CN218579870U - Buffering heat dissipation paster - Google Patents
Buffering heat dissipation paster Download PDFInfo
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- CN218579870U CN218579870U CN202223064927.0U CN202223064927U CN218579870U CN 218579870 U CN218579870 U CN 218579870U CN 202223064927 U CN202223064927 U CN 202223064927U CN 218579870 U CN218579870 U CN 218579870U
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Abstract
The utility model relates to a fin technical field's a buffering heat dissipation paster, including buffering fin body, buffering fin body still includes heat dissipation layer and buffer layer, it pastes the layer to be equipped with the complex between heat dissipation layer and the buffer layer, the heat dissipation layer, the layer is the sheet structure with compound the pasting, the top face and the bottom face on layer are all pasted to the complex all possess viscidity, paste the layer through the complex between heat dissipation layer and the buffer layer and bond, the quantity of inoxidizing coating between heat dissipation layer and the buffer layer has been reduced, the thickness dimension between heat dissipation layer and the buffer layer has been reduced, make buffering heat dissipation paster assemble in the electronic product in narrower space, make buffering heat dissipation paster adapt to the frivolous development trend of electronic product.
Description
Technical Field
The utility model relates to a fin technical field specifically is a buffering heat dissipation paster.
Background
Graphene sheets are generally selected as heat dissipation materials in the market, and the favorable characteristics of graphene sheets, such as heat conduction, lightness and thinness, and the like, are utilized. The graphene sheet is attached to the battery in the market, so that heat generated by the battery can be uniformly dispersed to achieve the heat dissipation effect, and the service life of an electronic product can be effectively protected. Meanwhile, a buffer patch with buffer foam is also assembled in the electronic product.
At present, electronic products are more and more diverse, and when electronic products are selected, the functions of the electronic products can be compared, and the appearance of the electronic products can be considered, so that the electronic products with the light and thin appearance are more popular with people and are the development trend of the electronic products. The slimness and thinness of the electronic product means that the space inside the electronic product becomes narrower and narrower.
According to the prior Chinese patent with publication number CN216584830U, a radiating film of a tablet personal computer used in the market is described, and the Chinese patent with publication number CN205473550U, an ultrathin buffer foam adhesive tape is described.
According to the cited documents, the existing radiating fins and the buffer patches are separately formed products, protective layers are arranged on two sides of the radiating fins and the buffer patches, and the radiating fins and the buffer patches need to be separately installed in the electronic equipment in the assembling process of the electronic equipment. The technical problems of the structure include: the radiating fin and the buffering patch are independently formed products, and the radiating fin and the buffering patch are assembled together, so that the radiating fin and the buffering patch cannot be assembled in electronic equipment with thinner internal size, and cannot adapt to the development trend of thinning electronic products; and (II) in the process of assembling the electronic equipment, the radiating fins and the buffer patches are independently installed, so that the working procedures are increased, and the assembling time of the electronic equipment is long.
Therefore, a buffer heat dissipation patch is needed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a buffering heat dissipation paster makes fin and buffering paster integrated as an organic whole, reduces the thickness size of fin and buffering paster better, adapts to the development trend that electronic product is frivolous.
In order to solve the technical problem, the utility model adopts the following technical scheme:
the utility model provides a buffering fin, includes buffering fin body, buffering fin body still includes heat dissipation layer and buffer layer, is equipped with the complex between heat dissipation layer and the buffer layer and pastes the layer, and heat dissipation layer, buffer layer and complex are pasted the layer and are the lamellar structure, and the top face and the bottom face on layer all possess viscidity are pasted through the complex between heat dissipation layer and the buffer layer and bond.
In the above description, as a further aspect, the top surface of the buffer layer is further provided with a protective film layer, the protective film layer is a sheet structure, the bottom surface of the protective film layer has adhesiveness, the protective film layer covers the top of the buffer layer, and the bottom surface of the protective film layer is adhered to the top surface of the buffer layer.
In the above description, as a further aspect, the protective film layer is formed of a PET protective film, and the thickness of the PET protective film is 0.055mm.
In the above description, as a further aspect, the bottom of the heat dissipation layer is further provided with a mounting adhesive layer, the mounting adhesive layer has a sheet-like structure, the top end surface and the bottom end surface of the mounting adhesive layer both have adhesiveness, the mounting adhesive layer covers the bottom of the heat dissipation layer, and the top end surface of the mounting adhesive layer is adhered to the bottom of the heat dissipation layer.
In the above description, as a further alternative, the assembly adhesive layer is made of the second double-sided adhesive, and the thickness of the assembly adhesive layer is 0.015mm.
In the above description, as a further scheme, the bottom of the assembly bonding layer is further provided with a release film layer, the release film layer is of a sheet structure, the top end face of the release film layer has viscosity, the release film layer covers the bottom of the assembly bonding layer, the top end face of the release film layer is adhered to the bottom of the assembly bonding layer, and the thickness of the release film layer is 0.075mm.
In the above description, as a further aspect, the heat dissipation layer is made of a graphite sheet, the thickness of the graphite sheet is 0.07mm, an insulating layer is further provided between the heat dissipation layer and the composite adhesive layer, the bottom end surface of the insulating layer has adhesiveness, the bottom end surface of the insulating layer is adhered to the top of the heat dissipation layer, and the top end surface of the insulating layer is adhered to the bottom of the composite adhesive layer.
In the above description, as a further alternative, the insulating layer is formed of a PET insulating film, and the thickness of the insulating layer is 0.07mm.
In the above description, as a further scheme, the middle portion of the buffering heat sink body is provided with a plurality of through holes, the through holes penetrate through the top end face and the bottom end face of the buffering heat sink body, and the through holes include exhaust holes for exhausting gas inside the buffering heat sink body and clearance holes for avoiding electronic components.
In the above description, as a further alternative, the composite adhesive layer is made of a first double-sided adhesive, the first double-sided adhesive has a thickness of 0.07mm, the cushion layer is made of cushion foam, and the cushion foam has a thickness of 0.2mm.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides a buffering heat dissipation paster, it pastes the layer and bonds all to possess viscidity complex in both sides with heat dissipation layer and buffer layer, it is integrated as an organic whole to make heat dissipation layer and buffer layer, the quantity of inoxidizing coating between heat dissipation layer and the buffer layer has been reduced, the thickness size between heat dissipation layer and the buffer layer has been reduced, make buffering heat dissipation paster assemble in the electronic product in narrower space, make buffering heat dissipation paster adapt to the frivolous development trend of electronic product. Indirectly, in the process of the assembly of the electronic equipment, the process can be completed by mounting the buffering heat dissipation patch once, so that the process steps are reduced, and the assembly time of the electronic equipment is shortened.
Drawings
FIG. 1 is a schematic cross-sectional view of a heat sink in the prior art;
FIG. 2 is a schematic cross-sectional view of a prior art bumper patch;
fig. 3 is a schematic cross-sectional structural view of a buffering heat dissipation patch according to the present invention;
fig. 4 is an exploded view of the three-dimensional structure of the buffering heat dissipation patch of the present invention;
in the figure: 1-a buffer radiating fin body, 2-a radiating layer, 3-an insulating layer, 4-a buffer layer, 5-a composite adhesive layer, 6-a protective film layer, 7-an assembly adhesive layer, 8-a release film layer, 9-an exhaust hole, 10-a clearance hole and 11-a protective layer.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention will be described in detail with reference to the accompanying drawings.
Referring to fig. 3-4, a specific embodiment of the buffer heat sink includes a buffer heat sink body 1, the buffer heat sink body 1 further includes a heat dissipation layer 2 and a buffer layer 4, a composite adhesive layer 5 is disposed between the heat dissipation layer 2 and the buffer layer 4, the heat dissipation layer 2, the buffer layer 4 and the composite adhesive layer 5 are both of a sheet structure, the buffer layer 4 is made of buffer foam, the thickness of the buffer foam is 0.2mm, both the top end face and the bottom end face of the composite adhesive layer 5 have viscosity, the composite adhesive layer 5 is made of first double-sided adhesive, the thickness of the first double-sided adhesive is 0.07mm, the heat dissipation layer 2 and the buffer layer 4 are bonded through the composite adhesive layer 5, and the composite adhesive layer 5 provides a fixed connection effect for the heat dissipation layer 2 and the buffer layer 4, so that the heat dissipation layer 2 and the buffer layer 4 are integrated through the composite adhesive layer 5.
The top end face of the buffer layer 4 is also provided with a protective film layer 6, the protective film layer 6 is of a sheet structure, the protective film layer 6 is composed of a PET protective film, the thickness of the PET protective film is 0.055mm, the bottom end face of the protective film layer 6 has viscosity, the protective film layer 6 covers the top of the buffer layer 4, and the bottom end face of the protective film layer 6 is adhered to the top end face of the buffer layer 4;
the PET protective film which is composed of polyethylene terephthalate, silicon rubber and silicon dioxide is attached to the top end face of the buffer layer 4, the PET protective film is attached to the heat dissipation layer 2 and the buffer layer 4 to play a role in protection, external impurities are prevented from rubbing the buffer layer 4, the integrity of the heat dissipation layer 2 and the integrity of the buffer layer 4 are guaranteed, meanwhile, the heat dissipation layer 2 and the buffer layer 4 can be jointly covered and protected through the PET protective film, the number of protective layers 11 inside the buffering radiating fin body 1 is reduced, and the thickness size of the buffering radiating fin body 1 is reduced.
The bottom of the heat dissipation layer 2 is also provided with an assembly adhesive layer 7, the assembly adhesive layer 7 is of a sheet structure, the assembly adhesive layer 7 is composed of second double-sided adhesive, the thickness of the assembly adhesive layer 7 is 0.015mm, the top end surface and the bottom end surface of the assembly adhesive layer 7 both have viscosity, the assembly adhesive layer 7 covers the bottom of the heat dissipation layer 2, and the top end surface of the assembly adhesive layer 7 is bonded to the bottom of the heat dissipation layer 2;
the assembling and pasting layer 7 composed of the second double-sided adhesive is compounded at the bottom of the heat dissipation layer 2, the fixing and pasting effect is achieved in the process that the buffering heat dissipation piece body 1 is assembled on the electronic equipment, it is guaranteed that the buffering heat dissipation piece body 1 can be stably assembled inside the electronic equipment, meanwhile, the heat dissipation layer 2 and the buffering layer 4 can be assembled inside the electronic equipment through the assembling and pasting layer 7, the number of the assembling and pasting layers 7 is reduced, and the thickness size of the buffering heat dissipation piece body 1 is reduced.
The bottom of the assembly sticking layer 7 is also provided with a release film layer 8, the release film layer 8 is of a sheet structure, the top end face of the release film layer 8 has viscosity, the release film layer 8 covers the bottom of the assembly sticking layer 7, the top end face of the release film layer 8 is adhered to the bottom of the assembly sticking layer 7, and the thickness of the release film layer 8 is 0.075mm;
the release film layer 8 covers the bottom of the assembly paste layer 7, so that the bottom supporting effect is realized before the buffering heat sink body 1 is assembled on the electronic equipment, meanwhile, the bottoms of the heat dissipation layer 2 and the assembly paste layer 7 are protected, and the rubbing of external impurities on the heat dissipation layer 2 and the assembly paste layer 7 is prevented.
The heat dissipation layer 2 is made of graphite flakes, the thickness of each graphite flake is 0.07mm, the insulating layer 3 is further arranged between the heat dissipation layer 2 and the composite sticking layer 5, the bottom end face of the insulating layer 3 has viscosity, the bottom end face of the insulating layer 3 is adhered to the top of the heat dissipation layer 2, and the top end face of the insulating layer 3 is adhered to the bottom of the composite sticking layer 5;
constitute heat dissipation layer 2 by the graphite flake and possess good heat conductivility, for buffering fin body 1 plays good heat conduction radiating effect in electronic equipment, and heat dissipation layer 2 and compound paste still to be equipped with insulating layer 3 between the layer 5, insulating layer 3 is for constituting heat dissipation layer 2 by the graphite flake and play insulating effect, prevents to take place electric connection between graphite flake and the electronic equipment, plays insulation protection's effect.
The insulating layer 3 is formed of a PET insulating film, and the thickness of the insulating layer 3 is 0.07mm; the PET insulating film having a thickness of only 0.07mm plays a role of insulation protection for the graphite sheet on one hand, and reduces the thickness dimension of the buffer fin body 1 on the other hand.
The middle part of the buffering cooling fin body 1 is provided with a plurality of through holes, the through holes penetrate through the top end surface and the bottom end surface of the buffering cooling fin body 1, and the through holes comprise exhaust holes 9 used for exhausting gas in the buffering cooling fin body 1 and clearance avoiding holes 10 used for avoiding electronic components;
the exhaust hole 9 that the middle part of buffering fin body 1 was seted up carries out the pressure complex in-process at buffering fin body 1, pastes layer 5, protection film 6, the compound layer of pasting 2, insulating layer 4, buffer layer 4, the assembly and pastes layer 7 and discharges through exhaust hole 9 from the air that exists between the rete 8, plays the effect that prevents the inside bubble that appears of buffering fin body 1.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (10)
1. The utility model provides a buffering heat dissipation paster, includes buffering fin body, its characterized in that: the buffering heat dissipation piece body further comprises a heat dissipation layer and a buffering layer, a composite pasting layer is arranged between the heat dissipation layer and the buffering layer, the heat dissipation layer, the buffering layer and the composite pasting layer are of a sheet structure, the top end face and the bottom end face of the composite pasting layer are both sticky, and the heat dissipation layer and the buffering layer are bonded through the composite pasting layer.
2. The patch of claim 1, wherein: the top end face of the buffer layer is also provided with a protective film layer, the protective film layer is of a sheet structure, the bottom end face of the protective film layer is provided with viscosity, the protective film layer covers the top of the buffer layer, and the bottom end face of the protective film layer is adhered to the top end face of the buffer layer.
3. The cushioned heat sink patch of claim 2, wherein: the protective film layer is composed of a PET protective film, and the thickness of the PET protective film is 0.055mm.
4. The patch of claim 1, wherein: the bottom of the heat dissipation layer is also provided with an assembly paste layer, the assembly paste layer is of a sheet structure, the top end face and the bottom end face of the assembly paste layer both have viscosity, the assembly paste layer covers the bottom of the heat dissipation layer, and the top end face of the assembly paste layer is bonded to the bottom of the heat dissipation layer.
5. The patch of claim 4, wherein: the assembly paste layer is composed of second double faced adhesive, and the thickness of the assembly paste layer is 0.015mm.
6. The patch of claim 4, wherein: the bottom on layer is pasted in the assembly still is equipped with from the type rete, is the lamellar structure from the type rete, and the top face that is from the type rete possesses viscidity, covers the bottom of pasting the layer in the assembly from the type rete, and the bottom on layer is pasted in the assembly from the top face bonding of type rete, and the thickness from the type rete is 0.075mm.
7. The patch of claim 1, wherein: the heat dissipation layer is composed of graphite flakes, the thickness of the graphite flakes is 0.07mm, an insulating layer is further arranged between the heat dissipation layer and the composite pasting layer, the bottom end face of the insulating layer is sticky, the bottom end face of the insulating layer is adhered to the top of the heat dissipation layer, and the top end face of the insulating layer is adhered to the bottom of the composite pasting layer.
8. The patch of claim 7, wherein: the insulating layer is composed of a PET insulating film, and the thickness of the insulating layer is 0.07mm.
9. The patch as claimed in any one of claims 1-8, wherein: the middle part of the buffering cooling fin body is provided with a plurality of through holes, the through holes penetrate through the top end face and the bottom end face of the buffering cooling fin body, and the through holes comprise exhaust holes used for exhausting gas inside the buffering cooling fin body and clearance holes used for avoiding electronic components.
10. The patch of claim 1, wherein: the compound layer of pasting comprises first double faced adhesive, and the thickness of first double faced adhesive is 0.07mm, and the buffer layer comprises the buffering bubble cotton, and the cotton thickness of buffering bubble is 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223064927.0U CN218579870U (en) | 2022-11-18 | 2022-11-18 | Buffering heat dissipation paster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223064927.0U CN218579870U (en) | 2022-11-18 | 2022-11-18 | Buffering heat dissipation paster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218579870U true CN218579870U (en) | 2023-03-07 |
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ID=85378847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223064927.0U Active CN218579870U (en) | 2022-11-18 | 2022-11-18 | Buffering heat dissipation paster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218579870U (en) |
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2022
- 2022-11-18 CN CN202223064927.0U patent/CN218579870U/en active Active
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