CN218273316U

CN218273316U - Heat-dissipation conductive sponge

Info

Publication number: CN218273316U
Application number: CN202222617530.3U
Authority: CN
Inventors: 李松
Original assignee: Dongguan Dimei Electronic Technology Co ltd
Current assignee: Dongguan Dimei Electronic Technology Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-01-10
Anticipated expiration: 2032-09-29

Abstract

The utility model discloses a heat dissipation conductive sponge, including preventing static sleeve, first heat conduction silica gel, second heat conduction silica gel, a plurality of louvres, electrically conductive sponge and sponge groove, prevent that static sleeve both ends opening and embedded have electrically conductive sponge, prevent that static sleeve one side inlays in the IO baffle and with the laminating of IO baffle inner wall, IO baffle one side is equipped with the mainboard, the mainboard top is equipped with the IO interface, IO baffle one side is seted up with IO baffle interface groove of IO interface level and size unanimity, still be equipped with heat dissipation mechanism in the prevent static sleeve, this heat dissipation conductive sponge not only can shield the signal and prevent static, and the heat dissipation mechanism of its setting can effectively dispel the heat for computer motherboard and IO interface, guarantees the performance and the life-span of mainboard.

Description

Heat-dissipation conductive sponge

Technical Field

The utility model relates to a conductive sponge field especially relates to a heat dissipation conductive sponge.

Background

The conductive sponge is produced by a polymer composite material foaming technology, the foaming pore diameter is uniform, soft and elastic, scraps are not removed, the device pins can be protected by the uniform distribution of the conductive sponge, and the conductive sponge has corrosion resistance, is an ideal medium material for long-term storage of devices, and is widely applied to: the conductive sponge is applied to a computer mainboard and has the function of preventing static electricity from damaging the mainboard when the input/output device is inserted, and a layer of conductive sponge is attached to an I/O baffle plate so as to play a good protection role on the mainboard.

The existing conductive sponge applied to the I/O interface of the computer mainboard has good signal shielding effect on the mainboard, but does not have good heat dissipation effect, and the service life and the performance of the mainboard can be reduced.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a heat dissipation conductive sponge, this heat dissipation conductive sponge not only can shield the signal, and the heat dissipation mechanism of its setting can dispel the heat for computer motherboard and IO interface.

In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides a heat dissipation electrically conductive sponge, is including preventing static sleeve, first heat conduction silica gel, second heat conduction silica gel, a plurality of louvres, electrically conductive sponge and sponge groove, prevent that static sleeve both ends opening and embedded have electrically conductive sponge, prevent static sleeve one side inlay in the IO baffle and with the laminating of IO baffle inner wall, IO baffle one side is equipped with the mainboard, the mainboard top is equipped with the IO interface, IO baffle one side is seted up with IO interface level and the unanimous IO baffle interface groove of size, its characterized in that: and a heat dissipation mechanism is also arranged in the anti-static sleeve.

Preferably, the heat dissipation mechanism comprises first heat conduction silica gel and second heat conduction silica gel, the first heat conduction silica gel is fixed on one side, close to the I/O baffle interface slot, of the electric conduction sponge through glue solution bonding, and the second heat conduction silica gel is fixed on one side, close to the I/O interface, of the electric conduction sponge through glue solution bonding.

Preferably, the heat dissipation mechanism further comprises a plurality of heat dissipation holes, and the heat dissipation holes are formed in the conductive sponge and penetrate through the conductive sponge.

Preferably, the plurality of heat dissipation holes are equidistantly formed and are in a rectangular array, and cavities formed by the plurality of heat dissipation holes are parallel to the first heat-conducting silica gel and the second heat-conducting silica gel.

Preferably, the sponge groove is for running through the cavity that antistatic sleeve, first heat conduction silica gel, second heat conduction silica gel, electrically conductive sponge and a plurality of radiating hole formed, sponge groove one side opening is unanimous with IO baffle interface slot opening, sponge groove another side opening is unanimous with IO interface size, and sponge inslot cavity width all is unanimous with the opening.

Preferably, the first heat-conducting silica gel, the second heat-conducting silica gel, the conductive sponge and the heat dissipation holes are close to two sides of the opening of the anti-static sleeve and are attached to the inner wall of the I/O baffle.

Compared with the prior art, the utility model discloses the beneficial effect that can reach is: the heat dissipation mechanism arranged in the heat dissipation conductive sponge comprises a plurality of heat dissipation holes and two pieces of heat conduction silica gel, heat of the mainboard and the I/O interface is transferred to the I/O baffle through the heat dissipation mechanism to be dissipated, the I/O baffle can transfer the heat to the mainframe box and the air which are in contact with each other to dissipate the heat, and compared with the existing heat dissipation conductive sponge, the heat dissipation mechanism has a good heat dissipation effect.

Drawings

FIG. 1 is a side sectional view of the present invention;

FIG. 2 is a side view of the present invention;

FIG. 3 is a perspective view of the present invention;

FIG. 4 is a schematic view of a part of the structure of the present invention;

wherein: 1. an anti-static sleeve; 2. a conductive sponge; 3. a heat dissipation mechanism; 4. a first thermally conductive silicone gel; 5. second heat-conducting silica gel; 6. heat dissipation holes; 7. a sponge groove; 8. an I/O baffle; 9. an I/O baffle interface slot; 10. a main board; 11. an I/O interface.

Detailed Description

In order to make the technical means, creation features, achievement objects and functions of the present invention easy to understand, the present invention will be further explained with reference to the following embodiments, however, the following embodiments are only preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

The embodiment is as follows:

as shown in fig. 1-4, the utility model provides a heat dissipation electrically conductive sponge, including preventing static sleeve 1, first heat conduction silica gel 4, second heat conduction silica gel 5, a plurality of louvre 6, electrically conductive sponge 2 and sponge groove 7, prevent that 1 both ends opening of static sleeve is embedded to have electrically conductive sponge 2, prevent that static sleeve 1 one side inlays in IO baffle 8 and with the laminating of IO baffle 8 inner wall, IO baffle 8 one side is equipped with mainboard 10, mainboard 10 top is equipped with IO interface 11, IO baffle 8 one side is seted up with IO baffle interface groove 9 that IO interface 11 level and size are unanimous, its characterized in that: and a heat dissipation mechanism 3 is also arranged in the anti-static sleeve 1.

In this embodiment, it is specific, heat dissipation mechanism 3 includes first heat conduction silica gel 4 and second heat conduction silica gel 5, first heat conduction silica gel 4 is fixed in electrically conductive sponge 2 through the glue solution bonding and is close to I/O baffle interface slot 9 one side, second heat conduction silica gel 5 is fixed in electrically conductive sponge 2 through the glue solution bonding and is close to I/O interface 11 one side, sets up first heat conduction silica gel 4 and second heat conduction silica gel 5 and can transmit the heat transfer of I/O interface 11 for I/O baffle 8 in the sponge groove 7.

In this embodiment, specifically, the heat dissipation mechanism 3 further includes a plurality of heat dissipation holes 6, the plurality of heat dissipation holes 6 are opened in the conductive sponge 2 and penetrate through the conductive sponge 2, and the heat dissipation holes are configured to transfer the heat of the I/O interface 11 in the sponge groove 7 to the I/O baffle 8.

In this embodiment, specifically, a plurality of louvres 6 equidistance are seted up and are the rectangular array, a plurality of louvres 6 are seted up the cavity that forms and are parallel with first heat conduction silica gel 4 and second heat conduction silica gel 5, and the equidistance is seted up louvre 6 and can be the even heat dissipation, and louvre 6 and IO interface 11 vertical contact can give off more heats.

In this embodiment, specifically, the sponge groove 7 is a cavity formed by the anti-static sleeve 1, the first heat conducting silica gel 4, the second heat conducting silica gel 5, the conductive sponge 2 and the heat dissipation holes 6, an opening on one side of the sponge groove 7 is consistent with an opening of the I/O baffle interface groove 9, an opening on the other side of the sponge groove 7 is consistent with the size of the I/O interface 11, the width of the cavity in the sponge groove 7 is consistent with the opening, and the opening of the sponge groove 7 and the width of the cavity are consistent with the I/O interface 11 so that the peripheral interface can contact the heat dissipation mechanism 3 and the conductive sponge 2 when being inserted into the sponge groove 7.

In this embodiment, specifically, the first heat conducting silica gel 4, the second heat conducting silica gel 5, the conductive sponge 2 and the heat dissipation holes 6 are close to two sides of the opening of the anti-static sleeve 1 and are attached to the inner wall of the I/O baffle 8, and the heat dissipation mechanism 3 and the conductive sponge 2 are attached to the I/O baffle 8 for better heat dissipation and electric conduction.

The working principle is as follows: during the use, with this utility model a heat dissipation electrically conductive sponge in inlaying the IO baffle, align IO baffle interface slot and sponge groove and IO interface again, pass IO baffle and sponge groove with the socket of IO equipment at last and inject in the IO interface on the mainboard, when IO equipment or outside static pass through the socket, prevent that static sleeve and electrically conductive sponge transmit static for the IO baffle, the mainframe box is passed to through the IO baffle to the rethread IO baffle, ground connection at last, thereby the protection mainboard is not disturbed, the louvre and the heat conduction silica gel of heat dissipation mechanism can transmit the heat of IO interface and mainboard for the IO baffle, the mainframe box and the air of contact are passed to through the IO baffle to the rethread, can guarantee the performance and the life-span of mainboard like this.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat dissipation electrically conductive sponge, includes prevents static sleeve (1), first heat conduction silica gel (4), second heat conduction silica gel (5), a plurality of louvre (6), electrically conductive sponge (2) and sponge groove (7), prevent that static sleeve (1) both ends opening and embedded have electrically conductive sponge (2), prevent that static sleeve (1) one side inlays in IO baffle (8) and laminates with IO baffle (8) inner wall, IO baffle (8) one side is equipped with mainboard (10), mainboard (10) top is equipped with IO interface (11), IO baffle (8) one side is seted up IO baffle interface groove (9) with IO interface (11) level and size unanimity, its characterized in that: and a heat dissipation mechanism (3) is also arranged in the anti-static sleeve (1).

2. The heat-dissipating conductive sponge as claimed in claim 1, wherein: heat dissipation mechanism (3) are including first heat conduction silica gel (4) and second heat conduction silica gel (5), first heat conduction silica gel (4) are fixed and are close to IO baffle interface slot (9) one side in electrically conductive sponge (2) through the glue solution bonding, second heat conduction silica gel (5) are fixed and are close to IO interface (11) one side in electrically conductive sponge (2) through the glue solution bonding.

3. The heat-dissipating conductive sponge as claimed in claim 1, wherein: the heat dissipation mechanism (3) further comprises a plurality of heat dissipation holes (6), and the heat dissipation holes (6) are formed in the conductive sponge (2) and penetrate through the conductive sponge (2).

4. The heat-dissipating conductive sponge as claimed in claim 1, wherein: a plurality of louvres (6) equidistance are seted up and are the rectangular array, the cavity that a plurality of louvres (6) were seted up and are formed is parallel with first heat conduction silica gel (4) and second heat conduction silica gel (5).

5. The heat-dissipating conductive sponge as claimed in claim 1, wherein: sponge groove (7) are for running through the cavity that prevents that static sleeve (1), first heat conduction silica gel (4), second heat conduction silica gel (5), electrically conductive sponge (2) and a plurality of louvre (6) form, sponge groove (7) one side opening is unanimous with IO baffle interface groove (9) opening, sponge groove (7) another side opening is unanimous with IO interface (11) size, and the cavity width all is unanimous with the opening in sponge groove (7).

6. The heat-dissipating conductive sponge as claimed in claim 1, wherein: the first heat-conducting silica gel (4), the second heat-conducting silica gel (5), the electric-conducting sponge (2) and the heat dissipation holes (6) are close to two sides of an opening of the anti-static sleeve (1) and are attached to the inner wall of the I/O baffle (8).