CN216290633U - Power supply heat radiation structure - Google Patents

Abstract

The utility model discloses a power supply heat dissipation structure which comprises a heat radiator and at least one PCB (printed circuit board), wherein a carrier plate and a fin connected to the first side of the carrier plate are arranged on the heat radiator, the PCB is arranged on the second side of the carrier plate, a plurality of heating components are arranged on the PCB, the plurality of heating components are all positioned on one side of the PCB, which is adjacent to the carrier plate, and heat conducting ends of the heating components are connected with the carrier plate. The support plate of the radiator can bear the PCB, the heating components on the PCB are connected with the same side of the support plate of the radiator, the other side of the support plate is connected with the fins, heat generated during the working of the PCB can be released through the radiator, the radiating effect can be improved, and the influence of the heat on other components is reduced.

Description

Power supply heat radiation structure

Technical Field

The utility model relates to the technical field of charging piles, in particular to a power supply heat dissipation structure.

Background

With the gradual development of new energy technology, new energy vehicles are gradually popularized and applied, and charging piles matched with the new energy vehicles are increased day by day. The charging pile is internally provided with a power supply module, the basic principle of the power supply module is that the existing power supply is converted into target power supplies with different voltages, currents and frequencies through a high-frequency switch, and most of the loss power during the conversion period is converted into heat energy to be released.

In order to achieve the purpose of heat dissipation, in the conventional design, a heat sink is generally added on an electronic component (e.g., a switching tube) with a large heat productivity, and then heat dissipation is performed by means of forced air cooling, a heat pipe + forced air cooling, water cooling + forced air cooling, or a built-in heat exchange system.

In high-power module, the quantity of the electronic components that generate heat greatly is more, and every electronic components all installs the radiator additional and can lead to power module's bulky, with high costs, and the heat energy through the radiator release can lead to the fact the influence to electronic components on every side moreover. In addition, no matter the air-cooled heat dissipation or the water-cooled heat dissipation, an air duct system or a water channel system needs to be additionally designed, and the structure is complex and the cost is high.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides a power supply heat dissipation structure which can optimize the heat dissipation structure and improve the heat dissipation effect.

The power supply heat dissipation structure comprises a heat radiator and at least one PCB, wherein the heat radiator is provided with a carrier plate and a fin connected to the first side of the carrier plate, the PCB is arranged on the second side of the carrier plate, the PCB is provided with a plurality of heating components, the plurality of heating components are all positioned on one side, close to the carrier plate, of the PCB, and the heat conduction ends of the heating components are connected with the carrier plate.

The power supply heat dissipation structure provided by the embodiment of the utility model at least has the following beneficial effects:

the support plate of the radiator can bear the PCB, and heating components on the PCB are connected with the same side of the support plate of the radiator, so that the heat generated by the work of the PCB is distributed and concentrated, and the other side of the support plate is connected with the fins, so that the heat generated by the work of the PCB can be released through the radiator, the improvement of the radiating effect is facilitated, and the influence of the heat on other components is reduced.

According to some embodiments of the utility model, the heat-generating component includes a plurality of plug-in switch tubes inserted on the PCB, pins of the plug-in switch tubes are L-shaped, and heat-conducting ends of the plug-in switch tubes face the carrier plate.

According to some embodiments of the utility model, the heat conducting ends of the plurality of the card switch tubes are located on the same plane.

According to some embodiments of the utility model, the carrier board has mounted thereon at least one of a plug-in transformer and a plug-in inductor;

if the plug-in transformer is installed on the carrier plate, a first end of the plug-in transformer is connected with the carrier plate, and a second end of the plug-in transformer is provided with a first pin;

if the plug-in inductor is installed on the carrier plate, the first end of the plug-in inductor is connected with the carrier plate, and the second end of the plug-in inductor is provided with a second pin.

According to some embodiments of the present invention, the plug-in transformer includes a first bobbin, a first coil wound on the first bobbin, and a first magnetic core sleeved outside the first bobbin, wherein a first end of the first bobbin is provided with a mounting portion, and the first pin is disposed at a second end of the first bobbin.

According to some embodiments of the present invention, the plug-in inductor includes a second bobbin, a second coil wound on the second bobbin, and a second magnetic core sleeved outside the second bobbin, and the second pin is disposed at an end of the second bobbin far from the carrier.

According to some embodiments of the utility model, the number of the plug-in transformers and the plug-in inductors is plural, and the plural plug-in transformers and the plural plug-in inductors are all mounted on a backplane and connected with the carrier board through the backplane.

According to some embodiments of the present invention, a first PCB connection board is connected between the plurality of plug-in transformers and the plurality of plug-in inductors, and is electrically connected through the first PCB connection board.

According to some embodiments of the present invention, a plurality of the plug-in transformers are electrically connected to a second PCB connection board, the second PCB connection board is electrically connected to a first conductive member and is electrically connected to the corresponding PCB board through the first conductive member;

and/or the plurality of plug-in inductors are electrically connected with a third PCB connecting plate, and the third PCB connecting plate is electrically connected with a second conductive piece and is electrically connected with the corresponding PCB through the second conductive piece.

According to some embodiments of the utility model, a flange is provided on the carrier plate and outside the fins.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is an exploded view of a heat dissipation structure of a power supply according to an embodiment of the utility model;

FIG. 2 is an enlarged fragmentary view of encircled portion A of FIG. 1;

fig. 3 is a schematic diagram of a power heat dissipation structure according to an embodiment of the utility model;

fig. 4 is a front view of the power heat dissipation structure shown in fig. 3;

fig. 5 is an exploded schematic view (with part of the PCB hidden) of the power heat dissipation structure shown in fig. 3;

FIG. 6 is an enlarged fragmentary view of circled location B in FIG. 5;

FIG. 7 is an enlarged fragmentary view of encircled location C in FIG. 1;

fig. 8 is a schematic usage status diagram of a power heat dissipation structure according to an embodiment of the utility model.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

Referring to fig. 1 and fig. 2, the present embodiment discloses a power supply heat dissipation structure, which includes a heat sink 100 and at least one PCB 200 mounted on the heat sink 100, the heat sink 100 is provided with a carrier 110 and a fin 120 connected to a first side of the carrier 110, the PCB 200 is mounted on a second side of the carrier 110, the PCB 200 is provided with a plurality of heat-generating components 210, the plurality of heat-generating components 210 are all located on one side of the PCB 200 adjacent to the carrier 110, and a heat-conducting end of the heat-generating components 210 is connected to the carrier 110. It is understood that the relative position relationship between the first side and the second side of the carrier plate 110 can refer to fig. 1.

The carrier plate 110 of the heat sink 100 can bear the PCB 200, and the heating components 210 on the PCB 200 are all connected to the same side of the carrier plate 110 of the heat sink 100, so that the heating components 210 on the PCB 200 share the same heat sink, which is beneficial to reducing the number of heat sinks, the heat generated by the work of the PCB is intensively distributed on the heat sink 100, the carrier plate 110 of the heat sink 100 has heat-conducting property, and the other side of the carrier plate 110 is connected with the fins 120, which can indirectly increase the heat dissipation area, which is beneficial to releasing the heat generated by the work of the PCB 200 through the heat sink 100, compared with the single heat sink adopted in the prior art, the carrier plate 110 of the heat sink 100 of the embodiment has a larger area, which can increase the heat dissipation area, which is beneficial to improving the heat dissipation effect, and reducing the influence of the heat on other components. In addition, the heat generated by the power supply during operation is mainly concentrated on one side of the heat sink 100, which is beneficial to simplifying the design of cooling channel structures such as air cooling or water cooling.

Referring to fig. 2, the heat-generating component 210 includes a plurality of plug-in type switch tubes inserted on the PCB 200, a heat conducting end 211 is disposed at the back of the plug-in type switch tubes, pins 212 of the plug-in type switch tubes are L-shaped, and the heat conducting end 211 of the plug-in type switch tubes faces the carrier 110. During production and processing, the pin 212 of the plug-in switch tube is bent forward, so that the pin 212 of the plug-in switch tube is in an L shape, and the plug-in switch tube is inserted and welded on the same surface of the PCB 200, wherein the heat conduction ends 211 of the plug-in switch tubes are located on the same plane, so that good contact between the plug-in switch tube and the heat sink 100 can be ensured.

Referring to fig. 3, at least one of the plug-in transformer 310 and the plug-in inductor 320 is mounted on the carrier 110, and according to different application requirements, electronic components such as a transformer or an inductor can be added to the power supply to perform voltage conversion or filtering, and some plug-in transformers and plug-in inductors are large in size and heavy in weight. If such a plug-in transformer or a plug-in inductor is disposed on the PCB 200, the PCB 200 is burdened, and thus the connection structure between the PCB 200 and the carrier 110 is more complicated. Therefore, in the embodiment, the plug-in transformer 310 and the plug-in inductor 320 are mounted on the carrier substrate 110, and the carrier substrate 110 carries the plug-in transformer 310 and the plug-in inductor 320, so that the burden of the PCB 200 can be effectively reduced, and the connection structure between the PCB 200 and the carrier substrate 110 can be simplified. It is appreciated that the carrier board 110 may have mounted thereon the card transformer 310 and the card inductor 320, or both.

Referring to fig. 4, if the package transformer 310 is mounted on the carrier 110, a first end of the package transformer 310 is connected to the carrier 110, a second end of the package transformer 310 is provided with a first pin 311, and the first end and the second end of the package transformer 310 are disposed oppositely, and the relative position relationship therebetween can be referred to as shown in the figure. Compared with the use mode of the traditional transformer, the first pin 311 of the plug-in transformer 310 of the embodiment faces upwards, so that the body of the plug-in transformer 310 can be prevented from being shielded during assembly, and the assembly efficiency can be improved, and the plug-in transformer 310 can be conveniently welded.

Similarly, referring to fig. 4, if the package inductor 320 is mounted on the carrier substrate 110, a first end of the package inductor 320 is connected to the carrier substrate 110, and a second end of the package inductor 320 is provided with a second pin 321. The second pin 321 of the plug-in inductor 320 faces upward, so that the plug-in inductor 320 can be prevented from being shielded by the body of the plug-in inductor 320 during assembly, which is beneficial to improving the assembly efficiency and facilitating the welding of the plug-in inductor 320.

Referring to fig. 5 and fig. 6, in order to facilitate the mounting and welding of the plug-in transformer 310, the plug-in transformer 310 includes a first bobbin 312, a first coil 313 wound on the first bobbin 312, and a first magnetic core 314 sleeved outside the first bobbin 312, a mounting portion 315 is disposed at a first end of the first bobbin 312, and a first pin 311 is disposed at a second end of the first bobbin 312. The mounting portion 315 may be a mounting hole or a clamping member, and the first frame 312 is directly or indirectly mounted on the carrier plate 110 through a screw connection or a clamping, which is simple and reliable. It is understood that the relative position relationship between the first end and the second end of the first skeleton 312 can refer to the drawings, wherein the first end of the first skeleton 312 is close to the heat sink 100, and the second end of the first skeleton 312 is far away from the heat sink 100 relative to the first end of the first skeleton 312.

Similarly, in order to facilitate the mounting and soldering of the plug-in inductor 320, the plug-in inductor 320 includes a second bobbin 322, a second coil 323 wound around the second bobbin 322, and a second magnetic core 324 sleeved outside the second bobbin 322, and the second pin 321 is disposed at one end of the second bobbin 322 far from the carrier 110. In assembly, the crimping plate 500 is placed on top of the second bobbin 322, and the crimping plate 500 is connected to the carrier board 110 by screws, thereby fixing the card inductor 320. It should be noted that, the term "far" in this embodiment means that the distance is far from the end of the second framework 322 connected to the carrier 110.

Referring to fig. 5 and fig. 6, the number of the plug-in transformers 310 and the plug-in inductors 320 is plural, and the plurality of plug-in transformers 310 and the plurality of plug-in inductors 320 are mounted on a bottom board 330 and connected to the carrier 110 through the bottom board 330. During production, the plug-in transformer 310 and the plug-in inductor 320 may be mounted on the base plate 330, and the plug-in transformer 310 and the plug-in inductor 320 may be welded to form a semi-finished product, and then the semi-finished product may be assembled to the heat sink 100.

Referring to fig. 4, 5 and 6, in order to improve the production assembly efficiency and the product reliability, a first PCB connection board 410 is connected between the plurality of plug-in transformers 310 and the plurality of plug-in inductors 320, and is electrically connected through the first PCB connection board 410. In traditional high-power supply design, electronic components such as transformer and inductor commonly use the cable conductor cluster and connect or through the copper bar jumper connection, but because the cable conductor cluster all needs high-power electric iron to weld with the copper bar jumper connection, have the possibility that the welding is not firm in addition to welding area is big, is difficult to realize automatic welding. In the embodiment, the mechanical connection between the plug-in transformers 310, the mechanical connection between the plug-in inductors 320, and the mechanical connection between the plug-in transformers 310 and the plug-in inductors 320 are realized through the first PCB connection board 410, and the wires are arranged on the first PCB connection board 410, and the electrical connection between the electronic components is realized through the wires, so that the advantages of the skin effect of the wires, the large surface heat dissipation area and the like can be utilized, and the internal resistance loss of the wires is smaller when the wires transmit large current. In addition, the welding area on the first PCB connecting plate 410 is smaller, the risk of electric leakage of the welding spot can be reduced, automatic welding can be realized, the production and assembly efficiency can be improved, the welding quality of the welding spot can be improved, and the reliability of the product can be improved.

Similarly, if the plurality of plug-in transformers 310 are mounted on the carrier board 110, the plurality of plug-in transformers 310 are electrically connected to the second PCB connecting board 420, and the second PCB connecting board 420 is electrically connected to the first conductive member 421 and is electrically connected to the corresponding PCB board 200 through the first conductive member 421.

Referring to fig. 4, if a plurality of plug-in inductors 320 are mounted on the carrier board 110, the plurality of plug-in inductors 320 are electrically connected to a third PCB connection board 430, and the third PCB connection board 430 is electrically connected to a second conductive member 431 and is electrically connected to the corresponding PCB board 200 through the second conductive member 431.

In the above embodiment, the first conductive member 421 and the second conductive member 431 both use copper pillars. It is contemplated that, in order to reduce the risk of leakage of the first and second conductive members 421 and 431, outer walls of the first and second conductive members 421 and 431 are wrapped or coated with an insulating layer.

It should be noted that, according to the actual application requirement, the card transformer 310 or the card inductor 320 may be mounted on the carrier board 110, or the card transformer 310 and the card inductor 320 may be mounted on the carrier board 110.

For example, referring to fig. 7, a flange 111 is disposed on the support plate 110 of the heat sink 100 and located outside the fins 120, a mounting hole is formed on the housing of the charging pile 600, so that the heat sink 100 is embedded in the mounting hole, the fins 120 of the heat sink 100 are located outside the housing of the charging pile 600, and the flange 111 of the support plate 110 abuts against the housing of the charging pile 600 located at the edge of the mounting hole, so that the support plate 110 is tightly attached to the housing of the charging pile 600. The heat that the power produced in the work exports outside the casing of filling electric pile through support plate 110 and fin 120 of radiator 100, can reduce the inside heat of the form of charging, is favorable to improving the radiating efficiency.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (10)

1. A power supply heat dissipation structure, comprising:

a heat sink (100) provided with a carrier plate (110) and fins (120) connected to a first side of the carrier plate (110);

the PCB comprises at least one PCB (200) which is arranged on the second side of the carrier plate (110), wherein a plurality of heating components (210) are arranged on the PCB (200), the plurality of heating components (210) are all positioned on one side, adjacent to the carrier plate (110), of the PCB (200), and the heat conducting end of each heating component (210) is connected with the carrier plate (110).

2. The power supply heat dissipation structure of claim 1, wherein the heat generating component (210) comprises a plurality of plug-in switch tubes inserted on the PCB (200), pins (212) of the plug-in switch tubes are L-shaped, and heat conducting ends (211) of the plug-in switch tubes face the carrier board (110).

3. The power supply heat dissipation structure of claim 2, wherein the heat conducting ends (211) of the plurality of plug-in switch tubes are located on the same plane.

4. The power supply heat dissipation structure of claim 1, wherein at least one of a plug-in transformer (310) and a plug-in inductor (320) is mounted on the carrier board (110);

if the plug-in transformer (310) is installed on the carrier plate (110), a first end of the plug-in transformer (310) is connected with the carrier plate (110), and a second end of the plug-in transformer (310) is provided with a first pin (311);

if the plug-in inductor (320) is mounted on the carrier plate (110), a first end of the plug-in inductor (320) is connected with the carrier plate (110), and a second end of the plug-in inductor (320) is provided with a second pin (321).

5. The power supply heat dissipation structure of claim 4, wherein the plug-in transformer (310) comprises a first bobbin (312), a first coil (313) wound on the first bobbin (312), and a first magnetic core (314) sleeved outside the first bobbin (312), a mounting portion (315) is disposed at a first end of the first bobbin (312), and the first pin (311) is disposed at a second end of the first bobbin (312).

6. The power supply heat dissipation structure of claim 4, wherein the plug-in inductor (320) comprises a second bobbin (322), a second coil (323) wound around the second bobbin (322), and a second magnetic core (324) sleeved outside the second bobbin (322), and the second pin (321) is disposed at an end of the second bobbin (322) away from the carrier (110).

7. The structure of any one of claims 4 to 6, wherein the number of the plug-in transformers (310) and the plug-in inductors (320) is plural, and the plural plug-in transformers (310) and the plural plug-in inductors (320) are mounted on a backplane (330) and connected to the carrier board (110) through the backplane (330).

8. The power supply heat dissipation structure of claim 7, wherein a first PCB connecting board (410) is connected between the plurality of plug-in transformers (310) and the plurality of plug-in inductors (320), and is electrically connected through the first PCB connecting board (410).

9. The power supply heat dissipation structure of claim 7, wherein a plurality of the plug-in transformers (310) are electrically connected to a second PCB connecting board (420), the second PCB connecting board (420) is electrically connected to a first conductive member (421), and is electrically connected to the corresponding PCB board (200) through the first conductive member (421);

and/or a plurality of the plug-in inductors (320) are electrically connected with a third PCB connecting board (430), and the third PCB connecting board (430) is electrically connected with a second conductive piece (431) and is electrically connected with the corresponding PCB (200) through the second conductive piece (431).

10. The power supply heat dissipation structure of claim 1, wherein a flange (111) is provided on the carrier plate (110) and outside the fins (120).

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