CN219068813U

CN219068813U - Composite heat dissipation patch with high conductivity

Info

Publication number: CN219068813U
Application number: CN202223584727.8U
Authority: CN
Inventors: 陈玉轩; 陶德仁; 史志远; 黎东; 陈洲
Original assignee: Dongguan Xingrui New Energy Co ltd
Current assignee: Dongguan Xingrui New Energy Co ltd
Priority date: 2022-12-31
Filing date: 2022-12-31
Publication date: 2023-05-23
Anticipated expiration: 2032-12-31

Abstract

The utility model relates to a composite heat dissipation patch with high conductivity, which belongs to the technical field of electronic heat dissipation patches, and comprises a buffer layer, a heat dissipation layer and a conductive foil layer, wherein the buffer layer, the heat dissipation layer and the conductive foil layer are of sheet structures, a composite adhesive layer is arranged among the buffer layer, the heat dissipation layer and the conductive foil layer, the top end surface and the bottom end surface of the composite adhesive layer are respectively provided with adhesiveness, the buffer layer, the heat dissipation layer and the conductive foil layer are sequentially adhered and fixed through the composite adhesive layer from top to bottom, the conductive foil layer is used as a conductive core functional layer, and meanwhile, the conductive foil layer and the heat dissipation layer formed by graphite sheets are combined into a whole, so that the composite heat dissipation patch has good heat conduction and conductivity, and meanwhile, the unstable resistivity of the conductive graphite sheets at different temperatures is avoided, and the conductive stability of the composite heat dissipation patch is ensured.

Description

Composite heat dissipation patch with high conductivity

Technical Field

The utility model relates to the technical field of electronic heat dissipation patches, in particular to a composite heat dissipation patch with high conductivity.

Background

Graphene sheets are generally selected as heat dissipation materials in the market, and the favorable characteristics of heat conduction, thinness and the like of the graphene sheets are utilized. The graphene sheets are attached to the battery in the market, so that heat generated by the battery can be evenly dispersed, and the heat dissipation effect is achieved, so that the service life of the electronic product can be effectively prolonged.

In the prior art, chinese patent publication No. CN210840545U describes a wave-absorbing shielding film with heat dissipation and electric conduction functions, after an electric conduction graphite sheet and a copper foil or an aluminum foil are compounded into a whole in the structure, the electric conduction graphite sheet positioned outside has good wave-absorbing, electric conduction and heat dissipation functions, and the copper foil or the aluminum foil positioned inside has good wave-absorbing, electric conduction and heat conduction functions, so that the electric conduction and heat dissipation effects are realized on the premise of meeting the good wave-absorbing and shielding effects, the bonding process is greatly simplified, and the compact layout of the installation structure is facilitated.

However, the resistivity of the conductive graphite is lower and lower in the range of 900-2800K with the rise of the temperature at different temperatures by adopting the high-density isotropic conductive graphite, so that the resistivity of the conductive graphite sheet in the structure is unstable in the process of conducting and radiating simultaneously, which is unfavorable for the stability of conducting, therefore, the development of a composite radiating patch with high conductivity is urgently needed to meet the needs of practical use under the current situations.

Disclosure of Invention

The utility model aims to solve the defects and provide the composite heat dissipation patch with high conductivity.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a compound heat dissipation paster with high conductivity, includes compound heat dissipation paster body, and compound heat dissipation paster body still includes buffer layer, heat dissipation layer and conductive foil layer, and buffer layer, heat dissipation layer and conductive foil layer are sheet structure, all are equipped with compound adhesive layer between buffer layer, heat dissipation layer and the conductive foil layer, and compound adhesive layer's top end face and bottom face all possess the viscidity, and buffer layer, heat dissipation layer and conductive foil layer loop through compound adhesive layer from top to bottom and adhere fixedly.

In the above description, as a further scheme, the top end face of the heat dissipation layer is further provided with an insulating layer, the bottom end face of the insulating layer is provided with adhesion, the bottom end face of the insulating layer is adhered to the top of the heat dissipation layer, and the top end face of the insulating layer is adhered to the bottom of the composite adhesion layer.

In the above description, as a further aspect, the conductive foil layer is composed of conductive fibers and a composite double-sided tape, and both the top end surface and the bottom end surface of the conductive foil layer have adhesiveness.

In the above description, as a further scheme, a shielding foil layer is further arranged on top of the conductive foil layer, the shielding foil layer is of a sheet structure, the shielding foil layer is adhered to the top end surface of the conductive foil layer, and the shielding foil layer is located between the conductive foil layer and the composite adhesive layer.

In the above description, as a further scheme, the bottom of the conductive foil layer is further provided with a release film layer, the release film layer is of a sheet structure, the top end face of the release film layer is provided with adhesiveness, the release film layer covers the bottom of the conductive foil layer, the top end face of the release film layer is adhered to the bottom of the conductive foil layer, and the thickness of the release film layer is 0.075mm.

In the above description, the cushioning layer is formed of cushioning foam having a thickness of 0.1mm.

In the above description, as a further proposal, the composite adhesive layer is composed of a first double-sided adhesive tape, the first double-sided adhesive tape is composed of polyester resin and organic glass, and the thickness of the composite adhesive layer is 0.006mm.

In the above description, as a further aspect, the heat dissipation layer is formed of a graphite sheet, the thickness of the heat dissipation layer is 0.025mm, the shielding foil layer is formed of a copper foil, the thickness of the shielding foil layer is 0.03mm, the insulating layer is formed of a PET insulating film, and the thickness of the PET insulating film is 0.01mm.

The beneficial effects of the utility model are as follows:

the utility model provides a compound heat dissipation paster with high conductivity carries out compound integration through compound adhesive layer between buffer layer, heat dissipation layer and the conductive foil layer, is as electrically conductive core functional layer by the conductive foil layer, simultaneously with conductive foil layer and the heat dissipation layer complex integration that constitutes by the graphite flake, has good heat conduction and electrically conductive function, has avoided the conductive graphite flake to present the condition of unstable resistivity under different temperatures simultaneously, has guaranteed the conductive stability of compound heat dissipation paster.

Drawings

Fig. 1 is a schematic top view of a composite heat dissipation patch with high conductivity according to the present utility model;

FIG. 2 is an exploded view of a composite heat dissipating patch with high electrical conductivity according to the present utility model;

FIG. 3 is a schematic cross-sectional view of a composite heat dissipating patch with high electrical conductivity according to the present utility model;

in the figure: 1-buffer layer, 2-composite adhesive layer, 3-shielding foil layer, 4-conductive foil layer, 5-heat dissipation layer, 6-insulating layer and 7-release film layer.

Detailed Description

The utility model will be further described with reference to examples and drawings, to which reference is made, but which are not intended to limit the scope of the utility model. The present utility model will be described in detail below with reference to the accompanying drawings.

Referring to fig. 1-3, a composite heat dissipation patch with high conductivity in specific implementation includes a composite heat dissipation patch body, the composite heat dissipation patch body further includes a buffer layer 1, a heat dissipation layer 5 and a conductive foil layer 4, the buffer layer 1, the heat dissipation layer 5 and the conductive foil layer 4 are all in a sheet structure, a composite adhesive layer 2 is arranged between the buffer layer 1, the heat dissipation layer 5 and the conductive foil layer 4, the heat dissipation layer 5 is composed of graphite sheets, the thickness of the heat dissipation layer 5 is 0.025mm, the composite adhesive layer 2 is composed of a first double-sided adhesive, the first double-sided adhesive is composed of polyester resin and organic glass, the thickness of the composite adhesive layer 2 is 0.006mm, and the top end face and the bottom end face of the composite adhesive layer 2 are both sticky, and the buffer layer 1, the heat dissipation layer 5 and the conductive foil layer 4 sequentially pass through the composite adhesive layer 2 from top to bottom to be adhered and fixed.

The top end face of the heat dissipation layer 5 is also provided with an insulating layer 6, the bottom end face of the insulating layer 6 is provided with adhesiveness, the bottom end face of the insulating layer 6 is adhered to the top of the heat dissipation layer 5, the top end face of the insulating layer 6 is adhered to the bottom of the composite adhesive layer 2, the insulating layer 6 is formed by PET insulating films, and the thickness of the PET insulating films is 0.01mm.

The conducting foil layer 4 is composed of conducting fibers and composite double faced adhesive tape, the top end face and the bottom end face of the conducting foil layer 4 are both provided with adhesion, the top of the conducting foil layer 4 is also provided with the shielding foil layer 3, the shielding foil layer 3 is of a sheet structure, the shielding foil layer 3 is adhered to the top end face of the conducting foil layer 4, the shielding foil layer 3 is located between the conducting foil layer 4 and the composite adhesive layer 2, the shielding foil layer 3 is composed of copper foil, and the thickness of the shielding foil layer 3 is 0.03mm.

The bottom of the conductive foil layer 4 is also provided with a release film layer 7, the release film layer 7 is of a sheet-shaped structure, the top end face of the release film layer 7 is provided with adhesiveness, the release film layer 7 covers the bottom of the conductive foil layer 4, the top end face of the release film layer 7 is adhered to the bottom of the conductive foil layer 4, and the thickness of the release film layer 7 is 0.075mm;

the bottom of the conductive foil layer 4 is covered by the release film layer 7, the bottom supporting effect is achieved before the composite heat dissipation patch body is assembled on the electronic equipment, the bottom of the heat dissipation layer 5 and the bottom of the conductive foil layer 4 are protected, and external impurities are prevented from rubbing the heat dissipation layer 5 and the conductive foil layer 4.

The buffer layer 1 is formed by buffer foam, and the thickness of the buffer foam is 0.1mm; the buffer foam composed of alumina trihydrate, silica amorphous state and carbon black is covered on the surface of the heat dissipation layer 5, so that the bearing capacity of the heat dissipation layer 5 and the conductive foil layer 4 to external stress is improved.

The present utility model is not limited to the preferred embodiments, but is intended to be limited to the following description, and any modifications, equivalent changes and variations in light of the above-described embodiments will be apparent to those skilled in the art without departing from the scope of the present utility model.

Claims

1. The utility model provides a compound heat dissipation paster with high conductivity, includes compound heat dissipation paster body, its characterized in that: the composite heat dissipation patch body further comprises a buffer layer, a heat dissipation layer and a conductive foil layer, wherein the buffer layer, the heat dissipation layer and the conductive foil layer are of sheet structures, a composite adhesion layer is arranged among the buffer layer, the heat dissipation layer and the conductive foil layer, the top end face and the bottom end face of the composite adhesion layer are all sticky, and the buffer layer, the heat dissipation layer and the conductive foil layer are sequentially adhered and fixed through the composite adhesion layer from top to bottom.

2. A composite heat dissipating patch of claim 1 having high electrical conductivity, wherein: the top end face of heat dissipation layer still is equipped with the insulating layer, and the bottom end face of insulating layer is equipped with the viscidity, and the bottom end face bonding of insulating layer is at the top of heat dissipation layer, and the top end face bonding of insulating layer is in the bottom of compound adhesive layer.

3. A composite heat dissipating patch of claim 1 having high electrical conductivity, wherein: the conductive foil layer is composed of conductive fibers and composite double faced adhesive tape, and the top end face and the bottom end face of the conductive foil layer are both sticky.

4. A composite heat sink patch having high electrical conductivity as in claim 3, wherein: the top of the conductive foil layer is also provided with a shielding foil layer which is of a sheet structure, the shielding foil layer is adhered to the top end surface of the conductive foil layer, and the shielding foil layer is positioned between the conductive foil layer and the composite adhesive layer.

5. A composite heat sink patch with high electrical conductivity as in claim 4, wherein: the bottom of conductive foil layer still is equipped with from type rete, is sheet structure from type rete, and from the top face that type rete was is equipped with viscidity, covers in the bottom of conductive foil layer from type rete, and from the top face bonding of type rete in the bottom of conductive foil layer, is 0.075mm from the thickness of type rete.

6. A composite heat dissipating patch having high electrical conductivity according to any one of claims 1-5, wherein: the buffer layer is composed of buffer foam, and the thickness of the buffer foam is 0.1mm.

7. A composite heat dissipating patch having high electrical conductivity according to any one of claims 1-5, wherein: the composite adhesive layer is composed of a first double-sided adhesive tape, the first double-sided adhesive tape is composed of polyester resin and organic glass, and the thickness of the composite adhesive layer is 0.006mm.

8. A composite heat dissipating patch having high electrical conductivity according to any one of claims 1-5, wherein: the heat dissipation layer is composed of graphite sheets, the thickness of the heat dissipation layer is 0.025mm, the shielding foil layer is composed of copper foil, the thickness of the shielding foil layer is 0.03mm, the insulating layer is composed of PET insulating films, and the thickness of the PET insulating films is 0.01mm.