effects such as changes in structure occur. The rolling rate R (%) is preferably 0.01% ≦ R ≦ 30%. If it is less than 0.01%, sufficient bonding strength cannot be obtained, and if it exceeds 30%, deformation becomes large, which is not preferable for processing. More preferably, 0.1% ≦ R ≦ 3%. More preferably, 1% <R ≦ 3%.

  The pressure welding apparatus is configured by a press die that holds or fixes a metal plate, and at least one of the press dies corresponds to the shape of the convex portion on the back surface of the metal plate in which the concave portion having a predetermined shape is formed. A depression is provided, and the convex portion of the metal plate, that is, the concave portion forming the pipe is arranged so as not to be deformed during the pressure welding. The pressure welding device is not limited to the press device, and may use a processing method such as roll forming. In these cases, the above-mentioned depression may be provided in the roll or the mold. The mold can be manufactured by electric discharge machining or etching.

  The cross-sectional shape of the hollow pipe portion of the plate pipe body is not limited to a specific one, and various forms can be adopted depending on the application. For example, this is the case where the distance from the height direction is larger than the distance from the width direction of the hollow pipe portion. This is because the plate piping body may sacrifice the mechanical properties of the plate piping body when it is aimed to reduce the thickness of the metal plate for the purpose of weight reduction. It was not so suitable in the field. In such a case, it is possible to cope with the rigidity problem by taking the height larger than the length in the width direction of the hollow pipe portion. In addition, when the plate piping body requires heat dissipation such as a heat diffusion plate, the effective surface area increases with respect to the bottom area of the plate piping body due to the height of the piping section. It has the effect of improving heat dissipation. The cross-sectional shape may be a triangular shape or a square shape such as a circular shape, an elliptical shape, or a trapezoidal shape.

  In addition, when forming a hollow pipe using a single metal plate, a forming process for providing a concave portion having a predetermined shape to be a pipe portion is performed on at least a part of the metal plate and loaded into the vacuum layer to activate the pipe. The process is applied. Next, a process of folding the other part of the metal plate is performed so as to completely or partially close the recess by a bending process or the like. The folding process may be performed so that opposing portions of the metal plate are in close contact with each other, or a gap may be left. By performing this folding process, the activation processing surfaces can be made to face each other, and a plate pipe body having a hollow pipe of a predetermined shape can be manufactured by performing pressure contact processing on this. It should be noted that the folding process can be performed in such a way that the portion that becomes the fold of the fold does not have the activation process or is weak even if activated. For example, the activity can be suppressed by recessing the crease when forming the recess by press working or by applying an agent that prevents or weakens activation to the crease. Alternatively, it is possible to use a method in which a relatively shallow crease is made in advance while considering the electrode shape of the activation processing apparatus.

  By laminating and bonding as described above, the plate pipe body 20 having a predetermined shape can be formed. Further, if necessary, the plate pipe body 20 as shown in FIG. 1 can be manufactured by cutting it into a predetermined size. Further, the plate pipe body 20 manufactured in this way may be subjected to heat treatment within a range that does not cause a problem in order to remove or reduce residual stress, if necessary, and a film material such as solder plating is laminated. May be. Further, a sputtering process may be inserted between the activation treatment process and the laminating and bonding process, and one or both of the metal plates 22 and 24 may be formed with the same or different types of sputtering layers. It is also possible to use a heat-pressure welding method instead of the above-described activated bonding method. It is also possible to provide an adhesive layer such as a brazing material or a resin for bonding. For example, the above-mentioned laminated material shown in FIG.

  The component of the present invention uses a plate piping body, and can be used for a heat diffusion plate or the like as a flat plate type micro heat pipe having a small-diameter cavity. Since the height of the hollow pipe portion of the plate pipe body is made larger than the distance in the width direction, the surface area of the plate pipe body can be remarkably increased, and the structure suitable for air cooling is provided. Further, the small-diameter cavity can be used as a waveguide or a light guide, and can be used as a flow path for fluid or the like. It can also be used as a gas pipe. Of course, inert gases such as helium, argon, and nitrogen, and various gases such as hydrogen, oxygen, and methane can be selected by appropriately selecting the material for the hollow pipe. It can correspond to.

  Embodiments will be described below with reference to the drawings. A copper plate having a thickness of 100 μm was used as the metal plate 22, and press forming was performed so as to form a depression of a piping pattern having a width of 300 μm and a depth of 500 μm. Next, using a copper plate having a thickness of 100 μm as the metal plate 24, it is set together with the press-formed metal plate 22 in a plate pipe body manufacturing apparatus, and activated by a sputter etching method in an activation processing unit in the vacuum chamber. The plate piping body 20 was manufactured by cold pressure welding with a pressure welding unit and laminating and joining. A small amount of pure water was added as a heat pipe working body to the hollow pipe portion of the plate pipe body, and the inside of the pipe was sealed under reduced pressure to produce a heat pipe.

  The component of the present invention uses a plate piping body, such as heat pipes and heat sinks used for heat conduction and heat diffusion, printed wiring boards for exhaust heat and heat dissipation, IC packages, interposers, CSPs (chips). It can be suitably used for IC packages such as size packages or chip scale packages) and BGAs (ball grid arrays), and various MEMS (microelectromechanical systems) applications.

It is a schematic sectional drawing which shows one Embodiment of the plate piping body of this invention.

Explanation of symbols

20 Plate piping body 22 Metal plate 24 Metal plate

Claims (6)

A pipe-shaped recess is provided in at least one of the plurality of metal plates, and a hollow pipe having a predetermined shape is formed by being laminated on another metal plate so as to completely or partially close the recess. Plate piping body characterized by that. A pipe-shaped recess is provided in at least a part of one metal plate, and a hollow pipe having a predetermined shape is formed by being laminated on another part of the metal plate so as to completely or partially close the recess. A plate piping body characterized by being formed.
3. The plate pipe body according to claim 1, wherein a distance in a height direction of the hollow portion is larger than a distance in a width direction of the hollow portion in a cross-sectional shape of at least a part of the hollow pipe. Plate piping body as described in 1. The stacking is performed by press-contacting the plurality of metal plates by providing a non-pressurizing portion on the pressure-contact surface of a pressure-welding device so as to correspond to the hollow pipe having the predetermined shape. The plate piping body according to any one of 3 above. A component using the plate piping body according to any one of claims 1 to 4. 6. The component according to claim 5, wherein the component is applied to any one of a heat pipe, a gas pipe, a printed wiring board, an IC package, an interposer, and a MEMS application.

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