CN218332517U

CN218332517U - SSD heat-conducting component

Info

Publication number: CN218332517U
Application number: CN202222875556.8U
Authority: CN
Inventors: 詹焕; 张剑勇; 曹勇
Original assignee: Huiju Electric Technology Dongguan Industrial Co Ltd
Current assignee: Huiju Storage Technology Dongguan Co ltd
Priority date: 2022-10-29
Filing date: 2022-10-29
Publication date: 2023-01-17
Anticipated expiration: 2032-10-29

Abstract

The utility model relates to the technical field of heat dissipation of storage equipment, in particular to a SSD heat conducting component, which comprises heat conducting plates, wherein connecting parts are arranged at two ends of each heat conducting plate, the heat conducting plates are movably connected through the connecting parts, each heat conducting plate comprises a heat conducting flat plate, a heat conducting curved plate and a heat conducting flitch, and the two connecting parts of the heat conducting flat plate are parallel to each other; the connecting part of the heat-conducting curved plate is bent along the axis direction of the long side of the heat-conducting curved plate; the connecting part of the heat-conducting flitch is bent along the axial direction of the short edge of the heat-conducting flitch. Through setting up a plurality of heat-conducting plates to through the heat conduction flat board and the heat conduction bent plate of combination different shapes, the heat conduction of SSD main control chip gives the host computer radiator, reduces SSD main control chip's temperature, makes SSD main control chip work under normal temperature, thereby reduces because the transmission speed that the high temperature brought descends and SSD main control chip's trouble. The heat conducting plate has a simple structure, is convenient to install and is suitable for large-scale production and sale.

Description

SSD heat-conducting component

Technical Field

The utility model belongs to the technical field of the storage device heat dissipation technique and specifically relates to a SSD heat-conducting component is related to.

Background

With the rapid development of chip technology, the CPU speed of the computer is faster and faster, and the speed of the corresponding peripheral components is also faster and faster, and the data storage speed cannot keep up with the rapid development, so the data storage speed has become a short board that restricts the further development of the computer. With the development of the latest storage technology, especially the emergence of solid state disks based on PCIe interfaces, the storage speed is greatly increased.

A Solid State Disk (SSD), also called Solid State Drive, is a hard Disk made of an array of Solid State electronic memory chips. PCIe is a short term PCI Express (peripheral component interconnect Express) and is a high-speed serial computer expansion bus standard, and a point-to-point serial connection is adopted, so that a data transmission rate can be increased to a very high frequency, thereby providing a higher bandwidth.

An SSD is typically composed of interfaces (Interface ports), caches (RAMs), host chips (SSD SoC), FLASH memory granules (NAND FLASH). The main control chip is a CPU in the SSD, and plays a role in commanding, calculating, and cooperating, and to achieve a large increase in the storage speed, it needs a corresponding main control. With the great increase of the storage speed, the operation amount and the operation frequency of the main control chip are also increased, and very large heat productivity is also brought, so that the main control chip of the SSD becomes a main heat generating component in the SSD; when data is read or written at a high speed, the temperature of the main control chip even reaches 80-100 ℃, which far exceeds the optimal working temperature of the main control chip by 45-55 ℃, and the main control chip works at a high temperature for a long time, so that the reading speed and the writing speed are easy to reduce or the failure rate of the main control chip is easy to increase, and therefore, the problem of heat dissipation of the main control chip is not easy to solve.

In the utility model patent of utility model with publication number CN216671199U, an SSD heat radiation structure is disclosed, including carriage, retaining member and radiator and SSD, the radiator includes the heating panel and locates a plurality of heat radiation fins on the heating panel. This patent dispels the heat through heat radiation fins, and is simple effective, but makes the heat pile up on heat radiation fins easily when SSD produces high temperature, can not be fine dispel the heat.

In the invention patent with publication number CN113707191B, a solid state disk heat dissipation reinforcing device based on ssd is disclosed, which comprises a fixed shell and a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a driving motor with an output end connected with fan blades. This patent uses the cold wind that the flabellum produced to dispel the heat, and is very high-efficient, but the structure is complicated, the installation of being not convenient for, and is with too high costs moreover, is unfavorable for large-scale production and sale.

Moreover, many existing improvements are schemes adopted when a user newly configures the computer host, but the problem of heat generation of the computer host which has been used for a period of time originally is increased due to aging of electronic parts, and the user generally does not need to spend much effort and cost to specially improve the heat dissipation problem of the whole computer host. After a user reads or writes data, the memory starts to slow down due to the rise of temperature, so that the normal use of the user is hindered, and how to reduce the temperature of the SSD control chip to a normal level under the condition of simplicity and convenience is a technical problem to be solved.

Therefore, a simple, fast and convenient solution for installation and use is needed to reduce the temperature of the SSD main control chip when transmitting data at high speed.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an it is not enough to overcome above-mentioned condition, aims at providing the technical scheme that can solve above-mentioned problem.

A SSD heat-conducting component comprises heat-conducting plates, wherein connecting parts are arranged at two ends of each heat-conducting plate, the heat-conducting plates are connected through the connecting parts, each heat-conducting plate comprises a heat-conducting flat plate, a heat-conducting curved plate and a heat-conducting flitch, and the two connecting parts of the heat-conducting flat plate are parallel to each other; the connecting parts of the heat-conducting curved plate are bent along the axis direction of the long side of the heat-conducting curved plate, so that a plane where the two connecting parts of the heat-conducting curved plate are located forms a certain angle; the connecting part of the heat-conducting flitch is bent along the axial direction of the short side of the heat-conducting flitch, so that a plane where the two connecting parts of the heat-conducting flitch are positioned forms a certain angle.

As a further aspect of the present invention: one end of the heat conducting plate is connected to the SSD heat generating component, and the other end of the heat conducting plate is connected to the heat radiating component of the host.

As a further aspect of the present invention: the connecting part of the heat conducting plate is provided with heat conducting adhesive for connecting other heat conducting plates, heating parts or radiating parts.

As a further aspect of the present invention: the connecting part of the heat conducting plate is provided with a bolt connecting hole which is used for being connected with other connecting part bolts.

As a further aspect of the present invention: the connecting part of the heat conducting plate is provided with a heat conducting gasket.

As a further aspect of the present invention: the heat conducting plate is made of copper sheets or aluminum sheets.

As a further aspect of the present invention: the heat conducting plate is made of a material sprayed with a heat conducting film.

As a further aspect of the present invention: the heat conducting plate is made of graphene carbon plastic alloy material.

As a further aspect of the present invention: the angle formed by the planes of the two connecting parts of the heat-conducting curved plate is 60-120 degrees.

As a further aspect of the present invention: the angle formed by the planes of the two connecting parts of the heat-conducting flitch is 90-155 degrees.

Compared with the prior art, the beneficial effects of the utility model are that:

through setting up a plurality of heat-conducting plates that can freely combine to through the heat conduction flat board and the heat conduction bent plate of combination different shapes, conduct the heat of SSD main control chip for the host computer the inside originally on the just radiator, thereby make the radiator take away the high heat that main control chip produced, reduce the temperature of SSD main control chip, make SSD main control chip work under normal temperature, thereby reduce the trouble that transmission speed that comes descends and SSD main control chip because the high temperature. Because the heat is conducted to the original radiator, the heat conducting plate has a simple structure, is convenient to install, is particularly suitable for radiating and transforming the original host SSD memory, and is suitable for large-scale production and sale.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic structural view of a first combination of the present invention;

fig. 2 is a schematic structural view of the first combination mode of the present invention after changing angles;

FIG. 3 is a schematic structural diagram of a second combination of the present invention;

FIG. 4 is a schematic structural view of a third combination of the present invention;

FIG. 5 is a schematic structural diagram of a fourth combination of the present invention;

FIG. 6 is a schematic structural view of the thermally conductive adhesive of the present invention;

fig. 7 is a schematic structural view of the heat conductive gasket of the present invention;

fig. 8 is a schematic structural view of the bolt securing piece of the present invention.

The reference numerals and names in the figures are as follows:

10 a heat conducting plate; 20 a connecting part; 11 a heat conducting plate; 12 a thermally conductive curved plate; 13 heat conducting flitch; 30 a thermally conductive adhesive; 31 bolt attachment holes; 32 bolts; 33 a fixing sheet; 40 thermally conductive pads.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be understood that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 7, in an embodiment of the present invention, an SSD heat-conducting component includes a heat-conducting plate 10, wherein two ends of the heat-conducting plate 10 are provided with connecting portions 20, and a plurality of heat-conducting plates 10 are movably connected by the connecting portions 20; the heat conducting plate 10 comprises a heat conducting flat plate 11, a heat conducting curved plate 12 and a heat conducting flitch plate 13, wherein two connecting parts 20 of the heat conducting flat plate 11 are parallel to each other; the connecting parts 20 of the curved heat conducting plate 12 are bent along the long-side axis direction of the curved heat conducting plate 12, so that a plane where the two connecting parts 20 of the curved heat conducting plate 12 are located forms a certain angle; the connection parts 20 of the heat conducting attachment plate 13 are bent along the axial direction of the short sides of the heat conducting attachment plate 13, so that the planes of the two connection parts 20 of the heat conducting attachment plate 13 form a certain angle.

One end of the heat-conducting plate 10 is fixedly connected to the SSD heat-generating part, and the other end of the heat-conducting plate 10 is connected to the heat-radiating part of the host.

Specifically, after the heat conducting plates 10 are connected, the heat conducting plates can be stretched in multiple directions, so that the heat conducting plates are suitable for different computer hosts. The computer host is usually provided with a CPU radiator, a north bridge radiator and a south bridge radiator, wherein the CPU radiator is the most common and has the largest heat dissipation area, and the south bridge radiator has the lowest temperature, so that the heat of the SSD can be led out to one of the two radiators, and the heat of the SSD is reduced by utilizing the original heat dissipation function of the radiator. Through on the main control chip of the part that generates heat to heat conduction flitch 13 fixed connection at SSD, thereby derive the heat that SSD generates heat the chip, then conduct for heat conduction bent plate 12 or heat conduction flat board 11, heat conduction bent plate 12 or heat conduction flat board 11 conduct again for the heat conduction flitch 13 of radiator end, heat conduction flitch 13 fixed connection is on the radiator, thereby give the radiator heat conduction, the heat on the radiating fin is taken away to the cold wind that the fan that the radiator utilized itself to rotate to bring up, or the heat on the radiating fin is taken away to the cold wind that other fans in the utilization host computer brought up.

The connecting portion 20 of the heat conductive plate 10 is provided with a heat conductive adhesive 30 for connecting other heat conductive plates 10, heat generating parts and heat radiating parts. Specifically, one side of the heat-conducting adhesive 30 is attached to the heat-conducting plate 10 during production, a non-adhesive film (not shown in the figure) is attached to the other side of the heat-conducting adhesive 30 in advance, when the heat-conducting adhesive is used, the space in the host is compared well in advance, the heat-conducting attachment plate 13, the heat-conducting flat plate 11 or the heat-conducting curved plate 12 is used, simulation connection is firstly carried out, the route from the SSD main control chip to the radiator is planned, then the non-adhesive film on the heat-conducting adhesive 30 is torn off, the heat-conducting adhesive 30 of the heat-conducting attachment plate 13 is attached to the SSD main control chip, and the connecting portion 20 at the other end of the heat-conducting attachment plate 13 is connected with the connecting portions 20 of other heat-conducting plates 10 which are simulated well before through the heat-conducting adhesive 30 and finally connected to the radiator.

The connection part 20 of the heat conductive plate 10 is provided with a bolt connection hole 31, the bolt connection hole 31 is used for bolt connection with other connection parts 20, and the connection part 20 of the heat conductive plate 10 is provided with a heat conductive gasket 40. Specifically, the bolt connection can better fix and conduct heat, in order to enhance the heat conduction between the connection portions 20, the connection portions 20 are provided with the heat conduction gaskets 40, and the heat conduction gaskets 40 can fill gaps between the connection portions 20, so that the heat transmission is faster.

As shown in fig. 8, when the heat conducting attachment plate 13 is connected to the SSD main control chip and the heat sink, the heat conducting adhesive 30 may be used for connection, or a snap connection or a bolt connection may be used to firmly connect the heat conducting attachment plate 13 to the SSD main control chip and the heat sink. The snap connection or the bolt connection is to fix the heat conducting attachment plate on the circuit board of the SSD or on the heat dissipating fins of the heat sink using bolts and fixing pieces.

The heat conducting plate 10 is made of copper sheet or aluminum sheet material; the heat conducting plate 10 is made of a material sprayed with a heat conducting film; the heat conducting plate 10 is made of graphene carbon plastic alloy material; the angle formed by the planes of the two connecting parts 20 of the heat-conducting curved plate 12 is 60-120 degrees; the angle formed by the planes of the two connecting parts 20 of the heat-conducting pasting board 13 is 90-155 degrees. Specifically, any material having good thermal conductivity may be used as the heat-conducting plate 10, and what material is used for the final product may be considered from the viewpoint of convenience in production cost and use effect, and also from the viewpoint of market acceptance.

Depending on the existing internal conditions of the host computer of the user, if the SSD main control chip of the user is closest to the south bridge heat sink, it may be considered to connect the heat conductive plate 10 to the south bridge heat sink. Because of the short distance, one heat conduction curved plate 12 and two heat conduction attachment plates 13 can be combined, two heat conduction attachment plates 13 are respectively connected to two ends of the heat conduction curved plate 12, one heat conduction attachment plate 13 is attached to the SSD main control chip, and the other heat conduction attachment plate 13 is attached to the south bridge heat sink. The temperature of the south bridge radiator is generally lower, so that high heat generated when the SSD master control chip reads and writes data at high speed can be radiated. If the SSD main control chip of the user is far from the south bridge heat sink, or the heat sink of the south bridge heat sink itself is too small or too hot, the heat conducting plate 10 may be connected to the CPU heat sink, and the CPU heat sink may have an active heat dissipating part to dissipate heat well. At this time, a heat conducting curved plate 12 and a heat conducting flat plate 11 may be connected to each other, then a heat conducting attachment plate 13 is added to the other end of the heat conducting curved plate 12, and a heat conducting attachment plate 13 is also added to the other end of the heat conducting flat plate 11, so that the two heat conducting attachment plates 13 are respectively connected to the SSD main control chip and the CPU heat sink. From the above, according to the specific situation in the user host, the plurality of heat conducting flat plates 11, the heat conducting curved plates 12 and the heat conducting attachment plates 13 can be combined, so that the heat of the SSD main control chip is conducted to the existing heat sink in the host without changing the existing host parts of the user, and the high temperature generated by the SSD main control chip when reading and writing data at high speed is reduced.

If the internal condition of the host of the user is complex and is inconvenient to be connected to a CPU radiator or a south bridge radiator, direct connection to a metal part of a case can be considered, the area of the metal part of the case is large, and the metal part is in direct contact with outside cold air, so that high heat emitted by the SSD main control chip can be well conducted out, the high temperature of the SSD main control chip is reduced, the SSD main control chip works in a normal temperature range, and the reduction of transmission speed reduction and SSD main control chip faults caused by overhigh temperature are reduced.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

1. The SSD heat conducting component comprises heat conducting plates (10), wherein connecting parts (20) are arranged at two ends of each heat conducting plate (10), and the heat conducting plates (10) are connected through the connecting parts (20) with each other, and is characterized in that each heat conducting plate (10) comprises a heat conducting flat plate (11), a heat conducting curved plate (12) and a heat conducting flitch plate (13), and the two connecting parts (20) of the heat conducting flat plate (11) are parallel to each other; the connecting parts (20) of the heat conduction curved plate (12) are bent along the long-side axis direction of the heat conduction curved plate (12), so that a plane where the two connecting parts (20) of the heat conduction curved plate (12) are located forms a certain angle; the connecting parts (20) of the heat-conducting flitch (13) are bent along the axial direction of the short side of the heat-conducting flitch (13), so that a plane where the two connecting parts (20) of the heat-conducting flitch (13) are positioned forms a certain angle.

2. The SSD heat conducting assembly of claim 1, wherein one end of the heat conducting plate (10) abuts against the SSD heat generating component and the other end of the heat conducting plate (10) abuts against the heat dissipating component of the host.

3. A SSD thermally conductive assembly according to claim 1, characterized in that the connecting portion (20) of the thermally conductive plate (10) is provided with a thermally conductive adhesive (30) for connecting other thermally conductive plates (10), heat generating or heat dissipating components.

4. The SSD heat-conducting assembly according to claim 1, wherein the connecting portion (20) of the heat-conducting plate (10) is provided with a bolt connecting hole (31), the bolt connecting hole (31) being for bolt connection with the other connecting portion (20).

5. A SSD heat-conducting assembly according to claim 4, characterized in that the connection portion (20) of the heat-conducting plate (10) is provided with heat-conducting gaskets (40).

6. The SSD heat conducting assembly of claim 1, wherein the heat conducting plate (10) is made of copper or aluminum sheet material.

7. A SSD thermally conductive assembly according to claim 1, wherein the thermally conductive plate (10) is formed of a material coated with a thermally conductive film.

8. A SSD thermally conductive assembly according to claim 1, wherein the thermally conductive plate (10) is made of a graphene carbon plastic alloy material.

9. A SSD thermally conductive assembly according to claim 1, wherein the two connecting portions (20) of the thermally conductive curved plate (12) are angled in the plane of 60 to 120 degrees.

10. A SSD heat conducting assembly according to claim 1, wherein the two connecting portions (20) of the heat conducting patch (13) are in the plane of an angle of 90-155 degrees.