JP2004306098A - Method of producing hard-soft layered material and method of producing part obtained by using the hard soft layered material - Google Patents

Method of producing hard-soft layered material and method of producing part obtained by using the hard soft layered material Download PDF

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Publication number
JP2004306098A
JP2004306098A JP2003104003A JP2003104003A JP2004306098A JP 2004306098 A JP2004306098 A JP 2004306098A JP 2003104003 A JP2003104003 A JP 2003104003A JP 2003104003 A JP2003104003 A JP 2003104003A JP 2004306098 A JP2004306098 A JP 2004306098A
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Japan
Prior art keywords
hard
soft
layer
laminated material
layered material
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JP2003104003A
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Japanese (ja)
Inventor
Kinji Saijo
謹二 西條
Kazuo Yoshida
一雄 吉田
Shinji Osawa
真司 大澤
Koji Nanbu
光司 南部
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Toyo Kohan Co Ltd
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Toyo Kohan Co Ltd
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Publication date
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Priority to JP2003104003A priority Critical patent/JP2004306098A/en
Publication of JP2004306098A publication Critical patent/JP2004306098A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of producing a hard-soft layered material obtained by layering a hard layer and a soft layer, and to provide a method of producing parts obtained by using the hard-soft layered material. <P>SOLUTION: In the method of producing the hard-soft layered material 20 obtained by layering a hard layer 23 and a soft layer 24 evaluated in indexes such as Vickers hardness, at least one face to be joined in the hard-soft layered material 20, each of the faces to be joined being subjected to activation treatment, are abutted and superimposed, and are layered and joined to produce the hard-soft layered material 20. Further, parts such as a suspension applied to a disk head or the like are produced by using the hard-soft layered material 20. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明が属する技術分野】
本発明は、硬質層と軟質層とを積層してなる硬軟積層材の製造方法、および硬軟積層材を用いてなる部品の製造方法に関する。
【0002】
【従来の技術】
近年、ハードディスク装置の高密度化やデータ転送速度の高速化が急速に進んできている。これにともなって、ハードディスク装置に使用されている部品、とりわけ磁気ヘッド部の小型化とアクセススピードの高速化が顕著となってきている。このため磁気ヘッド部を構成するサスペンションも高度化することが求められている。従来技術として、金属板に金属薄膜を形成した後、あるいは金属薄膜を形成するとともに金属箔を積層する方法が開示されている(例えば特許文献1参照)。また、過剰な熱や圧力を加えることなく金属板同士を接合する方法が開示されている(例えば特許文献2参照)。
【0003】
本出願に関する先行技術文献情報として次のものがある。
【特許文献1】
特開2002−127298号公報
【特許文献2】
特開平1−224184号公報
【0004】
【発明が解決しようとする課題】
本発明は、硬質層と軟質層とを積層してなる硬軟積層材の製造方法、および硬軟積層材を用いてなる部品の製造方法を提供することを課題とする。
【0005】
【課題を解決するための手段】
前記課題に対する第1の解決手段として本発明の硬軟積層材の製造方法は、硬質層と軟質層とを積層してなる硬軟積層材の製造方法において、硬軟積層材の少なくとも1つの接合面が、接合されるそれぞれの面を活性化処理して当接し、重ね合わせて積層接合する方法とした。あるいは軟質層の両側を硬質層で挟んでなる構造を硬軟積層材の少なくとも一部に有する方法とした。
【0006】
前記課題に対する第2の解決手段として本発明の部品の製造方法は、硬質層と軟質層とを積層してなる硬軟積層材を用いる方法とした。
【0007】
【発明の実施の形態】
以下に、本発明の製造方法を説明する。図1は、本発明の製造方法を用いた硬軟積層材の一実施形態を示す概略断面図であり、硬質層23と軟質層24とを積層した例を示している。図2は、本発明の製造方法を用いた硬軟積層材の他の一実施形態を示す概略断面図であり、軟質層24の両側を硬質層23で挟んだ構造の例を示している。
【0008】
硬質層23の材質としては、硬軟積層材を製造可能な素材で、軟質層よりも硬質であれば特にその種類は限定されず、硬軟積層材の用途により適宜選択して用いることができる。例えば、常温で固体である金属や、これらの金属のうち少なくとも1種類を含む合金や、これらの金属や合金を少なくとも1層有する積層体などのうち軟質層よりも硬質のものである。硬軟積層材の用途が、サスペンションなどのディスクヘッド用途部品などであれば、硬質層23としては、JISに規定のSUS304やSUS316などのステンレス鋼などをステンレス層として用いることができる。
【0009】
硬質層23の厚みは、硬軟積層材を製造可能であれば特に限定はされず、硬軟積層材の用途により適宜選定して用いることができる。例えば、5〜500μmであることが好ましい。5μm未満では充分な機械的強度を保持することが難しくなり、500μmを超えると硬軟積層材としての製造が難しくなる。より好ましくは、10〜50μmである。なお硬質層23は、電解箔や圧延箔などの板材であってもよいし、板材にめっきや蒸着などによる膜材を予め積層したものであってもよいし、クラッド材などの積層体でもよいし、積層体に拡散処理などを施したものであってもよい。
【0010】
軟質層24の材質としては、硬軟積層材を製造可能な素材で、硬質層よりも軟質であれば特にその種類は限定されず、硬軟積層材の用途により適宜選択して用いることができる。例えば、常温で固体である金属や、これらの金属のうち少なくとも1種類を含む合金や、これらの金属や合金を少なくとも1層有する積層体などのうち硬質層よりも軟質のものである。軟質層としては、アルミニウムまたはアルミニウム合金を用いることができる。アルミニウム合金としては、JISに規定の1000系、3000系などを適用することができる。硬軟積層材の用途が、サスペンションなどのディスクヘッド用途部品などであれば、軟質層24としては、JIS規定の1050アルミニウムなどのアルミニウム合金などをアルミニウム層として用いることができる。
【0011】
軟質層24の厚みは、硬軟積層材を製造可能であれば特に限定はされず、硬軟積層材の用途により適宜選定して用いることができる。軟質層24は、例えば5〜500μmであることが好ましい。5μm未満では板材としての製造が難しくなり、500μmを超えると重くなりすぎる。より好ましくは、50〜300μmである。なお軟質層24は、電解箔や圧延箔などの板材であってもよいし、板材にめっきや蒸着などによる膜材を予め積層したものであってもよいし、クラッド材などの積層体でもよいし、積層体に拡散処理などを施したものであってもよい。
【0012】
硬質層は軟質層よりも硬質であり、軟質層は硬質層よりも軟質である。硬質、軟質は、硬軟積層材の用途により、ビッカース硬さ、ブリネル硬さ、ショア硬さ、ロックウェル硬さなどの指標より適宜選択して用いる指標により定めることができる。硬質層はビッカース硬さにおいて軟質層よりも硬い材質とする。硬質層の望ましい硬度の範囲は、Hv150〜600であり、より望ましくはHv200〜300である。軟質層の望ましい硬度の範囲は、Hv10〜149であり、より望ましくはHv30〜80である。例えば、硬質層がSUS304、軟質層が1050アルミニウムの組合せなどである。硬軟積層材の用途によっては、軟質層を挟んだものは機械的振動などを吸収減衰させる効果が期待できる。さらに軟質層に軽量材を選択することが可能であるため、硬質層のみの単一材と比較して、硬軟積層材は比重を軽くすることができ、慣性モーメントを下げる効果がある。
【0013】
常温で固体である金属とは、例えば、Al、Mg、Fe、Ni、Co、Cu、Zn、Pb、Ti、Nb、W、Ag、Pt、Auなどである。これらの金属のうち少なくとも1種類を含む合金には、例えば、JISに規定の合金なども含むことができ、合金鋼やステンレス鋼の他にも、Cu系合金では、無酸素銅、タフピッチ銅、りん脱酸銅、丹銅、黄銅、快削黄銅、すず入り黄銅、アドミラルティ黄銅、ネーバル黄銅、アルミニウム青銅、白銅など、Al系合金では、1000系、2000系、3000系、5000系、6000系、7000系など、Ni系合金では、常炭素ニッケル、低炭素ニッケル、ニッケル−銅合金、ニッケル−銅−アルミニウム−チタン合金、ニッケル−モリブデン合金、ニッケル−モリブデン−クロム合金、ニッケル−クロム−鉄−モリブデン−銅合金、ニッケル−クロム−モリブデン−鉄合金などがある。これらの金属や合金を少なくとも1層有する積層体とは、例えば、クラッド材、メッキ材、蒸着膜材などであり、金属間化合物などの合金層も含むことができる。
【0014】
図1に示す硬軟積層材20の活性化接合法を用いた製造方法について説明する。図3に示すように、真空槽52内において、巻き戻しリール62に設置された硬質層23の接合予定面側を、活性化処理装置70で活性化処理する。同様にして巻き戻しリール64に設置された軟質層24の接合予定面側を、活性化処理装置80で活性化処理する。
【0015】
活性化処理は、以下のようにして実施する。すなわち、真空槽52内に装填された硬質層23および軟質層24をそれぞれアース接地された一方の電極Aと接触させ、絶縁支持された他の電極Bとの間に、10〜1×10−3Paの極低圧不活性ガス雰囲気中で、1〜50MHzの交流を印加してグロー放電を行わせ、グロー放電によって生じたプラズマ中に露出される電極Aと接触した硬質層23、および軟質層24のそれぞれの接合予定面側の面積が、実効的に電極Bの面積の1/3以下となるようにスパッタエッチング処理する。不活性ガスとしては、アルゴン、ネオン、キセノン、クリプトンなどやこれらを含む混合体を適用することができる。好ましくはアルゴンである。なお不活性ガス圧力が1×10−3Pa未満では安定したグロー放電が行いにくく高速エッチングが困難であり、10Paを超えると活性化処理効率が低下する。印加する交流は、1MHz未満では安定したグロー放電を維持するのが難しく連続エッチングが困難であり、50MHzを超えると発振し易く電力の供給系が複雑となり好ましくない。また、効率よくエッチングするためには電極Aと接触した硬質層23および軟質層24のそれぞれの面積を実効的に電極Bの面積より小さくする必要があり、実効的1/3以下とすることにより充分な効率でエッチング可能となる。
【0016】
その後、活性化処理された硬質層23と軟質層24を積層接合する。積層接合は、硬質層23、軟質層24の接合予定面側が対向するようにして両者を当接して重ね合わせ圧接ユニット60で冷間圧接を施すことによって達成される。この際の積層接合は低温度で可能であり、硬質層23、軟質層24ならびに接合部に組織変化や合金層の形成などといった悪影響を軽減または排除することが可能である。Tを硬質層23、軟質層24の温度(℃)とするとき、0℃<T<300℃で良好な圧接状態が得られる。0℃以下では特別な冷却装置が必要となり、300℃以上では組織変化などの悪影響が生じてくるため好ましくない。また圧延率R(%)は、0.01%≦R≦30%であることが好ましい。0.01%未満では充分な接合強度が得られず、30%を超えると変形が大きくなり加工上好ましくない。より好ましくは、0.1%≦R≦3%である。さらに好ましくは、1%<R≦3%である。
【0017】
このように積層接合することにより、所要の層厚みを有する2層構造の硬軟積層材20を形成することができ、巻き取りロール66に巻き取られる。さらに必要により所定の大きさに切り出して、図1に示すような硬軟積層材20を製造することができる。またこのようにして製造された硬軟積層材20に、必要により残留応力の除去または低減などのために問題が生じない範囲で熱処理を施してもよいし、さらに半田めっきなどの膜材などを積層してもよい。
【0018】
図2に示す3層の硬軟積層材22は、上記説明において軟質層24の代わりに硬軟積層材20を用いることにより製造することができる。3層の硬軟積層材はこの他にも軟質層24−硬質層23−軟質層24の構成も可能である。またより多層の硬軟積層材は、上記説明において硬質層23および/または軟質層24の一方または双方を硬軟積層材とすることにより製造することができる。
【0019】
硬軟積層材の製造にはバッチ処理を用いることができる。すなわち真空槽内に予め所定の大きさに切り出された硬質層、軟質層を複数装填して活性化処理装置に搬送して垂直または水平など適切な位置に処理すべき面を対向または並置した状態などで設置または把持して固定して活性化処理を行い、さらに硬質層、軟質層を保持する装置が圧接装置を兼ねる場合には活性化処理後に設置または把持したまま圧接し、硬質層、軟質層を保持する装置が圧接装置を兼ねない場合にはプレス装置などの圧接装置に搬送して圧接を行うことにより達成される。なお活性化処理は、硬質層、軟質層を絶縁支持された一方の電極Aとし、アース接地された他の電極Bとの間で行うことが好ましい。
【0020】
本発明の部品の製造方法は、硬質層と軟質層とを積層してなる硬軟積層材を用いる方法であり、本発明の製造方法を用いた部品は、硬軟積層材にエッチング加工やプレス加工などの加工を施したもの、硬軟積層材の一部を除去したもの、さらにこれらに樹脂などで被覆あるいは固定したものや、硬軟積層材を接着剤などを用いて高分子や金属、合金などからなる基材や基板に積層したものなどである。
【0021】
本発明の製造方法を用いた硬軟積層材や部品では、接合部に合金層などの用途上好ましくない層を形成させることが抑止できるため、曲げ加工やプレス加工などの機械加工性や、エッチング加工におけるエッチング性の低下問題などが発生しない。このため本発明の硬軟積層材や部品は、サスペンションなどのディスクヘッド用途部品に有用である。ステンレス層のみからなるサスペンションよりも、ステンレス層とアルミニウム層からなるサスペンションの方が、軽量化を図れ慣性モーメントを小さくすることが可能であるため、ディスクヘッドの位置決め性能に優れ、シーク時間などの短縮に効果がある。特にステンレス層を従来の40%以下とすると、それらの効果は大である。また外層をステンレス層とすることで従来用いられてきたディスクヘッド部の溶接技術を利用できることも利点である。
【0022】
【実施例】
以下に、実施例を図面に基づいて説明する。硬質層23として厚み50μmのSUS304の圧延箔を用い、軟質層24として厚み200μmのアルミニウム箔を用いて、硬軟積層材製造装置50にセットし、真空槽52内の活性化処理ユニット70および80でスパッタエッチング法によりそれぞれ活性化処理し、圧延ユニット60で圧接して積層接合して硬軟積層材20を製造した。さらにもう1層、厚み50μmのSUS304圧延箔を硬軟積層材20の軟質面側に積層接合して硬軟積層材22を製造した。次にプレス加工を施し部品を製造した。
【0023】
【発明の効果】
以上説明したように、本発明の硬軟積層材の製造方法は硬質層と軟質層とを積層する方法であり、本発明の部品の製造方法は硬軟積層材を用いる方法である。このためディスクヘッド用途部品などに好適である。
【図面の簡単な説明】
【図1】本発明の製造方法を用いた硬軟積層材の一実施形態を示す概略断面図である。
【図2】本発明の製造方法を用いた硬軟積層材の他の一実施形態を示す概略断面図である。
【図3】本発明の製造方法に用いる装置の一実施形態を示す概略断面図である。
【符号の説明】
20 硬軟積層材
22 硬軟積層材
23 硬質層
24 軟質層
50 硬軟積層材製造装置
52 真空槽
54 真空ポンプ
60 圧接ユニット
62 巻き戻しリール
64 巻き戻しリール
66 巻き取りロール
70 活性化処理装置
72 電極ロール
74 電極
80 活性化処理装置
82 電極ロール
84 電極
A 電極A
B 電極B
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a hard / soft laminated material formed by laminating a hard layer and a soft layer, and a method for manufacturing a component using the hard / soft laminated material.
[0002]
[Prior art]
In recent years, the density of hard disk drives and the speed of data transfer have been rapidly increasing. Along with this, components used in hard disk devices, especially magnetic heads, have been remarkably reduced in size and access speed has been remarkably increased. For this reason, it is required that the suspension constituting the magnetic head section be sophisticated. As a conventional technique, a method is disclosed in which a metal thin film is formed on a metal plate, or a metal thin film is formed and a metal foil is laminated (for example, see Patent Document 1). Further, a method of joining metal plates without applying excessive heat or pressure is disclosed (for example, see Patent Document 2).
[0003]
Prior art document information on the present application includes the following.
[Patent Document 1]
JP 2002-127298 A [Patent Document 2]
JP-A-1-224184
[Problems to be solved by the invention]
An object of the present invention is to provide a method for manufacturing a hard / soft laminated material formed by laminating a hard layer and a soft layer, and a method for manufacturing a component using the hard / soft laminated material.
[0005]
[Means for Solving the Problems]
As a first solution to the above problem, a method for manufacturing a hard / soft laminated material of the present invention is a method for manufacturing a hard / soft laminated material obtained by laminating a hard layer and a soft layer, wherein at least one bonding surface of the hard / soft laminated material is The respective surfaces to be joined are activated and brought into contact with each other, and then stacked and joined. Alternatively, a method in which a structure in which both sides of a soft layer are sandwiched between hard layers is provided in at least a part of a hard / soft laminated material.
[0006]
As a second solution to the above-mentioned problem, a method for manufacturing a component according to the present invention employs a method using a hard / soft laminated material obtained by laminating a hard layer and a soft layer.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the production method of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing one embodiment of a hard / soft laminated material using the manufacturing method of the present invention, and shows an example in which a hard layer 23 and a soft layer 24 are stacked. FIG. 2 is a schematic cross-sectional view showing another embodiment of the hard / soft laminated material using the manufacturing method of the present invention, and shows an example of a structure in which both sides of a soft layer 24 are sandwiched between hard layers 23.
[0008]
The material of the hard layer 23 is not particularly limited as long as it is harder than the soft layer, and can be appropriately selected depending on the use of the hard / soft laminated material. For example, a metal that is solid at room temperature, an alloy containing at least one of these metals, and a laminate having at least one layer of these metals and alloys are harder than the soft layer. If the application of the hard / soft laminated material is a disk head application component such as a suspension, the hard layer 23 may be a stainless steel layer such as SUS304 or SUS316 specified by JIS.
[0009]
The thickness of the hard layer 23 is not particularly limited as long as a hard / soft laminated material can be manufactured, and can be appropriately selected and used depending on the use of the hard / soft laminated material. For example, the thickness is preferably 5 to 500 μm. If it is less than 5 μm, it becomes difficult to maintain sufficient mechanical strength, and if it exceeds 500 μm, it becomes difficult to produce a hard / soft laminated material. More preferably, it is 10 to 50 μm. The hard layer 23 may be a plate material such as an electrolytic foil or a rolled foil, may be a plate material in which a film material is previously laminated by plating or vapor deposition, or may be a laminate such as a clad material. Alternatively, the laminate may be subjected to a diffusion process or the like.
[0010]
The material of the soft layer 24 is not particularly limited as long as it is a material from which a hard / soft laminated material can be manufactured and is softer than the hard layer, and can be appropriately selected and used depending on the use of the hard / soft laminated material. For example, a metal that is solid at room temperature, an alloy containing at least one of these metals, and a laminate having at least one layer of these metals and alloys are softer than the hard layer. Aluminum or an aluminum alloy can be used as the soft layer. As the aluminum alloy, 1000 series, 3000 series, etc. specified in JIS can be applied. If the application of the hard / soft laminated material is a disk head application component such as a suspension, the soft layer 24 may be an aluminum alloy such as 1050 aluminum specified in JIS as an aluminum layer.
[0011]
The thickness of the soft layer 24 is not particularly limited as long as a hard / soft laminated material can be manufactured, and can be appropriately selected and used depending on the use of the hard / soft laminated material. The soft layer 24 preferably has a thickness of, for example, 5 to 500 μm. If it is less than 5 μm, it becomes difficult to produce a plate material, and if it exceeds 500 μm, it becomes too heavy. More preferably, it is 50 to 300 μm. Note that the soft layer 24 may be a plate material such as an electrolytic foil or a rolled foil, a layer material in which a film material such as plating or vapor deposition is previously laminated on the plate material, or a laminate such as a clad material. Alternatively, the laminate may be subjected to a diffusion process or the like.
[0012]
The hard layer is harder than the soft layer, and the soft layer is softer than the hard layer. Hardness or softness can be determined by an index appropriately selected from indexes such as Vickers hardness, Brinell hardness, Shore hardness, and Rockwell hardness depending on the use of the hard / soft laminated material. The hard layer is made of a material harder than the soft layer in Vickers hardness. A desirable range of hardness of the hard layer is Hv 150 to 600, and more preferably Hv 200 to 300. The desirable range of the hardness of the soft layer is Hv10 to 149, and more desirably Hv30 to 80. For example, the combination of the hard layer is SUS304 and the soft layer is 1050 aluminum. Depending on the application of the hard / soft laminated material, a material sandwiching the soft layer can be expected to have an effect of absorbing and attenuating mechanical vibrations and the like. Furthermore, since a lightweight material can be selected for the soft layer, the hard / soft laminated material can reduce the specific gravity and reduce the moment of inertia as compared with a single material having only the hard layer.
[0013]
Examples of the metal that is solid at room temperature include Al, Mg, Fe, Ni, Co, Cu, Zn, Pb, Ti, Nb, W, Ag, Pt, and Au. The alloy containing at least one of these metals can also include, for example, alloys specified in JIS. In addition to alloy steel and stainless steel, Cu-based alloys include oxygen-free copper, tough pitch copper, 1000 series, 2000 series, 3000 series, 5000 series, 6000 series for Al alloys such as phosphorous deoxidized copper, copper bronze, brass, free-cutting brass, tin brass, Admiralty brass, Naval brass, aluminum bronze, and bronze And 7000 series nickel alloys, such as nickel-carbon, low-carbon nickel, nickel-copper alloy, nickel-copper-aluminum-titanium alloy, nickel-molybdenum alloy, nickel-molybdenum-chromium alloy, nickel-chromium-iron- There are a molybdenum-copper alloy, a nickel-chromium-molybdenum-iron alloy, and the like. The laminate having at least one layer of these metals and alloys is, for example, a clad material, a plating material, a deposited film material, and the like, and may also include an alloy layer of an intermetallic compound or the like.
[0014]
A method of manufacturing the hard / soft laminated material 20 shown in FIG. 1 using the activation joining method will be described. As shown in FIG. 3, in the vacuum chamber 52, an activation treatment device 70 activates the surface to be joined of the hard layer 23 installed on the rewind reel 62. Similarly, the activation treatment device 80 activates the bonding surface side of the soft layer 24 installed on the rewind reel 64.
[0015]
The activation process is performed as follows. That is, the hard layer 23 and the soft layer 24 loaded in the vacuum chamber 52 are each brought into contact with one of the electrodes A grounded, and 10-1 × 10 − A glow discharge is performed by applying an alternating current of 1 to 50 MHz in an extremely low-pressure inert gas atmosphere of 3 Pa, and the hard layer 23 and the soft layer in contact with the electrode A exposed in the plasma generated by the glow discharge The sputter-etching process is performed so that the area of each of the 24 to be joined is effectively 1 / or less of the area of the electrode B. As the inert gas, argon, neon, xenon, krypton, or the like or a mixture containing these can be used. Preferably it is argon. If the inert gas pressure is less than 1 × 10 −3 Pa, stable glow discharge is difficult to perform, and high-speed etching is difficult. If the inert gas pressure exceeds 10 Pa, the activation treatment efficiency decreases. If the applied alternating current is less than 1 MHz, it is difficult to maintain a stable glow discharge, and it is difficult to perform continuous etching. If the applied alternating current exceeds 50 MHz, oscillation tends to occur and the power supply system becomes complicated, which is not preferable. Further, in order to perform the etching efficiently, it is necessary to make each area of the hard layer 23 and the soft layer 24 in contact with the electrode A smaller than the area of the electrode B effectively. Etching can be performed with sufficient efficiency.
[0016]
After that, the activated hard layer 23 and soft layer 24 are laminated and joined. The lamination bonding is achieved by abutting the hard layer 23 and the soft layer 24 such that the surfaces to be bonded face each other, and performing cold pressure welding by the overlap pressure welding unit 60. At this time, the lamination bonding can be performed at a low temperature, and it is possible to reduce or eliminate adverse effects such as a structural change and formation of an alloy layer in the hard layer 23, the soft layer 24, and the bonding portion. When T is the temperature (° C.) of the hard layer 23 and the soft layer 24, a good pressure contact state is obtained at 0 ° C. <T <300 ° C. A temperature of 0 ° C. or lower requires a special cooling device, and a temperature of 300 ° C. or higher is not preferable because adverse effects such as structural changes occur. Further, the rolling reduction R (%) is preferably 0.01% ≦ R ≦ 30%. If it is less than 0.01%, sufficient bonding strength cannot be obtained, and if it exceeds 30%, deformation becomes large, which is not preferable in terms of processing. More preferably, 0.1% ≦ R ≦ 3%. More preferably, 1% <R ≦ 3%.
[0017]
By laminating and joining in this manner, the hard / soft laminated material 20 having a two-layer structure having a required layer thickness can be formed, and is taken up by the take-up roll 66. Further, if necessary, the hard and soft laminated material 20 as shown in FIG. 1 can be manufactured by cutting out to a predetermined size. The hard / soft laminated material 20 manufactured as described above may be subjected to a heat treatment within a range that does not cause a problem for removing or reducing residual stress, if necessary, or a film material such as solder plating may be laminated. May be.
[0018]
The three-layer hard / soft laminated material 22 shown in FIG. 2 can be manufactured by using the hard / soft laminated material 20 instead of the soft layer 24 in the above description. In addition to the three layers of the hard / soft laminated material, a configuration of a soft layer 24 -a hard layer 23 -a soft layer 24 is also possible. Further, a multilayered soft / soft laminated material can be manufactured by using one or both of the hard layer 23 and / or the soft layer 24 as the hard / soft laminated material in the above description.
[0019]
Batch processing can be used for the production of the hard / soft laminated material. That is, a state in which a plurality of hard layers and soft layers cut into a predetermined size in advance in a vacuum chamber are loaded, conveyed to an activation treatment device, and surfaces to be processed at an appropriate position such as vertical or horizontal are opposed or juxtaposed. If the device that holds and holds the hard layer and soft layer also serves as a pressure contact device, it is placed or held after the activation process and then pressed into contact with the hard layer and soft layer. When the device for holding the layer does not double as the press-contact device, it is achieved by carrying the press-contact device such as a press device to perform press-contact. The activation treatment is preferably performed between the hard layer and the soft layer as one electrode A which is insulated and supported, and between the other electrode B which is grounded.
[0020]
The method for manufacturing a part according to the present invention is a method using a hard / soft laminated material obtained by laminating a hard layer and a soft layer, and a part using the manufacturing method according to the present invention is used for etching or pressing on a hard / soft laminated material. It is made of polymer, metal, alloy, etc. using a processed material, a material obtained by removing a part of the hard / soft laminated material, a material covered or fixed with a resin, etc., or a hard / soft laminated material using an adhesive or the like. Such materials include those laminated on a base material or a substrate.
[0021]
In the hard / soft laminated material or component using the manufacturing method of the present invention, since it is possible to suppress the formation of an undesired layer such as an alloy layer at the joint, machining workability such as bending and pressing, and etching work In this case, there is no problem of lowering the etching property. For this reason, the hard and soft laminated materials and parts of the present invention are useful for disk head parts such as suspensions. Compared to a suspension consisting of a stainless steel layer alone, a suspension consisting of a stainless steel layer and an aluminum layer can reduce the weight and reduce the moment of inertia, so it has excellent disk head positioning performance and shortens seek time. Is effective. In particular, when the stainless steel layer is set to 40% or less of the conventional one, those effects are remarkable. It is also an advantage that the outer layer is made of a stainless steel layer so that the conventionally used disk head welding technique can be used.
[0022]
【Example】
Hereinafter, embodiments will be described with reference to the drawings. Using a 50 μm-thick rolled SUS304 foil as the hard layer 23 and a 200 μm-thick aluminum foil as the soft layer 24, they are set in the hard-soft laminate manufacturing apparatus 50. An activation treatment was performed by a sputter etching method, and a hard and soft laminated material 20 was manufactured by press-contacting and laminating and joining in a rolling unit 60. Another 50 μm thick SUS304 rolled foil was further laminated and joined to the soft surface side of the hard / soft laminated material 20 to produce a hard / soft laminated material 22. Next, parts were manufactured by press working.
[0023]
【The invention's effect】
As described above, the method of manufacturing a hard / soft laminated material of the present invention is a method of laminating a hard layer and a soft layer, and the method of manufacturing a component of the present invention is a method of using a hard / soft laminated material. For this reason, it is suitable for disk head parts and the like.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing one embodiment of a hard / soft laminated material using a manufacturing method of the present invention.
FIG. 2 is a schematic cross-sectional view showing another embodiment of the hard / soft laminated material using the manufacturing method of the present invention.
FIG. 3 is a schematic cross-sectional view showing one embodiment of an apparatus used for the manufacturing method of the present invention.
[Explanation of symbols]
Reference Signs List 20 hard / soft laminated material 22 hard / soft laminated material 23 hard layer 24 soft layer 50 hard / soft laminated material manufacturing device 52 vacuum tank 54 vacuum pump 60 pressure contact unit 62 rewind reel 64 rewind reel 66 take-up roll 70 activation processing device 72 electrode roll 74 Electrode 80 Activation device 82 Electrode roll 84 Electrode A Electrode A
B electrode B

Claims (3)

硬質層と軟質層とを積層してなる硬軟積層材の製造方法において、硬軟積層材の少なくとも1つの接合面が、接合されるそれぞれの面を活性化処理して当接し、重ね合わせて積層接合してなることを特徴とする硬軟積層材の製造方法。In a method of manufacturing a hard / soft laminated material obtained by laminating a hard layer and a soft layer, at least one joining surface of the hard / soft laminated material is activated by treating each surface to be joined, and is brought into contact with each other. A method for producing a hard / soft laminated material, comprising: 軟質層の両側を硬質層で挟んでなる構造を硬軟積層材の少なくとも一部に有することを特徴とする請求項1に記載の硬軟積層材の製造方法。The method for producing a hard / soft laminated material according to claim 1, wherein a structure in which both sides of the soft layer are sandwiched by hard layers is provided in at least a part of the hard / soft laminated material. 硬質層と軟質層とを積層してなる硬軟積層材を用いることを特徴とする部品の製造方法。A method for manufacturing a component, comprising using a hard / soft laminated material obtained by laminating a hard layer and a soft layer.
JP2003104003A 2003-04-08 2003-04-08 Method of producing hard-soft layered material and method of producing part obtained by using the hard soft layered material Pending JP2004306098A (en)

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