CN221531997U - Electronic module phase change thermal control device in closed cavity - Google Patents
Electronic module phase change thermal control device in closed cavity Download PDFInfo
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- CN221531997U CN221531997U CN202420086571.0U CN202420086571U CN221531997U CN 221531997 U CN221531997 U CN 221531997U CN 202420086571 U CN202420086571 U CN 202420086571U CN 221531997 U CN221531997 U CN 221531997U
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- phase change
- shell
- thermal control
- change thermal
- heat
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- 230000008859 change Effects 0.000 title claims abstract description 28
- 238000007789 sealing Methods 0.000 claims abstract description 25
- 239000012782 phase change material Substances 0.000 claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000741 silica gel Substances 0.000 claims abstract description 5
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 5
- 230000007704 transition Effects 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000002791 soaking Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 238000009434 installation Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of electronic heat dissipation, in particular to a phase change thermal control device of an electronic module in a closed cavity, which comprises a closed cavity, wherein an installation frame is welded on the inner wall of the closed cavity, a circuit board is installed on the inner wall of the installation frame through bolts, a phase change thermal control component is installed on one side of the closed cavity through bolts, and a heat conduction component is installed on one side of the phase change thermal control component through bolts. The phase change thermal control assembly comprises a shell which is installed on one side of the closed cavity through a bolt, a heat conduction silica gel sheet is attached to one side of the shell, a first sealing ring is glued on one side of the shell, and a heat conduction sheet is welded on the inner wall of the shell. The improved electronic module phase change thermal control device adopts a phase change thermal control component, can quickly absorb heat of the electronic module when the electronic module works, and adopts a heat conduction component, so that the heat emitted by the phase change material can be quickly led out when the electronic module stops working.
Description
Technical Field
The utility model relates to the technical field of electronic heat dissipation, in particular to a phase change thermal control device of an electronic module in a closed cavity.
Background
The heat generated by the electronic module device during operation can raise the internal temperature of the device, if the heat dissipation treatment is not performed, the device can continuously raise the temperature, the device can fail due to overheating, and the reliability of the electronic device can be reduced. As electronic devices are developed to high performance and high integration levels, the power density of the electronic devices is increased, and the heat productivity and heat flux density of the electronic devices per unit volume are also greatly increased. In order to ensure that the device can be in a good working temperature environment, heat needs to be rapidly emitted. The electronic devices typically dissipate heat in operation using passive techniques in the form of conduction, radiation or natural convection, or forced air cooling, heat exchangers or active techniques that circulate a cooling fluid. However, the electronic module in the closed cavity does not form a necessary condition for natural convection, the role played by the circuit board in the electronic device and system technology, such as the PCB board, is more and more important, along with the trend of shrinking the system volume, the IC process and packaging technology are continuously developed to finer and smaller links and volumes, when the electronic system is in the closed cavity, most of the heat of the electronic device is transferred to the PCB board through heat conduction besides the heat radiation of the electronic device, so the rapid heat dissipation and temperature reduction of the PCB board at this time becomes the key for the stable operation of the electronic device or the system, and therefore, a phase change thermal control device for the electronic module in the closed cavity is needed.
The inventors found that the following problems exist in the prior art in the process of implementing the present utility model: 1. when the electronic module phase change thermal control device uses the phase change material to dissipate heat, the heat is conducted by the contact surface of the shell and the phase change material, so that the heat conduction efficiency is low, and the heat dissipation effect is affected; 2. when the electronic module phase change thermal control device uses the phase change material to radiate, the heat radiation is performed by depending on the contact surface between the shell and the outside, and the heat radiation efficiency is possibly lower.
Disclosure of utility model
The utility model aims to provide a phase change thermal control device of an electronic module in a closed cavity, which is used for solving the problems that the heat conduction efficiency is low by relying on the contact surface of a shell and a phase change material, and the heat dissipation efficiency is low by relying on the contact surface of the shell and the outside when the phase change material dissipates heat. In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an airtight intracavity electronics module phase transition heat accuse device, includes airtight cavity, airtight cavity's inner wall welding has the mounting bracket, the circuit board is installed through the bolt to the inner wall of mounting bracket, the phase transition heat accuse subassembly is installed through the bolt to one side of airtight cavity, the heat conduction subassembly is installed through the bolt to one side of phase transition heat accuse subassembly.
The phase change thermal control assembly comprises a shell which is installed on one side of the closed cavity through a bolt, a heat conduction silica gel sheet is attached to one side of the shell, a first sealing ring is glued on one side of the shell, a heat conduction sheet is welded on the inner wall of the shell, and a phase change material is arranged on the inner wall of the shell.
Further preferably, the housing and the closed cavity form a sealing structure through a first sealing ring.
Further preferably, the shell is made of aluminum material, the heat conducting fins are S-shaped, radiating fins are arranged on two sides of the heat conducting fins, and a plurality of heat conducting fins are arranged inside the shell.
Further preferably, an annular groove is formed in one side of the shell, an annular protruding block is arranged on one side of the fixing frame, the outer size structure of the annular protruding block is identical to the inner size of the annular groove, and meanwhile the fixing frame and the shell form a sealing structure through a second sealing ring.
Further preferably, the heat conducting component comprises a fixing frame which is installed on one side of the shell through screws, a second sealing ring is glued on one side of the fixing frame, a radiating fin is welded on the inner wall of the fixing frame, and a vapor chamber is glued on the inner wall of the fixing frame.
Further preferably, one side of the heat sink is provided with a plurality of S-shaped fins.
Compared with the prior art, the utility model has the beneficial effects that:
In the utility model, when the electronic module is used, the heat conduction silica gel sheet can rapidly guide heat on the circuit board to the shell, the shell is made of aluminum material, the heat conduction sheets are S-shaped, the heat dissipation fins are arranged on two sides of the heat conduction sheets, meanwhile, the heat conduction sheets are arranged in the shell, the contact area between the S-shaped heat conduction sheets and the phase change material can be increased, the heat on the shell can be rapidly guided into the shell, and the phase change material is melted from a solid state to a liquid state for absorbing the heat.
In the utility model, when the electronic module stops working, the phase change material is solidified into a solid state from a liquid state, the heat is quickly led out by the vapor chamber and the radiating fins, a plurality of S-shaped fins are arranged on one side of the radiating fins, the contact area between the S-shaped fins and the outside air can be increased due to the leveling of the S-shaped fins, the radiating fins can quickly dissipate heat, and the heat emitted by the phase change material can be quickly led out.
Drawings
FIG. 1 is a schematic diagram of a front view structure of the present utility model;
FIG. 2 is a schematic diagram of a front view structure of the present utility model;
FIG. 3 is a schematic diagram of a phase change thermal control assembly according to the present utility model;
FIG. 4 is a schematic diagram of an exploded view of a phase change thermal control assembly according to the present utility model;
FIG. 5 is a schematic illustration of the heat conduction of the present utility model a sheet structure schematic;
FIG. 6 is a schematic view of a heat conducting component according to the present utility model;
fig. 7 is a schematic diagram of an explosion structure of the heat conducting component of the present utility model.
In the figure: 1. sealing the cavity; 2. a mounting frame; 3. a circuit board; 4. a phase change thermal control assembly; 401. a housing; 402. a thermally conductive silicone sheet; 403. a first seal ring; 404. a heat conductive sheet; 405. a phase change material; 5. a heat conducting component; 501. a fixed frame; 502. a second seal ring; 503. a heat sink; 504. and (5) a soaking plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are obtained by a worker of ordinary skill in the art without creative efforts, are within the protection scope of the present utility model based on the embodiments of the present utility model.
Referring to fig. 1 to 7, the present utility model provides a technical solution: the utility model provides an airtight intracavity electronics module phase transition heat accuse device, includes airtight cavity 1, and airtight cavity 1's inner wall welding has mounting bracket 2, and circuit board 3 is installed through the bolt to mounting bracket 2's inner wall, and phase transition heat accuse subassembly 4 is installed through the bolt to one side of airtight cavity 1, and heat conduction subassembly 5 is installed through the bolt to one side of phase transition heat accuse subassembly 4.
The phase change thermal control assembly 4 comprises a shell 401 which is installed on one side of the closed cavity 1 through a bolt, a heat conduction silica gel sheet 402 is attached to one side of the shell 401, a first sealing ring 403 is glued on one side of the shell 401, a heat conduction sheet 404 is welded on the inner wall of the shell 401, and a phase change material 405 is arranged on the inner wall of the shell 401.
In this embodiment, as shown in fig. 1, 2, 3 and 4, the housing 401 and the closed cavity 1 form a sealing structure through the first sealing ring 403; the shell 401 and the closed cavity 1 can be installed through the screws, so that the phase change thermal control assembly 4 and the closed cavity 1 are installed, the sealing performance of the installation of the shell 401 and the closed cavity 1 can be improved through the first sealing ring 403, and external air and the like are prevented from entering the closed cavity 1 from a gap between the shell 401 and the closed cavity 1.
In the present embodiment, as shown in fig. 1, 2, 3, 4 and 5, the case 401 is made of an aluminum material, the heat conductive sheet 404 is made of an S-shape, both sides of the heat conductive sheet 404 are provided with heat dissipation fins, and a plurality of heat conductive sheets 404 are provided inside the case 401; the heat conducting fin 404 can rapidly guide the heat on the shell 401 into the shell 401, absorb the heat through the phase change material 405, and improve the heat dissipation effect.
In this embodiment, as shown in fig. 1, 2, 3, 4, 6 and 7, an annular groove is formed on one side of the housing 401, an annular bump is formed on one side of the fixing frame 501, the outer dimension structure of the annular bump is consistent with the inner dimension of the annular groove, and the fixing frame 501 and the housing 401 form a sealing structure through the second sealing ring 502; the annular projection of the fixing frame 501 is inserted into the annular groove of the housing 401, and the second sealing ring 502 is located between the annular projection of the fixing frame 501 and the annular groove of the housing 401, so that the sealing performance can be improved, and external air and the like can be prevented from entering the housing 401 from a gap between the housing 401 and the fixing frame 501.
In this embodiment, as shown in fig. 1, 2, 3, 4, 6 and 7, the heat conducting component 5 includes a fixing frame 501 mounted on one side of the housing 401 by screws, a second sealing ring 502 is glued on one side of the fixing frame 501, a heat dissipating fin 503 is welded on an inner wall of the fixing frame 501, and a soaking plate 504 is glued on an inner wall of the fixing frame 501; the heat in the shell 401 can be rapidly conducted out through the vapor chamber 504 and the radiating fins 503, so that the phase change material 405 can radiate heat conveniently.
In this embodiment, as shown in fig. 1, 2 and 5, a plurality of S-shaped fins are provided on one side of the heat sink 503; the S-fin level can increase the contact area with the outside air, so that the heat dissipation of the heat sink 503 can be performed quickly.
The application method and the advantages of the utility model are as follows: the electronic module phase change thermal control device in the closed cavity has the following working process when in use:
As shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6 and fig. 7, firstly, the housing 401 and the closed cavity 1 can be installed through screws, so that the phase-change thermal control component 4 and the closed cavity 1 can be conveniently installed or detached, the tightness of the installation of the housing 401 and the closed cavity 1 can be improved by the first sealing ring 403, the outside air and the like can be prevented from entering the closed cavity 1 from a gap between the housing 401 and the closed cavity 1, the housing 401 and the fixed frame 501 can be conveniently installed through screws, so that the phase-change thermal control component 4 and the heat conducting component 5 can be conveniently installed or detached, when the electronic module is used, the heat conducting silicon sheet 402 can quickly guide the heat on the circuit board 3 to the housing 401, the housing 401 is made of an aluminum material, the heat conducting sheet 404 is made of an S type, and the two sides of the heat conducting sheet 404 are provided with radiating fins, meanwhile, the heat on the housing 401 can be quickly led into the housing 401 through the gap between the housing 401 and the heat conducting sheet 404 provided with the radiating fins, the heat conducting fins 405 can be quickly led out of the heat conducting fins, the heat on the housing 401 can be quickly from the heat conducting sheet 405 is quickly melted, the heat conducting fins can quickly led out of the heat conducting fins, and the heat conducting fins can quickly be quickly led out of the heat conducting fins from the heat conducting fins on the solid phase-change material by the solid phase-change material, and quickly can quickly be quickly led out of the heat from the heat conducting fins when the heat conducting sheet is quickly by the heat conducting plate, and quickly by the heat conducting plate is quickly by the heat in the heat conducting plate is quickly by the heat through the heat conducting plate.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides an airtight intracavity electronics module phase transition heat accuse device, includes airtight cavity (1), its characterized in that: the inner wall of the closed cavity (1) is welded with a mounting frame (2), the inner wall of the mounting frame (2) is provided with a circuit board (3) through bolts, one side of the closed cavity (1) is provided with a phase change thermal control component (4) through bolts, and one side of the phase change thermal control component (4) is provided with a heat conduction component (5) through bolts;
The phase change thermal control assembly (4) comprises a shell (401) which is installed on one side of a closed cavity (1) through a bolt, a heat conduction silica gel sheet (402) is attached to one side of the shell (401), a first sealing ring (403) is glued on one side of the shell (401), a heat conduction sheet (404) is welded on the inner wall of the shell (401), and a phase change material (405) is arranged on the inner wall of the shell (401).
2. The closed-cavity electronic module phase change thermal control device according to claim 1, wherein: the shell (401) and the closed cavity (1) form a sealing structure through a first sealing ring (403).
3. The closed-cavity electronic module phase change thermal control device according to claim 1, wherein: the shell (401) is made of aluminum materials, the heat conducting fins (404) are S-shaped, radiating fins are arranged on two sides of the heat conducting fins (404), and a plurality of heat conducting fins (404) are arranged inside the shell (401).
4. The closed-cavity electronic module phase change thermal control device according to claim 1, wherein: an annular groove is formed in one side of the shell (401), an annular protruding block is arranged on one side of the fixing frame (501), the outer size structure of the annular protruding block is identical to the inner size of the annular groove, and meanwhile the fixing frame (501) and the shell (401) form a sealing structure through a second sealing ring (502).
5. The closed-cavity electronic module phase change thermal control device according to claim 1, wherein: the heat conduction assembly (5) comprises a fixed frame (501) which is installed on one side of the shell (401) through screws, a second sealing ring (502) is glued on one side of the fixed frame (501), cooling fins (503) are welded on the inner wall of the fixed frame (501), and a soaking plate (504) is glued on the inner wall of the fixed frame (501).
6. The closed-cavity electronic module phase change thermal control device according to claim 5, wherein: a plurality of S-shaped fins are arranged on one side of the radiating fin (503).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202420086571.0U CN221531997U (en) | 2024-01-15 | 2024-01-15 | Electronic module phase change thermal control device in closed cavity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202420086571.0U CN221531997U (en) | 2024-01-15 | 2024-01-15 | Electronic module phase change thermal control device in closed cavity |
Publications (1)
Publication Number | Publication Date |
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CN221531997U true CN221531997U (en) | 2024-08-13 |
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Family Applications (1)
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CN202420086571.0U Active CN221531997U (en) | 2024-01-15 | 2024-01-15 | Electronic module phase change thermal control device in closed cavity |
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CN (1) | CN221531997U (en) |
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- 2024-01-15 CN CN202420086571.0U patent/CN221531997U/en active Active
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