CN217377765U - Heat-conducting film - Google Patents
Heat-conducting film Download PDFInfo
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- CN217377765U CN217377765U CN202123372494.0U CN202123372494U CN217377765U CN 217377765 U CN217377765 U CN 217377765U CN 202123372494 U CN202123372494 U CN 202123372494U CN 217377765 U CN217377765 U CN 217377765U
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Abstract
The application relates to the technical field of heat dissipation materials, in particular to a heat conduction film which comprises a composite layer, wherein the composite layer comprises at least one graphene layer, a substrate-free heat conduction double-sided adhesive layer and an artificial graphite layer; the substrate-free heat-conducting double-sided adhesive layer is arranged on at least one side of the artificial graphite layer, and the graphene layer is arranged on one side, far away from the artificial graphite layer, of the substrate-free heat-conducting double-sided adhesive layer. According to the heat-conducting film, the non-substrate heat-conducting double-sided adhesive layers are arranged on the two sides of the artificial graphite layer, so that the layers of the heat-conducting film can be firmly bonded, a certain supporting effect is achieved, and the heat-conducting film is favorable for cutting and forming; and the substrate-free heat conduction double-sided adhesive layer can efficiently transfer heat energy to the graphene layer and the artificial graphite layer, so that the heat can be rapidly and efficiently dissipated. The laminated structure of stack in turn can also avoid causing the damage to graphite alkene layer when cross cutting, can optimize the cross cutting technology simultaneously, promotes the cross cutting suitability of heat conduction membrane to be favorable to forming super high thickness heat conduction membrane, satisfy jumbo size electronic product's heat dissipation demand.
Description
Technical Field
The application relates to the technical field of heat dissipation materials, in particular to a heat conduction film.
Background
Due to the ever-limitless miniaturization and integration of the 3C electronics field, the performance and reliability of modern electronic devices and many other high power systems are severely threatened by heat dissipation problems. To solve this problem, the heat sink material must achieve better performance in terms of thermal conductivity, thickness, flexibility and robustness to match the complexity and high integration of the power system. At present, some products in the market take metal as a heat conduction and dissipation material, particularly mainly take aluminum (with a heat conduction coefficient of 237W/mK) and copper (with a heat conduction coefficient of 398W/mK) as main materials, but the heat conduction coefficients of the two metal materials are not high, and the requirements of the existing products on heat conduction and dissipation are difficult to meet. Compare in aluminium and copper metal, artifical graphite film has had certain promotion to electronic product's heat dissipation, and its cross cutting suitability is better, can be directly with no substrate heat conduction double faced adhesive tape collocation, prepare the heat conduction material of high thickness, but its raw and other materials cost is higher, and film forming process is comparatively complicated.
The heat-conducting film prepared from graphene in the new material is a very thin and flexible material, has good processability and elasticity, can be cut and punched into any shape, can be bent for multiple times, can convert a point heat source into a surface heat source, has high heat conductivity coefficient, but has very thin thickness and small size, and cannot meet the use requirement of large-area electronic products, so that the high-thickness graphene heat-conducting film needs to be prepared. The preparation of the graphene heat-conducting film with high thickness generally adopts two processing technologies, firstly, a high-power calendaring device is utilized to press and form the multilayer graphene heat-conducting film, but the high-thickness graphene heat-conducting film prepared by the technology is seriously layered, and the yield of finished products is low; and secondly, a layer of PET substrate double-sided adhesive is added between the graphene heat-conducting films as a bonding material, and the graphene heat-conducting films are bonded together, but the PET film is an insulating material, so that the heat-conducting property of the graphene heat-conducting film can be greatly reduced, and after the PET substrate double-sided adhesive is replaced by the substrate-free heat-conducting double-sided adhesive, the die-cutting adaptability is poor, the yield of finished products is reduced, and mass production cannot be realized.
SUMMERY OF THE UTILITY MODEL
To the problem that exists in the background art, this application provides a heat conduction membrane, and heat conduction membrane utilizes no substrate heat conduction double faced adhesive tape can transmit graphite alkene layer and artificial graphite layer with heat energy high-efficiently, and graphite alkene layer and artificial graphite layer are fast and high-efficiently with heat energy effluvium.
In order to achieve the purpose, the following technical scheme is adopted in the application:
a heat conduction membrane comprises a composite layer, wherein the composite layer comprises at least one graphene layer, a substrate-free heat conduction double-sided adhesive layer and an artificial graphite layer;
the substrate-free heat-conducting double-sided adhesive layer is arranged on at least one side of the artificial graphite layer, and the graphene layer is arranged on one side of the substrate-free heat-conducting double-sided adhesive layer away from the artificial graphite layer.
Preferably, the number of the artificial graphite layers is n, the number of the graphene layers is n +1, and the number of the substrate-free heat-conducting double-sided adhesive layers is 2 n; wherein n is more than 0 and less than or equal to 5.
Preferably, the thickness of a single-layer non-base material heat-conducting double-sided adhesive layer is 3-20 micrometers.
Preferably, the thickness of the artificial graphite layer is 25-70 μm.
Preferably, the thickness of the graphene layer is 25 μm to 100 μm.
Preferably, the heat conduction membrane further comprises a PET substrate heat conduction double-sided adhesive layer, and the PET substrate heat conduction double-sided adhesive layer is arranged on one side, away from the artificial graphite layer, of the graphene layer.
Preferably, the heat conduction membrane further comprises a release layer, wherein the release layer is arranged on one side, far away from the artificial graphite layer, of the PET substrate heat conduction double-sided adhesive layer.
Preferably, the heat conduction membrane still includes the antistatic layer, the antistatic layer set up in keep away from the type layer one side on artificial graphite layer.
Preferably, the heat conductive film further includes a protective layer.
Preferably, the thickness of the heat conduction film is 200-550 μm.
Compared with the prior art, the technical scheme of the application has at least the following beneficial effects,
according to the heat-conducting film, the non-substrate heat-conducting double-sided adhesive layers are arranged on the two sides of the artificial graphite layer, so that the layers of the heat-conducting film can be firmly bonded, a certain supporting effect is achieved, and the heat-conducting film is favorable for cutting and forming; and no substrate heat conduction double-sided adhesive layer can transmit graphite alkene layer and artifical graphite layer to heat energy high-efficiently, utilizes graphite alkene layer and quick and efficient with heat energy effluvium on artifical graphite layer. Artifical graphite layer, no substrate heat conduction double-sided adhesive layer, graphite alkene layer superpose in turn, can also avoid the cross cutting in-process to cause the damage to graphite alkene layer, can optimize the cross cutting technology simultaneously, promote the cross cutting suitability of heat conduction membrane to be favorable to forming super high thickness heat conduction membrane, satisfy jumbo size electronic product's heat dissipation demand.
Drawings
Fig. 1 is a schematic structural view of a thermal conductive film provided in the present application.
The reference numerals are used to designate the same elements,
10-artificial graphite layer;
20-a graphene layer;
30-no substrate heat-conducting double-sided adhesive layer;
40-a release layer;
50-a protective layer;
60-PET substrate heat-conducting double-sided adhesive layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the description of the present specification, unless explicitly stated or limited otherwise, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless specified or indicated otherwise; the terms "connected", "fixed", and the like are to be construed broadly and may, for example, be fixed or removable, integrally or electrically connected; may be directly connected or indirectly connected through an intermediate.
The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description of the present application, it should be understood that the terms "upper" and "lower" used in the description of the embodiments of the present application are used in a descriptive sense only and not for purposes of limitation. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
At present, two processing technologies are generally adopted for preparing the graphene composite heat-conducting film with high thickness, wherein the first technology is that high-power calendaring equipment is utilized to press and form the multilayer graphene heat-conducting film, but the high-thickness graphene heat-conducting film prepared by the pressing technology is seriously layered, the yield of finished products is low, and the use requirement is not met; the second process is that a layer of PET substrate double-sided adhesive tape is added between each layer of graphene heat-conducting film to serve as a bonding material, and the multiple layers of graphene heat-conducting films are bonded together to form a composite heat-conducting film, but the PET film is an insulating material, so that the heat-conducting performance of the graphene heat-conducting film can be greatly reduced; other processes also comprise replacing the PET substrate double-sided adhesive tape with a substrate-free heat-conducting double-sided adhesive tape, but the die cutting adaptability of the composite heat-conducting film prepared after replacing the PET substrate double-sided adhesive tape with the substrate-free heat-conducting double-sided adhesive tape is poor, the yield of finished products of the composite heat-conducting film is reduced, and mass production cannot be realized.
In view of the above, the present application provides a heat conducting film, which includes a composite layer, wherein the composite layer includes at least one artificial graphite layer 10, a graphene layer 20, and a substrate-free heat conducting double-sided adhesive layer 30;
the substrate-free heat-conducting double-sided adhesive layer 30 is arranged on at least one side of the artificial graphite layer 10, and the graphene layer 20 is arranged on one side, far away from the artificial graphite layer 10, of the substrate-free heat-conducting double-sided adhesive layer 30.
In the scheme, the non-base-material heat-conducting double-sided adhesive layer 30 is arranged on two sides of the artificial graphite layer 10, so that the heat-conducting films can be firmly bonded, a certain supporting effect is achieved, and the cutting and forming of the heat-conducting films are facilitated. And no substrate heat conduction double-sided adhesive layer 30 can transmit heat energy to graphite alkene layer 20 and artificial graphite layer 10 high-efficiently, utilizes graphite alkene layer 20 and artificial graphite layer 10 to go out heat energy fast and high-efficiently. Artifical graphite layer 10, no substrate heat conduction double-sided adhesive layer 30, graphite alkene layer 20 superpose in turn, can also avoid the cross cutting in-process to cause the damage to graphite alkene layer 20, can optimize the cross cutting technology simultaneously, promote the cross cutting suitability of heat conduction membrane to be favorable to forming super high thickness heat conduction membrane, satisfy jumbo size electronic product's heat dissipation demand.
In some embodiments, the two sides of the substrate-free heat-conducting double-sided adhesive layer 30 are provided with release films, and during use, the release film on one side is torn off first, and the adhesive surface is attached to the artificial graphite layer 10; and tearing the release film on the other side, and pasting the adhesive surface on the graphene layer 20.
The order of bonding the substrate-free inlet double-sided adhesive layer 30 to the artificial graphite layer 10 and the graphene layer 20 is fixed. Specifically, artificial graphite layer 10 is overall structure, and graphite alkene layer 20 is lamellar structure, by calendering molding after the stack of multilayer graphite alkene piece, if will not have on the substrate heat conduction double-sided adhesive layer 30 earlier be connected with graphite alkene layer 20 from the type membrane in the use, peel off not having the substrate heat conduction double-sided adhesive layer 30 opposite side from the type membrane when, can lead to graphite alkene layer 20 layering, fold.
In the composite layer used in the application, the number of the artificial graphite layers 10 is n, the number of the graphene layers 20 is n +1, and the number of the substrate-free heat-conducting double-sided adhesive layers 30 is 2 n; wherein n is more than 0 and less than or equal to 5, namely the superposition of the multilayer artificial graphite layer 10, the graphene layer 20 and the substrate-free heat-conducting double-sided adhesive layer 30 can be selected, and optionally, n can be specifically 1, 2, 3, 4 and 5. For example, when the composite layer includes 2 layers of artificial graphite layers 10, the number of the substrate-free heat-conductive double-sided adhesive layers 30 disposed on both sides of the artificial graphite layer 10 is 4 layers, the graphene layer 20 disposed on the substrate-free heat-conductive double-sided adhesive layer 30 is 3 layers, and specifically, the arrangement manner is graphene layer 20, substrate-free heat-conductive double-sided adhesive layer 30, artificial graphite layer 10, substrate-free heat-conductive double-sided adhesive layer 30, graphene layer 20. Preferably, 0< n.ltoreq.3.
The thickness of the single-layer artificial graphite layer 10 is 25-70 microns, the heat dissipation effect of the heat dissipation layer prepared from the artificial graphite is better than that of a common heat dissipation material, the die cutting adaptability of the heat conduction film is better in the processing process, and the thickness of the artificial graphite layer 10 can be selected according to actual needs. Alternatively, the thickness of the single artificial graphite layer 10 may be 25 μm, 35 μm, 45 μm, 55 μm, 65 μm, 70 μm, or the like. The thickness of the single-layer artificial graphite layer 10 is too thick, the difficulty of a film forming process is increased, and the preparation cost is increased; the thickness of the single-layer artificial graphite layer 10 is too thick and too thin, so that the heat dissipation requirement required by the product cannot be met.
The thickness of the single graphene layer 20 is 25-100 μm, the graphene sheet is a very thin and flexible material, has good processability and elasticity, can be cut and punched into any shape, can be bent for multiple times, can convert a point heat source into a surface heat source, and has a high thermal conductivity, the graphene layer 20 is formed by laminating at least one graphene sheet and then rolling, and the thickness of the single graphene sheet used in the application is 25 μm. Optionally, the thickness of the single-layer graphene layer 20 may specifically be 25 μm, 35 μm, 50 μm, 75 μm, 100 μm, and the like, and the thickness of the graphene layer 20 may be selected according to actual needs. The thickness of the single graphene layer 20 is too thick, and the processing difficulty is high, so that the yield of finished products is low; the thickness of the single graphene layer 20 is too thick and too thin, which cannot meet the heat dissipation requirement of large-area electronic products.
The single-layer thickness of the substrate-free heat-conducting double-sided adhesive layer 30 for connecting the graphene layer 20 and the artificial graphite layer 10 is 3-20 microns, and the substrate-free heat-conducting double-sided adhesive is prepared by directly coating and processing high-heat-conducting ceramic powder or filling high-temperature-resistant acrylate pressure-sensitive adhesive. The substrate-free heat-conducting double-sided adhesive layer 30 has good heat-conducting property, high temperature resistance and chemical stability, and can be immediately bonded by only light pressure when in use. Optionally, the thickness of the single-layer substrate-free heat-conducting double-sided adhesive layer 30 may be specifically 3 μm, 5 μm, 8 μm, 10 μm, 20 μm, and the like, and the thickness of the substrate-free heat-conducting double-sided adhesive layer 30 may be selected according to actual needs. The thickness of the single-layer substrate-free heat-conducting double-sided adhesive layer 30 is too thick, and the prepared heat-conducting film has the risk of glue overflow in the die cutting process; the single-layer substrate-free heat-conducting double-sided adhesive layer 30 is too thick and too thin, so that the artificial graphite layer 10 and the graphene layer 20 are not firmly bonded, and are easily separated in the use process.
Graphene layer 20, no substrate heat conduction double-sided adhesive layer 30 and artificial graphite layer 10 constitute the composite bed that plays the radiating effect, and is further, the heat conduction membrane still includes PET substrate heat conduction double-sided adhesive layer 60, and PET substrate heat conduction double-sided adhesive layer 60 sets up the one side of keeping away from artificial graphite layer 10 on graphene layer 20 for carry out the radiating process with pasting the heat conduction membrane to the surface of product.
The single-layer thickness of the PET substrate heat-conducting double-sided adhesive layer 60 used in the present application is 5 μm to 30 μm, and optionally, the thickness of the single-layer PET substrate heat-conducting double-sided adhesive layer 60 may specifically be 5 μm, 10 μm, 15 μm, 25 μm, 30 μm, and the like, and the thickness of the PET substrate heat-conducting double-sided adhesive layer 60 may be selected according to actual needs. The thickness of the PET substrate heat-conducting double-sided adhesive layer 60 is too thick, so that the heat-conducting performance of the heat-conducting film can be greatly reduced, and the heat dissipation process of a product is influenced.
In order to prevent PET substrate heat conduction double-sided adhesive layer 60 contact air and oxidation, the protection film still includes from type layer 40, sets up in one side that artifical graphite layer 10 was kept away from to PET substrate heat conduction double-sided adhesive layer 60 from type layer 40 for isolated PET substrate heat conduction double-sided adhesive layer 60 and the contact of air, the type layer 40 that uses of this application is the net from type layer, and the thickness from type layer 40 is 50 mu m ~ 100 mu m.
Furthermore, in order to avoid the harm of electrostatic effect, can set up one deck antistatic layer in the one side of keeping away from PET substrate heat conduction double-sided adhesive layer 60 from type layer 40, the probability on the heat conduction membrane is adsorbed because of static to the setting up of antistatic layer can impurity such as greatly reduced dust to effectively avoid the serious loss that static arouses, prolong the life of heat conduction membrane.
After the heat conduction membrane is pasted to the product, the heat conduction membrane still includes protective layer 50, and protective layer 50 sets up in the composite bed and keeps away from one side of product for prevent that the heat conduction membrane from being destroyed in the use, prolong the life of heat conduction membrane. The protective layer 50 used in the present application has a thickness of 50 μm to 150 μm.
The graphene layer 20, the substrate-free heat-conducting double-sided adhesive layer 30, the artificial graphite layer 10, the PET substrate heat-conducting double-sided adhesive layer 60, the release layer 40 and the protective layer 50 form a heat-conducting film which plays a heat dissipation role on a product, the thickness of the heat-conducting film is 200-550 μm, optionally, the thickness of the heat-conducting film can be specifically 200 μm, 230 μm, 280 μm, 430 μm, 480 μm, 550 μm and the like, and the thickness of the heat-conducting film can be selected according to actual needs. The thickness of the heat-conducting film is too large, and the preparation cost is increased; the thickness of the heat-conducting film is too thin, the heat-radiating capacity is reduced, and a good heat-radiating effect on a product cannot be achieved.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same. Although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. And these modifications or substitutions do not depart from the scope of the technical solutions of the embodiments of the present application.
Claims (9)
1. The heat-conducting film is characterized by comprising a composite layer, wherein the composite layer comprises at least one graphene layer, a substrate-free heat-conducting double-sided adhesive layer and an artificial graphite layer; wherein the thickness of the single graphene layer is 25-100 μm;
the substrate-free heat-conducting double-sided adhesive layer is arranged on at least one side of the artificial graphite layer; the graphene layer is arranged on one side, away from the artificial graphite layer, of the substrate-free heat-conducting double-sided adhesive layer.
2. The heat transfer film of claim 1, wherein the number of layers of the artificial graphite layer is n, the number of layers of the graphene layer is n +1, and the number of layers of the substrate-free heat transfer double-sided adhesive layer is 2 n; wherein n is more than 0 and less than or equal to 5.
3. A heat transfer film as recited in claim 1, wherein a single layer of the substrate-less heat transfer double sided adhesive layer has a thickness of 3 μm to 20 μm.
4. The heat transfer film of claim 1, wherein the thickness of the single artificial graphite layer is 25 μm to 70 μm.
5. The heat transfer film of claim 1, further comprising a PET substrate heat transfer double sided adhesive layer disposed on a side of the graphene layer away from the artificial graphite layer.
6. The heat conduction film according to claim 5, further comprising a release layer disposed on a side of the PET substrate heat conduction double-sided adhesive layer away from the artificial graphite layer.
7. A heat transfer film as recited in claim 6, further comprising an antistatic layer disposed on a side of the release layer away from the artificial graphite layer.
8. A heat conductive film according to claim 1, further comprising a protective layer.
9. A heat conductive film according to claim 1, wherein the heat conductive film has a thickness of 200 μm to 550 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202123372494.0U CN217377765U (en) | 2021-12-29 | 2021-12-29 | Heat-conducting film |
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| CN202123372494.0U CN217377765U (en) | 2021-12-29 | 2021-12-29 | Heat-conducting film |
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| CN217377765U true CN217377765U (en) | 2022-09-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116042187A (en) * | 2022-12-30 | 2023-05-02 | 常州富烯科技股份有限公司 | Flexible graphite composite heat conducting film and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116042187A (en) * | 2022-12-30 | 2023-05-02 | 常州富烯科技股份有限公司 | Flexible graphite composite heat conducting film and preparation method thereof |
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Effective date of registration: 20221213 Address after: No.21, Shuidong Park, Gongchuan Town, Yong'an City, Sanming City, Fujian Province Patentee after: Shenruimene Technology (Fujian) Co.,Ltd. Address before: 515100 Room 405, building 1, Huike Industrial Park, No. 1, industrial 2nd Road, Shilong community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee before: Shenzhen Shen Rui Graphene Technology Co.,Ltd. |