CN210112491U

CN210112491U - Self-cooling heat superconducting plate fin radiator

Info

Publication number: CN210112491U
Application number: CN201821551947.1U
Authority: CN
Inventors: 仝爱星; 唐必洪; 孙会会
Original assignee: Zhejiang Jiaxi Optoelectronic Equipment Manufacturing Co ltd
Current assignee: Zhejiang Jiaxi Technology Co.,Ltd.
Priority date: 2018-09-21
Filing date: 2018-09-21
Publication date: 2020-02-21
Anticipated expiration: 2028-09-21

Abstract

The utility model provides a self-cooling heat superconducting plate fin radiator, include: the heat superconducting plate is internally provided with mutually communicated sealing channels, and the sealing channels are filled with heat transfer working mediums; the surface of the heat superconducting plate is vertical to the horizontal plane; the first heat dissipation fins are positioned on one surface of the heat superconducting plate, a plurality of vertically extending first self-cooling heat dissipation channels are formed in the first heat dissipation fins, and the plurality of first self-cooling heat dissipation channels are arranged at intervals along the horizontal direction; at least the size of the partial area of the first radiating fin along the vertical direction is smaller than the size of the heat superconducting plate along the vertical direction, so that a heat source installation area is reserved in the partial area of the heat superconducting plate corresponding to the lower part of the first radiating fin. The utility model discloses a natural convection heat dissipation can be realized to self-cooling heat superconducting plate fin radiator, need not additionally to install the fan additional and carries out forced cooling, has reduced the noise when equipment operation.

Description

Self-cooling heat superconducting plate fin radiator

Technical Field

The utility model belongs to the technical field of heat transfer, especially, relate to a self-cooling heat superconducting plate fin radiator.

Background

Along with the rapid development of power electronic technology, the requirements of modularization, integration, light weight, low cost and high reliability are higher and higher, the heat generated by the power device during working is larger and larger, if the heat generated by the power device cannot be dissipated rapidly in time, the temperature of a chip in the power device is increased, the efficiency is reduced, the service life is shortened, and the failure of the power device and the burning of the chip are caused. Therefore, solving the problem of heat dissipation of the power device has been one of the core problems troubling manufacturers and users of power device packages. In order to effectively solve the heat dissipation problem of the power device, the power device is usually fixed on a substrate of a heat sink, heat is conducted to heat dissipation fins of the heat sink through the substrate, the contact area of the heat dissipation fins and air is large, and the heat is dissipated to the surrounding environment through the flowing and following heat exchange of the air. At present, aluminum profile radiators of natural convection or forced convection are generally adopted, and comprise aluminum inserting sheet radiators, aluminum shovel sheet radiators, aluminum extruded radiators and aluminum welding fins. Because the heat conductivity coefficient of the aluminum and the aluminum alloy is within 220W/m.K, the fin efficiency of the radiating fin is low, the heat diffusion performance is poor, and the power devices are uniformly distributed on the base plate of the radiator, so that the diffusion thermal resistance of the base plate is reduced, and the heat radiating capacity of the radiator is improved. With the development of packaging technology, the volume of a power device is reduced, the power is increased, the heat flux density of the power device is correspondingly increased, and the conventional aluminum heat radiator cannot meet the heat radiation requirement of a high-heat-flux high-power module.

SUMMERY OF THE UTILITY MODEL

In view of the above shortcomings in the prior art, an object of the present invention is to provide a self-cooling heat superconducting plate finned radiator for solving the problem that the aluminum radiator in the prior art cannot satisfy the heat dissipation requirement of the high heat flux density high power module.

In order to achieve the above objects and other related objects, the utility model provides a self-cooling heat superconducting plate finned radiator, self-cooling heat superconducting plate finned radiator includes:

the heat superconducting plate is internally provided with mutually communicated sealing channels, and the sealing channels are filled with heat transfer working mediums; the surface of the heat superconducting plate is vertical to the horizontal plane;

the first heat dissipation fins are positioned on one surface of the heat superconducting plate, a plurality of vertically extending first self-cooling heat dissipation channels are formed in the first heat dissipation fins, and the plurality of first self-cooling heat dissipation channels are arranged at intervals along the horizontal direction; at least the size of the partial area of the first radiating fin along the vertical direction is smaller than the size of the heat superconducting plate along the vertical direction, so that a heat source installation area is reserved in the partial area of the heat superconducting plate corresponding to the lower part of the first radiating fin.

As a preferred embodiment of the present invention, the first heat dissipation fins extend in a wave shape or a square wave shape along the horizontal direction.

As an optimized scheme of the utility model, first radiating fin is wavy or square wave form extension along vertical direction.

As an optimized scheme of the utility model, first radiating fin includes the flat fin of a plurality of or L shape fin, a plurality of flat fin or L shape fin are arranged along the parallel interval of horizontal direction.

As a preferable scheme of the present invention, the first heat dissipation fin includes a first portion and a second portion arranged along a horizontal direction, and a size of the first portion in a vertical direction is smaller than a size of the second portion in the vertical direction; the heat source installation region is located at a region of the heat superconducting plate corresponding to below the first portion.

As an optimized scheme of the utility model, self-cooling heat superconducting plate fin radiator still includes second radiating fin, second radiating fin is located heat superconducting plate keeps away from one side of first radiating fin, be formed with the self-cooling heat dissipation channel of second that a plurality of extends along vertical direction, a plurality of in the second radiating fin the self-cooling heat dissipation channel of second is arranged along the horizontal direction interval.

As a preferred scheme of the utility model, the second radiating fin is wavy or square wave form extension along the horizontal direction.

As an optimized scheme of the utility model, second radiating fin is wavy or square wave form extension along vertical direction.

As an optimized scheme of the utility model, the second radiating fin includes flat fin of a plurality of or L shape fin, a plurality of flat fin or L shape fin are arranged along the parallel interval of horizontal direction.

As a preferred scheme of the utility model, self-cooling heat superconducting plate fin radiator still includes:

a planar backing plate located on the mounting area;

and the power device is positioned on the surface of the plane backing plate far away from the heat superconducting plate.

As an optimized scheme of the utility model, self-cooling heat superconducting plate fin radiator still includes the section bar radiator, the section bar radiator is located power device keeps away from the plane backing plate on the surface.

As a preferable aspect of the present invention, the heat superconducting plate includes: the annular frame, the first cover plate, the second cover plate and the at least one guide plate; wherein the content of the first and second substances,

the first cover plate is attached to one surface of the annular frame, and the second cover plate is attached to the surface, far away from the first cover plate, of the annular frame, so that a sealed cavity is formed between the first cover plate and the second cover plate;

the deflector is positioned in the sealed chamber; the guide plate comprises a plurality of convex parts which are arranged at intervals along a first direction and extend along a second direction, wherein the first direction is vertical to the second direction, the bottoms of the convex parts which are adjacent to each other in the first direction are integrally connected, and gaps are formed between the inner sides of the convex parts and the adjacent convex parts, so that the sealing channel is formed between the guide plate and the first cover plate and the second cover plate.

As a preferable scheme of the present invention, the heat superconducting plate includes a flow guide plate, the length of the flow guide plate is the same as the length of the inner side of the annular frame, and the width of the flow guide plate is the same as the width of the inner side of the annular frame; the height of the guide plate is the same as that of the annular frame.

As a preferred scheme of the utility model, the heat superconducting plate comprises at least two flow guide plates, and the length of the flow guide plates is the same as that of the inner side of the annular frame; gaps are formed between the adjacent guide plates, so that a first balance channel of the heat transfer working medium is formed between the adjacent guide plates, and the first balance channel extends along the first direction; a gap is formed between the guide plate adjacent to the annular frame and the annular frame, so that a second balance channel of the heat transfer working medium is formed between the guide plate and the annular frame, and the second balance channel extends along the first direction; the height of the guide plate is the same as that of the annular frame.

As a preferred scheme of the utility model, the lateral wall of convex part all is equipped with a plurality of water conservancy diversion hole, the water conservancy diversion hole is followed the thickness direction of water conservancy diversion plate runs through the guide plate.

As a preferred scheme of the utility model, at least one reserved gap is arranged in the guide plate; the heat superconducting plate also comprises at least one cushion block, and the cushion block is positioned in the reserved gap; the height of the cushion block is the same as that of the guide plate, and a first mounting through hole which is through along the height direction of the cushion block is arranged in the cushion block; the first cover plate is also provided with at least one second mounting through hole which is penetrated through along the thickness direction of the first cover plate, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole penetrating along the thickness direction of the second cover plate, and the third mounting through hole corresponds to the first mounting through hole.

As a preferred scheme of the utility model, at least one reserved gap is arranged in the guide plate; the first cover plate or the second cover plate is provided with at least one stamping boss, the stamping boss is arranged in the reserved gap in a protruding mode from the inner surface of the first cover plate or the second cover plate, the height of the stamping boss is the same as that of the guide plate, a first installation through hole which is communicated along the height direction of the stamping boss is formed in the stamping boss, the second cover plate or the first cover plate is further provided with at least one second installation through hole which is communicated along the thickness direction of the first cover plate, and the second installation through hole corresponds to the first installation through hole.

As a preferable aspect of the present invention, the heat superconducting plate includes:

a first cover plate;

the second cover plate comprises a cover plate main body and an annular convex edge, and the annular convex edge is integrally connected with the cover plate main body; the first cover plate is attached to the surface, far away from the cover plate main body, of the annular convex edge, so that a sealed cavity is formed between the first cover plate and the cover plate main body;

at least one baffle plate positioned in the sealed chamber; the guide plate comprises a plurality of convex parts which are arranged at intervals along a first direction and extend along a second direction, wherein the first direction is vertical to the second direction, the bottoms of the convex parts which are adjacent to each other in the first direction are integrally connected, and gaps are formed between the inner sides of the convex parts and the adjacent convex parts, so that the sealing channel is formed between the guide plate and the first cover plate and the second cover plate.

As a preferable scheme of the present invention, the heat superconducting plate includes a flow guide plate, the length of the flow guide plate is the same as the length of the inner side of the annular convex edge, and the width of the flow guide plate is the same as the width of the inner side of the annular convex edge; the height of the guide plate is the same as that of the annular convex edge.

As a preferred scheme of the present invention, the heat superconducting plate includes at least two flow guiding plates, and the length of the flow guiding plates is the same as the length of the inner side of the annular convex edge; gaps are formed between the adjacent guide plates, so that a first balance channel of the heat transfer working medium is formed between the adjacent guide plates, and the first balance channel extends along the first direction; a gap is formed between the guide plate and the annular convex edge adjacent to the annular convex edge, so that a second balance channel of the heat transfer working medium is formed between the guide plate and the annular convex edge, and the second balance channel extends along the first direction; the height of the guide plate is the same as that of the annular convex edge.

As above, the utility model discloses a self-cooling heat superconducting plate fin radiator has following beneficial effect:

1. the power device is positioned below, at least part of the radiator is positioned above the power device, and the radiator is internally provided with a vertically extending self-cooling heat dissipation channel;

2. the heat superconducting plate is internally provided with a sealed cavity and welded with a guide plate, and the guide plate welds the cover plates at two sides together, so that the reinforcing effect is achieved, the thickness of the cover plates at two sides can be reduced, the bearing capacity is increased, the strength is improved, the weight and the thickness of the heat superconducting plate are reduced, the heat exchange area in the heat superconducting plate is increased, and the heat dissipation capacity of the heat superconducting plate is enhanced;

3. a heat transfer working medium is filled in a sealed cavity inside the heat superconducting plate, and the heat transfer is inhibited by means of phase change heat transfer or phase change of the heat transfer working medium, so that the heat superconducting characteristic of rapid heat conduction is formed, and the temperature of the whole heat superconducting plate is uniform;

4. radiating fins are welded on two side surfaces outside the heat superconducting plate, so that the radiating area of the heat superconducting plate can be increased by times to dozens of times; the heat conducted by the heat superconducting plate is quickly carried away by air through the heat radiating fins and then dissipated. The radiating fins not only increase the heat exchange area with the air, reduce the system thermal resistance and improve the radiating capacity, but also play a role of strengthening the heat superconducting plate due to being welded at the two sides of the heat superconducting plate, thereby reducing the material thickness of the heat superconducting plate, improving the strength, lightening the weight and reducing the cost;

5. the lower part of the heat superconducting plate is welded with a plane base plate with a heat source junction surface such as a heating electronic device and the like, so that the flatness of the junction surface is improved, the junction thermal resistance is reduced, and the strength and the deformation resistance of the heat superconducting plate are enhanced and improved;

6. the heating electronic device or other heat sources are directly arranged at the lower part of the heat superconducting plate, and heat is directly and quickly conducted to the radiating fins on the heat superconducting plate through the heat superconducting plate, so that the heat conduction resistance is reduced, and the radiating capacity is improved;

7. compared with the traditional section bar radiator, when a high-power and high-heat-flux-density power device is radiated, the heat superconducting finned radiator has the heat superconducting characteristic and the large radiating area, so that a natural convection radiating mode can be adopted, a fan does not need to be additionally arranged for forced cooling, and the noise generated when equipment runs is reduced;

8. the heat conduction efficiency is high: most of traditional section bar radiators are made of aluminum or aluminum alloy materials, the heat conductivity coefficient is within 220W/m.K, the heat conduction efficiency is low, the heat diffusion performance is poor, the heat superconducting finned radiator has the rapid heat conduction characteristic of heat transfer working media passing through the inside of a heat superconducting plate, and the equivalent heat conductivity coefficient can reach more than 4000W/m ℃;

9. the fin is efficient: the double-sided welding fin mode is adopted for manufacturing, the defect that the tail end of the fin is low in efficiency due to the fact that the height of the fin is too high in the traditional section bar radiator is overcome, and the radiating efficiency of the fin is improved.

Drawings

Fig. 1 is a schematic perspective view of a self-cooling heat superconducting plate finned radiator according to a first embodiment of the present invention.

Fig. 2 is an exploded schematic view of a self-cooling heat superconducting plate finned radiator according to a first embodiment of the present invention.

Fig. 3 is an exploded schematic view of a partial structure of a self-cooling heat superconducting plate fin radiator provided in a first embodiment of the present invention, which includes a heat superconducting plate, first heat dissipating fins, second heat dissipating fins, and a planar backing plate.

Fig. 4 is a schematic diagram illustrating an exploded structure of a heat superconducting plate in a self-cooling heat superconducting plate finned radiator according to a first embodiment of the present invention.

Fig. 5 is a schematic perspective view of a heat superconducting plate in a self-cooling heat superconducting plate finned radiator according to a first embodiment of the present invention.

Fig. 6 to 11 are schematic structural diagrams illustrating different exemplary deflectors in the heat superconducting plate in the self-cooling heat superconducting plate finned radiator according to the first embodiment of the present invention; wherein fig. 7 is a front view of fig. 6, fig. 9 is a front view of fig. 8, and fig. 11 is a front view of fig. 10.

Fig. 12 is a schematic partial cross-sectional view of an edge portion of a self-cooling heat superconducting plate finned heat sink provided in a first embodiment of the present invention.

Fig. 13 to 17 are schematic perspective views illustrating first heat dissipating fins of different examples in a self-cooling heat superconducting plate fin radiator according to a first embodiment of the present invention

Fig. 18 is a schematic diagram illustrating an exploded structure of a heat superconducting plate with a reserved gap in a self-cooling heat superconducting plate finned radiator according to a second embodiment of the present invention.

Fig. 19 is a schematic partial cross-sectional view of a self-cooling heat superconducting plate finned radiator provided in the second embodiment of the present invention, which has a pad block portion.

Fig. 20 is a schematic diagram illustrating an exploded structure of a heat superconducting plate with a stamped boss in a self-cooling heat superconducting plate finned radiator according to a second embodiment of the present invention.

Fig. 21 is a schematic diagram showing an exploded structure of a heat superconducting plate in a self-cooling heat superconducting plate finned radiator according to a third embodiment of the present invention.

Fig. 22 is a schematic top view of a self-cooling heat superconducting plate finned radiator according to a third embodiment of the present invention, in which a deflector of a heat superconducting plate is disposed in an annular frame.

Fig. 23 is an exploded schematic view of a heat superconducting plate with a clearance and a cushion block in a self-cooling heat superconducting plate finned radiator provided in the fourth embodiment of the present invention.

Fig. 24 is a schematic top view of a self-cooling heat superconducting plate finned radiator according to a fourth embodiment of the present invention, in which a deflector of a heat superconducting plate is disposed in an annular frame.

Fig. 25 is a schematic diagram showing an exploded structure of a heat superconducting plate with a punched boss in a self-cooling heat superconducting plate fin radiator according to a fourth embodiment of the present invention.

Fig. 26 is an exploded schematic view of the heat superconducting plate in the self-cooling heat superconducting plate finned radiator according to the fifth embodiment of the present invention.

Fig. 27 is an exploded schematic view of a heat superconducting plate with a reserved gap in a self-cooling heat superconducting plate finned radiator according to a sixth embodiment of the present invention.

Fig. 28 is an exploded schematic view of the heat superconducting plate in the self-cooling heat superconducting plate finned radiator according to the seventh embodiment of the present invention.

Fig. 29 is a schematic top view of a self-cooling heat superconducting plate finned radiator according to an embodiment of the present invention, in which a flow guide plate in the heat superconducting plate is located inside an annular convex edge of the second cover plate.

Fig. 30 is a schematic diagram illustrating an exploded structure of a heat superconducting plate with a clearance and a cushion block in a self-cooling heat superconducting plate finned radiator according to an eighth embodiment of the present invention.

Fig. 31 is a schematic top view of a heat superconducting plate in a self-cooling heat superconducting plate finned radiator according to an eighth embodiment of the present invention, wherein a guide plate is located inside an annular convex edge of a second cover plate.

Fig. 32 is a schematic diagram illustrating an exploded structure of a heat superconducting plate with a stamped boss in a self-cooling heat superconducting plate fin radiator according to an eighth embodiment of the present invention.

Description of the element reference numerals

10 heat superconducting plate

100 first cover plate

101 second cover plate

1011 cover plate main body

1012 annular convex edge

102 annular frame

1021 filling hole

103 guide plate

1031 convex part

1032 flow guiding hole

1033 flow guide strip

Connection 1034

1035 reserved gap

104 first solder layer

105 second solder layer

106 sealing the channel

107 first balance channel

108 second balance channel

109 cushion block

110 first mounting through hole

111 second mounting through hole

112 third mounting through hole

113 stamping boss

114 filling tube

115 third solder layer

116 fourth solder layer

20 first radiating fin

201 first self-cooling heat dissipation channel

202L-shaped fin

203 reinforcing bar

204 first part

205 second part

206 heat dissipation strip

30 second radiating fin

301 second self-cooling heat dissipation channel

40 plane backing plate

50 power device

60 section bar radiator

Detailed Description

The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.

Please refer to fig. 1 to 32. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.

Example one

Referring to fig. 1 to 12, the present invention provides a self-cooling heat superconducting plate finned radiator, which includes: the heat superconducting plate 10 is provided with mutually communicated sealing channels 106 formed in the heat superconducting plate 10, and heat transfer working media 1061 are filled in the sealing channels 106; the surface of the heat superconducting plate 10 is vertical to the horizontal plane; the first heat dissipation fins 20 are located on one surface of the heat superconducting plate 10, a plurality of vertically extending first self-cooling heat dissipation channels 201 are formed in the first heat dissipation fins 20, and the plurality of first self-cooling heat dissipation channels 201 are arranged at intervals in the horizontal direction; at least a partial region of the first fin 20 has a smaller vertical dimension than that of the heat superconducting plate 10, so that a heat source installation region is reserved in a partial region of the heat superconducting plate 10 corresponding to a region below the first fin 20. The heat source mounting area for mounting the power device is located below, the first heat dissipation fin 20 is located at least partially above the power device, and the first self-cooling heat dissipation channel 201 extends vertically in the first heat dissipation fin 20, when the power device is in operation, the temperature of the air below is higher, the temperature of the air above is lower, the cold air moves downwards and the hot air moves upwards, so that natural air convection is formed on the surface of the first heat dissipation fin 20, and the first self-cooling heat dissipation channel 201 is a channel for air convection, so that the heat dissipation efficiency is significantly increased, and self-cooling heat dissipation is realized.

As an example, as shown in fig. 4, the heat superconducting plate 10 includes: the air-tight structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101; the baffle 103 is located within the sealed chamber; the air deflector 103 comprises a plurality of protrusions 1031 arranged at intervals in a first direction and extending in a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of the protrusions 1031 adjacent to each other in the first direction are integrally connected, and gaps are formed between the inner sides of the protrusions 1031 and the adjacent protrusions 1031, so that mutually communicated sealed passages 106 are formed between the air deflector 103 and the first cover plate 100 and the second cover plate 101; and a heat transfer working medium 1061 is filled in the sealing channel 106. Note that, in fig. 6, 8, and 10, a direction indicated by an arrow a is the first direction, and a direction indicated by an arrow b is the second direction; the first direction may be a longitudinal direction of the baffle 103, in which case the second direction is a width direction of the baffle 103, or the first direction may be a width direction of the baffle 103, in which case the second direction is a longitudinal direction of the baffle 103.

It should be noted that, because the inner side of the annular frame 102 is a hollow area, after the first cover plate 100 and the second cover plate 101 are attached to the upper and lower surfaces of the annular frame 102, a sealed chamber is formed inside the first cover plate 100, the second cover plate 101 and the annular frame 102.

The heat superconducting heat transfer technology comprises a heat pipe technology of filling working media in a closed mutually communicated micro-channel system and realizing heat superconducting heat transfer through evaporation and condensation phase change of the working media; and the phase change suppression (PCI) heat transfer technology for realizing high-efficiency heat transfer by controlling the microstructure state of the working medium in a closed system, namely, in the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and the consistency of the microstructure of the working medium is achieved on the basis. In this embodiment, the heat superconducting plate may be a phase change suppression heat dissipation plate, and at this time, the heat transfer working medium in the heat superconducting plate is suppressed from boiling or condensing during the heat transfer process, and on this basis, the consistency of the microstructure of the working medium is achieved to achieve heat transfer. In this embodiment, the heat superconducting plate may also be a heat pipe heat transfer plate, and at this time, the heat transfer working medium in the heat superconducting plate continuously performs a phase change cycle of evaporation heat absorption and condensation heat release in the heat transfer process to realize rapid heat transfer.

By way of example, heat transfer medium 1061 is a fluid, and preferably, heat transfer medium 1061 may be a gas or a liquid or a mixture of a gas and a liquid, and more preferably, in this embodiment, heat transfer medium 1061 is a mixture of a liquid and a gas.

Specifically, the bottoms of the adjacent protrusions 1031 in the first direction are integrally connected, and gaps are formed below the protrusions 1031 and between the adjacent protrusions 1031, so that the baffles 103 are arranged in a convex-concave manner at alternating intervals along the length direction.

As an example, as shown in fig. 12, the heat superconducting plate 10 further includes a first solder layer 104 and a second solder layer 105; wherein the first solder layer 104 is located between the first cover plate 100 and the annular frame 102 and the baffle 103 to solder the first cover plate 100 and the annular frame 102 and the baffle 103 together; the second solder layer 105 is located between the second cover plate 101 and the annular rim 102 and the baffle 103 to solder the second cover plate 101 and the annular rim 102 and the baffle 103 together.

As an example, the height of the baffle 103 is the same as the height of the annular rim 102. Setting the height of the baffle plate 103 to be the same as the height of the annular frame 102 can ensure that the soldering area of the baffle plate 103 with the first solder layer 104 and the second solder layer 105 is maximized, thereby increasing the soldering strength.

As an example, as shown in fig. 4, one side of the annular frame 102 is provided with a filling hole 1021 penetrating through the sidewall. After the first cover plate 100 and the second cover plate 101 are welded to the annular frame 102 and the guide plate 103, one end of a filling tube 114 is inserted into the filling hole 1021, so that the heat transfer working medium 1061 can be filled into the sealed passage 106. After filling heat transfer medium 1061, filling opening 1021 is closed to seal sealing channel 106.

In an example, the baffle 103 may be, but is not limited to, a stamped plate, as shown in fig. 4 and 6, the length of the baffle 103 is the same as the length of the inner side of the annular frame 102, and the width of the baffle 103 is the same as the width of the inner side of the annular frame 102; the side walls of the protrusions 1031 are provided with a plurality of diversion holes 1032, and the diversion holes 1032 penetrate through the diversion plate 103 along the thickness direction of the diversion plate 103. Specifically, as shown in fig. 6 and 7, the diversion plate 103 may extend in a square wave shape along the first direction, that is, the diversion plate 103 includes a plurality of protrusions 1031 arranged at intervals along the first direction, bottoms of adjacent protrusions 1031 are connected to each other along the first direction, and adjacent protrusions 1031 are recessed. Of course, in other examples, the flow guide plate 103 may also extend in a wave shape along the first direction, but preferably, the flow guide plate 103 extends in a square wave shape along the first direction, so that both the upper surface (i.e., the top surface of the protruding portion 1031) and the lower surface (i.e., the bottom surface of the concave portion between the adjacent protruding portions 13) of the flow guide plate 103 are ensured to be planar, and thus the contact area between the flow guide plate 103 and the first solder layer 104 and the second solder layer 105 is ensured to be as large as possible, thereby improving the soldering strength. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the flow guide plate 103 are welded together, the gap between the protrusions 1031 of the flow guide plate 103 and the second solder layer 105, the gap between the depressions of the protrusions 1031 and the first solder layer 104, and the flow guide holes 1032 together constitute the sealed passage 106. In this example, the protrusion 1031 penetrates the baffle 103 in the second direction, i.e. the protrusion 1031 extends through the baffle 103 in the second direction, i.e. the length of the protrusion 1031 is the same as in the second direction. Each of the protruding portions 1031 is provided with a plurality of flow guiding holes 1032, the flow guiding holes 1032 on each of the protruding portions 1031 are arranged at intervals in a single row or multiple rows along the extending direction of the protruding portions 1031, and the flow guiding holes 1032 are provided on the side walls on both sides of each of the protruding portions 1031. The diversion holes 1032 on each protrusion 1031 may be arranged in a one-to-one correspondence as shown in fig. 4, or may be arranged in a staggered manner. With sufficient clearance between the flow guide plate 103 and the first solder layer 104 and the second solder layer 105 in the second direction, the flow of the heat transfer working substance 1061 in the second direction is very smooth, and the flow of the heat transfer working medium 1061 along the first direction (i.e. the direction in which the protrusions 1031 are arranged at intervals) is blocked, by providing the diversion holes 1032 on the protrusions 1031, the flow of the heat transfer working medium 1061 along the first direction can be increased, thereby increasing the heat transfer effect in the first direction such that heat transfer medium 1061 has approximately the same flow in the first direction and in the second direction, so that the whole heat superconducting plate has the same heat dissipation effect in all directions, thereby ensuring that the temperature of all regions of the heat superconducting plate is the same, thereby effectively avoiding the local overheating phenomenon of the heat superconducting plate caused by poor heat dissipation effect in one or more directions.

In another example, as shown in fig. 8 and 9, the baffle 103 includes: a plurality of flow guide strips 1033 and connection portions 1034 arranged in parallel along the second direction, wherein the flow guide strips 1033 include a plurality of convex portions 1031 arranged at intervals along the first direction; the flow guide strips 1033 at two sides are in contact with the inner side of the annular frame 102; the connecting portions 1034 are located at two ends of the flow guide strips 1033 and integrally connected to the flow guide strips 1033; the side of the connecting portion 1034 away from the gib 1033 contacts the inner side of the annular frame 102. In this example, the width of the baffle 103 is the same as the width of the inside of the annular rim 102, and the length of the baffle 103 is the same as the length of the inside of the annular rim 102. The flow guide strips 1033 may extend in a square wave shape or in a wave shape along the first direction (generally, the length direction of the flow guide strips 1033), that is, the flow guide strips 1033 include a plurality of protrusions 1031 arranged at intervals along the first direction, and are adjacent to each other at the bottoms of the protrusions 1031 along the first direction, and are adjacent to each other between the protrusions 1031 in a concave shape. Preferably, in this embodiment, the flow guiding strips 1033 extend in a square wave shape along the first direction, so as to ensure that both the upper surface and the lower surface of the flow guiding strips 1033 are flat, that is, both the upper surface (i.e., the top surface of the protruding portion 1031) and the lower surface (i.e., the surface opposite to the top portion of the protruding portion 1031) of the flow guiding plate 103 are flat, and thus, the contact area between the flow guiding plate 103 and the first solder layer 104 and the second solder layer 105 is ensured to be as large as possible, thereby improving the soldering strength. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the flow guide plate 103 are welded together, the gaps between the protrusions 1031 of the flow guide strips 1033 and the second solder layer 105, the gaps between the depressions 1031 of the protrusions 1031 and the first solder layer 104, and the gaps between adjacent flow guide strips 1033 together constitute the sealed passages 106.

As an example, the protruding portions 1031 on two adjacent rows of the airflow guiding strips 1033 may be disposed in a one-to-one correspondence, that is, along the second direction (i.e., the direction in which the airflow guiding strips 1033 are arranged), the protruding portions 1031 on each airflow guiding strip 1033 may be disposed in a one-to-one correspondence. Of course, in other examples, the protrusions 1031 on two adjacent rows of the flow guide strips 1033 may also be arranged in a staggered manner, and the staggered arrangement of the protrusions 1031 on two adjacent rows of the flow guide strips 1033 means that the side edges of the protrusions 1031 on two adjacent rows of the flow guide strips 1033 are staggered, as shown in fig. 6 and 7; the offset distance of the convex portions 1031 of two adjacent rows of the flow guide strips 1033 may be smaller than the width of the convex portions 1031, as shown in fig. 6 and 7, the offset distance of the convex portions 1031 of two adjacent rows of the flow guide strips 1033 may also be equal to the width of the convex portions 1031, and at this time, the convex portions 1031 of one row of the flow guide strips 1033 are aligned with the concave portions between the convex portions 1031 of one row of the flow guide strips 1033 adjacent thereto. It should be noted that, when the convex portions 1031 on the two adjacent rows of the flow guide strips 1033 are arranged in a staggered manner, the convex portions 1031 on the flow guide strips 1033 in every other row are arranged in a one-to-one correspondence manner, that is, the convex portions 1031 on the odd rows of the flow guide strips 1033 are arranged in a staggered manner with the convex portions 1031 on the even rows of the flow guide strips 1033, the convex portions 1031 on the odd rows of the flow guide strips 1033 are arranged in a one-to-one correspondence manner, and the convex portions 1031 on the even rows of the flow guide strips 1033 are also arranged in a one.

As shown in fig. 10 and 11, a flow guiding hole 1032 may be formed in each of the sidewalls of the protrusion 1031, and the flow guiding hole 1032 penetrates the flow guiding strip 1033 in the thickness direction of the flow guiding strip 1033. Due to the sufficient clearance between the flow-guiding strips and the first solder layer 104 and the second solder layer 105 in the second direction, the heat transfer medium 1061 flows very smoothly in the second direction, whereas the flow of said heat transfer medium 1061 in said first direction, i.e. the direction in which said flow guiding strips 1033 extend, is hindered, by providing said flow guiding holes 1032 in said protrusions 1031, the flow of said heat transfer medium 1061 in said first direction may be increased, thereby increasing the heat transfer effect in the first direction such that heat transfer working substance 1061 has nearly the same flow in the first direction and in the second direction, so that the heat dissipation effect is the same in all directions throughout the heat superconducting plate 10, and thus the temperature of each region of the heat superconducting plate 10 is the same, thereby effectively avoiding the occurrence of the local overheating phenomenon of the heat superconducting plate 10 caused by the poor heat dissipation effect in one or more directions.

As an example, the side walls on both sides of each protruding portion 1031 on each flow guide strip 1033 are provided with the flow guide holes 1032, and along the extending direction of the flow guide strips 1033, the flow guide holes 1032 on each protruding portion 1031 may be arranged in a one-to-one correspondence as shown in fig. 10, or may be arranged in a staggered manner.

In an example, the first heat dissipating fins 20 may be wavy in the horizontal direction (as shown in fig. 13) or may extend in a square wave shape in the horizontal direction (as shown in fig. 14). The first heat dissipation fins 20 extend in a wave shape or a square wave shape along the horizontal direction, so that the surface area of the first heat dissipation fins 20 can be increased to the maximum extent in a limited space, and the heat dissipation effect is increased.

In another example, the first heat dissipating fins 20 may also extend in a wavy or square wave shape in the vertical direction, wherein fig. 15 exemplifies that the first heat dissipating fins 20 extend in a wavy shape in the vertical direction. The first heat dissipation fins 20 extend in a wavy manner or in a square wave manner in the vertical direction, so that the surface area of the first heat dissipation fins 20 can be further increased.

In yet another example, the first heat dissipation fin 20 may further include a plurality of flat plate-shaped fins, and may also include a plurality of L-shaped fins 202, and a plurality of the flat plate-shaped fins or the L-shaped fins 202 are arranged in parallel and at intervals along the horizontal direction. It should be noted that, at this time, the first heat dissipation fin 20 further includes a plurality of reinforcing bars 203, and the reinforcing bars 203 extend along the arrangement direction of the flat plate-shaped fins or the L-shaped fins 202, so as to serially connect and fix the flat plate-shaped fins or the L-shaped fins 202, and increase the mechanical strength thereof.

In yet another example, the first heat dissipating fin 20 may further include a plurality of heat dissipating strips 206 arranged in parallel and spaced apart, and the ends of the heat dissipating strips 206 are integrally connected, as shown in fig. 17.

As an example, as shown in fig. 12, the first heat radiation fin 20 may be solder-fixed to the surface of the heat superconducting plate 10 via a third solder layer 115.

As an example, as shown in fig. 2, the first heat dissipation fin 20 includes a first portion 204 and a second portion 205 arranged in a horizontal direction, and a vertical dimension of the first portion 204 is smaller than a vertical dimension of the second portion 205; the heat source installation region is located in a region of the heat superconducting plate 10 corresponding to the lower side of the first portion 204 (i.e., a region covered by the planar pad 40 in fig. 2). Preferably, the vertical dimension of the first portion 204 is smaller than the vertical dimension of the heat superconducting plate 10, and the vertical dimension of the second portion 205 is the same as the vertical dimension of the heat superconducting plate 10.

As an example, as shown in fig. 1 to fig. 3 and fig. 12, the self-cooling heat superconducting plate fin heat sink further includes a second heat dissipation fin 30, the second heat dissipation fin 30 is located on a side of the heat superconducting plate 10 away from the first heat dissipation fin 20, a plurality of second self-cooling heat dissipation channels 301 extending in a vertical direction are formed in the second heat dissipation fin 30, and the plurality of second self-cooling heat dissipation channels 301 are arranged at intervals in a horizontal direction, that is, the second self-cooling heat dissipation channels 301 are parallel to the first self-cooling heat dissipation channels 201.

In an example, the specific structure of the second heat dissipating fin 30 may be identical to that of the first heat dissipating fin 20, and will not be described in detail herein.

In another example, the second heat dissipating fin 30 is different from the first heat dissipating fin 20 only in that the first heat dissipating fin 20 includes the first portion 204 and the second portion 205, and all portions of the second heat dissipating fin 30 have the same vertical dimension as that of the heat superconducting plate 10. In this example, other structural features of the second heat dissipating fin 30 are all identical to those of the first heat dissipating fin 20, and will not be described in detail herein.

As an example, as shown in fig. 12, the second heat radiation fins 30 may be solder-fixed to the surface of the heat superconducting plate 10 via a fourth solder layer 116.

As an example, as shown in fig. 1 to 3, the self-cooled heat superconducting plate finned heat sink further includes: a planar backing plate 40, said planar backing plate 40 being located on said mounting area; and the power device 50 is positioned on the surface of the plane backing plate 40 far away from the heat superconducting plate 10. The planar backing plate 40 serves to improve the flatness of the joint surface, reduce the thermal resistance, and also serves to reinforce and improve the strength and the deformation resistance of the heat superconducting plate 10.

As an example, the self-cooled heat superconducting plate fin radiator further comprises a profile radiator 60, and the profile radiator 60 is located on the surface of the power device 50 away from the planar backing plate 40. The profile heat sink 60 may serve to further enhance heat dissipation.

Example two

Referring to fig. 18 to 20 in conjunction with fig. 1 to 17, the present embodiment further provides a self-cooled heat superconducting plate finned heat sink, and the structure of the self-cooled heat superconducting plate finned heat sink in the present embodiment is substantially the same as that of the self-cooled heat superconducting plate finned heat sink in the first embodiment, except that the specific structure of the heat superconducting plate 10 is different: compared with the heat superconducting plate 10 described in the first embodiment, in the heat superconducting plate 10 described in the first embodiment, at least one reserved gap 1035 is additionally provided in the guide plate 103, and at the same time, the heat superconducting plate 10 further includes at least one pad block 109 or at least one stamping boss 113 provided on the first cover plate 100 or the second cover plate 101. Other structures of the heat superconducting plate 10 described in this embodiment are completely the same as those of the heat superconducting plate 10 described in the first embodiment, and specific reference is made to the first embodiment, which will not be described again here.

In an example, as shown in fig. 18 and fig. 19, a plurality of reserved gaps 1035 are provided in the guide plate 103 in the heat superconducting plate 10, where fig. 18 exemplifies that 4 reserved gaps 1035 are provided in the guide plate 103, and in a practical example, the number of reserved gaps 1035 is not limited thereto; the heat superconducting plate 10 further includes a plurality of the spacers 109, the number of the spacers 109 is the same as the number of the reserved gaps 1035, and the spacers 109 are correspondingly arranged in each reserved gap 1035 one to one; the height of the cushion blocks 109 is the same as that of the guide plate 103, and a first mounting through hole 110 which penetrates through the cushion blocks 109 along the height direction is arranged in each cushion block 109; the first cover plate 100 is further provided with a plurality of second mounting through holes 111 penetrating in the thickness direction of the first cover plate 100, the number of the second mounting through holes 111 is the same as that of the first mounting through holes 110, and the second mounting through holes 111 and the first mounting through holes 110 are arranged in a one-to-one correspondence manner; the second cover plate 101 is further provided with a plurality of third mounting through holes 112 which are communicated along the thickness direction of the second cover plate 101, the number of the third mounting through holes 112 is equal to that of the first mounting through holes 110, and the third mounting through holes 112 are in one-to-one correspondence with the first mounting through holes 110. It should be noted that, for the convenience of illustration of the reserved gap 1035, the pad 109 is not illustrated in fig. 18, and for the convenience of illustration, the first solder layer 104 and the second solder layer 105 are not illustrated in fig. 18. Because a heating power device needs to be installed and fixed on the surface of the heat superconducting plate 10, and the sealing channel 106 in the heat superconducting plate 10 is a sealing pipeline, a fixing hole cannot be directly drilled at a position of the heat superconducting plate 10 corresponding to the sealing channel 106, so as to prevent the heat transfer working medium 1061 in the sealing channel 106 from leaking; the utility model discloses a reserve in the guide plate 103 reserve clearance 1035, and be in reserve clearance 1035 in set up in the guide plate 103 highly the same the cushion 109 be formed with in the cushion 109 first installation through-hole 110 is in like this form on the first apron 100 second installation through-hole 111 and form on the second apron 101 just can utilize behind the third installation through-hole 112 under the prerequisite with the help of fixing device such as bolts first installation through-hole 110 second installation through-hole 111 and third installation through-hole 112 will power device 50 is fixed in on the heat superconducting plate 10, simultaneously, can ensure again seal passage 106 is in encapsulated situation, heat transfer working medium 1061 can not reveal.

In another example, as shown in fig. 20, a plurality of reserved gaps 1035 are provided in the guide plate 103 of the heat superconducting plate 10, where fig. 20 exemplifies that four reserved gaps 1035 are provided in the guide plate 103, and in a practical example, the number of reserved gaps 1035 is not limited thereto; a plurality of stamping bosses 113 are arranged on the first cover plate 100 or the second cover plate 101, wherein a plurality of stamping bosses 113 are arranged on the second cover plate 101 in fig. 20 as an example; the stamping bosses 113 are protruded from the inner surface of the first cover plate 100 or the second cover plate 101 and arranged in the reserved gaps 1035, the height of the stamping bosses 113 is the same as that of the guide plate 103, the number of the stamping bosses 113 is the same as that of the reserved gaps 1035, the stamping bosses and the reserved gaps 1035 are arranged in a one-to-one correspondence manner, first installation through holes 110 penetrating through the stamping bosses in the height direction are arranged in the stamping bosses 113, a plurality of second installation through holes 111 penetrating through the second cover plate 101 or the first cover plate 100 in the thickness direction are further arranged on the second cover plate 101 or the first cover plate 100, and the number of the second installation through holes 111 is the same as that of the first installation through holes 110 and the second installation through holes 111 are arranged in a one-to-one correspondence manner. It should be noted that, if the stamping boss 113 is disposed on the second cover plate 101, the second mounting through hole 111 is located on the first cover plate 100, as shown in fig. 20; if the stamping boss 113 is disposed on the first cover plate 100, the second mounting through hole 111 is located on the second cover plate 101. It is further noted that, for convenience of illustration, the first solder layer 104 and the second solder layer 105 are not illustrated in fig. 20. The utility model discloses a reserve in the guide plate 103 reserve clearance 1035, and first apron 100 or set up a plurality of protruding locating on the second apron 12 in reserving clearance 1035, and with the height of guide plate 103 is the same punching press boss 113 be equipped with in the punching press boss 113 first installation through-hole 110, like this second apron 101 or set up on the first apron 100 just can utilize behind the second installation through-hole 111 under the prerequisite with the help of fixing device such as bolts first installation through-hole 110 reaches second installation through-hole 111 will power device is fixed in on the heat superconducting plate, simultaneously, can ensure again sealed passageway 106 is in encapsulated situation, heat transfer working medium 1061 can not reveal.

It should be noted that in fig. 18 to 20, the baffle 103 is a whole piece of the baffle after the reserved gap 1035 is provided in the baffle 103 as shown in fig. 6 and 7 in the first embodiment, but in other examples, the baffle 103 may also be a baffle after the reserved gap 1035 is provided in the baffle 103 as shown in fig. 8 to 11 in the first embodiment.

EXAMPLE III

Referring to fig. 21 to 22 in conjunction with fig. 1 to 17, the present embodiment further provides a self-cooled heat superconducting plate finned heat sink, and the structure of the self-cooled heat superconducting plate finned heat sink in the present embodiment is substantially the same as that of the self-cooled heat superconducting plate finned heat sink in the first embodiment, except that the structure of the heat superconducting plate 10 is different: in the first embodiment, the number of the flow guiding plates 103 in the heat superconducting plate 10 is one, while the number of the flow guiding plates 103 in this embodiment is at least two, and there is a gap between adjacent flow guiding plates 103, so as to form a first balance channel 107 of the heat transfer medium 1061 between adjacent flow guiding plates 103, where the first balance channel 107 extends along the first direction, that is, the extending direction of the first balance channel 107 is parallel to the first direction; a gap is formed between the flow guide plate 103 adjacent to the annular frame 102 and the annular frame 102, so that a second balance channel 108 of the heat transfer working medium 1061 is formed between the flow guide plate 103 and the annular frame 102, and the second balance channel 108 extends along the first direction, namely the extending direction of the second balance channel 108 is parallel to the end surface of the convex part 31; the height of the baffle plate 103 is the same as the height of the annular frame 102. Other structures of the heat superconducting plate 10 described in this embodiment are completely the same as those of the heat superconducting plate 10 described in the first embodiment, and specific reference is made to the first embodiment, which will not be described again here. The first balance channel 107 can be used as a gas-liquid balance channel to enhance the flow of the heat transfer working medium 1061 in a gas state, the heat transfer working medium 1061 in a liquid state or the heat transfer working medium 1061 in a gas-liquid mixed state along the length direction of the flow guide plate 103; second balance channel 108 may act as a liquid balance channel to enhance the flow of heat transfer medium 1061 in a liquid state in the first direction. Because the heat superconducting plate 10 is mainly in the channel direction along the second direction, and the heat transfer working medium 1061 has a large flow resistance and a poor fluidity along the first direction, the fluidity of the heat transfer working medium 1061 along the first direction can be enhanced by additionally arranging the first balance channel 107 and the second balance channel 108, so that the whole heat superconducting plate 10 has the same heat dissipation effect in each direction, the temperature of each region of the heat superconducting plate 10 is the same, and the occurrence of the local region overheating phenomenon of the heat superconducting plate 10 due to the poor heat dissipation effect of one movable multi-direction can be effectively avoided.

Example four

Referring to fig. 23 to 25 in conjunction with fig. 1 to 20, the present embodiment further provides a self-cooled heat superconducting plate finned heat sink, and the structure of the self-cooled heat superconducting plate finned heat sink in the present embodiment is substantially the same as that of the self-cooled heat superconducting plate finned heat sink in the second embodiment, except that the structure of the heat superconducting plate 10 is different: in the second embodiment of the heat superconducting plate 10, the number of the flow guiding plates 103 is one, while in the present embodiment, the number of the flow guiding plates 103 is at least two, and there is a gap between adjacent flow guiding plates 103, so as to form a first balance channel 107 of the heat transfer medium 1061 between adjacent flow guiding plates 103, where the first balance channel 107 extends along the first direction, that is, the extending direction of the first balance channel 107 is parallel to the first direction; a gap is formed between the flow guide plate 103 adjacent to the annular frame 102 and the annular frame 102, so that a second balance channel 108 of the heat transfer working medium 1061 is formed between the flow guide plate 103 and the annular frame 102, and the second balance channel 108 extends along the first direction, namely the extending direction of the second balance channel 108 is parallel to the end surface of the convex part 31; the height of the baffle plate 103 is the same as the height of the annular frame 102. Other structures of the heat superconducting plate 10 described in this embodiment are completely the same as those of the heat superconducting plate 10 described in the second embodiment, and specific reference is made to the second embodiment, which will not be described again here. The first balance channel 107 can be used as a gas-liquid balance channel to enhance the flow of the heat transfer working medium 1061 in a gas state, the heat transfer working medium 1061 in a liquid state or the heat transfer working medium 1061 in a gas-liquid mixed state along the length direction of the flow guide plate 103; second balance channel 108 may act as a liquid balance channel to enhance the flow of heat transfer medium 1061 in a liquid state in the first direction. Because the heat superconducting plate 10 is mainly in the channel direction along the second direction, and the heat transfer working medium 1061 has a large flow resistance and a poor fluidity along the first direction, the fluidity of the heat transfer working medium 1061 along the first direction can be enhanced by additionally arranging the first balance channel 107 and the second balance channel 108, so that the whole heat superconducting plate 10 has the same heat dissipation effect in each direction, the temperature of each region of the heat superconducting plate 10 is the same, and the occurrence of the local region overheating phenomenon of the heat superconducting plate 10 due to the poor heat dissipation effect of one movable multi-direction can be effectively avoided.

Fig. 23 and 24 are schematic views showing the structure of heat superconducting plate 10 having clearance 1035 and spacers 109 in a self-cooling heat superconducting plate fin heat sink, and fig. 25 is a schematic view showing the structure of heat superconducting plate 10 having punched bosses 113 in a self-cooling heat superconducting plate fin heat sink.

It should be further noted that the reserved gap 1035 formed in the baffle 103 in the embodiment is located in the baffle 103 closest to the second balance channel 108, as shown in fig. 23 to 25. Fig. 14 to 17 illustrate the baffle 103 as a baffle including a plurality of the baffle bars 1033 and the connection portions 1034 after the reserved gaps 1035 are provided in the baffle 103 shown in fig. 8 and 9 in the first embodiment, the number of the baffles 103 is two, and the baffle 103 further includes the spacers 109 as an example; of course, in other examples, the flow guide plate 103 may also be a flow guide plate after the reserved gap 1035 is provided in the flow guide plate 103 shown in fig. 6 and 7 or fig. 10 and 11 in the first embodiment, and when the flow guide plate 103 does not include the spacer block 109, the first cover plate 11 or the second cover plate 21 may also be provided with the stamping protrusion 113. The number of the baffles 103 can be set according to actual needs, and is not limited to two.

It should be further noted that the reserved gaps 1035 may be arranged according to actual needs, for example, a plurality of reserved gaps 1035 may be arranged in a line as shown in fig. 23 to 25, or may be arranged in an array as shown in fig. 18 and 20 in the second embodiment.

EXAMPLE five

Referring to fig. 26 in conjunction with fig. 1 to 17, the present invention further provides a self-cooling heat superconducting plate finned radiator, wherein the specific structure of the self-cooling heat superconducting plate finned radiator in this embodiment is substantially the same as that of the self-cooling heat superconducting plate finned radiator in the first embodiment, and the difference between the specific structure of the heat superconducting plate 10 is different: in one embodiment, the heat superconducting plate 10 includes: the sealing structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101. In the present embodiment, the heat superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a guide plate 103; the second cover plate 101 comprises a cover plate main body 1011 and an annular convex edge 1012, wherein the annular convex edge 1012 is integrally connected with the cover plate main body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

In this embodiment, the first cover plate 100 may include a cover plate main body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the first embodiment; at this time, the second cover plate 101 is attached to the annular flange.

The specific structure of the current guiding plate 103 in the heat superconducting plate 10 described in this embodiment is exactly the same as the specific structure of the current guiding plate 103 in the heat superconducting plate 10 described in the first embodiment, and will not be described in detail here. Also, the structures of the self-cooled heat superconducting plate finned radiator described in this embodiment other than the heat superconducting plate 10 are exactly the same as the corresponding structures of the self-cooled heat superconducting plate finned radiator described in the first embodiment, and will not be described again here.

In this embodiment, the second cover plate 101 may be formed by a stamping process to form the cover plate main body 1011 and the annular convex edge 1012, without using an additional annular frame, so as to reduce the weight of the heat superconducting plate 10 and reduce the cost.

EXAMPLE six

Referring to fig. 27 in conjunction with fig. 1 to 20, the present invention further provides a self-cooling heat superconducting plate finned radiator, wherein the specific structure of the self-cooling heat superconducting plate finned radiator described in this embodiment is substantially the same as that of the self-cooling heat superconducting plate finned radiator described in the second embodiment, and the difference between the two is that the specific structure of the heat superconducting plate 10 is different: in the second embodiment, the heat superconducting plate 10 includes: the sealing structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101. In the present embodiment, the heat superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a guide plate 103; the second cover plate 101 comprises a cover plate main body 1011 and an annular convex edge 1012, wherein the annular convex edge 1012 is integrally connected with the cover plate main body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

In this embodiment, the first cover plate 100 may include a cover plate main body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the second embodiment; at this time, the second cover plate 101 is attached to the annular flange.

The specific structure of the current guiding plate 103 in the heat superconducting plate 10 described in this embodiment is completely the same as the specific structure of the current guiding plate 103 in the heat superconducting plate 10 described in the second embodiment, and will not be described in detail here. Also, the structures of the self-cooled heat superconducting plate finned radiator described in this embodiment other than the heat superconducting plate 10 are exactly the same as the corresponding structures of the self-cooled heat superconducting plate finned radiator described in the second embodiment, and will not be described again here.

EXAMPLE seven

Referring to fig. 28 to 29 in conjunction with fig. 1 to 22, the present invention further provides a self-cooled heat superconducting plate finned radiator, wherein the specific structure of the self-cooled heat superconducting plate finned radiator in this embodiment is substantially the same as that of the self-cooled heat superconducting plate finned radiator in the third embodiment, and the difference between the two structures is that the specific structure of the heat superconducting plate 10 is different: in the third embodiment, the heat superconducting plate 10 includes: the sealing structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101. In the present embodiment, the heat superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a guide plate 103; the second cover plate 101 comprises a cover plate main body 1011 and an annular convex edge 1012, wherein the annular convex edge 1012 is integrally connected with the cover plate main body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

In this embodiment, the first cover plate 100 may include a cover plate main body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the third embodiment; at this time, the second cover plate 101 is attached to the annular flange.

The specific structure of the current guiding plate 103 in the heat superconducting plate 10 described in this embodiment is exactly the same as the specific structure of the current guiding plate 103 in the heat superconducting plate 10 described in the third embodiment, and will not be described in detail here. Also, the structures of the self-cooled heat superconducting plate finned radiator described in this embodiment other than the heat superconducting plate 10 are exactly the same as the corresponding structures of the self-cooled heat superconducting plate finned radiator described in the third embodiment, and will not be described again here.

Example eight

Referring to fig. 30 to 32 in conjunction with fig. 1 to 25, the present invention further provides a self-cooled heat superconducting plate finned radiator, wherein the specific structure of the self-cooled heat superconducting plate finned radiator described in this embodiment is substantially the same as that of the self-cooled heat superconducting plate finned radiator described in the fourth embodiment, and the difference between the specific structure of the heat superconducting plate 10 is different: in the fourth embodiment, the heat superconducting plate 10 includes: the sealing structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101. In the present embodiment, the heat superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a guide plate 103; the second cover plate 101 comprises a cover plate main body 1011 and an annular convex edge 1012, wherein the annular convex edge 1012 is integrally connected with the cover plate main body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

In this embodiment, the first cover plate 100 may include a cover plate main body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the fourth embodiment; at this time, the second cover plate 101 is attached to the annular flange.

The specific structure of the current guiding plate 103 in the heat superconducting plate 10 described in this embodiment is exactly the same as the specific structure of the current guiding plate 103 in the heat superconducting plate 10 described in the fourth embodiment, and will not be described in detail here. Also, the structure of the self-cooled heat superconducting plate finned radiator described in this embodiment other than the heat superconducting plate 10 is exactly the same as the corresponding structure of the self-cooled heat superconducting plate finned radiator described in the fourth embodiment, and will not be described again here.

To sum up, the utility model provides a self-cooling heat superconducting plate fin radiator, self-cooling heat superconducting plate fin radiator includes: the heat superconducting plate is internally provided with mutually communicated sealing channels, and the sealing channels are filled with heat transfer working mediums; the surface of the heat superconducting plate is vertical to the horizontal plane; the first heat dissipation fins are positioned on one surface of the heat superconducting plate, a plurality of vertically extending first self-cooling heat dissipation channels are formed in the first heat dissipation fins, and the plurality of first self-cooling heat dissipation channels are arranged at intervals along the horizontal direction; at least the size of the partial area of the first radiating fin along the vertical direction is smaller than the size of the heat superconducting plate along the vertical direction, so that a heat source installation area is reserved in the partial area of the heat superconducting plate corresponding to the lower part of the first radiating fin. The utility model discloses a self-cooling heat superconducting plate fin radiator has following beneficial effect: 1. the power device is positioned below, at least part of the radiator is positioned above the power device, and the radiator is internally provided with a vertically extending self-cooling heat dissipation channel; 2. the heat superconducting plate is internally provided with a sealed cavity and welded with a guide plate, and the guide plate welds the cover plates at two sides together, so that the reinforcing effect is achieved, the thickness of the cover plates at two sides can be reduced, the bearing capacity is increased, the strength is improved, the weight and the thickness of the heat superconducting plate are reduced, the heat exchange area in the heat superconducting plate is increased, and the heat dissipation capacity of the heat superconducting plate is enhanced; 3. a heat transfer working medium is filled in a sealed cavity inside the heat superconducting plate, and the heat transfer is inhibited by means of phase change heat transfer or phase change of the heat transfer working medium, so that the heat superconducting characteristic of rapid heat conduction is formed, and the temperature of the whole heat superconducting plate is uniform; 4. radiating fins are welded on two side surfaces outside the heat superconducting plate, so that the radiating area of the heat superconducting plate can be increased by times to dozens of times; the heat conducted by the heat superconducting plate is quickly carried away by air through the heat radiating fins and then dissipated. The radiating fins not only increase the heat exchange area with the air, reduce the system thermal resistance and improve the radiating capacity, but also play a role of strengthening the heat superconducting plate due to being welded at the two sides of the heat superconducting plate, thereby reducing the material thickness of the heat superconducting plate, improving the strength, lightening the weight and reducing the cost; 5. the lower part of the heat superconducting plate is welded with a plane base plate with a heat source junction surface such as a heating electronic device and the like, so that the flatness of the junction surface is improved, the junction thermal resistance is reduced, and the strength and the deformation resistance of the heat superconducting plate are enhanced and improved; 6. the heating electronic device or other heat sources are directly arranged at the lower part of the heat superconducting plate, and heat is directly and quickly conducted to the radiating fins on the heat superconducting plate through the heat superconducting plate, so that the heat conduction resistance is reduced, and the radiating capacity is improved; 7. compared with the traditional section bar radiator, when a high-power and high-heat-flux-density power device is radiated, the heat superconducting finned radiator has the heat superconducting characteristic and the large radiating area, so that a natural convection radiating mode can be adopted, a fan does not need to be additionally arranged for forced cooling, and the noise generated when equipment runs is reduced; 8. the heat conduction efficiency is high: most of traditional section bar radiators are made of aluminum or aluminum alloy materials, the heat conductivity coefficient is within 220W/m.K, the heat conduction efficiency is low, the heat diffusion performance is poor, the heat superconducting finned radiator has the rapid heat conduction characteristic of heat transfer working media passing through the inside of a heat superconducting plate, and the equivalent heat conductivity coefficient can reach more than 4000W/m ℃; 9. the fin is efficient: the double-sided welding fin mode is adopted for manufacturing, the defect that the tail end of the fin is low in efficiency due to the fact that the height of the fin is too high in the traditional section bar radiator is overcome, and the radiating efficiency of the fin is improved.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A self-cooled heat superconducting plate finned radiator, comprising:

2. The self-cooled heat superconducting plate finned heat sink according to claim 1, wherein the first heat dissipating fins extend in a wave or square wave shape in the horizontal direction.

3. The self-cooled heat superconducting plate finned radiator of claim 2, wherein the first heat dissipating fins extend in a wave or square wave shape in the vertical direction.

4. The self-cooled heat superconducting plate finned radiator according to claim 1, wherein the first heat radiating fins comprise a plurality of flat plate-like fins or L-shaped fins, and the plurality of flat plate-like fins or L-shaped fins are arranged in parallel at intervals in the horizontal direction.

5. The self-cooled heat superconducting plate finned heat sink according to claim 1, wherein the first heat dissipating fin comprises a first portion and a second portion arranged in a horizontal direction, and the vertical dimension of the first portion is smaller than the vertical dimension of the second portion; the heat source installation region is located at a region of the heat superconducting plate corresponding to below the first portion.

6. The self-cooled heat superconducting plate finned radiator of claim 1, further comprising second heat dissipating fins located on a side of the heat superconducting plate away from the first heat dissipating fins, wherein a plurality of second self-cooled heat dissipating channels extending in a vertical direction are formed in the second heat dissipating fins, and a plurality of the second self-cooled heat dissipating channels are arranged at intervals in a horizontal direction.

7. The self-cooled heat superconducting plate finned radiator of claim 6, wherein the second heat dissipating fins extend in a wave or square wave shape in the horizontal direction.

8. The self-cooled heat superconducting plate finned radiator of claim 7, wherein the second heat dissipating fins extend in a wave or square wave shape in the vertical direction.

9. The self-cooled heat superconducting plate finned radiator according to claim 6, wherein said second heat dissipating fins comprise a plurality of flat plate fins or L-shaped fins arranged in parallel and at intervals in the horizontal direction.

10. The self-cooled heat superconducting plate finned heat sink of claim 1, further comprising:

a planar backing plate located on the mounting area;

11. The self-cooled heat superconducting plate fin heat sink of claim 10, further comprising a profile heat sink on a surface of the power device remote from the planar backing plate.

12. A self-cooling heat superconducting plate finned heat sink according to any one of claims 1 to 11, wherein the heat superconducting plate comprises: the annular frame, the first cover plate, the second cover plate and the at least one guide plate; wherein the content of the first and second substances,

13. A self-cooled heat superconducting plate finned heat sink according to claim 12 wherein said heat superconducting plate comprises a single said baffle having a length equal to the length of the inside of said annular rim and a width equal to the width of the inside of said annular rim; the height of the guide plate is the same as that of the annular frame.

14. A self-cooled heat superconducting plate finned heat sink according to claim 12 wherein the heat superconducting plate comprises at least two of said flow deflectors having the same length as the inside of said annular rim; gaps are formed between the adjacent guide plates, so that a first balance channel of the heat transfer working medium is formed between the adjacent guide plates, and the first balance channel extends along the first direction; a gap is formed between the guide plate adjacent to the annular frame and the annular frame, so that a second balance channel of the heat transfer working medium is formed between the guide plate and the annular frame, and the second balance channel extends along the first direction; the height of the guide plate is the same as that of the annular frame.

15. The self-cooled heat superconducting plate finned radiator of claim 12, wherein the side walls of the convex portions are provided with a plurality of guiding holes, and the guiding holes penetrate through the guiding plate along the thickness direction of the guiding plate.

16. The self-cooled heat superconducting plate finned radiator of claim 12, wherein at least one pre-gap is provided in the flow guide plate; the heat superconducting plate also comprises at least one cushion block, and the cushion block is positioned in the reserved gap; the height of the cushion block is the same as that of the guide plate, and a first mounting through hole which is through along the height direction of the cushion block is arranged in the cushion block; the first cover plate is also provided with at least one second mounting through hole which is penetrated through along the thickness direction of the first cover plate, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole penetrating along the thickness direction of the second cover plate, and the third mounting through hole corresponds to the first mounting through hole.

17. The self-cooled heat superconducting plate finned radiator of claim 12, wherein at least one pre-gap is provided in the flow guide plate; the first cover plate or the second cover plate is provided with at least one stamping boss, the stamping boss is arranged in the reserved gap in a protruding mode from the inner surface of the first cover plate or the second cover plate, the height of the stamping boss is the same as that of the guide plate, a first installation through hole which is communicated along the height direction of the stamping boss is formed in the stamping boss, the second cover plate or the first cover plate is further provided with at least one second installation through hole which is communicated along the thickness direction of the first cover plate, and the second installation through hole corresponds to the first installation through hole.

18. A self-cooling heat superconducting plate finned heat sink according to any one of claims 1 to 11, wherein the heat superconducting plate comprises:

a first cover plate;

19. The self-cooled heat superconducting plate finned heat sink of claim 18, wherein the heat superconducting plate comprises a baffle having a length equal to the length of the inside of the annular ledge and a width equal to the width of the inside of the annular ledge; the height of the guide plate is the same as that of the annular convex edge.

20. The self-cooled heat superconducting plate finned heat sink of claim 18, wherein the heat superconducting plate comprises at least two of said flow deflectors having the same length as the inside of the annular ledge; gaps are formed between the adjacent guide plates, so that a first balance channel of the heat transfer working medium is formed between the adjacent guide plates, and the first balance channel extends along the first direction; a gap is formed between the guide plate and the annular convex edge adjacent to the annular convex edge, so that a second balance channel of the heat transfer working medium is formed between the guide plate and the annular convex edge, and the second balance channel extends along the first direction; the height of the guide plate is the same as that of the annular convex edge.

21. The self-cooled heat superconducting plate finned radiator of claim 18, wherein the side walls of the convex portions are provided with a plurality of flow guiding holes, and the flow guiding holes penetrate through the flow guiding plate along the thickness direction of the flow guiding plate.

22. The self-cooled heat superconducting plate finned radiator of claim 18, wherein at least one pre-gap is provided in the flow guide plate; the heat superconducting plate also comprises at least one cushion block, and the cushion block is positioned in the reserved gap; the height of the cushion block is the same as that of the guide plate, and a first mounting through hole which is through along the height direction of the cushion block is arranged in the cushion block; the first cover plate is also provided with at least one second mounting through hole which is penetrated through along the thickness direction of the first cover plate, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole penetrating along the thickness direction of the second cover plate, and the third mounting through hole corresponds to the first mounting through hole.

23. The self-cooled heat superconducting plate finned radiator of claim 18, wherein at least one pre-gap is provided in the flow guide plate; the first cover plate or the second cover plate is provided with at least one stamping boss, the stamping boss is arranged in the reserved gap in a protruding mode from the inner surface of the first cover plate or the second cover plate, the height of the stamping boss is the same as that of the guide plate, a first installation through hole which is communicated along the height direction of the stamping boss is formed in the stamping boss, the second cover plate or the first cover plate is further provided with at least one second installation through hole which is communicated along the thickness direction of the first cover plate, and the second installation through hole corresponds to the first installation through hole.