CN216982186U

CN216982186U - PCB substrate and metal-based printed circuit board

Info

Publication number: CN216982186U
Application number: CN202123191308.3U
Authority: CN
Inventors: 陈家伟
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-12-18
Filing date: 2021-12-18
Publication date: 2022-07-15
Anticipated expiration: 2031-12-18

Abstract

The utility model discloses a PCB (printed circuit board) substrate which comprises a substrate body, wherein the substrate body is provided with a cooling liquid inlet and a cooling liquid outlet, the substrate body comprises a first plate body, a second plate body and a hollow cavity enclosed by the first plate body and the second plate body, a plurality of partition plates are arranged in the hollow cavity, and the partition plates divide the hollow cavity into cooling water channels for cooling liquid to flow from the cooling liquid inlet to the cooling liquid outlet. PCB base plate, first circuit layer, insulating layer trinity and the printed circuit board who makes, moreover, the steam generator is simple in structure, and the modern design, through changing traditional PCB base plate structure, current PCB base plate is a whole board structure, this invention board and water-cooling structure combine together, dispel the heat to the PCB board through the water-cooling mode, be convenient for improve metal base printed circuit board's radiating effect, guarantee metal base printed circuit board normal use, very big improvement metal base printed circuit board's life, the worker of being convenient for uses.

Description

PCB substrate and metal-based printed circuit board

Technical Field

The utility model belongs to the technical field of electronic boards, and particularly relates to a PCB (printed circuit board) substrate and a metal-based printed circuit board.

Background

Metal-based printed circuit boards, simply referred to as metal-based pcbs (mcpcbs). The metal-based printed circuit board has more and more applications in the fields of hybrid integrated circuits, automobiles, motorcycles, office self-cutting, high-power electrical equipment, power supply equipment and the like due to excellent heat dissipation performance, machining performance, electromagnetic shielding performance, dimensional stability, magnetic performance and multifunctional performance, and is particularly widely applied as a base substrate in LED packaging products.

The heat dissipation effect of the metal-based printed circuit board is not ideal, and when the metal-based printed circuit board is used for a long time, internal heat cannot be dissipated timely, so that the service life of the metal-based printed circuit board is greatly shortened.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a PCB substrate and a metal-based printed circuit board, which are convenient for improving the heat dissipation effect of the metal-based printed circuit board, ensure the normal use of the metal-based printed circuit board and greatly prolong the service life of the metal-based printed circuit board through the improvement of the structure of the PCB substrate.

In order to achieve the purpose, the utility model is realized by the following technical scheme:

the utility model provides a PCB base plate, includes the base plate body, the base plate body be provided with coolant liquid import and coolant liquid export, the base plate body include first plate body, second plate body and enclose synthetic cavity by first plate body, second plate body, the cavity intracavity be provided with a plurality of baffle, the baffle with cavity interval play supply coolant liquid follow the coolant liquid import to the coolant liquid cooling water course that the coolant liquid export flows.

Preferably, the edges of the first plate body and the second plate body are welded by argon arc welding or gas shielded welding.

Preferably, the cooling water channel is S-shaped.

The utility model provides a metal matrix printed circuit board, includes the PCB base plate, the PCB base plate first surface and second surface have, the first surface on have first circuit layer, insulating layer from inside to outside in proper order to overlap.

Preferably, the PCB substrate is made of aluminum, iron, copper, invar copper, or tungsten-molybdenum alloy.

Preferably, the insulating layer is made of modified epoxy resin, polyphenyl ether and polyimide.

The embodiment of the utility model has the following beneficial effects: the utility model provides a high-heat-dissipation metal-based printed circuit board which is simple in structure and novel in design, the traditional PCB substrate structure is changed, the existing PCB substrate is of a whole board structure, the board is combined with a water cooling structure, and the PCB is subjected to heat dissipation in a water cooling mode, so that the heat dissipation effect of the metal-based printed circuit board is improved conveniently, the normal use of the metal-based printed circuit board is ensured, the service life of the metal-based printed circuit board is greatly prolonged, and the metal-based printed circuit board is convenient for workers to use.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic perspective view of a PCB substrate according to the present invention;

fig. 2 is a schematic structural diagram of a first board of the PCB substrate of the present invention;

fig. 3 is a schematic structural diagram of the metal-based printed circuit board of the present invention.

Wherein the figures include the following reference numerals:

1. a substrate body; 11. a first plate body; 13. a partition plate; 2. a coolant inlet; 3. a coolant outlet; 4 a first circuit layer; 5 a second insulating layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses.

To maintain the following description of the embodiments of the present invention clear and concise, a detailed description of known functions and known components of the utility model have been omitted.

Referring to fig. 1 to 3, the present invention relates to a PCB substrate, including a substrate body 1, wherein the substrate body 1 is provided with a cooling liquid inlet 2 and a cooling liquid outlet 3, the substrate body 1 includes a first plate 11, a second plate and a hollow cavity surrounded by the first plate 11 and the second plate, a plurality of partition plates 13 are disposed in the hollow cavity, and the partition plates 13 partition the hollow cavity to form a cooling water channel for a cooling liquid to flow from the cooling liquid inlet 2 to the cooling liquid outlet 3.

Preferably, the edges of the first plate body 11 and the second plate body are welded by resistance welding, brazing, argon arc welding or gas shielded welding.

Preferably, the edges of the first plate body 11 and the second plate body are bonded by thermal curing using an enamel material.

Preferably, the cooling water channel is S-shaped.

The utility model provides a metal matrix printed circuit board, includes the PCB base plate, the PCB base plate have first surface and second surface, the first surface on overlap in proper order from inside to outside and have first insulating layer 6, first circuit layer 4, second insulating layer 5.

Preferably, the PCB substrate is made of aluminum, iron, copper, invar copper, or tungsten-molybdenum alloy. Preferably, the insulating layer is made of modified epoxy resin, polyphenyl ether and polyimide.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Claims

1. The utility model provides a PCB base plate, includes the base plate body, its characterized in that, the base plate body be provided with coolant liquid import and coolant liquid export, the base plate body include first plate body, second plate body and enclose synthetic cavity by first plate body, second plate body, the cavity in be provided with a plurality of baffle, the baffle with cavity interval play supply coolant liquid follow the coolant liquid import to the coolant liquid export cooling water course that flows.

2. The PCB substrate of claim 1, wherein the edges of the first board and the second board are welded by argon arc welding or gas shielded welding.

3. The PCB substrate of claim 1, wherein the cooling channel is S-shaped.

4. A metal-based printed circuit board comprising at least one PCB substrate according to any of claims 1 to 3, wherein the PCB substrate comprises a first surface and a second surface, and the first surface is sequentially stacked with a first circuit layer and an insulating layer from inside to outside.

5. A metal matrix printed circuit board according to claim 4, wherein the PCB substrate is made of aluminum or iron or copper or tungsten-molybdenum alloy.