JP7369360B2 - Wick sheet for vapor chamber, vapor chamber and vapor chamber manufacturing method - Google Patents

Description

The present invention relates to a wick sheet for a vapor chamber having a sealed space in which a working fluid is sealed, a vapor chamber, and a method for manufacturing a vapor chamber.

Devices that generate heat, such as central processing units (CPUs), light emitting diodes (LEDs), and power semiconductors used in mobile terminals such as mobile terminals and tablet terminals, are cooled by heat dissipation members such as heat pipes ( For example, see Patent Document 1). In recent years, as mobile terminals and the like have become thinner, there has been a demand for thinner heat dissipation members, and progress is being made in developing vapor chambers that can be made thinner than heat pipes. A working fluid is sealed in the vapor chamber, and this working fluid cools the device by absorbing heat from the device and releasing it to the outside.

More specifically, the working fluid in the vapor chamber receives heat from the device in a portion close to the device (evaporation section) and evaporates into vapor, and then the vapor moves to a position away from the evaporation section. It is cooled and condensed into a liquid. A liquid flow path section with a capillary structure (wick) is provided in the vapor chamber, and the liquefied working fluid passes through this liquid flow path section, is transported to the evaporation section, and is then returned to the evaporation section. Evaporates due to heat. In this way, the working fluid circulates in the vapor chamber while undergoing phase changes, that is, repeating evaporation and condensation, thereby transferring heat in the device and increasing heat transport efficiency.

By the way, a vapor chamber including a first metal sheet and a second metal sheet joined to the first metal sheet is known. A vapor passage section through which the vapor of the working fluid passes is provided on the surface of the first metal sheet on the second metal sheet side, and a vapor flow path section through which the vapor of the working fluid passes is provided on the surface of the second metal sheet on the side of the first metal sheet. A liquid flow path portion through which liquid passes is provided.

JP 2015-59693 Publication

In this way, when each metal sheet is provided with a vapor flow path section or a liquid flow path section, each metal sheet is processed to provide such a flow path section. Therefore, there is a problem in that the manufacturing process of the vapor chamber becomes complicated. Furthermore, when joining two metal sheets, alignment accuracy between the flow path portion provided in one metal sheet and the flow path portion provided in the other metal sheet is required. For this reason, there is also the problem that it is difficult to simplify the manufacture of the vapor chamber.

The present invention has been made in consideration of these points, and an object of the present invention is to provide a wick sheet for a vapor chamber, a vapor chamber, and a method for manufacturing a vapor chamber that can be easily manufactured.

The present invention
A wick sheet for a vapor chamber that is interposed between a first sheet and a second sheet and has a sealed space in which a working fluid is sealed,
a first surface that comes into contact with the first sheet;
a second surface provided on the opposite side of the first surface and in contact with the second sheet;
a liquid flow path portion provided on the first surface, forming a part of the sealed space, and through which the liquid working fluid passes;
A wick sheet for a vapor chamber, comprising: a vapor flow path section provided on the second surface, communicating with the liquid flow path section and forming a part of the sealed space, through which vapor of the working fluid passes. ,
I will provide a.

In addition, in the wick sheet for the vapor chamber mentioned above,
The steam flow path portion is formed in a concave shape on the second surface of the wick sheet,
further comprising a communication section that communicates the vapor flow path section and the liquid flow path section;
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path section has a plurality of mainstream grooves through which the liquid working fluid passes,
The communication portion is in contact with and communicates with the plurality of mainstream grooves,
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The communication portion is formed in a concave shape on the first surface of the wick sheet,
A wall surface defining the vapor flow path portion and a wall surface defining the communication portion are communicated with each other via a penetration portion, and are curved toward the penetration portion.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
A plurality of flow path protrusions are provided within the steam flow path portion, protruding from the bottom of the steam flow path portion and abutting the second sheet,
In a cross section including the center of the pair of channel protrusions adjacent to the penetrating part on both sides of the penetrating part, the width of the penetrating part is equal to the gap between the pair of channel protrusions and/or the corresponding width of the passage protruding part. smaller than the width of the communication part,
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In addition, in the wick sheet for the vapor chamber described above,
A plurality of flow path protrusions are provided within the steam flow path portion, protruding from the bottom of the steam flow path portion and abutting the second sheet.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The plurality of channel protrusions are arranged in a staggered manner when viewed from above,
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In addition, in the wick sheet for the vapor chamber described above,
The communication portion is arranged between the flow path protrusions adjacent to each other in plan view.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The steam flow path section extends from the second surface to the first surface.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path portion is also provided on the second surface.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path section extends in a first direction and includes a plurality of mainstream grooves through which the liquid working fluid passes, and a communication groove that communicates between adjacent mainstream grooves,
The steam flow path portion is in contact with and communicates with the communication groove,
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path section extends in a first direction and includes a plurality of mainstream grooves through which the liquid working fluid passes, and a communication groove that communicates between adjacent mainstream grooves,
The mainstream groove provided on the first surface and the mainstream groove provided on the second surface overlap in a plan view.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path section extends in a first direction and includes a plurality of mainstream grooves through which the liquid working fluid passes, and a communication groove that communicates between adjacent mainstream grooves,
The mainstream groove provided on the first surface and the mainstream groove provided on the second surface do not at least partially overlap in plan view.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The steam flow path portion is in contact with and communicates with the communication groove,
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In addition, in the wick sheet for the vapor chamber described above,
a frame portion defining the steam flow path portion inside in plan view;
further comprising a land portion provided within the steam flow path portion;
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In addition, in the wick sheet for the vapor chamber described above,
The land portion has a first land surface that constitutes the first surface, and a second land surface that constitutes the second surface,
The liquid flow path section includes a first land liquid flow path section provided on the first land surface.
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In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path further includes a second land liquid flow path provided on the second land surface.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path section extends in a first direction and includes a plurality of mainstream grooves through which the liquid working fluid passes, and a communication groove that communicates between adjacent mainstream grooves,
The steam flow path portion is in contact with and communicates with the communication groove,
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path section extends in a first direction and includes a plurality of mainstream grooves through which the liquid working fluid passes, and a communication groove that communicates between adjacent mainstream grooves,
The mainstream groove provided on the first land surface and the mainstream groove provided on the second land surface overlap in plan view.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path section extends in a first direction and includes a plurality of mainstream grooves through which the liquid working fluid passes, and a communication groove that communicates between adjacent mainstream grooves,
The mainstream groove provided on the first land surface and the mainstream groove provided on the second land surface do not at least partially overlap in plan view.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The steam flow path portion is in contact with and communicates with the communication groove,
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
A first support part that supports the land part on the frame part is provided in the steam flow path part.
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In addition, in the wick sheet for the vapor chamber described above,
A plurality of land portions are provided within the steam flow path portion,
A second support part that supports the land parts adjacent to each other is provided in the steam flow path part.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The frame portion has a first frame surface forming the first surface, and a second frame surface forming the second surface,
The liquid flow path section includes a first frame liquid flow path section provided on the first frame surface.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path further includes a second frame liquid flow path provided on the second surface.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The liquid flow path portion has a plurality of mainstream grooves each extending in a first direction and through which the liquid working fluid passes;
A protrusion row including a plurality of protrusions arranged in the first direction via a communication groove is provided between a pair of adjacent main grooves,
The main stream groove includes an intersection part that communicates with the communication groove, and a main stream groove main body part that is located at a different position from the intersection part in the first direction and between the pair of adjacent convex parts. , contains
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In addition, in the wick sheet for the vapor chamber described above,
The depth of the intersection of the main stream groove is deeper than the depth of the main stream groove body.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The depth of the intersection of the main stream groove is deeper than the depth of the communication groove.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The communication groove communicates a corresponding pair of the main stream grooves,
The width of the communication groove is larger than the width of the main stream groove.
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The depth of the communication groove is deeper than the depth of the main stream groove,
You can do it like this.

In addition, in the wick sheet for the vapor chamber described above,
The convex portions are arranged in a staggered manner,
You can do it like this.

Moreover, the present invention
A vapor chamber having a sealed space in which a working fluid is sealed,
The first sheet,
a second sheet;
a vapor chamber comprising the above-mentioned wick sheet interposed between the first sheet and the second sheet;
I will provide a.

Moreover, in the vapor chamber mentioned above,
The first sheet has a first peripheral edge provided on the outside of the wick sheet in plan view,
The second sheet has a second peripheral edge provided on the outside of the wick sheet in plan view,
A spacer member is interposed between the first peripheral edge part and the second peripheral edge part,
The first peripheral edge portion and the second peripheral edge portion may be diffusion bonded via the spacer member.

Moreover, in the vapor chamber mentioned above,
The first sheet has a first heat-sealing layer provided on the outer side of the wick sheet in plan view among the side surfaces of the wick sheet,
The second sheet has a second heat-sealing layer provided on the outer side of the wick sheet in plan view among the side surfaces of the wick sheet,
the first heat sealing layer and the second heat sealing layer are heat sealed;
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Moreover, in the vapor chamber mentioned above,
The surface of the first sheet on the side of the wick sheet is formed into a flat shape.
You can do it like this.

Moreover, in the vapor chamber mentioned above,
The first sheet and the wick sheet are diffusion bonded, and the second sheet and the wick sheet are diffusion bonded.
You can do it like this.

Moreover, in the vapor chamber mentioned above,
The first sheet includes a first main body sheet provided on a side of the wick sheet, and a first reinforcing sheet provided on a side opposite to the wick sheet with respect to the first main body sheet. death,
The first reinforcing sheet has higher mechanical strength than the first main body sheet.
You can do it like this.

Moreover, in the vapor chamber mentioned above,
The second sheet includes a second main sheet provided on a side of the wick sheet, and a second reinforcing sheet provided on a side opposite to the wick sheet with respect to the second main sheet. death,
The second reinforcing sheet has higher mechanical strength than the second main body sheet.
You can do it like this.

Moreover, the present invention
A method for manufacturing a vapor chamber having a sealed space filled with a hydraulic fluid, the method comprising:
A wick sheet manufacturing step of manufacturing a wick sheet having a first surface and a second surface provided on the opposite side of the first surface, the step of manufacturing a wick sheet having a first surface and a second surface provided on the opposite side of the first surface, a liquid flow path portion through which the liquid working fluid passes; and a liquid flow path portion provided on the second surface that communicates with the liquid flow path portion and constitute a part of the sealed space; a wick sheet manufacturing step of manufacturing a wick sheet having a steam flow path through which steam passes;
a joining step of joining the first sheet and the second sheet by interposing the wick sheet between the first sheet and the second sheet, the step of joining the first sheet and the second sheet; a bonding step of forming the sealed space;
A method for manufacturing a vapor chamber, the method comprising: sealing the hydraulic fluid in the sealed space;
I will provide a.

Furthermore, in the vapor chamber manufacturing method described above,
The first sheet has a first peripheral edge provided on the outside of the wick sheet in plan view,
The second sheet has a second peripheral edge provided on the outside of the wick sheet in plan view,
In the joining step, a spacer member is interposed between the first peripheral edge of the first sheet and the second peripheral edge of the second sheet, and the first peripheral edge and the second peripheral edge are diffusion bonded via the spacer member;
You can do it like this.

Furthermore, in the vapor chamber manufacturing method described above,
The first sheet has a first heat-sealing layer provided on the outer side of the wick sheet in plan view among the side surfaces of the wick sheet,
The second sheet has a second heat-sealing layer provided on the outer side of the wick sheet in plan view among the side surfaces of the wick sheet,
In the bonding step, the first heat sealing layer and the second heat sealing layer are heat sealed.
You can do it like this.

Furthermore, in the vapor chamber manufacturing method described above,
In the bonding step, the first sheet and the wick sheet are diffusion bonded, and the second sheet and the wick sheet are diffusion bonded.
You can do it like this.

Furthermore, in the vapor chamber manufacturing method described above,
The first sheet includes a first main body sheet provided on a side of the wick sheet, and a first reinforcing sheet provided on a side opposite to the wick sheet with respect to the first main body sheet. death,
The first reinforcing sheet has higher mechanical strength than the first main body sheet.
You can do it like this.

Furthermore, in the vapor chamber manufacturing method described above,
The second sheet includes a second main sheet provided on a side of the wick sheet, and a second reinforcing sheet provided on a side opposite to the wick sheet with respect to the second main sheet. death,
The second reinforcing sheet has higher mechanical strength than the second main body sheet.
You can do it like this.

According to the present invention, it can be easily manufactured.

FIG. 1 is a schematic perspective view illustrating an electronic device according to a first embodiment of the present invention. FIG. 2 is a top view showing the vapor chamber according to the first embodiment of the invention. FIG. 3 is a cross-sectional view taken along line AA, showing the vapor chamber of FIG. 2. FIG. 4 is a top view of the wick sheet of FIG. 2. FIG. 5 is a bottom view of the wick sheet of FIG. 2. FIG. 6 is a partially enlarged bottom view showing the lower liquid flow path section of FIG. 5. FIG. FIG. 7 is an enlarged sectional view taken along line BB in FIG. 5 showing the main groove together with the lower metal sheet. FIG. 8 is a diagram for explaining the wick sheet preparation step in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 9 is a diagram for explaining a resist forming step in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 10 is a diagram for explaining a resist patterning step in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 11 is a diagram for explaining the etching process in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 12 is a diagram for explaining a resist removal step in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 13 is a diagram for explaining an assembly process in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 14 is a diagram for explaining a temporary fixing step in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 15 is a diagram for explaining the bonding step in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 16 is a diagram for explaining the evacuation step in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 17 is a diagram for explaining a step of injecting a working fluid in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 18 is a diagram for explaining the sealing step in the vapor chamber manufacturing method according to the first embodiment of the present invention. FIG. 19 is a partially enlarged bottom view showing a modification (first modification) of the lower liquid flow path section in FIG. FIG. 20 is an enlarged sectional view taken along the line CC in FIG. 19 showing the communication groove together with the lower metal sheet. FIG. 21 is an enlarged sectional view taken along the line DD in FIG. 19 showing the main groove and the communication groove together with the lower metal sheet. FIG. 22 is a partially enlarged bottom view showing a modification (second modification) of the liquid flow path section in FIG. FIG. 23 is a sectional view showing a vapor chamber according to a second embodiment of the present invention, and is a sectional view corresponding to FIG. 3. FIG. 24 is a sectional view showing a modification of the vapor chamber shown in FIG. 23. FIG. 25 is a top view showing a vapor chamber according to a third embodiment of the invention. FIG. 26 is a sectional view taken along line BB showing the vapor chamber of FIG. 25. FIG. 27 is a top view of the wick sheet of FIG. 25. FIG. 28 is a bottom view of the wick sheet of FIG. 25. FIG. 29 is a sectional view taken along the line EE in FIG. 27. FIG. 30 is a partially enlarged bottom view showing the lower liquid flow path section of FIG. 28. FIG. 31 is a sectional view showing a modification of the vapor chamber shown in FIG. 26. FIG. 32 is a partially enlarged sectional view showing the lower liquid flow path section and the upper liquid flow path section of FIG. 31. FIG. FIG. 33 is a partially enlarged sectional view showing a modification of the lower liquid flow path section and the upper liquid flow path section shown in FIG. 32. FIG. 34 is a sectional view showing a vapor chamber according to a fourth embodiment of the present invention.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in the drawings attached to this specification, for convenience of illustration and ease of understanding, the scale, vertical and horizontal dimension ratios, etc. are appropriately changed and exaggerated from those of the actual drawings.

A wick sheet for a vapor chamber, a vapor chamber, and a method for manufacturing a vapor chamber according to an embodiment of the present invention will be described with reference to FIGS. 1 to 22. The vapor chamber 1 in this embodiment is a device installed in the electronic device E in order to cool a device D as a heating element housed in the electronic device E. Examples of device D include electronic devices that generate heat (cooled devices) such as central processing units (CPUs), light emitting diodes (LEDs), and power semiconductors used in mobile terminals such as mobile terminals and tablet terminals. It will be done.

Here, first, an electronic device E in which a vapor chamber 1 according to the present embodiment is mounted will be described using a tablet terminal as an example. As shown in FIG. 1, the electronic device E (tablet terminal) includes a housing H, a device D housed in the housing H, and a vapor chamber 1. In the electronic device E shown in FIG. 1, a touch panel display TD is provided on the front surface of the housing H. A vapor chamber 1 is housed within a housing H and placed in thermal contact with a device D. This allows the vapor chamber 1 to receive heat generated by the device D when the electronic device E is used. The heat received by the vapor chamber 1 is released to the outside of the vapor chamber 1 via the working fluid 2, which will be described later. In this way, device D is effectively cooled. When the electronic device E is a tablet terminal, the device D corresponds to a central processing unit or the like.

Next, the vapor chamber 1 according to this embodiment will be explained. The vapor chamber 1 has a sealed space 3 in which a working fluid 2 is sealed, and the working fluid 2 in the sealed space 3 undergoes repeated phase changes to effectively cool the device D of the electronic equipment E described above. It is supposed to be done. The vapor chamber 1 is generally formed into a thin flat plate shape. Although the planar shape of the vapor chamber 1 is arbitrary, it may be rectangular as shown in FIG.

(First embodiment)
As shown in FIGS. 2 and 3, the vapor chamber 1 includes a lower metal sheet 10 (first sheet), an upper metal sheet 20 (second sheet), and a lower metal sheet 10 and an upper metal sheet 20. A wick sheet 30 (hereinafter simply referred to as wick sheet 30) for the vapor chamber 1 is provided between the two. In the form shown in FIG. 2, in order to simplify the explanation, an example is shown in which the lower metal sheet 10, the upper metal sheet 20, and the wick sheet 30 are all formed into a rectangular shape in plan view. , but is not limited to this. Here, the plane view refers to a direction perpendicular to the surface of the vapor chamber 1 that receives heat from the device D (the lower surface 10a of the lower metal sheet 10) and the surface that releases the received heat (the upper surface 20b of the upper metal sheet 20). This corresponds to, for example, a state in which the vapor chamber 1 is seen from above (the state shown in FIG. 2) or a state in which it is seen from below.

As shown in FIG. 3, a sealed space 3 in which a working fluid 2 is sealed is formed between the lower metal sheet 10 and the upper metal sheet 20. More specifically, the sealed space 3 is formed by an upper steam flow path recess 32, a communication recess 35, and a mainstream groove 41 and a communication groove 45 of the lower liquid flow path 40, which are provided in the wick sheet 30 and will be described later. . Examples of the working fluid 2 include pure water, ethanol, methanol, acetone, and the like.

The lower metal sheet 10 has a lower surface 10a and an upper surface 10b (the surface on the wick sheet 30 side) provided on the opposite side to the lower surface 10a. Among these, the upper surface 10b is in contact with the lower surface 30a (described later) of the wick sheet 30. In this embodiment, the lower surface 10a and the upper surface 10b are formed flat. That is, the lower metal sheet 10 is formed as a flat rectangular sheet as a whole.

As shown in FIGS. 2 and 3, the lower metal sheet 10 has a heat receiving portion 11 that receives heat from the device D. Device D is attached to the lower surface 10a of the lower metal sheet 10 (in particular, the lower surface of the heat receiving section 11). Here, the heat receiving part 11, that is, the part to which the device D is attached, can be placed anywhere on the lower metal sheet 10, but in FIG. 2, it is placed at the center of the lower metal sheet 10. An example is shown. In this case, the attitude of the mobile terminal in which the vapor chamber 1 is installed can be suppressed from affecting the stabilization of the operation of the vapor chamber 1.

The lower metal sheet 10 further includes a lower peripheral edge part 12 (first peripheral edge part) provided on the outside of the wick sheet 30 in plan view. A spacer member 50, which will be described later, comes into contact with this lower peripheral edge portion 12 and is diffusion bonded to the spacer member 50. The lower peripheral edge portion 12 is formed around the entire periphery of the wick sheet 30 in a plan view, and has a rectangular frame shape.

As shown in FIGS. 2 and 3, the upper metal sheet 20 has a lower surface 20a (the surface on the wick sheet 30 side) and an upper surface 20b provided on the opposite side to the lower surface 20a. Among these, the lower surface 20a is in contact with the upper surface 30b (described later) of the wick sheet 30. A housing member Ha that constitutes a part of a housing of a mobile terminal or the like is brought into contact with the upper surface 20b. Thereby, the heat received from device D is cooled by the outside air via upper metal sheet 20 and housing member Ha. In this embodiment, the lower surface 20a and the upper surface 20b are formed in a flat shape. That is, the upper metal sheet 20 is formed as a flat rectangular sheet as a whole.

The upper metal sheet 20 further includes an upper peripheral edge part 21 (second peripheral edge part) provided on the outside of the wick sheet 30 in plan view. A spacer member 50, which will be described later, comes into contact with this upper peripheral edge portion 21 and is diffusion bonded to the spacer member 50. The upper peripheral edge portion 21 is formed around the entire periphery of the wick sheet 30 in a plan view, and has a rectangular frame shape.

As shown in FIG. 3, the upper metal sheet 20 further includes an injection hole 22 for injecting the working fluid 2 into the sealed space 3. The injection hole 22 extends from the upper surface 20b to the lower surface 20a perpendicularly to the upper surface 20b and the lower surface 20a. In addition, the injection hole 22 is disposed at a position overlapping an upper steam flow path recess 32 (described later) of the wick sheet 30 in plan view, and communicates with the upper steam flow path recess 32 . Note that the position of the injection hole 22 is arbitrary as long as the working fluid 2 can be injected into the sealed space 3. Further, the injection hole 22 may be provided in the lower metal sheet 10 instead of the upper metal sheet 20. Further, an injection hole 22 may be provided extending from the spacer member 50 to the wick sheet 30 so that the working fluid 2 can be injected into the sealed space 3.

A sealing member 23 is provided in the injection hole 22, and the injection hole 22 is sealed after the hydraulic fluid 2 is injected. This sealing member 23 is preferably formed of the same material as the upper metal sheet 20.

By the way, when the vapor chamber 1 is installed in a mobile terminal, the vertical relationship between the lower metal sheet 10 and the upper metal sheet 20 may collapse depending on the posture of the mobile terminal. However, in this embodiment, for convenience, the metal sheet that receives heat from device D is referred to as the lower metal sheet 10, the metal sheet that releases the received heat is referred to as the upper metal sheet 20, and the lower metal sheet 10 is referred to as the lower metal sheet 10. The explanation will be made with the upper metal sheet 20 disposed on the lower side and the upper metal sheet 20 on the upper side.

As shown in FIG. 3, the wick sheet 30 has a lower surface 30a (first surface), an upper surface 30b (second surface) provided on the opposite side to the lower surface 30a, and an outer surface 30c. . Among these, the lower surface 30a is in contact with the upper surface 10b of the lower metal sheet 10, and the upper surface 30b is in contact with the lower surface 20a of the upper metal sheet 20. The outer surface 30c is formed to extend from the lower surface 30a to the upper surface 30b, and is a surface against which a spacer member 50, which will be described later, comes into contact from the outside. Here, in order to clarify the drawing, FIG. 3 shows an upper steam flow path recess 32, an upper flow path protrusion 34, a lower liquid flow path 40, etc., which will be described later, in an enlarged manner, and shows the upper steam flow. The number and arrangement of the channel recess 32, the upper channel protrusion 34, and the main flow groove 41 of the lower liquid channel section 40 are different from those in FIGS. 2, 4, and 5.

As shown in FIG. 4, the wick sheet 30 further includes an evaporation part 31 in which the working fluid 2 evaporates to generate steam, and an upper steam passage recess 32 (steam passage part) provided on the upper surface 30b. have. The steam flow path portion in this embodiment is constituted by this upper steam flow path recess 32. Among these, the evaporation part 31 is a part to which the heat received from the device D by the heat receiving part 11 (see FIGS. 2 and 3) of the lower metal sheet 10 is transmitted, and the working fluid 2 is evaporated by this heat. That is, the heat from the heat receiving part 11 can be transmitted not only to the region overlapping the wick sheet 30 in plan view but also to the periphery of the region. For this reason, the evaporation section 31 may correspond to a region including a portion overlapping the heat receiving section 11 and a portion around the heat receiving section 11 in a plan view.

The upper vapor flow path recess 32 constitutes a part of the sealed space 3 and is configured so that the vapor of the working fluid 2 generated in the evaporator 31 mainly passes therethrough. The upper vapor flow path recess 32 is formed into a concave shape on the upper surface 30b by etching from the upper surface 30b of the wick sheet 30 in an etching process to be described later. As a result, the upper steam flow path recess 32 has a wall surface 33 formed in a curved shape, as shown in FIG. 3 . This wall surface 33 defines an upper steam flow path recess 32 and is curved in a shape that swells toward the lower surface 30a. As shown in FIG. 4, the upper steam flow path recess 32 is formed so as to be recessed from the upper surface 30b toward the lower surface 30a over the entire upper surface 30b of the wick sheet 30, and the wall surface 33 has a plurality of curved recesses. It is formed to have a part. The side wall of the upper steam flow path recess 32 is constituted by a spacer member 50, which will be described later.

The heat receiving portion 11 of the lower metal sheet 10 is arranged at the center of the upper steam flow path recess 32 in plan view. As a result, the steam in the upper steam flow path concave portion 32 is diffused in a direction away from the central portion overlapping with the heat receiving portion 11, and most of the steam is transported to the peripheral portion of the wick sheet 30 where the temperature is relatively low. .

As shown in FIGS. 3 and 4, in the upper steam passage recess 32, there are a plurality of upper passage protrusions 34 (flow passage protrusions) that protrude upward from the bottom of the wall surface 33 of the upper steam passage recess 32. It is provided. The upper channel protrusion 34 is a portion where the material of the wick sheet 30 remains without being etched in an etching process to be described later.

As shown in FIG. 3, the upper channel protrusion 34 has an upper surface 34a (projecting end surface) located on the same plane as the upper surface 30b of the wick sheet 30. As shown in FIG. This upper surface 34a is in contact with the lower surface 20a of the upper metal sheet 20. This improves the mechanical strength of the vapor chamber 1 when the pressure in the sealed space 3 is reduced. The wall surface 33 of the upper steam passage recess 32 described above constitutes a side wall of the upper passage protrusion 34 .

In this embodiment, the upper channel protrusions 34 are arranged in a staggered manner when viewed from above. This allows the vapor of the working fluid 2 to flow around the upper channel protrusion 34, and prevents the flow of the vapor from being obstructed. Further, the planar shape of the upper surface 34a of the upper flow path protrusion 34 is circular, and in this respect as well, the flow of the vapor of the working fluid 2 is suppressed from being obstructed. Note that the planar shape of the upper channel protrusion 34 is not limited to a circular shape as long as the vapor of the working fluid 2 can be smoothly diffused.

As shown in FIGS. 3 and 5, the lower surface 30a of the wick sheet 30 is provided with a lower liquid flow path section 40 (liquid flow path section) through which the liquid working fluid 2 passes. The lower liquid flow path portion 40 constitutes a part of the sealed space 3 described above, and communicates with the upper vapor flow path recess 32 .

The lower liquid flow path portion 40 has a plurality of mainstream grooves 41 . As shown in FIGS. 5 and 6, each mainstream groove 41 is formed to extend in the first direction X (the longitudinal direction of the vapor chamber 1, the left-right direction in FIG. It is configured to pass through. As a result, the main stream groove 41 is configured to transport the liquid working fluid 2 condensed from the vapor of the working fluid 2 to the evaporation section 31 . The main grooves 41 are arranged at equal intervals in a second direction Y perpendicular to the first direction X. In the second direction Y, the width w1 of the main flow groove 41 is smaller than the gap G between the upper channel protrusions 34 adjacent to each other (the gap at the upper surface 30b, see FIG. 3). For example, the gap G is 500 μm to 1500 μm, and the width w1 of the main groove 41 is 5 μm to 500 μm. Further, the depth h1 (in the vertical direction in FIG. 7) of the main groove 41 is shallower than the depth of the communicating recess 35 (described later), and is, for example, about 50 μm. The same applies to a communication groove 45 described later. Note that the width w1 of the mainstream groove 41 means the dimension at the lower surface 30a.

The mainstream groove 41 is formed by being etched from the lower surface 30a of the wick sheet 30 in an etching process to be described later. As a result, the main stream groove 41 has a wall surface 42 formed in a curved shape, as shown in FIG. 7 . This wall surface 42 defines the mainstream groove 41 and is curved in a shape that swells toward the upper surface 30b.

As shown in FIG. 6, a row of protrusions 43 is provided between the main grooves 41 adjacent to each other. Each convex row 43 includes a plurality of convex portions 44 arranged in the first direction X. Each convex portion 44 is formed in a rectangular shape so that the first direction X is the longitudinal direction in plan view. A communication groove 45 is interposed between the protrusions 44 adjacent to each other. The communication groove 45 is formed to extend in the second direction Y, and communicates between the adjacent mainstream grooves 41. This allows the hydraulic fluid 2 to flow back and forth between these main stream grooves 41 .

The convex portion 44 is a portion where the material of the wick sheet 30 remains without being etched in an etching process to be described later. In this embodiment, as shown in FIG. 6, the planar shape of the convex portion 44 (the shape at the position of the lower surface 30a of the wick sheet 30) is rectangular. The positions of the protrusions 44 of each protrusion row 43 in the first direction X are the same. As a result, the communication grooves 45 of the adjacent convex rows 43 are arranged at the same position in the first direction X, and the plurality of main flow grooves 41 and the plurality of communication grooves 45 are arranged in a grid pattern. Note that it is preferable that the width w2 of the convex portion 44 is, for example, 5 μm to 500 μm.

As shown in FIGS. 3 to 5, the upper vapor flow path recess 32 and the main stream groove 41 of the lower liquid flow path 40 may be communicated with each other through a plurality of communication recesses 35 (communication portions). As a result, the liquid working fluid 2 generated by condensation from the vapor of the working fluid 2 in the upper vapor flow path recess 32 passes through the communication recess 35 and enters the main stream groove 41 of the lower liquid flow path 40. It is configured as follows.

The communication recess 35 is formed in a concave shape on the lower surface 30a by etching from the lower surface 30a of the wick sheet 30 in an etching process described later. As a result, the communication recess 35 has a wall surface 36 formed in a curved shape, as shown in FIG. 3 . This wall surface 36 defines a communicating recess 35 and is curved in a shape that swells toward the upper surface 30b. This wall surface 36 is connected to the wall surface 33 of the upper steam flow path recess 32. That is, the wall surface 36 of the communication recess 35 and the wall surface 33 of the upper steam flow path recess 32 are connected to form a penetrating section 37, and the wall surface 36 and the wall surface 33 are each curved toward the penetrating section 37. . As a result, the communication recess 35 communicates with the upper steam flow path recess 32. In this embodiment, an example is shown in which the planar shape of the penetrating portion 37 is circular. The diameter of the penetrating portion 37 is, for example, 5 μm to 1000 μm. The position of the penetrating portion 37 in the thickness direction of the wick sheet 30 (vertical direction in FIG. 3) may be an intermediate position between the lower surface 30a and the upper surface 30b, or may be a position shifted downward or upward from the intermediate position. It is optional as long as the upper steam flow path recess 32 and the communication recess 35 communicate with each other.

In FIG. 6 , some of the plurality of mainstream grooves 41 are separated by the communication recess 35 . In the present embodiment, other main stream grooves 41 of the plurality of main stream grooves 41 are not separated by the communicating recesses 35 but are continuous from one end to the other end of the wick sheet 30 in the first direction X. is formed. This improves the transportability of the liquid working fluid 2 to the evaporation section 31. However, the present invention is not limited to this, and as long as the main stream grooves 41 communicate with each other through the communication grooves 45, the main stream groove 41 that is continuously formed from one end of the wick sheet 30 to the other end does not exist. Good too.

Each communication recess 35 contacts and communicates with the plurality of mainstream grooves 41 . This allows the liquid working fluid 2 that has passed through the communication recess 35 to easily enter the plurality of main stream grooves 41 . More specifically, the communication recess 35 on the lower surface 30a of the wick sheet 30 is formed to cross a plurality of mainstream grooves 41 arranged in the second direction Y. However, the present invention is not limited to this, and the communication recess 35 may be in contact with one mainstream groove 41. Furthermore, the communication recess 35 may be in contact with the communication groove 45 and communicate with the main stream groove 41 via the communication groove 45 .

As shown in FIGS. 4 to 6, the communication recesses 35 are spaced apart from each other in plan view. In this embodiment, the communication recesses 35 are arranged evenly throughout the wick sheet 30, and are arranged between the upper channel protrusions 34 adjacent to each other in plan view. In this way, the communicating recesses 35 are arranged in a staggered manner when viewed from above. Moreover, although the planar shape of the communicating recess 35 on the lower surface 30a of the wick sheet 30 is formed into a circular shape, it is not limited to this. For example, the diameter of the communicating recess 35 (diameter at the lower surface 30a, see FIG. 3) is 100 μm to 3000 μm.

FIG. 3 shows a cross-sectional view taken along the line AA in FIG. 2, and this cross-section includes the centers of a pair of upper channel protrusions 34 adjacent to the penetrating portion 37 on both sides of the penetrating portion 37 in the Y direction. A cross section is shown. In the cross section shown in FIG. 3, the width w4 of the penetrating portion 37 (corresponding to the diameter of the penetrating portion 37 described above) is the gap G between the pair of upper channel protrusions 34 and/or the width of the corresponding communicating recess 35. It is preferable that the width is smaller than the width w5 (corresponding to the diameter of the above-mentioned communicating recess 35). In FIG. 3, the width of the penetrating portion 37 is smaller than the gap G and also smaller than the width of the communicating recess 35. In FIG. Here, the gap G means the gap at the upper surface 30b, and the width of the communicating recess 35 means the width at the lower surface 30a.

By the way, as described above, the lower liquid flow path section 40 is formed on the lower surface 30a of the wick sheet 30. On the other hand, the upper surface 10b of the lower metal sheet 10 is formed in a flat shape. As a result, each mainstream groove 41 of the lower liquid flow path section 40 is covered with the flat upper surface 10b. In this case, as shown in FIG. 7, two right-angled or acute-angled corners 38 can be formed by the wall surface 42 of the mainstream groove 41 and the upper surface 10b of the lower metal sheet 10. Capillary action at the corners 38 can be enhanced. That is, when the mainstream groove 41 is formed by etching, the wall surface 42 of the mainstream groove 41 tends to be formed in a curved shape as described above. Therefore, by forming the upper surface 10b of the lower metal sheet 10 in a flat shape so as to cover the mainstream groove 41, the capillary action can be enhanced at the corner portion 38 shown in FIG. Like the main flow groove 41, the communication groove 45 is also covered by the upper surface 10b of the lower metal sheet 10, so that the capillary action can be enhanced by the similar corners.

The lower metal sheet 10 and the upper metal sheet 20 are permanently bonded via a spacer member 50 by diffusion bonding. That is, the spacer member 50 is interposed between the lower peripheral edge 12 of the lower metal sheet 10 and the upper peripheral edge 21 of the upper metal sheet 20. The spacer member 50 has a lower surface 50 a that contacts the lower peripheral edge 12 of the lower metal sheet 10 and an upper surface 50 b that contacts the upper peripheral edge 21 of the upper metal sheet 20 . The upper surface 10b of the lower peripheral edge 12 of the lower metal sheet 10 and the lower surface 50a of the spacer member 50 are diffusion-bonded, and the lower surface 20a of the upper peripheral edge 21 of the upper metal sheet 20 and the upper surface 50b of the spacer member 50 are bonded together. Diffusion bonded. Like the lower peripheral edge part 12 and the upper peripheral edge part 21, the spacer member 50 is formed around the entire periphery of the wick sheet 30, and is formed into a rectangular frame shape along each metal sheet 10, 20. There is. In this way, the sealed space 3 formed by the upper vapor flow path recess 32 and the lower liquid flow path 40 of the wick sheet 30 is sealed by the lower metal sheet 10, the upper metal sheet 20, and the spacer member 50. There is. Note that the lower metal sheet 10 and the spacer member 50, and the upper metal sheet 20 and the spacer member 50 may be joined by other methods such as brazing instead of diffusion bonding, as long as they can be permanently joined. Further, the planar shape of the spacer member 50 is arbitrary as long as it is formed along each metal sheet 10, 20.

The spacer member 50 further has an inner surface 50c that contacts the outer surface 30c of the wick sheet 30. The inner surface 50c is formed to extend from the lower surface 50a to the upper surface 50b. No gap is formed between the inner surface 50c of the spacer member 50 and the outer surface 30c of the wick sheet 30 through which the vapor of the working fluid 2 or the liquid working fluid 2 can pass.

Note that the upper surface 10b of the lower metal sheet 10 and the lower surface (corresponding to the lower surface 30a) of the convex portion 44 of the wick sheet 30 are in contact with each other, but are not joined. However, no gap is formed between the upper surface 10b of the lower metal sheet 10 and the lower surface of the convex portion 44 of the wick sheet 30 through which the vapor of the hydraulic fluid 2 or the liquid hydraulic fluid 2 can pass. There is. Similarly, the lower surface 20a of the upper metal sheet 20 and the upper surface 34a (corresponding to the upper surface 30b) of the upper channel protrusion 34 of the wick sheet 30 are in contact with each other, but are not joined. However, no gap is formed between the lower surface 20a of the upper metal sheet 20 and the upper surface 34a of the upper channel protrusion 34 of the wick sheet 30, through which the vapor of the hydraulic fluid 2 or the liquid hydraulic fluid 2 can pass. It has become.

The materials used for the lower metal sheet 10, the upper metal sheet 20, and the wick sheet 30 are preferably materials with good thermal conductivity. For example, the lower metal sheet 10, the upper metal sheet 20, and the wick sheet 30 are preferably made of a metal material such as copper (oxygen-free copper) or a copper alloy. Thereby, the thermal conductivity of the lower metal sheet 10, the upper metal sheet 20, and the wick sheet 30 can be increased. Therefore, the heat transport efficiency of the vapor chamber 1 can be improved. Note that since heat transport from the lower metal sheet 10 to the upper metal sheet 20 is mainly achieved by the working fluid 2, the wick sheet 30 is made of a different material from the lower metal sheet 10 and the upper metal sheet 20. Therefore, the thermal conductivity may be lower than that of the metal sheets 10 and 20. Moreover, the lower metal sheet 10, the upper metal sheet 20, and the wick sheet 30 may be made of materials other than metal materials as long as the heat transport function can be ensured.

The material used for the spacer member 50 is arbitrary as long as it can be suitably diffusion bonded to the lower metal sheet 10 and suitably diffusion bonded to the upper metal sheet 20. When the same material as the lower metal sheet 10 and the upper metal sheet 20 is used as the spacer member 50, the spacer member 50 can also function as a heat transport member, improving the heat transport efficiency of the vapor chamber 1. be able to.

The thickness of the vapor chamber 1 is, for example, 150 μm to 2700 μm. The thickness T1 of the lower metal sheet 10 and the thickness T2 of the upper metal sheet 20 are, for example, 5 μm to 1000 μm, but are preferably 10 μm or more from the viewpoint of ease of handling. The thickness T3 of the wick sheet 30 is, for example, 50 μm to 700 μm, preferably 100 μm to 700 μm. The thickness of the spacer member 50 is the same as the thickness T3 of the wick sheet 30. Although FIG. 2 shows a case where the thickness T1 of the lower metal sheet 10 and the thickness T2 of the upper metal sheet 20 are equal, the present invention is not limited to this, and the thickness T1 of the lower metal sheet 10 and the thickness T2 of the upper metal sheet The thicknesses T2 of the metal sheets 20 do not have to be equal.

Next, a method for manufacturing the vapor chamber 1 of this embodiment having such a configuration will be described with reference to FIGS. 8 to 18. Note that FIGS. 8 to 18 show cross sections similar to the cross-sectional view of FIG. 3.

Here, first, the manufacturing process of the wick sheet 30 will be explained.

First, as shown in FIG. 8, as a preparation step, a flat metal material sheet M is prepared.

Subsequently, as shown in FIG. 9, as a resist forming step, a lower resist film 60 is formed on the lower surface Ma of the metal material sheet M, and an upper resist film 61 is formed on the upper surface Mb. Before forming each resist film 60, 61, it is preferable that the lower surface Ma and upper surface Mb of the metal material sheet M be subjected to acidic degreasing treatment as a pretreatment.

Next, as shown in FIG. 10, in a patterning step, the lower resist film 60 and the upper resist film 61 are patterned by photolithography. In this case, first resist openings 62 corresponding to the main stream grooves 41 and communication grooves 45 of the lower liquid flow path section 40 are formed in the lower resist film 60, and second resist openings corresponding to the communication recesses 35 are formed in the lower resist film 60. 63 is formed. Among these, the first resist opening 62 is preferably formed to be smaller than the width of the main groove 41 and the communication groove 45 on the lower surface 30a of the wick sheet 30. For example, when forming the mainstream groove 41 having a width w1 of 70 μm to 150 μm, the width w3 of the first resist opening 62 is preferably 20 μm to 100 μm. On the other hand, the second resist opening 63 is preferably formed in the same planar shape as the communicating recess 35 on the lower surface 30a of the wick sheet 30. Furthermore, a third resist opening 64 corresponding to the upper vapor flow path recess 32 is formed in the upper resist film 61 . This third resist opening 64 is preferably formed in the same planar shape as the upper vapor flow path recess 32 on the upper surface 30b of the wick sheet 30. In this case, the upper resist film 61 in which the third resist opening 64 is formed is formed to have the same planar shape as the upper surface 34a of the upper channel protrusion 34.

Subsequently, as shown in FIG. 11, in an etching step, the lower surface Ma and upper surface Mb of the metal material sheet M are etched. As a result, portions of the lower surface Ma of the metal material sheet M corresponding to the first resist openings 62 and the second resist openings 63 are etched, and the mainstream groove of the lower liquid flow path section 40 as shown in FIG. 11 is etched. 41, a communication groove 45, and a communication recess 35 are formed.

Here, as described above, the first resist opening 62 is formed smaller than the width of the mainstream groove 41 and the communication groove 45 on the lower surface 30a of the wick sheet 30. This reduces the amount of etching solution that enters the first resist openings 62, and reduces the etching rate of the portion of the lower surface Ma of the metal material sheet M that corresponds to the first resist openings 62. Therefore, the depths of the main groove 41 and the communication groove 45 formed by the first resist opening 62 can be made shallow. On the other hand, the second resist opening 63 is formed to have the same planar shape as the communicating recess 35 on the lower surface 30a of the wick sheet 30. As a result, the amount of etching solution that enters the second resist opening 63 is ensured, and the depth of the communicating recess 35 formed by the second resist opening 63 can be increased.

In the etching process, the upper surface Mb of the metal material sheet M is also etched at the same time, and the portion of the upper surface Mb that corresponds to the third resist opening 64 is etched to form the upper vapor flow path recess 32 as shown in FIG. be done. Here, as described above, the third resist opening 64 is formed to have the same planar shape as the upper vapor flow path recess 32 on the upper surface 30b of the wick sheet 30. As a result, the amount of etching solution that enters the third resist opening 64 is ensured, and the depth of the upper vapor flow path recess 32 formed by the third resist opening 64 can be increased.

Furthermore, in the etching process, the peripheral edge of the metal material sheet M is etched from the lower surface Ma and the upper surface Mb to obtain a predetermined external contour shape as shown in FIGS. 4 and 5. That is, the outer surface 30c of the wick sheet 30 is formed. Note that as the etching solution, for example, an iron chloride-based etching solution such as a ferric chloride aqueous solution, or a copper chloride-based etching solution such as a copper chloride aqueous solution can be used.

After the etching process, as shown in FIG. 12, the lower resist film 60 and the upper resist film 61 are removed in a resist removal process.

In this way, the wick sheet manufacturing process is completed, and the wick sheet 30 according to the present embodiment can be obtained.

After the wick sheet manufacturing process, as shown in FIG. 13, the lower metal sheet 10, the upper metal sheet 20, the wick sheet 30, and the spacer member 50 are assembled in an assembly process.

In this case, first, a lower metal sheet 10 and an upper metal sheet 20 as shown in FIGS. 2 and 3 are prepared. It is preferable that injection holes 22 be formed in advance in the upper metal sheet 20 by etching, cutting, punching, or the like.

Subsequently, the wick sheet 30 and the spacer member 50 are placed on the lower metal sheet 10. At this time, the lower surface 30a of the wick sheet 30 is brought into contact with the upper surface 10b of the lower metal sheet 10. The spacer member 50 is arranged around the wick sheet 30, and the lower surface 50a of the spacer member 50 is brought into contact with the upper surface 10b of the lower peripheral edge 12 of the lower metal sheet 10. Furthermore, the inner surface 50c of the spacer member 50 is brought into contact with the outer surface 30c of the wick sheet 30. Here, the upper surface 10b of the lower metal sheet 10 is not formed with a vapor flow path through which the vapor of the working fluid 2 passes or a liquid flow path through which the liquid working fluid 2 passes. Therefore, the alignment between the lower metal sheet 10 and the wick sheet 30 can be performed to the extent that the outer edge of the lower metal sheet 10 and the outer edge of the spacer member 50 can be aligned, which simplifies the alignment. Can be done.

Next, the upper metal sheet 20 is placed on the wick sheet 30 and the spacer member 50. In this case, the lower surface 20a of the upper metal sheet 20 is brought into contact with the upper surface 30b of the wick sheet 30. Furthermore, the lower surface 20a of the upper peripheral edge portion 21 of the upper metal sheet 20 is brought into contact with the upper surface 50b of the spacer member 50. Here, the lower surface 20a of the upper metal sheet 20 is not formed with a vapor flow path through which the vapor of the working fluid 2 passes or a liquid flow path through which the liquid working fluid 2 passes. Therefore, the upper metal sheet 20 and the wick sheet 30 need only be aligned to the extent that the outer edge of the upper metal sheet 20 and the outer edge of the spacer member 50 can be aligned, and the alignment can be simplified. .

In this way, a sheet assembly 65 is obtained in which the wick sheet 30 and the spacer member 50 are interposed between the lower metal sheet 10 and the upper metal sheet 20.

After the assembly process, as shown in FIG. 14, the lower metal sheet 10, upper metal sheet 20, and spacer member 50 of the sheet assembly 65 are temporarily attached in a temporary attachment process. In this case, the lower metal sheet 10, the upper metal sheet 20, and the spacer member 50 are fixed. The fixing method is not particularly limited, but for example, by resistance welding the lower metal sheet 10 and the upper metal sheet 20 via the spacer member 50, the lower metal sheet 10 and the upper metal sheet 20 are fixed. 20 and spacer member 50 may be fixed. In this case, as shown in FIG. 14, it is preferable to perform spot resistance welding using an electrode rod 66. Laser welding may be used instead of resistance welding.

After the temporary fixing step, as shown in FIG. 15, in a bonding step, the lower metal sheet 10 and the upper metal sheet 20 are permanently bonded via the spacer member 50 by diffusion bonding. Diffusion bonding refers to bonding the lower metal sheet 10 and spacer member 50 and the upper metal sheet 20 and spacer member 50 in close contact with each other, and then bonding the lower metal sheet 10 in a controlled atmosphere such as a vacuum or inert gas. In this method, the upper metal sheet 20 and the spacer member 50 are pressed in a direction in which they are brought into close contact with each other and are heated, thereby making use of the diffusion of atoms that occurs at the bonding surface. In diffusion bonding, the materials of the lower metal sheet 10, upper metal sheet 20, and spacer member 50 are heated to a temperature close to their melting point, but lower than the melting point, so each metal sheet 10, 20 and spacer member 50 are melted. Deformation can be avoided.

Through the bonding process, the upper surface 10b of the lower peripheral edge portion 12 of the lower metal sheet 10 is diffusion bonded to the lower surface 50a of the spacer member 50. Further, the lower surface 20a of the upper peripheral edge portion 21 of the upper metal sheet 20 is diffusion bonded to the upper surface 50b of the spacer member 50. As a result, a sealed space 3 is formed by the lower metal sheet 10, the upper metal sheet 20, and the spacer member 50.

After the bonding process, the hydraulic fluid 2 is sealed in the sealed space 3 as an enclosure process. The enclosing process includes a vacuuming process, an injection process, and a sealing process.

First, as shown in FIG. 16, in a vacuuming process, the sealed space 3 is evacuated. As a result, the pressure in the sealed space 3 is reduced.

After the evacuation process, as shown in FIG. 17, the hydraulic fluid 2 is injected into the sealed space 3 as an injection process. The hydraulic fluid 2 is injected into the sealed space 3 through an injection hole 22 provided in the upper metal sheet 20.

After the injection process, as shown in FIG. 18, the injection hole 22 is sealed in a sealing process. In this case, first, the amount of hydraulic fluid 2 injected into the sealed space 3 is adjusted. More specifically, the seat assembly 65 is heated as a whole, vaporizing the injected hydraulic fluid 2 and causing some of the vapor of the hydraulic fluid 2 to be discharged from the sealed space 3 . Subsequently, when the amount of the working fluid 2 remaining in the sealed space 3 is reduced to a predetermined amount, the sealing member 23 is attached to the injection hole 22 . Thereafter, the sealing member 23 is joined to the injection hole 22 by, for example, laser welding. In this way, the injection hole 22 is sealed. This blocks communication between the sealed space 3 and the outside air, seals the hydraulic fluid 2 in the sealed space 3, and prevents the hydraulic fluid 2 in the sealed space 3 from leaking to the outside. Note that when the temperature of the seat assembly 65 decreases to room temperature, the pressure in the sealed space 3 decreases to a pressure close to vacuum. Thereby, when receiving heat from the device D, the working fluid 2 sealed in the sealed space 3 can evaporate at a temperature lower than 100° C., and heat transport efficiency can be increased.

As described above, the manufacture of vapor chamber 1 is completed, and vapor chamber 1 according to the present embodiment is obtained.

Next, a method of operating the vapor chamber 1, that is, a method of cooling the device D will be described.

The vapor chamber 1 obtained as described above is installed in a housing of a mobile terminal or the like, and a device D such as a CPU, which is a device to be cooled, is attached to the lower surface 10a of the lower metal sheet 10. Since the amount of the working fluid 2 injected into the sealed space 3 is small, the liquid working fluid 2 inside the sealed space 3 is caused to spread on the wall surface of the sealed space 3, that is, on the wall surface of the upper steam passage recess 32, due to its surface tension. 33, adheres to the wall surface 36 of the communication recess 35, the wall surface 42 of the main stream groove 41 of the lower liquid flow path section 40, and the wall surface 46 of the communication groove 45 (see FIG. 20). Further, the hydraulic fluid 2 is applied to the portions of the upper surface 10b of the lower metal sheet 10 that are exposed to the communication recess 35, the mainstream groove 41, and the communication groove 45, and to the upper steam flow path recess 32 of the lower surface 20a of the upper metal sheet 20. It also adheres to exposed areas.

When the device D generates heat in this state, the working fluid 2 present in the evaporation part 31 (see FIGS. 4 and 5) of the upper vapor flow path recess 32 is transferred from the device D to the heat receiving part 11 of the lower metal sheet 10 (see FIGS. (see Figure 3). The received heat is absorbed as latent heat, the working fluid 2 evaporates (vaporizes), and vapor of the working fluid 2 is generated. Most of the generated steam diffuses within the upper steam flow path recess 32 that constitutes the sealed space 3 (see solid line arrows in FIG. 4). The steam in the upper steam flow path recess 32 leaves the evaporator 31, and most of the steam is transported to the peripheral edge of the wick sheet 30, where the temperature is relatively low. The diffused vapor mainly radiates heat to the upper metal sheet 20 and is cooled. The heat received by the upper metal sheet 20 from the steam is transferred to the outside air via the housing member Ha (see FIG. 3).

By radiating heat to the upper metal sheet 20, the steam loses the latent heat absorbed in the evaporator 31 and condenses. The condensed and liquid working fluid 2 adheres to the wall surface 33 of the upper steam flow path recess 32 and the lower surface 20a of the upper metal sheet 20. Here, since the working fluid 2 continues to evaporate in the evaporation section 31, the working fluid 2 in the portion of the lower liquid flow path section 40 other than the evaporation section 31 is transported toward the evaporation section 31 (Fig. (See dashed arrow in 5). As a result, the liquid working fluid 2 adhering to the wall surface 33 of the upper vapor flow path recess 32 and the lower surface 20a of the upper metal sheet 20 moves to the lower liquid flow path section 40 through the wall surface 36 of the communication recess 35. . Then, the liquid working fluid 2 enters the mainstream groove 41 of the lower liquid flow path portion 40 and fills each mainstream groove 41 and each communication groove 45 . Therefore, the filled working fluid 2 obtains a driving force toward the evaporation section 31 due to the capillary action of each mainstream groove 41 and each communication groove 45, and is smoothly transported toward the evaporation section 31.

In the lower liquid flow path section 40, each mainstream groove 41 communicates with another adjacent mainstream groove 41 via a corresponding communication groove 45. As a result, the liquid working fluid 2 flows back and forth between the mainstream grooves 41 that are adjacent to each other, and dry-out in the mainstream grooves 41 is suppressed from occurring. Therefore, a capillary action is applied to the working fluid 2 in each mainstream groove 41, and the working fluid 2 is smoothly transported toward the evaporation section 31.

The working fluid 2 that has reached the evaporation section 31 receives heat again from the device D via the heat receiving section 11 of the lower metal sheet 10 and evaporates. The vapor of the evaporated working fluid 2 passes through the communication groove 45 and the communication recess 35, moves to the upper steam flow path recess 32 having a large flow channel cross-sectional area, and diffuses within the upper steam flow path recess 32. In this way, the working fluid 2 circulates in the sealed space 3 while repeating phase changes, that is, evaporation and condensation, and transports and releases the heat of the device D. As a result, device D is cooled.

As described above, according to the present embodiment, the upper steam passage recess 32 through which the vapor of the working fluid 2 passes is provided on the upper surface 30b of the wick sheet 30 interposed between the lower metal sheet 10 and the upper metal sheet 20. A lower liquid flow path section 40 through which the liquid working fluid 2 passes is provided on the lower surface 30a. This makes it unnecessary to perform etching on the lower metal sheet 10 and the upper metal sheet 20 to form vapor channels and liquid channels. That is, the number of members to be etched can be reduced. Therefore, the manufacturing process of the vapor chamber 1 can be simplified, and the vapor chamber 1 can be easily manufactured. In addition, since the upper vapor flow path recess 32 and the lower liquid flow path 40 are formed in the wick sheet 30, the upper vapor flow path recess 32 and the lower liquid flow path 40 can be positioned accurately during etching. can do. Therefore, it is not necessary to align the upper vapor flow path recess 32 and the lower liquid flow path 40 in the assembly process. As a result, the vapor chamber 1 can be manufactured easily.

Further, according to the present embodiment, the lower surface 30a of the wick sheet 30 is provided with a lower liquid flow path section 40 through which the liquid working fluid 2 passes, and the upper surface 30b is provided with an upper vapor flow path through which the vapor of the working fluid 2 passes. A path recess 32 is provided. As a result, the lower liquid flow path section 40 can be arranged on the lower metal sheet 10 side, and the upper vapor flow path recess 32 can be arranged on the upper metal sheet 20 side. Therefore, the heat received from the heat receiving portion 11 of the lower metal sheet 10 can be effectively used for evaporating the working fluid 2, and the vapor of the working fluid 2 can effectively radiate heat to the upper metal sheet 20. can. As a result, the heat transport efficiency of the vapor chamber 1 can be improved.

Further, according to the present embodiment, the spacer member 50 is interposed between the lower peripheral edge 12 of the lower metal sheet 10 and the upper peripheral edge 21 of the upper metal sheet 20. Thereby, the lower metal sheet 10 and the upper metal sheet 20 can be diffusion bonded via the spacer member 50, and the bonding strength can be improved. Therefore, the lower metal sheet 10 and the upper metal sheet 20 can be diffusion bonded while making the lower metal sheet 10 and the upper metal sheet 20 into a simple flat shape.

Further, according to this embodiment, the upper surface 10b of the lower metal sheet 10 is formed into a flat shape. Thereby, the main stream groove 41 of the lower liquid flow path section 40 can be covered by the flat upper surface 10b. Therefore, two right-angled or acute-angled corners 38 (see FIG. 7) can be formed in the cross section of the mainstream groove 41, which enhances the capillary action acting on the hydraulic fluid 2 in each mainstream groove 41. be able to. Therefore, a driving force toward the evaporation section 31 can be applied to the working fluid 2 in the main stream groove 41, and the working fluid 2 can be smoothly transported toward the evaporation section 31. Capillary action can be similarly enhanced in each communication groove 45 as well.

Further, according to the present embodiment, the upper vapor flow path recess 32 communicates with the lower liquid flow path 40 via the communication recess 35. Thereby, the liquid working fluid 2 condensed in the upper vapor flow path recess 32 can be smoothly moved to the lower liquid flow path 40 through the communication recess 35 . Therefore, the liquid working fluid 2 can be smoothly transported to the evaporation section 31. In particular, according to this embodiment, the communication recess 35 contacts and communicates with the plurality of mainstream grooves 41 of the lower liquid flow path section 40. As a result, the liquid working fluid 2 that has passed through the communication recess 35 can smoothly enter the plurality of mainstream grooves 41 . Therefore, the liquid working fluid 2 can be more smoothly transported by the evaporator 31.

Further, according to the present embodiment, the wall surface 33 that defines the upper steam flow path recess 32 and the wall surface 36 that defines the communication recess 35 are curved toward the penetrating portion 37 . As a result, the upper vapor flow path recess 32 and the communication recess 35 can be formed by etching from the lower surface 30a and the upper surface 30b of the wick sheet 30, and the lower liquid flow path 40 and the upper steam flow path recess 32 can be easily communicated with each other.

Further, according to the present embodiment, in the cross section shown in FIG. It is smaller than the width of the recess 35. This makes it possible to ensure a distance between the adjacent penetration parts 37 and increase the strength of the wick sheet 30. Further, the vapor of the working fluid 2 evaporated in the evaporator 31 passes through the constricted through-hole 37 and reaches the upper vapor flow path recess 32 . At this time, since the flow passage cross-sectional area of the vapor of the working fluid 2 expands when it passes through the penetration part 37, the vapor of the working fluid 2 can diffuse vigorously into the upper vapor passage recessed part 32. Therefore, heat transport efficiency can be improved.

Further, according to the present embodiment, a plurality of upper passage protrusions are provided in the upper steam passage recess 32 and protrude from the bottom of the wall surface 33 of the upper steam passage recess 32 and come into contact with the lower surface 20a of the upper metal sheet 20. 34 are provided. Thereby, when the pressure in the sealed space 3 is reduced, the upper metal sheet 20 can be prevented from being deformed by the pressure of the outside air, and the mechanical strength of the vapor chamber 1 can be improved. In particular, according to the present embodiment, the plurality of upper channel protrusions are arranged in a staggered manner in plan view, thereby further preventing deformation of the upper metal sheet 20 when the pressure in the sealed space 3 is reduced. At the same time, it is possible to suppress the flow of steam of the working fluid 2 from being obstructed.

Further, according to the present embodiment, the communication recess 35 is arranged between the upper channel protrusions 34 adjacent to each other in plan view. This effectively prevents the mechanical strength of the vapor chamber 1 from decreasing.

(First modification)
In addition, in this embodiment mentioned above, the example in which the width and depth of the communication groove 45 were the same as the width and depth of the main stream groove 41 was explained. However, it is not limited to this. For example, as shown in FIGS. 19 to 21, the width of the communication groove 45 may be larger than the width of the main groove 41. Modifications shown in FIGS. 19 to 21 will be described below.

As shown in FIG. 19, the main stream groove 41 includes an intersection P with which the communication groove 45 communicates, and a main stream groove main body part 41a.

Among these, at the intersection P, a pair of communication grooves 45 located on both sides of the main stream groove 41 in the second direction Y communicate with the main stream groove 41 . The pair of communication grooves 45 are aligned in the second direction Y and arranged in a straight line. In this way, at the intersection P, the main groove 41 and the communication groove 45 intersect in a cross shape. The intersection P is a region between the main groove main body portions 41a that are adjacent to each other in the first direction X, and is a region between the communication grooves 45 that are adjacent to each other in the second direction Y. In other words, the main groove 41 and the row of communication grooves 45 intersect (ie, overlap).

The main groove main body portion 41a is disposed at a position different from the intersection P in the first direction X, and is a portion located between the convex portions 44 adjacent to each other in the second direction Y. The intersection portions P and the main groove main body portions 41a are arranged alternately.

The width w1 (dimension in the second direction Y) of the mainstream groove 41 may be larger than the width w2 (dimension in the second direction Y) of the convex portion 44. In this case, the proportion of the mainstream grooves 41 in the lower surface 30a of the wick sheet 30 can be increased. Therefore, the flow path density of the mainstream grooves 41 on the lower surface 30a can be increased, and the transport function of the liquid working fluid 2 can be improved. For example, the width w1 of the main groove 41 may be 30 μm to 200 μm, and the width w2 of the convex portion 44 may be 20 μm to 180 μm.

The width w3 of the communication groove 45 may be larger than the width w1 of the main stream groove 41 (more specifically, the width of the main stream groove body portion 41a). The width w3 of the communication groove 45 may be, for example, 40 μm to 300 μm.

The shape of the cross section (cross section in the second direction Y) of the main stream groove 41 is not particularly limited, and can be, for example, rectangular, curved, semicircular, or V-shaped. The cross-sectional shape (cross-section in the first direction X) of the communication groove 45 is also similar. 20 and 21 show an example in which the main flow groove 41 and the communication groove 45 have curved cross sections, respectively. In this case, the width of the main groove 41 and the communication groove 45 is the width of the groove on the lower surface 30a of the wick sheet 30. Similarly, the width of the convex portion 44 is the width of the convex portion on the lower surface 30a.

By the way, in FIG. 19, each convex part 44 is formed in a rectangular shape so that the first direction X is the longitudinal direction in plan view. The convex portion 44 may be formed in the same shape throughout the lower liquid flow path portion 40. However, a rounded curved portion 47 is provided at the corner of each convex portion 44 . Thereby, the corners of each convex portion 44 are formed into a smoothly curved shape, and the flow path resistance of the liquid working fluid 2 is reduced. Note that two curved portions 47 are provided at the right end and left end of the convex portion 44 in FIG. 19, respectively, and a linear portion 48 is provided between these two curved portions 47. An example is shown. Therefore, the width w3 of the communication groove 45 is the distance between the linear portions 48 of the convex portions 44 that are adjacent to each other in the first direction X. Although not shown, the same applies when the curved portion 47 is not formed at the corner of each convex portion 44. However, the end shape of the convex portion 44 is not limited to this. For example, the straight portion 48 may not be provided at each of the right end and the left end, and the entire end may be curved (for example, semicircular). In this case, the width w3 of each communication groove 45 is the minimum distance between the convex portions 44 adjacent to each other in the first direction X.

As shown in FIGS. 20 and 21, in this modification, the depth h3 of the communication groove 45 is deeper than the depth h1 of the main stream groove 41 (more specifically, the depth of the main stream groove body 41a). It may be. Here, as described above, when the cross-sectional shape of each mainstream groove 41 and the cross-sectional shape of each communication groove 45 are formed in a curved shape, the depth of the grooves 41 and 45 is determined at the deepest position in the groove. Let the depth be . The depth h3 of the communication groove 45 may be, for example, 10 μm to 250 μm.

In this modification, as shown in FIG. 21, the depth h1' of the intersection P of the main stream groove 41 may be deeper than the depth h1 of the main stream groove body 41a. Further, the depth h1' of the intersection P of the main groove 41 may be deeper than the depth h3 of the communication groove 45. The depth h1' of such an intersection P may be, for example, 20 μm to 300 μm. The depth h1' of the intersection P is the depth at the deepest position in the intersection P.

As described above, the depth h3 of the communication groove 45 is deeper than the depth h1 of the main stream groove body portion 41a of the main stream groove 41, and the depth h1' of the intersection P of the main stream groove 41 is deeper than the depth h1 of the main stream groove body 41a of the main stream groove 41. It may be deeper than the depth h1 of the groove main body portion 41a. As a result, a buffer region Q deeper than the depth h1 of the main groove main body portion 41a is formed in a region extending from the intersection P via the communication groove 45 to the intersection P. This buffer region Q is capable of storing liquid working fluid 2. Normally, each main flow groove 41 and each communication groove 45 of the lower liquid flow path section 40 are filled with liquid working fluid 2. Therefore, since the depths (h1' and h3) of the buffer region Q are deeper than the depth h1 of the main groove main body portion 41a, it is possible to store a large amount of the working fluid 2 in the buffer region Q. It has become. As described above, since each mainstream groove 41 and each communication groove 45 are filled with the hydraulic fluid 2, the hydraulic fluid 2 can be stored in the buffer region Q regardless of the attitude of the vapor chamber 1. . In this modification, since the communication grooves 45 are aligned in the second direction Y, the buffer region Q is formed to extend continuously in the second direction Y.

Note that a large number of intersections P are formed in the lower liquid flow path section 40 of the vapor chamber 1, and the depth h1' of at least one of the intersections P is the depth h1' of the main groove main body section 41a. (or the depth h3 of the communication groove 45), the storage performance of the hydraulic fluid 2 at the intersection P can be improved. This storage performance improves as the number of intersections P having a depth h1' deeper than the depth h1 of the main groove body 41a increases, so that the depth h1' of all intersections P has a similar depth. It is preferable to have. However, it is clear that the storage performance of the hydraulic fluid 2 can be improved even if the depth h1' of some of the intersections P is not deeper than the depth h1 of the main groove main body part 41a due to manufacturing errors or the like. It is. The same applies to the depth h3 of the communication groove 45.

Here, a method of confirming the width and depth of the main stream groove 41 and the width and depth of the communication groove 45 from the completed vapor chamber 1 will be explained. Generally, the main stream groove 41 and the communication groove 45 are not visible from the outside of the vapor chamber 1. For this reason, there is a method of checking the width and depth of the mainstream groove 41 and the communication groove 45 from the cross-sectional shape obtained by cutting the completed vapor chamber 1 at a desired position.

Specifically, first, the vapor chamber 1 was cut into a 10 mm square piece using a wire saw to prepare a sample. Subsequently, the sample is embedded in a resin while degassing under vacuum so that the resin enters the upper vapor flow path recess 32, communication recess 35, and lower liquid flow path 40 (mainstream groove 41 and communication groove 45). Next, trimming is performed using a diamond knife to obtain the desired cross section. At this time, a diamond knife of a microtome (Ultra Microtome manufactured by Leica Microsystems) is used to perform trimming to a portion 40 μm away from the measurement target position. For example, if the pitch of the communication grooves 45 is 200 μm, by cutting 160 μm from the communication groove 45 next to the communication groove 45 that is the purpose of measurement, it is possible to specify a portion 40 μm away from the communication groove 45 that is the purpose of measurement. can. Next, a cut surface for observation is prepared by cutting the trimmed cut surface. At this time, using a cross-sectional sample preparation device (cross-section polisher manufactured by J OEL), the cut surface is polished by ion beam processing with the protrusion width set to 40 μm, the voltage to 5 kV, and the time to 6 hours. Thereafter, the cut surface of the obtained sample is observed. At this time, the cut surface is observed using a scanning electron microscope (scanning electron microscope manufactured by Carl Zeiss) with the voltage set to 5 kV, the working distance set to 3 mm, and the observation magnification set to 500 times. In this way, the width and depth of the main groove 41 and the communication groove 45 can be measured. Note that the observation magnification standard during photographing is Polaroid 545 .

As described above, the width w3 of the communication groove 45 is larger than the width w1 of the main flow groove 41. As a result, the buffer region Q has a larger opening than the main groove main body portion 41a. Therefore, in the etching process shown in FIG. 11, more of the etching solution enters the buffer region Q than the main groove main body portion 41a. As a result, the buffer region Q is eroded by the etching solution, and the depth of the buffer region Q becomes deeper. The portion of the buffer region Q that corresponds to the intersection P communicates with the main groove main body portion 41a, so that the etching solution enters therein more easily than in the communication groove 45. As a result, the depth h1' of the intersection P can be deeper than the depth h3 of the communication groove 45. In this way, a buffer region Q as shown in FIGS. 19 and 21 is formed.

By the way, a part of the working fluid 2 heading toward the evaporator 31 is drawn into the buffer region Q formed by the intersection P and is stored therein.

When dryout occurs in the main groove main body portion 41a during operation of the vapor chamber 1, the hydraulic fluid 2 stored in the buffer region Q moves toward the portion where the dryout occurs. More specifically, when dryout occurs in the main groove main body part 41a, the hydraulic fluid 2 flows from the buffer region Q closest to the part where the dryout occurs due to the capillary action of the main flow groove main body part 41a. Go to section. As a result, the area where the dryout occurs is filled with the hydraulic fluid 2, and the dryout is eliminated.

Further, when bubbles are generated by the vapor in the liquid working fluid 2 in the mainstream groove main body portion 41a, the bubbles are drawn into the buffer region Q on the downstream side (the side of the evaporation section 31) and are held there. Since the depth of the buffer region Q is deeper than the depth h1 of the main groove main body portion 41a, the bubbles drawn into the buffer region Q are suppressed from moving from the buffer region Q to the main groove main body portion 41a. Ru. Therefore, the buffer region Q can trap air bubbles generated in the main groove main body portion 41a, and can prevent the flow of the working fluid 2 to the evaporator 31 from being obstructed by the air bubbles.

As described above, according to this modification, the width w3 of the communication groove 45 is larger than the width w1 of the main groove 41. Thereby, the flow path resistance of the hydraulic fluid 2 in each communication groove 45 can be reduced. Therefore, the liquid working fluid 2 condensed from steam can smoothly enter each mainstream groove 41. That is, it can smoothly enter not only the mainstream groove 41 communicating with the communicating recess 35 but also the mainstream groove 41 not communicating with the communicating recess 35, improving the transport function of the condensed liquid working fluid 2. can be done. As a result, the transport function of the liquid working fluid 2 can be improved, and the heat transport efficiency can be improved.

Further, according to this modification, the depth h3 of the communication groove 45 is deeper than the depth h1 of the main groove 41. This allows each communication groove 45 to form a buffer region Q in which the hydraulic fluid 2 is stored. Therefore, when dryout occurs in the main stream groove 41, the hydraulic fluid 2 stored in the buffer region Q can be moved to the area where the dryout occurs. Therefore, dryout can be eliminated, and the function of transporting the hydraulic fluid 2 in each mainstream groove 41 can be restored. Further, when air bubbles are generated in the main stream groove 41, the air bubbles can be drawn into the buffer region Q and captured. In this respect as well, the transport function of the hydraulic fluid 2 in each mainstream groove 41 can be restored.

Further, according to this modification, the depth h1' of the intersection P of the main stream groove 41 is deeper than the depth h1 of the main stream groove main body part 41a. This allows the buffer area Q to extend to the intersection P. Therefore, the amount of hydraulic fluid 2 stored in the buffer region Q can be increased, making it easier to eliminate dryout.

Further, according to this modification, the depth h1' of the intersection P of the main groove 41 is deeper than the depth h3 of the communication groove 45. As a result, the depth of the buffer region Q can be increased on the side of the buffer region Q that is closer to the dry-out occurrence area. Therefore, the stored hydraulic fluid 2 can be smoothly moved to the area where dryout occurs, making it easier to eliminate dryout.

In the first modification described above, the width w3 of the communication groove 45 is larger than the width w1 of the main stream groove 41, the depth h3 of the communication groove 45 is deeper than the depth h1 of the main stream groove 41, and the width w3 of the communication groove 45 is greater than the width w1 of the main stream groove 41, The depth h1' of the intersection P of the groove 41 is deeper than the depth h1 of the main groove main body part 41a, and the depth h1' of the intersection P of the main groove 41 is deeper than the depth h3 of the communication groove 45. I explained an example where the depth is also deep. That is, in the first modification, an example in which the width and depth have four magnitude relationships has been described. However, the invention is not limited to this, and as long as at least one of these four magnitude relationships is satisfied, the above-described effects corresponding to the magnitude relationship can be achieved. Therefore, all four magnitude relationships may not be satisfied, and at least one magnitude relationship may be satisfied. In this case, the patterning process and the etching process may be performed in multiple steps, if necessary. For example, when forming the mainstream groove 41 and the communication groove 45 that satisfy the magnitude relationship that the depth h3 of the communication groove 45 is deeper than the depth h1 of the main flow groove 41, the main flow groove 41 and the communication groove 45 are formed. The steps may be performed separately. More specifically, first, the mainstream groove 41 is patterned, and then the resist is removed by etching. Thereafter, the communication groove 45 may be patterned while masking the main groove 41, and then the resist may be removed by etching. Alternatively, after patterning and etching the main groove 41 and the communication groove 45 at the same time, patterning is performed so as to mask the main groove main part 41a from above the resist without removing the resist, and the communication groove 45 and the intersection P are added. Alternatively, the resist may be removed after etching.

(Second modification)
Furthermore, in the present embodiment described above, the positions of the protrusions 44 of each protrusion row 43 in the first direction An example was explained where it is placed in . However, the present invention is not limited to this, and as shown in FIG. 22, the convex portions 44 may be arranged in a staggered manner.

More specifically, in the form shown in FIG. 22, the communication grooves 45 of adjacent convex rows 43 are arranged to be shifted from each other in the first direction X. In this case, even if the lower metal sheet 10 is dented inward (toward the wick sheet 30 side) along the communication groove 45 due to the pressure of the outside air, the dent can be prevented from crossing the main groove 41. . Therefore, the cross-sectional area of the main flow groove 41 can be secured, and the flow of the hydraulic fluid 2 can be prevented from being obstructed. As a result, the transport function of the liquid working fluid 2 can be improved, and the heat transport efficiency can be improved.

Moreover, in the form shown in FIG. 22, the main groove 41 and the communication groove 45 intersect in a T-shape. As a result, at the intersection where one main stream groove 41 and the communication groove 45 on one side (for example, the upper side in FIG. 22) intersect, the communication groove 45 on the other side (for example, the lower side in FIG. 22) intersects. Intersection with the main flow groove 41 can be avoided. This prevents the wall surface 42 (see FIG. 7) of the mainstream groove 41 from being cut out on both sides (upper and lower sides in FIG. 22) at the intersection, and allows one side of the wall surface 42 to remain. I can do it. Therefore, a capillary action can be applied to the hydraulic fluid 2 in the main stream groove 41 even at the intersection, and it is possible to suppress the propulsive force of the hydraulic fluid 2 toward the evaporator 31 from decreasing at the intersection. As a result, the transport function of the liquid working fluid 2 can be improved, and the heat transport efficiency can be improved.

(Modification 3)
Further, in the present embodiment described above, in the etching process, the lower surface 30a and the upper surface 30b of the wick sheet 30 are etched at the same time, and the upper vapor flow path recess 32, the communication recess 35, and the lower liquid flow path 40 are etched. An example in which the main groove 41 and the communication groove 45 are formed at the same time has been described. However, the invention is not limited to this, and the lower surface 30a and upper surface 30b of the wick sheet 30 may be etched separately. Furthermore, regarding the lower surface 30a of the wick sheet 30, the mainstream groove 41 and the communication groove 45 of the lower liquid flow path portion 40 may be etched separately from the communication recess 35. In this case, the depth of the main flow groove 41 and the depth of the communication groove 45 can be easily made different from the depth of the communication recess 35.

(Modification 4)
Furthermore, in the present embodiment described above, an example has been described in which the communication recess 35 is formed by etching from the lower surface 30a of the wick sheet 30, and the wall surface 36 is formed in a curved shape. However, the present invention is not limited to this, and the communication recess 35 may be formed in any cross-sectional shape as long as the upper vapor flow path recess 32 and the main stream groove 41 of the lower liquid flow path section 40 can communicate with each other. It's okay. For example, although not shown, the wall surface 36 of the communication recess 35 may be formed to extend linearly in a direction perpendicular to the lower surface 30a. In this case, after forming the upper vapor flow path recess 32 and the lower liquid flow path 40 in the etching process shown in FIG. 11, the communication recess 35 may be formed by punching from the lower surface 30a. can. Further, although not shown, the wall surface 36 of the communication recess 35 may be formed in a trapezoid shape that tapers from the lower surface 30a toward the upper surface 30b. In this case, after forming the upper vapor flow path recess 32 and the lower liquid flow path 40 in the etching process shown in FIG. 11, the communication recess 35 can be formed by irradiating laser light from the lower surface 30a. .

(Modification 5)
Furthermore, in the present embodiment described above, a vapor flow path recess (not shown) through which the vapor of the working fluid 2 passes may be formed in the lower surface 30a of the wick sheet 30. In this case, the vapor of the working fluid 2 can be diffused even more smoothly, and the heat transport efficiency can be improved.

(Second embodiment)
Next, a wick sheet for a vapor chamber, a vapor chamber, and a method for manufacturing a vapor chamber according to a second embodiment of the present invention will be described using FIGS. 23 and 24.

In the second embodiment shown in FIGS. 23 and 24, the main point is that the lower heat sealing layer of the lower metal sheet and the upper heat sealing layer of the upper metal sheet are heat-sealed. However, the other configurations are substantially the same as the first embodiment shown in FIGS. 1 to 22. Note that in FIGS. 23 and 24, the same parts as those in the first embodiment shown in FIGS. 1 to 22 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In this embodiment, as shown in FIG. 23, the lower metal sheet 10 has a lower heat-sealing layer 70 (first heat-sealing layer) provided on the outside of the wick sheet 30 in plan view on the upper surface 10b. layer). That is, the lower heat-sealing layer 70 is disposed on the upper surface 10b of the lower peripheral edge 12 of the lower metal sheet 10, is formed around the entire periphery of the wick sheet 30 in plan view, and has a rectangular frame shape. is formed.

The lower heat-fusible layer 70 can be formed by applying a heat-fusible resin material to the upper surface 10b of the lower metal sheet 10 by die coating, roll coating, or the like. The heat-adhesive resin material may be, for example, high-pressure low-density polyethylene (LDPE), vinyl acetate copolymer (EVA), or non-alcoholic resin, taking into consideration the bondability with the lower metal sheet 10 and the sealability of the sealed space 3. It is preferable to use oriented polypropylene (CPP) or the like. Further, in order to seal the sealed space 3 and maintain the lower metal sheet 10 in a flat shape, it is preferable that the coating width of the heat-fusible resin material is 1 mm, and the coating thickness is about 50 μm. It is preferable that

The upper metal sheet 20 has an upper heat sealing layer 71 (second heat sealing layer) provided on the lower surface 20a outside the wick sheet 30 in plan view. That is, the upper heat-sealing layer 71 is disposed on the lower surface 20a of the upper peripheral edge 21 of the upper metal sheet 20, is formed all around the wick sheet 30 in a plan view, and is formed into a rectangular frame shape. ing. The upper heat sealing layer 71 can be formed on the lower surface 20a of the upper metal sheet 20 using the same material and using the same method as the lower heat sealing layer 70.

The lower heat-sealing layer 70 and the upper heat-sealing layer 71 are heat-sealed and bonded to each other. That is, the lower heat sealing layer 70 and the upper heat sealing layer 71 are heat-sealed around the entire circumference of the wick sheet 30. In this way, the sealed space 3 formed by the upper vapor flow path recess 32 and the lower liquid flow path 40 of the wick sheet 30 is sealed by the lower metal sheet 10, the upper metal sheet 20, and the spacer member 50. There is. In this embodiment, it is preferable to omit the temporary fixing step as shown in FIG. 14 and to perform heat sealing instead of diffusion bonding in the bonding step as shown in FIG. 15. The heat sealing method is not particularly limited as long as the sealed space 3 can be sealed.

As described above, according to this embodiment, the lower heat sealing layer 70 of the lower metal sheet 10 and the upper heat sealing layer 71 of the upper metal sheet 20 are heat sealed. As a result, the lower metal sheet 10 and the upper metal sheet 20 can be joined by heat sealing, which is a relatively simple method, instead of by diffusion bonding. Therefore, the manufacturing process of the vapor chamber 1 can be simplified, and the vapor chamber 1 can be manufactured easily. It is also advantageous in that relatively large-scale diffusion bonding equipment can be eliminated in order to manufacture the vapor chamber 1. Furthermore, when joining the lower metal sheet 10 and the upper metal sheet 20, it is possible to suppress the temperature rise of each metal sheet 10, 20 and the wick sheet 30. Therefore, softening and deformation of the materials of each metal sheet 10, 20 and wick sheet 30 can be prevented.

Further, according to the present embodiment, the lower metal sheet 10 and the upper metal sheet 20 are heat-sealed by the lower heat-sealing layer 70 and the upper heat-sealing layer 71, so that the spacer member 50 ( (see FIG. 3, etc.) can be made unnecessary. Therefore, the mass of the vapor chamber 1 as a whole can be reduced, and weight reduction can be achieved.

(Modification 6)
In addition, in this embodiment mentioned above, the example in which the lower side metal sheet 10 and the upper side metal sheet 20 were formed in the flat shape was demonstrated. However, it is not limited to this. For example, as shown in FIG. 24, the lower metal sheet 10 and the upper metal sheet 20 may be formed into flexible films. In this case, for example, the thickness of the lower metal sheet 10 and the thickness of the upper metal sheet 20 are preferably 50 μm to 200 μm.

In the form shown in FIG. 24, the coating thickness of the heat-fusible resin material for forming the lower heat-fusible layer 70 is thinner than in the form shown in FIG. 23. For example, it can be about 30 μm. As a result, the lower peripheral edge 12 of the lower metal sheet 10 is deformed toward the upper peripheral edge 21 of the upper metal sheet 20. Similarly, the upper peripheral edge 21 of the upper metal sheet 20 is deformed toward the lower peripheral edge 12 of the lower metal sheet 10, and the lower peripheral edge and the upper peripheral edge are connected to the lower heat-sealing layer and the upper peripheral edge. It is heat sealed via the upper heat sealing layer.

In the form shown in FIG. 24, the thickness of the lower metal sheet 10 and the thickness of the upper metal sheet 20 can be reduced, so the thickness of the vapor chamber 1 as a whole can be reduced. Moreover, further weight reduction can be achieved.

(Third embodiment)
Next, a wick sheet for a vapor chamber, a vapor chamber, and a method for manufacturing a vapor chamber according to a third embodiment of the present invention will be described using FIGS. 25 to 33.

The third embodiment shown in FIGS. 25 to 33 differs mainly in that the steam flow path section of the wick sheet extends from the second surface to the first surface, and the other configurations are different from those shown in FIGS. 1 to 33. This embodiment is substantially the same as the first embodiment shown in 22. Note that in FIGS. 25 to 33, the same parts as those in the first embodiment shown in FIGS. 1 to 22 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In this embodiment, as shown in FIGS. 25 to 28, the vapor chamber 1 includes a lower metal sheet 10, an upper metal sheet 20, and a wick sheet 30. A spacer member 50 shown in FIG. 3 and the like is not provided between the lower metal sheet 10 and the upper metal sheet 20. Therefore, the lower surface 30a of the wick sheet 30 is diffusion bonded to the upper surface 10b of the lower metal sheet 10, and the upper surface 30b is diffusion bonded to the lower surface 20a of the upper metal sheet 20. The sealed space 3 includes a first steam passage 81 and a second steam passage 82 (a lower steam passage recess 85 and an upper steam passage recess 86, which will be described later) of a steam passage section 80, which will be described later, and a lower liquid passage section. 40 main stream grooves 41 and communication grooves 45.

The steam flow path section 80 of the wick sheet 30 extends from the upper surface 30b to the lower surface 30a of the wick sheet 30, and is formed to penetrate the wick sheet 30. This steam flow path section 80 is configured to allow the steam of the working fluid 2 to pass therethrough, and is defined inside a frame section 83, which will be described later.

The wick sheet 30 according to the present embodiment includes a frame portion 83 formed in a rectangular frame shape in plan view, and a land portion 84 provided within the frame portion 83. The frame portion 83 and the land portion 84 are portions where the material of the wick sheet 30 remains without being etched in the etching process shown in FIG.

A plurality of land portions 84 are arranged within the steam flow path portion 80, and divide the steam flow path portion 80 into a first steam passage 81 and a plurality of second steam passages 82. A steam flow path section 80 is formed around the land section 84 in plan view. A first steam passage 81 is formed between the land portion 84 and the frame portion 83. The first steam passage 81 is continuously formed inside the frame portion 83 and outside the land portion 84 . The planar shape of the first steam passage 81 is a rectangular frame. A second steam passage 82 is formed between adjacent land portions 84. The planar shape of the second steam passage 82 is an elongated rectangular shape. The first steam passage 81 and the second steam passage 82 constitute a steam passage section 80.

As shown in FIG. 26, the steam flow path section 80 includes a lower steam flow path recess 85 provided on the lower surface 30a and an upper steam flow path recess 86 provided on the upper surface 30b. The lower steam flow path recess 85 and the upper steam flow path recess 86 communicate with each other, and the steam flow path 80 is formed to extend from the upper surface 30b to the lower surface 30a.

The lower vapor flow path recess 85 constitutes a part of the sealed space 3 and is configured so that the vapor of the working fluid 2 generated in the evaporator 31 mainly passes therethrough. The lower vapor flow path recess 85 is formed in a concave shape on the lower surface 30a by etching from the lower surface 30a of the wick sheet 30 in the etching process shown in FIG. As a result, the lower steam flow path recess 85 has a wall surface 87 formed in a curved shape, as shown in FIG. This wall surface 87 defines a lower steam flow path recess 85 and is curved in a shape that swells toward the upper surface 30b. The wall surface 87 has a plurality of curved recessed parts, and each recessed part forms a part (lower half) of the first steam passage 81 and a part (lower half) of the second steam passage 82. ing.

The upper steam flow path recess 86 constitutes a part of the sealed space 3 and is configured so that the steam of the working fluid 2 generated in the evaporator 31 mainly passes therethrough. This upper vapor flow path recess 86 is formed in a concave shape on the upper surface 30b by etching from the upper surface 30b of the wick sheet 30 in the etching process shown in FIG. As a result, the upper steam flow path recess 86 has a wall surface 88 formed in a curved shape, as shown in FIG. 26. This wall surface 88 defines an upper steam flow path recess 86 and is curved in a shape that swells toward the lower surface 30a. The wall surface 88 has a plurality of curved recessed parts, and each recessed part forms a part (upper half) of the first steam passage 81 and a part (upper half) of the second steam passage 82. ing.

A wall surface 87 of the lower steam flow path recess 85 and a wall surface 88 of the upper steam flow path recess 86 are connected to form a through portion 89 . The wall surface 87 and the wall surface 88 are each curved toward the penetrating portion 89. This allows the lower steam flow path recess 85 and the upper steam flow path recess 86 to communicate with each other. In this embodiment, the planar shape of the penetrating portion 89 in the first steam passage 81 is a rectangular frame shape similarly to the first steam passage 81, and the planar shape of the penetrating portion 89 in the second steam passage 82 is as follows. Like the second steam passage 82, it has an elongated rectangular shape. The penetrating portion 89 is defined by a ridgeline that is formed so that the wall surface 87 of the lower steam flow path recess 85 and the wall surface 88 of the upper steam flow path recess 86 merge and project inward. In this penetrating portion 89, the planar area of the steam flow path portion 80 is minimized. The width dimension w6 of such a penetrating portion 89 is, for example, 400 μm to 1600 μm. Note that the position of the penetration part 89 in the thickness direction of the wick sheet 30 (vertical direction in FIG. 26) may be an intermediate position between the lower surface 30a and the upper surface 30b, or may be a position shifted downward or upward from the intermediate position. It is optional as long as the lower steam flow path recess 85 and the upper steam flow path recess 86 communicate with each other. Further, in the present embodiment, the cross-sectional shapes of the first steam passage 81 and the second steam passage 82 are formed to include a through portion 89 defined by a ridge line that is formed to project inward. , but is not limited to this. For example, the cross-sectional shapes of the first steam passage 81 and the second steam passage 82 may be trapezoidal, rectangular, or barrel-shaped.

The frame portion 83 described above has a frame lower surface 83a (first frame surface) that constitutes the lower surface 30a of the wick sheet 30, and a frame upper surface 83b (second frame surface) that constitutes the upper surface 30b. There is. That is, the frame lower surface 83a is located on the same plane as the lower surface 30a, and the frame upper surface 83b is located on the same plane as the upper surface 30b. The lower surface 83a of the frame is in contact with the upper surface 10b of the lower metal sheet 10 and is diffusion bonded. The frame upper surface 83b is in contact with the lower surface 20a of the upper metal sheet 20 and is diffusion bonded.

The land portion 84 described above has a land lower surface 84a (first land surface) that constitutes the lower surface 30a of the wick sheet 30, and a land upper surface 84b (second land surface) that constitutes the upper surface 30b. That is, the land lower surface 84a is located on the same plane as the lower surface 30a, and the land upper surface 84b is located on the same plane as the upper surface 30b. The land lower surface 84a is in contact with the upper surface 10b of the lower metal sheet 10 and is diffusion bonded. The land upper surface 84b is in contact with the lower surface 20a of the upper metal sheet 20 and is diffusion bonded. In this way, the mechanical strength of the vapor chamber 1 is improved when the pressure in the sealed space 3 is reduced. The wall surface 87 of the lower steam flow path recess 85 and the wall surface 88 of the upper steam flow path recess 86 described above constitute a side wall of the land portion 84.

Note that the lower metal sheet 10 and the wick sheet 30 (frame portion 83 and land portion 84) may be joined by other methods such as brazing instead of diffusion bonding, as long as they can be permanently joined. The same applies to the wick sheet 30 and the upper metal sheet 20.

In this embodiment, the land portion 84 extends in an elongated shape along the first direction X in a plan view, and the planar shape of the land portion 84 is an elongated rectangular shape. Further, the land portions 84 are arranged parallel to each other and spaced apart from each other at equal intervals in the second direction Y. In this way, the steam of the working fluid 2 flows around each land portion 84 and is configured to be transported toward the peripheral edge of the wick sheet 30, thereby preventing the flow of steam from being obstructed. It's suppressed. The width w7 of the land portion 84 is, for example, 100 μm to 1500 μm. Here, the width w7 of the land portion 84 is the dimension of the land portion 84 in the second direction Y, and means the dimension at the position where the penetration portion 89 is present in the thickness direction of the wick sheet 30.

As shown in FIGS. 27 to 29, a first support portion 91 that supports the land portion 84 on the frame portion 83 is provided within the steam flow path portion 80. As shown in FIGS. In this embodiment, each land portion 84 is supported by the frame portion 83 by first support portions 91 provided on both sides of the land portion 84 in the first direction X. Further, a plurality of first support portions 91 are provided on both sides of the land portion 84 in the second direction Y. The land portions 84 arranged on both sides in the second direction Y are supported by the frame portion 83 by these first support portions 91 . Note that although FIGS. 27 and 28 show an example in which each land portion 84 is supported by the frame portion 83 by a corresponding first support portion 91 in the first direction X, the present invention is not limited to this. Never. For example, the plurality of land parts 84 are supported by the frame part 83 by one first support part 91, that is, several first support parts 91 adjacent to each other shown in FIG. 27 are integrally and continuously formed. It is also possible to do so. Furthermore, all the land parts 84 may be supported by the frame part 83 by one first support part 91 on both sides in the first direction X. In this case, a portion of the lower frame body fluid flow path portion 97 (described later) provided on both sides of the land portion 84 in the first direction ) may not be provided. However, the part may also be provided. In this case, the parts of the lower frame body fluid flow path part 97 provided on both sides of the land part 84 in the second direction Y (the part along the first direction X, the upper and lower parts in FIGS. 27 and 28) Both parts can be communicated with each other, and liquid working fluid 2 can be passed between both parts.

As shown in FIG. 29, the first support portion 91 is provided on the lower surface 30a side of the wick sheet 30, and the upper steam flow path recess 86 is provided on the upper surface 30b side of the first support portion 91. ing.

The first support portion 91 is continuously formed on the corresponding land portion 84 and frame portion 83. That is, the first support portion 91 is a portion where the material of the wick sheet 30 remains without being etched in the etching process shown in FIG. For example, the first support portion 91 can be formed by performing an etching process such that the upper steam flow path recess 86 is formed but the lower steam flow path recess 85 is not formed. In this case, as shown in FIG. 11, the resist material is left in the second resist opening 63 for forming the lower vapor flow path recess 85, and the lower resist film is formed so as to divide the second resist opening 63. Pattern 60. As a result, the portion of the lower surface Ma of the metal material sheet M where the resist material remains within the second resist opening 63 is not etched from the lower surface Ma, and the material of the metal material sheet M remains. On the other hand, by forming the third resist opening 64 in the portion of the upper resist film 61 that corresponds to the first support portion 91, the portion of the upper surface Mb of the metal material sheet M that corresponds to the first support portion 91 is etched. As a result, an upper steam flow path recess 86 is formed. In this way, as shown in FIGS. 27 to 29, the first support portion 91 can be formed while the upper steam flow path recess 86 is formed continuously.

Further, a second support portion 92 is provided within the steam flow path portion 80 to support the land portions 84 adjacent to each other. In this embodiment, the land portions 84 are spaced apart in the second direction Y as described above, and a plurality of second support portions 92 are provided between adjacent land portions 84. . Each second support part 92 is arranged at the same position as the corresponding first support part 91 in the first direction X. However, the arrangement of each second support part 92 is not limited to this. For example, each second support part 92 may be arranged at a different position from the first support part 91 in the first direction X, and may be arranged in a staggered manner, for example. Further, although FIGS. 27 and 28 show an example in which each land portion 84 is supported by a plurality of second support portions 92, the present invention is not limited to this, and each land portion 84 is supported by a plurality of second support portions 92. may be supported by one second support part 92.

As shown in FIG. 29, the second support portion 92 is provided on the lower surface 30a side of the wick sheet 30, and the upper steam flow path recess 86 is provided on the upper surface 30b side of the second support portion 92. ing.

The second support portion 92 is continuously formed on the corresponding land portion 84 . The second support portion 92 is also a portion where the material of the wick sheet 30 remains without being etched in the etching process shown in FIG. The second support part 92 can be formed in the same manner as the first support part 91.

In the embodiments of FIGS. 27 to 29, the first support portion 91 and the second support portion 92 are formed along the first direction X or the second direction Y. However, the shapes of the support parts 91 and 92 do not have to be along the first direction X or the second direction Y, and are arbitrary. Further, the height h2 (vertical dimension in FIG. 29) of the first support part 91 and the second support part 92 is arbitrary, but may be smaller than half the height of the wick sheet 30, for example. In this case, it is possible to prevent the first support part 91 and the second support part 92 from blocking the flow of the vapor of the working fluid 2 (increasing the flow path resistance). Here, the height h2 of the first support portion 91 and the second support portion 92 is the minimum height of each of the support portions 91 and 92, which is closest to the lower surface 30a among the corresponding upper steam flow path recesses 86. This corresponds to the distance between the point and the lower surface 30a.

As shown in FIG. 25, lower alignment holes 15 are provided at each of the four corners of the lower metal sheet 10, and upper alignment holes 24 are provided at each of the four corners of the upper metal sheet 20. Wick sheet alignment holes 93 are provided at each of the four corners of the wick sheet 30. The corresponding alignment holes 15, 24, and 93 are aligned so as to overlap each other in the temporary fixing process shown in FIG. 14, and the lower metal sheet 10, the upper metal sheet 20, and the wick sheet 30 can be positioned. There is.

Further, as shown in FIG. 25, the vapor chamber 1 further includes an injection part 4 at one end of the pair of ends in the first direction X for injecting the working fluid 2 into the sealed space 3. . The injection section 4 includes a lower injection projection 16 projecting from the end surface of the lower metal sheet 10, an upper injection projection 25 projecting from the end surface of the upper metal sheet 20, and a wick sheet projecting from the end surface of the wick sheet 30. It has a protrusion 94. An injection channel 95 is formed in the wick sheet protrusion 94 . This injection channel 95 extends from the lower surface 30a of the wick sheet 30 to the upper surface 30b, and penetrates the wick sheet 30. Further, the injection channel 95 communicates with a lower liquid channel section 40 and a vapor channel section 80, which will be described later, and the working fluid 2 is injected into the sealed space 3 through the injection channel 95. The upper surface of the lower injection protrusion 16 and the lower surface of the upper injection protrusion 25 are formed flat. In addition, in this embodiment, an example is shown in which the injection part 4 is provided at one end of the pair of ends in the first direction X of the vapor chamber 1, but the present invention is not limited to this. Never. Moreover, the injection channel 95 does not need to penetrate the wick sheet 30. In this case, the injection channel 95 communicating with the lower liquid channel section 40 and the vapor channel section 80 can be formed by etching only from one of the lower surface 30a and the upper surface 30b of the wick sheet 30. Furthermore, the injection part 4 may be constituted by the injection hole 22 as in the first embodiment.

As shown in FIGS. 26 and 28, the lower surface 30a of the wick sheet 30 is provided with a lower liquid flow path section 40 (liquid flow path section) through which the liquid working fluid 2 passes. In the present embodiment, the lower liquid flow path section 40 includes a lower land liquid flow path section 96 (first land liquid flow path section) provided on the land lower surface 84a of each land section 84, and a frame section 83. A lower frame body fluid flow path section 97 (first frame body fluid flow path section) provided on the frame lower surface 83a. The lower land liquid flow path section 96 and the lower frame body fluid flow path section 97 constitute a part of the sealed space 3 described above. The lower land liquid passage section 96 communicates with the first steam passage 81 and the second steam passage 82 of the steam passage section 80 , and the lower frame body liquid passage section 97 communicates with the first steam passage 81 . There is.

As shown in FIG. 30, the lower land liquid flow path section 96 has a plurality of mainstream grooves 41 extending in the first direction It has a communication groove 45 that communicates the matching main grooves 41 with each other. A convex row 43 is provided between the main grooves 41 that are adjacent to each other. Each convex row 43 includes a plurality of convex portions 44 arranged in the first direction X. The convex portions 44 may be arranged in a staggered manner similar to the form shown in FIG. 22. However, similar to the embodiment shown in FIG. 6, the plurality of main stream grooves 41 and the plurality of communication grooves 45 may be arranged in a grid pattern. As shown in FIG. 19, when the width w3 of the communication groove 45 is larger than the width w1 of the main flow groove 41, the flow path resistance of the hydraulic fluid 2 in each communication groove 45 can be reduced. Therefore, the liquid working fluid 2 condensed from steam can smoothly enter each mainstream groove 41. That is, it can smoothly enter not only the mainstream groove 41 on the side close to the steam passages 81 and 82 but also the mainstream groove 41 on the side far from the steam passages 81 and 82, and the function of transporting the condensed liquid working fluid 2 is improved. can be improved.

The lower frame body liquid flow path section 97 can be configured similarly to the lower land liquid flow path section 96. Therefore, detailed explanation will be omitted here. Note that in the lower frame body liquid flow path section 97, in the portions on both sides of the land section 84 in the first direction X, the flow of the liquid working fluid 2 along the second direction Y becomes a flow toward the evaporation section 31. In this section, the groove extending in the second direction Y will be referred to as the main groove 41, and the groove extending in the first direction X will be referred to as the communication groove 45.

The vapor flow path section 80 communicates with the communication groove 45 of the lower liquid flow path section 40 . More specifically, the lower steam passage recess 85 of the first steam passage 81 communicates with the communication groove 45 of the lower land liquid passage part 96 and the communication groove 45 of the lower frame liquid passage part 97. is connected to. As a result, the liquid working fluid 2 in the lower steam passage recess 85 of the first steam passage 81 is transferred to the plurality of mainstream grooves 41 of the lower land liquid passage 96 and the lower frame body liquid passage 97. It's easy to get into. Similarly, the lower steam passage recess 85 of the second steam passage 82 communicates with the communication groove 45 of the lower land liquid passage 96, and the lower steam passage recess 85 of the second steam passage 82 communicates with the communication groove 45 of the lower land liquid passage 96. The liquid working fluid 2 can easily enter the plurality of mainstream grooves 41 of the lower land fluid flow path section 96.

During operation of the vapor chamber 1 according to the present embodiment, most of the vapor of the working fluid 2 generated by receiving heat from the device D flows under the first steam passage 81 and the second steam passage 82 that constitute the sealed space 3. It diffuses within the side steam flow path recess 85 and the upper steam flow path recess 86 (see solid line arrows in FIGS. 27 and 28). The steam in each steam channel recess 85, 86 leaves the evaporator 31, and most of the steam is transported to the peripheral edge of the wick sheet 30 where the temperature is relatively low. The steam diffused within the upper steam flow path recess 86 mainly radiates heat to the upper metal sheet 20 and is cooled, and the steam diffused within the lower steam flow path recess 85 mainly radiates heat to the wick sheet 30 and is cooled. . The heat received by the upper metal sheet 20 from the steam is transferred to the outside air via the housing member Ha (see FIG. 3). The heat received by the wick sheet 30 from the steam is transferred to the outside air via the upper metal sheet 20 and the housing member Ha.

The heat-radiated steam condenses, and the liquefied working fluid 2 adheres to the wall surface 87 of the lower steam flow path recess 85 and the wall surface 88 of the upper steam flow path recess 86, and also to the upper surface 10b of the lower metal sheet 10 and It also adheres to the lower surface 20a of the upper metal sheet 20. Here, since the working fluid 2 continues to evaporate in the evaporator 31, the portions other than the evaporator 31 of the lower land liquid flow path 96 and the lower frame liquid flow path 97 of the lower liquid flow path 40 The working fluid 2 in is transported toward the evaporation section 31 (see the broken line arrow in FIG. 28). As a result, the liquid working fluid 2 adhering to the wall surface 87 of the lower vapor flow path recess 85 and the upper surface 10b of the lower metal sheet 10 is transferred to the lower land liquid flow path section 96 or the lower frame body liquid flow path section 97. Move to. The liquid working fluid 2 adhering to the wall surface 88 of the upper steam flow path recess 86 and the lower surface 20a of the upper metal sheet 20 passes through the wall surface 87 of the lower steam flow path recess 85 and connects with the lower land liquid flow path section 96. It moves to the groove 45 or the communication groove 45 of the lower frame body fluid flow path section 97. Here, the lower steam flow path recess 85 and the communication groove 45 are provided on the lower surface 30a of the wick sheet 30, and are in contact with the upper surface 10b of the lower metal sheet 10. Thereby, the hydraulic fluid 2 adhering to the upper surface 10b can be smoothly drawn into the communication groove 45 by the capillary force of the communication groove 45. Therefore, it is possible to prevent the liquid working fluid 2 from accumulating in the lower steam flow path recess 85. In the lower land liquid flow path section 96 and the lower frame body liquid flow path section 97, the liquid working fluid 2 that has entered the communication groove 45 enters the main flow groove 41, and flows into each main flow groove 41 and each communication groove 45 as a liquid. of hydraulic fluid 2 is filled. Therefore, the filled working fluid 2 obtains a driving force toward the evaporation section 31 due to the capillary action of each mainstream groove 41 and each communication groove 45, and is smoothly transported toward the evaporation section 31.

The working fluid 2 that has reached the evaporation section 31 receives heat again from the device D via the heat receiving section 11 of the lower metal sheet 10 and evaporates. The vapor of the working fluid 2 evaporated in the lower land liquid flow path section 96 and the lower frame body liquid flow path section 97 passes through the communication groove 45 and moves to the lower steam flow path recess 85 having a large flow path cross-sectional area. A part of the vapor moves to the upper vapor flow path recess 86 and diffuses therein. In this way, the working fluid 2 circulates in the sealed space 3 while repeating phase changes, that is, evaporation and condensation, and transports and releases the heat of the device D. As a result, device D is cooled.

As described above, according to the present embodiment, the vapor flow path portion 80 through which the vapor of the working fluid 2 passes extends from the upper surface 30b of the wick sheet 30 to the lower surface 30a. Thereby, the liquid working fluid 2 condensed within the steam flow path section 80 can be smoothly moved to the lower liquid flow path section 40 provided on the lower surface 30a. Therefore, the liquid working fluid 2 can be smoothly transported to the evaporation section 31. Further, the flow path area of the steam flow path section 80 can be increased. Therefore, the vapor of the working fluid 2 evaporated in the evaporator 31 can be smoothly diffused to the peripheral edge of the wick sheet 30.

Further, according to the present embodiment, the lower steam passage recess 85 of the steam passage part 80 is in contact with and communicates with the communication groove 45 of the lower land liquid passage part 96 and the lower frame body liquid passage part 97. are doing. This allows the liquid working fluid 2 in the lower steam flow path recess 85 to smoothly enter the plurality of mainstream grooves 41 . Therefore, the liquid working fluid 2 can be more smoothly transported by the evaporator 31.

Further, according to the present embodiment, a land portion 84 is provided within the steam flow path portion 80 defined inside the frame portion 83 of the wick sheet 30. As a result, when the pressure in the sealed space 3 is reduced, the lower metal sheet 10 and the upper metal sheet 20 can be prevented from being deformed by the pressure of the outside air, and the mechanical strength of the vapor chamber 1 can be improved. be able to.

Further, according to the present embodiment, the lower land liquid flow path portion 96 of the lower side liquid flow path portion 40 is provided on the land lower surface 84a of the land portion 84 of the wick sheet 30, and the lower land liquid flow path portion 96 of the lower side liquid flow path portion 40 is provided. A steam flow path section 80 is formed around the section 96. As a result, the liquid working fluid 2 condensed in the first steam passage 81 and the second steam passage 82 of the steam passage section 80 can be smoothly moved to the lower land liquid passage section 96, and the The vapor of the working fluid 2 evaporated within the side land liquid flow path section 96 can be smoothly diffused into the first steam passage 81 and the second steam passage 82 of the steam flow path section 80 .

Further, according to the present embodiment, a first support portion 91 for supporting the land portion 84 on the frame portion 83 is provided within the steam flow path portion 80 . Thereby, the land portion 84 can be supported by the frame portion 83, and the land portion 84 and the frame portion 83 can be integrated. For this reason, it is possible to prevent the handling of the wick sheet 30 from deteriorating during manufacturing, and the vapor chamber 1 can be manufactured easily. In particular, according to this embodiment, the first support portion 91 is provided on the lower surface 30a side of the wick sheet 30. Thereby, the upper steam passage recess 86 can be formed on the upper surface 30b side of the first support part 91, and the first steam passage 81 can be prevented from being divided. Therefore, a decrease in the diffusivity of the vapor of the working fluid 2 can be suppressed.

Further, according to the present embodiment, a second support portion 92 is provided within the steam flow path portion 80 to support the land portions 84 that are adjacent to each other. By this, adjacent land portions 84 can be mutually supported, and the plurality of land portions 84 can be integrated, and these land portions 84 and the frame body portion 83 can be integrated. For this reason, it is possible to prevent the handling of the wick sheet 30 from deteriorating during manufacturing, and the vapor chamber 1 can be manufactured easily. In particular, according to this embodiment, the second support portion 92 is provided on the lower surface 10a side of the wick sheet 30. As a result, the upper steam passage recess 86 can be formed on the upper surface 30b side of the second support portion 92, and the second steam passage 82 can be prevented from being separated. Therefore, a decrease in the diffusivity of the vapor of the working fluid 2 can be suppressed.

Further, according to the present embodiment, the lower frame body liquid flow path section 97 of the lower side liquid flow path section 40 is provided on the frame lower surface 83a of the frame body section 83 of the wick sheet 30. As a result, the liquid working fluid 2 condensed in the first steam passage 81 of the steam passage section 80 can be smoothly moved to the lower frame liquid passage section 97, and the lower frame liquid passage section The vapor of the working fluid 2 evaporated in the vapor passage 97 can be smoothly diffused into the first vapor passage 81 of the vapor passage section 80 .

Furthermore, according to this embodiment, the lower metal sheet 10 and the wick sheet 30 are diffusion bonded. Thereby, the lower metal sheet 10 and the wick sheet 30 can be diffusion bonded over a wide range, and the bonding strength can be improved. Further, the upper metal sheet 20 and the wick sheet 30 are diffusion bonded. Thereby, the upper metal sheet 20 and the wick sheet 30 can be diffusion bonded over a wide range, and the bonding strength can be improved.

(Modification 7)
In addition, in this embodiment mentioned above, the example where the lower side liquid flow path part 40 was provided in the lower surface 30a of the wick sheet 30 was demonstrated. However, the invention is not limited to this, and for example, as shown in FIGS. 31 to 33, the liquid flow path portion may be provided not only on the lower surface 30a but also on the upper surface 30b of the wick sheet 30. In FIG. 31, an example is shown in which the lower surface 30a of the wick sheet 30 is provided with the lower liquid flow path portion 40, and the upper surface 30b is provided with the upper liquid flow path portion 98. In the example shown in FIG. 31, the upper liquid flow path section 98 includes an upper land liquid flow path section 99 (second land liquid flow path section) provided on the land upper surface 84b of each land section 84, and an upper land liquid flow path section 99 (second land liquid flow path section) provided on the land upper surface 84b of each land section 84. It includes an upper frame body fluid flow path section 100 (second frame body fluid flow path section) provided on the frame upper surface 83b. The upper land liquid flow path section 99 and the upper frame body fluid flow path section 100 constitute a part of the sealed space 3 described above. The upper land liquid passage section 99 communicates with the upper steam passage recess 86 of the first steam passage 81 and the second steam passage 82 of the steam passage section 80, and the upper frame liquid passage section 100 communicates with the first steam passage 81 and the upper steam passage recess 86 of the second steam passage 82. 81 and communicates with the upper steam flow path recess 86 . The upper land liquid flow path section 99 can be configured similarly to the lower land liquid flow path section 96, and the upper frame body liquid flow path section 100 can be configured similarly to the lower frame body liquid flow path section 97. can.

According to the embodiment shown in FIG. 31, an upper liquid flow path section 98 is provided on the upper surface 30b of the wick sheet 30. As a result, the number of channels for transporting the liquid working fluid 2 to the evaporation section 31 can be increased, and the efficiency of transporting the liquid working fluid 2 to the evaporation section 31 can be improved. Therefore, the heat transport efficiency of the vapor chamber 1 can be improved.

Further, according to the embodiment shown in FIG. 31, an upper land liquid flow path portion 99 is provided on the land upper surface 84b of the land portion 84 of the wick sheet 30. As a result, the liquid working fluid 2 condensed in the first steam passage 81 and the second steam passage 82 of the steam passage section 80 can be smoothly moved to the upper land liquid passage section 99, and the upper land The vapor of the working fluid 2 evaporated within the liquid flow path section 99 can be smoothly diffused into the first steam passage 81 and the second steam passage 82 of the steam flow path section 80 . Further, an upper frame body fluid flow path section 100 is provided on the frame upper surface 83b of the frame section 83 of the wick sheet 30. As a result, the liquid working fluid 2 condensed within the first steam passage 81 of the steam passage section 80 can be smoothly moved to the upper frame liquid passage section 100, and the inside of the upper frame liquid passage section 100 can be moved smoothly. The vapor of the working fluid 2 evaporated can be smoothly diffused into the first vapor passage 81 of the vapor passage section 80.

Note that, as shown in FIG. 32, the mainstream grooves 41 provided on the lower surface 30a of the wick sheet 30 and the mainstream grooves 41 provided on the upper surface 30b may overlap in plan view. In this case, the structure of the wick sheet 30 can be unified between the lower surface 30a and the upper surface 30b.

On the other hand, as shown in FIG. 33, the mainstream grooves 41 provided on the lower surface 30a of the wick sheet 30 and the mainstream grooves 41 provided on the upper surface 30b do not need to at least partially overlap in plan view. That is, the mainstream groove 41 on the lower surface 30a may be offset from the mainstream groove 41 on the upper surface 30b. In the example shown in FIG. 33, in plan view, the mainstream groove 41 provided on the upper surface 30b is arranged between a pair of adjacent mainstream grooves 41 provided on the lower surface 30a. In this case, it is possible to prevent the mainstream groove 41 on the lower surface 30a and the mainstream groove 41 on the upper surface 30b from communicating with each other. Further, it is possible to prevent the communication grooves 45 on the lower surface 30a and the communication grooves 45 on the upper surface 30b from overlapping in plan view, and it is possible to prevent these communication grooves 45 from communicating with each other. This is effective, for example, when the depth of the communication groove 45 is made deeper than the depth of the main stream groove 41.

(Modification 8)
Furthermore, in the present embodiment described above, an example was described in which the spacer member 50 was not provided between the lower metal sheet 10 and the upper metal sheet 20. However, the present invention is not limited to this, and the spacer member 50 may be provided in the same manner as in the first embodiment. In this case, the lower peripheral edge 12 of the lower metal sheet 10 may be diffusion bonded to the spacer member 50, and the upper peripheral edge 21 of the upper metal sheet 20 may be diffusion bonded to the spacer member 50. The lower metal sheet 10 and the wick sheet 30 do not need to be joined, and the upper metal sheet 20 and the wick sheet 30 do not need to be joined.

(Modification 9)
Furthermore, in the present embodiment described above, an example has been described in which the lower metal sheet 10 and the wick sheet 30 are diffusion bonded, and the upper metal sheet 20 and the wick sheet 30 are diffusion bonded. However, the present invention is not limited to this, and similarly to the second embodiment, the lower metal sheet 10 is provided with the lower thermal adhesive layer 70, and the upper metal sheet 20 is provided with the upper thermal adhesive layer 71. The lower heat-sealing layer 70 and the upper heat-sealing layer 71 may be heat-sealed.

(Modification 10)
In addition, in the present embodiment described above, an example has been described in which the lower metal sheet 10 and the upper metal sheet 20 are formed in a flat shape. However, the present invention is not limited to this, and, for example, the lower metal sheet 10 and the upper metal sheet 20 may be formed in a flexible film shape, similar to the form shown in FIG. 24.

(Fourth embodiment)
Next, a wick sheet for a vapor chamber, a vapor chamber, and a method for manufacturing a vapor chamber in the fourth embodiment of the present invention will be described using FIG. 34.

In the fourth embodiment shown in FIG. 34, the lower metal sheet has a lower main sheet and a lower reinforcing sheet, and the upper metal sheet has an upper main sheet and an upper reinforcing sheet. The third embodiment is mainly different from the third embodiment in that it has the following features, and the other configurations are substantially the same as the third embodiment shown in FIGS. 25 to 33. Note that in FIG. 34, the same parts as those in the third embodiment shown in FIGS. 25 to 33 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In this embodiment, as shown in FIG. 34, the lower metal sheet 10 of the vapor chamber 1 includes a lower main body sheet 111 (first main body sheet) provided on the side of the wick sheet 30, and a lower main body sheet 111 (first main body sheet) provided on the side of the wick sheet 30. A lower reinforcing sheet 112 (first reinforcing sheet) may be provided on the opposite side of the wick sheet 30 to the sheet 111 (lower side in FIG. 34). The lower reinforcing sheet 112 has higher mechanical strength (for example, tensile strength) than the lower main sheet 111. The lower main body sheet 111 is diffusion bonded to the wick sheet 30.

The lower main sheet 111 may be made of the same material as the wick sheet 30. When the lower main sheet 111 and the wick sheet 30 are made of copper, the lower reinforcing sheet 112 may be made of stainless steel or nickel, for example. For such a lower metal sheet 10, a so-called clad material, which is a combination of different types of metal sheets, may be used. Then, one of the lower main sheet 111 and the lower reinforcing sheet 112 may be made of metal foil, and the other sheet may be made by plating the metal foil. Further, the lower main body sheet 111 and the lower reinforcing sheet 112 may be bonded together using an adhesive or the like, or may be bonded by any other method. The thickness of the lower main sheet 111 may be smaller or larger than the thickness of the lower reinforcing sheet 112, and the thickness of the lower main sheet 111 and the thickness of the lower reinforcing sheet 112 may be equal. good.

Similar to the lower metal sheet 10, the upper metal sheet 20 has an upper main body sheet 121 (second main body sheet) provided on the side of the wick sheet 30, and a side of the wick sheet 30 with respect to the upper main body sheet 121. It may also have an upper reinforcing sheet 122 (second reinforcing sheet) provided on the opposite side (upper side in FIG. 34). The upper reinforcing sheet 122 has higher mechanical strength than the upper main sheet 121 (for example, tensile strength, 0.2% yield strength, upper yield point, etc.). The lower main body sheet 111 is diffusion bonded to the wick sheet 30.

As described above, according to the present embodiment, the lower metal sheet 10 has a lower main sheet 111 provided on the side of the wick sheet 30 and a lower main sheet 111 provided on the side of the wick sheet 30 opposite to the lower main sheet 111. The lower reinforcing sheet 112 is provided on the side, and the lower reinforcing sheet 112 has higher mechanical strength than the lower main sheet 111. This allows the lower metal sheet 10 to be reinforced. For example, when the pressure in the sealed space 3 is reduced, the lower metal sheet 10 can be prevented from being deformed by the pressure of the outside air, and the mechanical strength of the vapor chamber 1 can be improved. Further, when pure water is used as the working fluid 2, the working fluid 2 may expand due to freezing, but even in that case, deformation of the lower metal sheet 10 can be prevented.

Furthermore, according to the present embodiment, the mechanical strength of the lower metal sheet 10 can be improved, so the thickness of the lower metal sheet 10 can be reduced. This thinning can be allocated to the thickness of the wick sheet 30, and the wick sheet 30 can be made thicker. In this case, the flow path area of the vapor flow path portion can be increased, and the vapor of the working fluid 2 evaporated in the evaporation portion 31 can be smoothly diffused to the peripheral portion of the wick sheet 30.

Further, according to the present embodiment, the upper metal sheet 20 includes the upper main body sheet 121 provided on the side of the wick sheet 30 and the upper main body sheet 121 provided on the side opposite to the wick sheet 30 with respect to the upper main body sheet 121. The upper reinforcing sheet 122 has a higher mechanical strength than the upper main sheet 121. This allows the upper metal sheet 20 to be reinforced. For example, when the pressure in the sealed space 3 is reduced, the upper metal sheet 20 can be prevented from being deformed by the pressure of the outside air, and the mechanical strength of the vapor chamber 1 can be improved. Further, when pure water is used as the working fluid 2, the working fluid 2 may expand due to freezing, but even in that case, deformation of the upper metal sheet 20 can be prevented.

The present invention is not limited to the above-described embodiments and modified examples as they are, but can be implemented by modifying the constituent elements within the scope of the invention at the implementation stage. Moreover, various inventions can be formed by appropriately combining the plurality of components disclosed in each of the above embodiments and each modification (including combinations of modifications). Some components may be deleted from all the components shown in each embodiment and each modification. Furthermore, in each of the embodiments and modifications described above, the configuration of the lower metal sheet 10 and the configuration of the upper metal sheet 20 may be replaced.

1 Vapor chamber 2 Working fluid 3 Sealed space 10 Lower metal sheet 10b Upper surface 12 Lower peripheral edge 20 Upper metal sheet 20a Lower surface 21 Upper peripheral edge 30 Wick sheet 30a Lower surface 30b Upper surface 32 Upper vapor flow path recess 33 Wall surface 34 Upper flow path Protruding portion 35 Communication recess 36 Wall surface 40 Lower liquid flow path portion 41 Main stream groove 50 Spacer member 70 Lower heat sealing layer 71 Upper heat sealing layer 80 Steam flow path portion 83 Frame portion 83a Frame lower surface 83b Frame upper surface 84 Land portion 84a Land lower surface 84b Land upper surface 91 First support portion 92 Second support portion 93 Wick sheet alignment hole 94 Wick sheet protrusion 95 Injection flow path 96 Lower land liquid flow path portion 97 Lower frame liquid flow path portion 98 Upper liquid flow path section 99 Upper land liquid flow path section 100 Upper frame body liquid flow path section 111 Lower main body sheet 112 Lower reinforcing sheet 121 Upper main sheet 122 Upper reinforcing sheet

Claims (13)

A wick sheet for a vapor chamber interposed between a first sheet and a second sheet,
A frame portion;
a land portion provided within the frame body portion;
a steam flow path portion provided within the frame portion around the land portion and formed to penetrate the wick sheet;
Equipped with
A first support part that supports the land part on the frame part is provided in the steam flow path part.
Wick sheet. The land portion extends in a slender shape along the first direction,
The first support portion is provided on both sides of the land portion in the first direction.
The wick sheet according to claim 1. The land portion extends in a slender shape along the first direction,
The first support portion is provided on both sides of the land portion in a second direction intersecting the first direction.
The wick sheet according to claim 1 or 2. a first surface configured by the frame portion and the land portion;
a second surface configured by the frame portion and the land portion and provided on the opposite side to the first surface;
further comprising;
The first support portion is provided on the first surface side and not provided on the second surface side.
The wick sheet according to any one of claims 1 to 3. Three or more land portions are provided within the frame portion,
The three or more land portions are spaced apart from each other and arranged in parallel,
The land portions that are adjacent to each other are supported by a second support portion.
The wick sheet according to any one of claims 1 to 4. A wick sheet for a vapor chamber interposed between a first sheet and a second sheet,
three or more land parts spaced apart from each other and arranged in parallel;
a steam flow path portion provided between the land portions adjacent to each other and formed to penetrate the wick sheet;
a liquid flow path portion provided in the land portion through which a liquid working fluid passes;
Equipped with
A second support part that supports the land parts adjacent to each other is provided in the steam flow path part.
Wick seat. A wick sheet for a vapor chamber interposed between a first sheet and a second sheet,
three or more land parts spaced apart from each other and arranged in parallel;
a steam flow path portion provided between the land portions adjacent to each other and formed to penetrate the wick sheet;
a capillary structure provided in the land portion;
Equipped with
A second support part that supports the land parts adjacent to each other is provided in the steam flow path part.
Wick seat . A wick sheet for a vapor chamber interposed between a first sheet and a second sheet,
three or more land parts spaced apart from each other and arranged in parallel;
a steam flow path portion provided between the land portions adjacent to each other and formed to penetrate the wick sheet;
Equipped with
A second support part that supports the land parts adjacent to each other is provided in the steam flow path part,
The width of the second support portion is smaller than the width of the land portion.
Wick seat . The land portion extends in a slender shape along the first direction,
the second support portions are arranged at equal intervals in the first direction;
The wick sheet according to any one of claims 6 to 8 . The land portion extends in a slender shape along the first direction,
The second support portion is aligned in a second direction intersecting the first direction.
The wick sheet according to any one of claims 6 to 9 . The land portion extends in a slender shape along the first direction,
The second support portions are arranged in a staggered manner.
The wick sheet according to any one of claims 6 to 10 . a first surface configured by the land portion;
a second surface configured by the land portion and provided on the opposite side to the first surface;
Equipped with
The second support portion is provided on the first surface side and is not provided on the second surface side.
The wick sheet according to any one of claims 6 to 11 . A vapor chamber having a sealed space in which a working fluid is sealed,
The first sheet,
a second sheet;
The wick sheet according to any one of claims 1 to 12 , interposed between the first sheet and the second sheet,
Vapor chamber with.

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