CN207624681U - A kind of high heat conduction height rebound module pad - Google Patents
A kind of high heat conduction height rebound module pad Download PDFInfo
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- CN207624681U CN207624681U CN201721794994.4U CN201721794994U CN207624681U CN 207624681 U CN207624681 U CN 207624681U CN 201721794994 U CN201721794994 U CN 201721794994U CN 207624681 U CN207624681 U CN 207624681U
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- heat conduction
- high heat
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- conduction height
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Abstract
The utility model belongs to technical field of function materials, and in particular to a kind of high heat conduction height rebound module pad, and it is used to prepare the purposes of high heat conduction height rebound pad.High heat conduction height described in the utility model springs back module pad, using elastomer core material as base material, there are graphite linings and metal layer in its external sheath using binder, and selective coated has insulating layer, utilize the good heat conductivility of the graphite linings and metal layer, obtained high heat conduction height rebound module pad has more preferably heat conductivility, so that the high heat conduction height rebound pad can conduct the heat that electronic component high-speed cruising generates rapidly, simultaneously, the elastomer core material has good resilience performance, it is set to be more suitable for the application of microelectronic component and electronic device field.
Description
Technical field
The utility model belongs to technical field of function materials, and in particular to a kind of high heat conduction height rebound module pad and its preparation
Method, and it is used to prepare the purposes of high heat conduction height rebound pad.
Background technology
With flourishing for 21st century electronics technology, electronic product, which is constantly updated, regenerates, and electronic equipment is more next
More tend to micromation, highly integrated and high-power, the size of work package is smaller and smaller, and the speed and efficiency of work are more next
Higher, calorific value is also increasing, and the heat density of all kinds of electronic components is higher and higher.If generated inside electronic building brick
The speed that sheds of heat is excessively slow, and overlong time, a large amount of heat cannot shed in time, it will influences the operation speed of electronic building brick
Degree, in some instances it may even be possible to some parts of electronic building brick be damaged, many inconvenience is brought to user.Therefore, it quickly dissipates
Heat becomes an important factor for microelectronic component and equipment and technology development.
To solve the heat dissipation problem of electronic product, existing solution is usually to wrap up graphite flake with single foam
Gasket is made in mode, but this mode radiating efficiency is not high, it is difficult to reach the requirement of high heat electronic equipment height heat dissipation.
Utility model content
For this purpose, the technical problem to be solved by the utility model is to provide a kind of high heat conduction height to spring back module pad, go forward side by side
One step discloses preparation method, and is used to prepare the purposes of high heat conduction height rebound pad.
In order to solve the above technical problems, a kind of high heat conduction height described in the utility model springs back module pad, including flexible core
Material layer and the clad for being coated on the elastic core material layer outer layer, are cohesive between the elastic core material layer and the clad
Dosage form at adhesive layer.
The wrapping layer includes high heat conduction supporting layer, and the thickness of the high heat conduction supporting layer is 0.117-0.4mm.
The heat conduction supporting layer includes graphite linings and/or metal layer, and the thickness of the graphite linings is 0.017-0.2mm, institute
The thickness for stating metal layer is 0.1-0.2mm.
The thickness of the graphite linings is 0.017-0.2mm, and the thickness of the metal layer is 0.1-0.2mm.
The one kind of the graphite linings in natural graphite or electrographite；The metal layer is in copper foil or aluminium foil
It is a kind of.
The clad further includes insulating layer, and the thickness of the insulating layer is 0.01-0.02mm.
The insulating layer is selected from PET film, PE films, at least one of PP films or nylon membrane.
The elastic core material layer choosing is from least one of foam, thermoplastic elastic body.
The elastic core material layer is the stereochemical structure that longitudinal cross-section is rectangle, square, circle, ellipse or triangle
Core material.
The clad is coated on each face outer layer of the length direction of the elastic core material layer.
The invention also discloses a kind of rebounds of high heat conduction height to pad, and module pad is sprung back along length by the high heat conduction height
Direction is formed by the way that adhesive is bonding, is the gluing that the adhesive is formed between the adjacent high heat conduction height rebound module pad
Layer.
The number of the high heat conduction height rebound module pad is 1-100.
High heat conduction height described in the utility model springs back module pad, using elastomer core material as base material, using binder outside it
Layer is coated with graphite linings and metal layer, and selective coated has insulating layer, is led using the graphite linings and the good of metal layer
Hot property, obtained high heat conduction height, which springs back module pad, has more preferably heat conductivility so that the high heat conduction height rebound pad energy
It is enough to conduct the heat that electronic component high-speed cruising generates rapidly, meanwhile, the elastomer core material has good time
Elastic energy, makes it be more suitable for the application of microelectronic component and electronic device field.
High heat conduction height rebound pad described in the utility model utilizes gluing based on the high heat conduction height springs back module pad
Layer makes several module pads combine, and high heat conduction height rebound pad obtained has better heat conductivility and resilience performance so that
The high heat conduction height rebound pad can conduct the heat that electronic component high-speed cruising generates rapidly, it is made to be more suitable for
The application of microelectronic component and electronic device field.
Description of the drawings
In order to make the content of the utility model be more likely to be clearly understood, below according to the specific implementation of the utility model
Example and in conjunction with attached drawing, the utility model is described in further detail, wherein
Fig. 1 is the structural schematic diagram that high heat conduction height described in the utility model springs back module pad；
Fig. 2 is the structural schematic diagram of high heat conduction height described in the utility model rebound pad；
Fig. 3 is the side view of high heat conduction height described in the utility model rebound pad；
Reference numeral is expressed as in figure：1- elastic core material layers, 2- adhesive layers, 3- graphite linings, 4- metal layers, 5- insulating layers,
6- high heat conduction height springs back module pad, 7- adhesive layers.
Specific implementation mode
Structure as shown in Figure 1, high heat conduction height described in the utility model spring back module pad, are followed successively by elasticity from inside to outside
Core layer 1, adhesive layer 2, graphite linings 3, metal layer 4 and insulating layer 5, the graphite linings 3, metal layer 4 and insulating layer 5 constitute packet
It is overlying on the clad of 1 outer layer of elastic core material layer.As preferred structure, the graphite linings 3, metal layer 4 and insulating layer 5 it
Between can also be bonded by adhesive layer 2.
In above structure, the elastic core material layer 1 is selected from least one of foam, thermoplastic elastic body, institute
State the thickness about 1-3mm of elastic core material layer 1, and preferred 2mm.In order to obtain preferably elasticity and resilience performance, the elasticity
1 preferably longitudinal section of core layer is the rectangular parallelepiped structure core material of square structure, and preferably its size is 2 × 2 × (30-45) mm's
The three-dimensional core material of rectangular parallelepiped structure.
In above structure, the adhesive layer 2 is bonded by binder to be formed, and the binder is selected fromPolyurethane, acrylic acid, silicon At least one of glue, polyester, vinyl acetate ethylene.The thickness of the adhesive layer 2 is substantially0.01-0.1mm。
In above structure, the thickness of the graphite linings 3 is 0.017-0.2mm, the graphite linings 3 be selected from natural graphite and/
Or electrographite；The thickness of the metal layer 4 is 0.1-0.2mm, the one kind of the metal layer 4 in copper foil or aluminium foil.On
It states graphite linings 3 and metal layer 4 collectively forms the heat conduction supporting layer, the thickness of the heat conduction supporting layer is 0.117-0.4mm.
In above structure, the thickness of the insulating layer 5 is 0.005-5mm, and the insulating layer 5 is selected from PET film, PE films, PP
At least one of film or nylon membrane.
As the scheme that can be replaced, the clad of high heat conduction height rebound module pad described in the utility model can only
Heat conduction supporting layer is stated, and does not contain the insulating layer 5.And the heat conduction supporting layer can be single or multi-layer structure, if
Single layer structure can be single graphite linings 3 or single metal layer 4, be then the compound of graphite linings 3 and metal layer 4 if multilayered structure
Layer.The thickness of the graphite linings 3 is 0.017-0.2mm, and the thickness of the metal layer 4 is 0.1-0.2mm.
As a preferred option, clad described in the utility model is each of the length direction along the elastomer core 1
The external sheath in face coats along square face surrounding and forms " mouth " font clad structure so that the high heat conduction height springs back mould
The length of block pad is about 30-45mm.
As the structure that can be replaced, the elastomer core 1 can also be that longitudinal cross-section is square, is round, is oval
The stereochemical structure core material of shape or triangle.The clad is in addition to longitudinal cross-section along the length direction of the elastomer core 1
Other each face external sheaths be advisable.
The preparation method of high heat conduction height rebound module pad described in the utility model includes the following steps：Take selected structure and ruler
Spraying or blade coating or direct pipe sensitive adhesion layer 2, then compound by pressure roller with selected graphite linings 3 on very little elastic core material layer 1；
The metal layer 4 can be directly coated in outside graphite linings 3 or is bonded by adhesive, and adhesive uses equally with adhesive layer 2
Material and technique be applied on metal layer 4, it is then compound by pressure roller with graphite linings 3；The insulating layer 5 can be wrapped up directly
In outside the metal layer 4, or can also be bonded by adhesive.Adhesive uses same material and technique with adhesive layer 2
It is applied on insulating layer 5, it is then compound by pressure roller with metal layer 4.
Structure as described in Fig. 2-3, the utility model give a kind of high heat conduction height rebound mat structure, the high heat conduction
Height rebound pad is formed by the way that adhesive is bonding by the high heat conduction height of several groups rebound module pad 6 along its length, adjacent
Adhesive between the high heat conduction height rebound module pad 6 of group bonds to form adhesive layer 7.High heat conduction described in the utility model is high
Rebound pad is generally formed by the 1-100 groups high heat conduction height rebound module pad 6 is bonding, in structure as Figure 2-3, preferably
The high heat conduction height rebound module pad 6 is 5 groups, and the width of high heat conduction height rebound module pad 6 is preferably 2mm.This practicality
In the novel structure, the adhesive is preferably acrylic acid.
The preparation of high heat conduction height rebound pad described in the utility model only needs the high heat conduction height springing back module pad 6 along length
Direction is mutually adjacent to bonding by the adhesive.
The height formed to the high heat conduction height rebound module pad 6 by different number using conventional method in the prior art is led
Hot high rebound pad carries out performance detection, and the structural parameters of high heat conduction height rebound module pad 6 described in every group see the table below shown in 1, described
The performance test results of high heat conduction height rebound pad see the table below 2.
The structural parameters of high heat conduction height rebound module pad 6 described in table 1
The performance test results of high heat conduction height rebound pad described in table 2
From upper table data it is found that high heat conduction height described in the utility model rebound pad, sandwich layer is wrapped up by existing wrapping layer
Basic module makes several basic modules combine with adhesive layer, and high heat conduction height rebound pad obtained has better thermal conductivity
It can so that the high heat conduction height rebound pad can conduct the heat that electronic component high-speed cruising generates rapidly, make it
It is more suitable for the application of microelectronic component and electronic device field.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. a kind of high heat conduction height springs back module pad, which is characterized in that including elastic core material layer (1) and be coated on the flexible core
The clad of material layer (1) outer layer, the adhesive layer (2) formed for binder between the elastic core material layer (1) and the clad.
2. high heat conduction height according to claim 1 springs back module pad, which is characterized in that the clad includes high heat conduction branch
Layer is supportted, the thickness of the high heat conduction supporting layer is 0.117-0.4mm.
3. high heat conduction height according to claim 2 springs back module pad, which is characterized in that the heat conduction supporting layer includes graphite
The thickness of layer (3) and/or metal layer (4), the graphite linings (3) is 0.017-0.2mm, and the thickness of the metal layer (4) is
0.1-0.2mm。
4. springing back module pad according to claim 1-3 any one of them high heat conduction height, which is characterized in that the clad also wraps
Insulating layer (5) is included, the thickness of the insulating layer (5) is 0.005-5mm.
5. high heat conduction height according to claim 4 springs back module pad, which is characterized in that the insulating layer (5) is selected from PET
Film, PE films, at least one of PP films or nylon membrane.
6. high heat conduction height according to claim 5 springs back module pad, which is characterized in that the elastic core material layer (1) is selected from
At least one of foam, thermoplastic elastic body.
7. high heat conduction height according to claim 6 springs back module pad, which is characterized in that the elastic core material layer (1) is vertical
To the stereochemical structure core material that section is rectangle, square, circle, ellipse or triangle.
8. high heat conduction height according to claim 7 springs back module pad, which is characterized in that the clad is coated on the bullet
Each face outer layer of the length direction of property core layer (1).
9. a kind of high heat conduction height rebound pad, which is characterized in that spring back module by claim 1-8 any one of them high heat conduction height
Pad (6) is formed by the way that adhesive is bonding along its length, is the glue between the adjacent high heat conduction height rebound module pad (6)
Glutinous dosage form at adhesive layer (7).
10. high heat conduction height rebound pad according to claim 9, which is characterized in that the high heat conduction height rebound module pad (6)
Number be 1-100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721794994.4U CN207624681U (en) | 2017-12-20 | 2017-12-20 | A kind of high heat conduction height rebound module pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721794994.4U CN207624681U (en) | 2017-12-20 | 2017-12-20 | A kind of high heat conduction height rebound module pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207624681U true CN207624681U (en) | 2018-07-17 |
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ID=62821886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721794994.4U Active CN207624681U (en) | 2017-12-20 | 2017-12-20 | A kind of high heat conduction height rebound module pad |
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| CN (1) | CN207624681U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946265A (en) * | 2017-12-20 | 2018-04-20 | 上海叹止新材料科技有限公司 | High rebound module pad of a kind of high heat conduction and preparation method and application |
-
2017
- 2017-12-20 CN CN201721794994.4U patent/CN207624681U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946265A (en) * | 2017-12-20 | 2018-04-20 | 上海叹止新材料科技有限公司 | High rebound module pad of a kind of high heat conduction and preparation method and application |
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Address after: Fourth Floor, Building 1, 312 East Huancheng Road, Fengxian District, Shanghai, 201400 Co-patentee after: East China University of Science and Technology Patentee after: Shanghai sigh new Mstar Technology Ltd Address before: 201609 3rd Floor, No. 1 Yewang Road, Yexie Town, Songjiang District, Shanghai Co-patentee before: East China University of Science and Technology Patentee before: Shanghai sigh new Mstar Technology Ltd |