CN109904130A - A kind of integral electrical module heat radiator - Google Patents
A kind of integral electrical module heat radiator Download PDFInfo
- Publication number
- CN109904130A CN109904130A CN201910112221.0A CN201910112221A CN109904130A CN 109904130 A CN109904130 A CN 109904130A CN 201910112221 A CN201910112221 A CN 201910112221A CN 109904130 A CN109904130 A CN 109904130A
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- China
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- radiator
- radiator body
- module
- integral electrical
- igbt module
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to electrical equipment fields, more particularly to a kind of integral electrical module heat radiator, including IGBT module and radiator body, the IGBT module bottom plate is located above the radiator body, cooling fin is equipped with below the radiator body, copper plated area is equipped between the IGBT module and the radiator body, this integral electrical module heat radiator, thermal resistance can be greatly reduced, to improve efficiency, IGBT the or MOS constant power chip used, cpable of lowering power is used, and then cost is reduced, safety coefficient is higher.
Description
Technical field
The invention belongs to electrical equipment fields, and in particular to a kind of integral electrical module heat radiator.
Background technique
Radiator is chiefly used in electrical equipment, prevents electrical equipment from causing electric appliance to damage since heat dissipation is bad in use
Bad, module is connect by existing radiator by heat-conducting silicone grease with radiator.Thermal resistance therein is very high, most power wave
Take on heat loss, in order to be transmitted on radiator as early as possible by heat caused by device (module), needs with very big heat dissipation
Device causes the temperature difference of heating device and radiator, and to achieve the purpose that absorb heat, radiating efficiency is lower.
Summary of the invention
The object of the present invention is to provide a kind of integral electrical module heat radiators, and thermal resistance can be greatly reduced, to improve effect
Can, IGBT the or MOS constant power chip used, cpable of lowering power uses, and then reduces cost, and safety coefficient is higher.
In order to achieve the goal above, the technical solution adopted by the present invention are as follows: a kind of integral electrical module heat radiator, including
IGBT module and radiator body, the IGBT module bottom plate are located above the radiator body, the radiator
It is equipped with cooling fin below ontology, copper plated area is equipped between the IGBT module and the radiator body.
Further, connecting bottom board is equipped with below the IGBT module, the connecting bottom board is equipped with mounting hole, institute
The radiator body stated is equipped with fixation hole corresponding with the mounting hole.
Further, the copper plated area size shape is identical as the IGBT module bottom surface.
Further, the IGBT module is welded on copper plated area.
Further, the copper of the copper plated area is welded on radiator body using cold welding or hot weld technology.
Further, the cooling fin has multiple, between distance be 3-5mm.
The technical effects of the invention are that: module is welded on radiator by this integral electrical module heat radiator, can
Thermal resistance is greatly reduced, to improve efficiency, IGBT the or MOS constant power chip used, cpable of lowering power is used, and then reduce at
This, safety coefficient is higher, and using cold-welding technique, copper is sprayed on specific position, is just being suitble to module " multiple copper ceramic substrate "
(DBC) or other modules use the bottom plate that may be welded to copper radiator, therefore, the accurate positioning (having target) of module welding,
Yield is high.Copper material is sprayed in designated position, cost can also be greatly reduced.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Appended drawing reference:
10-IGBT module；11- connecting bottom board；12- mounting hole；20- radiator body；21- cooling fin；22- fixation hole；
The copper plated area 30-.
Specific embodiment
A kind of integral electrical module heat radiator, including IGBT module 10 and radiator body 20, the IGBT module
10 are located at 20 top of radiator body, are equipped with cooling fin 21, the IGBT mould below the radiator body 20
Copper plated area 30 is equipped between block 10 and the radiator body 20.Module is welded on radiator, thermal resistance can be greatly reduced,
To improve efficiency, IGBT the or MOS constant power chip used, cpable of lowering power is used, and then reduces cost or original device
Surplus it is bigger, safety coefficient is higher
Preferably, connecting bottom board 11 is equipped with below the IGBT module 10, the connecting bottom board 11 is equipped with installation
Hole 12, the radiator body 20 are equipped with fixation hole 22 corresponding with the mounting hole 12.Pass through mounting hole and fixation
The interconnection in hole, more fastens so that connecting between IGBT module and radiator body.
Preferably, 30 size shape of copper plated area is identical as the IGBT module 10.It copper plated area can be according to module
Size is adjusted, and carries out copper facing without large area, cost can be greatly reduced.
Preferably, the IGBT module 10 is welded on copper plated area 30.
Preferably, the copper of the copper plated area 30 is welded on radiator body 20 using cold welding or hot weld technology.
Preferably, the cooling fin 21 has multiple, and distance is 3-5mm between each cooling fin 21.
Claims (6)
1. a kind of integral electrical module heat radiator, including IGBT module (10) and radiator body (20), it is characterised in that: institute
The IGBT module (10) stated is located above the radiator body (20), and heat dissipation is equipped with below the radiator body (20)
Piece (21) is equipped with copper plated area (30) between the IGBT module (10) and the radiator body (20).
2. integral electrical module heat radiator according to claim 1, it is characterised in that: below the IGBT module (10)
Equipped with connecting bottom board (11), the connecting bottom board (11) is equipped with mounting hole (12), and the radiator body is set on (20)
There is fixation hole (22) corresponding with the mounting hole (12).
3. integral electrical module heat radiator according to claim 1, it is characterised in that: described copper plated area (30) the size shape
Shape is identical as IGBT module (10).
4. integral electrical module heat radiator according to claim 2, it is characterised in that: IGBT module (10) welding
In on copper plated area (30).
5. integral electrical module heat radiator according to claim 3, it is characterised in that: the copper of the copper plated area (30) is adopted
It is welded on radiator body (20) with cold welding or hot weld technology.
6. integral electrical module heat radiator according to claim 1, it is characterised in that: the cooling fin (21) has more
A, distance is 3-5mm between each cooling fin (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910112221.0A CN109904130A (en) | 2019-02-13 | 2019-02-13 | A kind of integral electrical module heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910112221.0A CN109904130A (en) | 2019-02-13 | 2019-02-13 | A kind of integral electrical module heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109904130A true CN109904130A (en) | 2019-06-18 |
Family
ID=66944810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910112221.0A Pending CN109904130A (en) | 2019-02-13 | 2019-02-13 | A kind of integral electrical module heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109904130A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039566A (en) * | 2006-03-17 | 2007-09-19 | 富准精密工业(深圳)有限公司 | Heat abstractor and electronic device using the same |
| CN102299144A (en) * | 2011-06-15 | 2011-12-28 | 佛山市顺德区和而泰电子科技有限公司 | Discreet IGBT module and substrate thereof |
| CN103887339A (en) * | 2012-12-19 | 2014-06-25 | 中兴通讯股份有限公司 | Transistor, transistor heat radiation structure and transistor production method |
| CN107195604A (en) * | 2016-03-15 | 2017-09-22 | 富士电机株式会社 | The manufacture method of semiconductor module and semiconductor module |
| CN209747503U (en) * | 2019-02-13 | 2019-12-06 | 浙江天毅半导体科技有限公司 | Integrated power module radiator |
-
2019
- 2019-02-13 CN CN201910112221.0A patent/CN109904130A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039566A (en) * | 2006-03-17 | 2007-09-19 | 富准精密工业(深圳)有限公司 | Heat abstractor and electronic device using the same |
| CN102299144A (en) * | 2011-06-15 | 2011-12-28 | 佛山市顺德区和而泰电子科技有限公司 | Discreet IGBT module and substrate thereof |
| CN103887339A (en) * | 2012-12-19 | 2014-06-25 | 中兴通讯股份有限公司 | Transistor, transistor heat radiation structure and transistor production method |
| CN107195604A (en) * | 2016-03-15 | 2017-09-22 | 富士电机株式会社 | The manufacture method of semiconductor module and semiconductor module |
| CN209747503U (en) * | 2019-02-13 | 2019-12-06 | 浙江天毅半导体科技有限公司 | Integrated power module radiator |
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