TWI479983B - Monolithical fin-type heat sink - Google Patents
Monolithical fin-type heat sink Download PDFInfo
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- TWI479983B TWI479983B TW100121951A TW100121951A TWI479983B TW I479983 B TWI479983 B TW I479983B TW 100121951 A TW100121951 A TW 100121951A TW 100121951 A TW100121951 A TW 100121951A TW I479983 B TWI479983 B TW I479983B
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- heat sink
- fin
- electronic component
- region
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- 230000037303 wrinkles Effects 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明係有關一種散熱裝置，尤指一種用於薄型化電子產品的一體成型薄型化散熱裝置。The invention relates to a heat dissipating device, in particular to an integrally formed thinned heat dissipating device for thinned electronic products.
對於電子元件而言，例如電腦裝置中的顯示晶片或微處理器，平面電視中的控制晶片、各種功能模組的晶片...等，在運作時特別容易產生高溫，此時散熱器便扮演重要的角色。一般而言，在空間較不受限制的電腦裝置中，散熱器為許多散熱鰭片的組合，並且搭配一風扇，以強制將散熱鰭片上的熱源帶走。然而在整體為扁平化的平面顯示器(如液晶顯示器、液晶電視、電漿電視等)中，則無法使用一般使用在電腦裝置中的立體散熱裝置，亦無法搭配使用散熱風扇。因此目前在空間受限制的電子裝置中，通常多直接在易產生熱能的電子元件上，直接黏貼一片金屬導熱片，以將電子元件上的熱能帶走。然而這種單一片狀的金屬導熱片受限於其尺寸大小所具有的導熱面積，導熱效果有限。For electronic components, such as display chips or microprocessors in computer devices, control chips in flat-panel TVs, wafers of various functional modules, etc., it is particularly prone to high temperatures during operation, at which point the heat sink plays Important role. In general, in a computer device where space is unrestricted, the heat sink is a combination of many heat sink fins and is equipped with a fan to force the heat source on the heat sink fins away. However, in a flat panel display (such as a liquid crystal display, a liquid crystal television, a plasma TV, etc.) as a whole, it is impossible to use a three-dimensional heat sink generally used in a computer device, and it is not possible to use a heat sink fan. Therefore, in an electronic device with limited space, it is usually directly attached to a metal thermal conductive sheet directly on an electronic component that is prone to generate thermal energy to carry away thermal energy on the electronic component. However, such a single sheet-shaped metal heat conductive sheet is limited by the heat transfer area of its size and has a limited heat conduction effect.
為解決上述問題，本發明提供了一種一體成型的散熱裝置，在有限空間中，針對發熱的電子元件提供絕佳的散熱效果。In order to solve the above problems, the present invention provides an integrally formed heat dissipating device which provides an excellent heat dissipating effect for heat-generating electronic components in a limited space.
本發明提供一種一體成型的鰭片式散熱裝置，包含有一接合區以及一皺摺區。該接合區用來固接於一電子元件以傳導該電子元件產生的熱能，該接合區為沿一水平方向延伸的片狀結構且具有一接合面積，該接合面積不小於該電子元件內的一晶粒的面積。該皺摺區沿與該水平方向平行之一軸自該接合區之兩側延伸，且該皺摺區之部分可與該軸產生一位移而產生變形。The present invention provides an integrally formed fin heat sink comprising an engagement zone and a crease zone. The bonding region is for fixing to an electronic component for transmitting thermal energy generated by the electronic component, the bonding region is a sheet structure extending in a horizontal direction and has a bonding area, and the bonding area is not less than one of the electronic components The area of the grain. The crease region extends from both sides of the splicing zone along an axis parallel to the horizontal direction, and a portion of the crease zone is deformable by displacement of the shaft.
本發明所提供的鰭片式散熱裝置相較於習知片狀散熱片，在有限的空間限制下，具有足夠大的散熱面積，可有效將電子元件在運作時所產生的熱能帶走。其一體成型的結構可節省散熱裝置的材料成本以及加工成本，而薄型化的片狀結構以及皺摺區亦可配合所接合的電子元件周邊的元件分佈而適當的彎折變形，使散熱裝置不需要另外加工即可使用於各種場合。The fin-type heat dissipating device provided by the invention has a sufficiently large heat dissipating area compared with the conventional sheet fins under the limited space limit, and can effectively carry away the heat energy generated by the electronic components during operation. The integrally formed structure can save the material cost and the processing cost of the heat dissipating device, and the thinned sheet structure and the wrinkle area can also be appropriately bent and deformed according to the distribution of the components around the joined electronic components, so that the heat dissipating device does not It can be used in a variety of applications if it needs additional processing.
請參考第1圖以及第2圖，第1圖為本發明所揭露的一體成型的鰭片式散熱裝置1一第一實施例之示意圖，第2圖為鰭片式散熱裝置1的側面示意圖。鰭片式散熱裝置1用於傳導在運作中的電子元件所產生的熱能，以達到散熱的效果。為達到較佳的散熱效果，鰭片式散熱裝置1較佳地為銅質或鋁質的金屬材料。在本發明中，鰭片式散熱裝置1係由薄型片狀的銅片或鋁片一體成型製成，因此僅需要進行簡單的機械加工程序，可省下將多個子元件組裝固定為一散熱器的材料以及組裝成本。Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic view showing a first embodiment of the integrally formed fin heat sink 1 according to the present invention, and FIG. 2 is a schematic side view of the fin heat sink 1 . The fin heat sink 1 is used to conduct heat generated by electronic components in operation to achieve heat dissipation. In order to achieve a better heat dissipation effect, the fin heat sink 1 is preferably a copper or aluminum metal material. In the present invention, the fin-type heat dissipating device 1 is integrally formed from a thin sheet-shaped copper sheet or an aluminum sheet, so that only a simple machining process is required, and the assembly of the plurality of sub-elements into a radiator can be saved. Materials and assembly costs.
如第1圖所示，鰭片式散熱裝置1包含一接合區10以及一皺摺區20。接合區10為沿著水平方向(如圖中的L1 L2 方向)延伸的片狀結構，且接合區10具有接合面積A。在第2圖中，皺摺區20則沿著水平方向(如圖中的L1 L2 方向)自接合區10的兩側水平延伸，且具有複數個皺摺211、221。本實施例之這些皺摺211、221的彎折形狀係為ㄇ字型，其彎折之樣式一部分與其延伸的水平方向垂直，一部分與水平方向平行；而皺摺211、221的彎折高度取決於鰭片式散熱裝置1所安裝的環境。由於皺摺區20係由接合區10兩側向著L1 L2 方向延伸的片狀結構彎折而成，因此當鰭片式散熱裝置1因所安裝的環境而具有特定的尺寸時，鰭片式散熱裝置1的皺摺區20所具有的複數個皺摺211、221可顯著地增加鰭片式散熱裝置1的散熱面積，從而較迅速地將電子元件所產生的熱能帶走。As shown in FIG. 1, the fin type heat sink 1 includes a land 10 and a crease area 20. The land 10 is a sheet-like structure extending in the horizontal direction (L 1 L 2 direction in the drawing), and the land 10 has a joint area A. In Fig. 2, the crease area 20 extends horizontally from both sides of the joint region 10 in the horizontal direction (L 1 L 2 direction in the drawing), and has a plurality of creases 211, 221. The bending shapes of the wrinkles 211 and 221 of the embodiment are U-shaped, and a part of the bending pattern is perpendicular to the horizontal direction of the extension, and a part is parallel to the horizontal direction; and the bending height of the wrinkles 211 and 221 depends on the bending height. The environment in which the fin heat sink 1 is installed. Since the wrinkle region 20 is formed by bending a sheet-like structure extending from both sides of the joint region 10 toward the L 1 L 2 direction, when the fin-type heat sink 1 has a specific size due to the installed environment, the fins The plurality of wrinkles 211, 221 of the wrinkle region 20 of the heat dissipating device 1 can significantly increase the heat dissipating area of the fin type heat dissipating device 1, thereby rapidly carrying away the heat energy generated by the electronic components.
請繼續參考第2圖。在本發明的第一實施例中，鰭片式散熱裝置1的皺摺區20包含一第一皺摺區21以及一第二皺摺區22，其中第一皺摺區21自接合區10一側沿著水平方向向L1 方向延伸，第二皺摺區22自接合區10相對另一側沿著水平方向向L2 方向延伸。由於第一皺摺區21以及第二皺摺區22係由接合區10兩側向著L1 L2 方向延伸的片狀結構彎折而成，因此第一皺摺區21以及第二皺摺區22的複數個皺摺211、221與接合區10實質上具有相同的厚度。在本發明中，製成鰭片式散熱裝置1的薄型片狀銅片或鋁片的厚度較薄，因此可允許皺摺區20相對於接合區10沿著垂直方向(或圖中的D1 D2 方向)輕微移動變形。換言之，假設皺摺區20係沿與水平方向平行之一x軸自接合區10之兩側延伸，則皺摺區20之部分可與該x軸產生一位移而產生變形，使得皺摺區20配合該電子元件周邊的元件分佈，而沿垂直方向微幅向上或向下變形(如第2圖中以虛線顯示的第一皺摺區21即沿著D1 方向微幅向上變形)，以避免元件間的接觸；舉例而言，當鰭片式散熱裝置1安裝於需散熱的電子元件時，在接合區10兩側的皺摺區20可視需要微幅向上(D1 方向)或向下(D2 方向)彎折變形，以避開其上或其下的其他元件。Please continue to refer to Figure 2. In the first embodiment of the present invention, the wrinkle region 20 of the fin-type heat dissipating device 1 includes a first wrinkle region 21 and a second wrinkle region 22, wherein the first wrinkle region 21 is self-joining region 10 lateral direction L extends in the horizontal direction, opposite side of the second region 10 from the region 22 engage corrugations extending direction of the horizontal direction L 2. Since the first crease area 21 and the second crease area 22 are bent by a sheet-like structure extending from both sides of the joint area 10 toward the L 1 L 2 direction, the first crease area 21 and the second crease area The plurality of wrinkles 211, 221 of 22 have substantially the same thickness as the land 10. In the present invention, the thin sheet-like copper sheet or the aluminum sheet in which the fin type heat sink 1 is made is thinner in thickness, thereby allowing the wrinkle region 20 to be vertically oriented with respect to the joint region 10 (or D 1 in the drawing) D 2 direction) slight movement deformation. In other words, assuming that the wrinkle region 20 extends from both sides of the joint region 10 along one of the x-axis parallel to the horizontal direction, a portion of the wrinkle region 20 can be displaced with the x-axis to cause deformation, so that the wrinkle region 20 Cooperating with the component distribution around the electronic component, and deforming slightly upward or downward in the vertical direction (as shown by the dashed line in the second figure, the first wrinkle region 21 is slightly deformed upward along the D 1 direction) to avoid the contact between the elements; for example, when a finned heat sink attached to the electronic component requiring heat dissipation, in the region of corrugations 10 on both sides of the engagement region 20 may optionally be slightly upwards (direction D 1) or down ( D 2 direction) Bend deformation to avoid other components above or below it.
在本發明的其他實施例中，皺摺區20亦可僅包含第一皺摺區21或第二皺摺區22，亦即鰭片式散熱裝置1的皺摺區20可僅在接合區10的其中一側水平延伸，使散熱裝置具有更彈性的應用。In other embodiments of the present invention, the crease area 20 may also include only the first crease area 21 or the second crease area 22, that is, the crease area 20 of the fin type heat sink 1 may be only in the joint area 10 One of the sides extends horizontally, making the heat sink more flexible.
請參考第3圖，第3圖為鰭片式散熱裝置1固接於一電子元件50的側面示意圖，電子元件50則為電路板60上其中一需要散熱的元件。在第3圖的實施例中，鰭片式散熱裝置1另包含一接合材料30，其可為雙面膠或熱固性膠。接合材料30先固定於接合區10上，再黏貼於電子元件50欲散熱的表面，使接合區10固接於電子元件50上以傳導電子元件50在運作時產生的熱能。在電子元件50中，其主要產生熱能的為其中的晶粒51，因此藉由接合材料30而接合於電子元件50上的接合區10的接合面積A在實務上至少不小於晶粒51的面積(透過接合材料30直接接觸於電子元件50的晶粒51上方)。較佳地，接合區10的接合面積A可涵蓋電子元件50的面積，以完全覆蓋電子元件50，使電子元件50的熱皆能經由接觸接合區10而被傳導出去。換言之，第1圖中的接合面積A即為接合材料30使接合區10以及電子元件50相固接的面積。特別說明的是，在本發明中，鰭片式散熱裝置1係由接合區10與電子元件50接觸導熱，皺摺區20則自接合區10向外水平延伸而未與電子元件50接觸。Please refer to FIG. 3 . FIG. 3 is a schematic side view of the fin-type heat sink 1 fixed to an electronic component 50 . The electronic component 50 is one of the components of the circuit board 60 that needs to dissipate heat. In the embodiment of FIG. 3, the fin heat sink 1 further includes a bonding material 30, which may be a double-sided tape or a thermosetting glue. The bonding material 30 is first fixed on the bonding region 10, and then adhered to the surface of the electronic component 50 to be dissipated, so that the bonding region 10 is fixed on the electronic component 50 to conduct the thermal energy generated by the electronic component 50 during operation. In the electronic component 50, the die 51 which mainly generates thermal energy therein, and thus the bonding area A of the bonding region 10 bonded to the electronic component 50 by the bonding material 30 is at least not less than the area of the die 51 in practice. (directly contacting the die 51 of the electronic component 50 through the bonding material 30). Preferably, the bonding area A of the land 10 can cover the area of the electronic component 50 to completely cover the electronic component 50 so that the heat of the electronic component 50 can be conducted out through the contact land 10. In other words, the joint area A in Fig. 1 is the area where the bonding material 30 fixes the joint region 10 and the electronic component 50. Specifically, in the present invention, the fin type heat dissipating device 1 is thermally contacted by the bonding portion 10 and the electronic component 50, and the wrinkle region 20 extends horizontally outward from the bonding region 10 without coming into contact with the electronic component 50.
請參考第4圖，第4圖為鰭片式散熱裝置2一第二實施例固接於電子元件50之側面示意圖。其中在鰭片式散熱裝置2的皺摺區20一側(在第4圖為面對電路板60的一側)另設置一絕緣片40，如此一來，可確保鰭片式散熱裝置2在固接於電子元件50時，延伸於接合區10的皺摺區20受到絕緣片40的阻隔而不會與電路板60上其他的電子元件互相接觸而發生短路的情況。Please refer to FIG. 4 , which is a schematic diagram of a side view of the fin-type heat sink 2 fixed to the electronic component 50 in the second embodiment. Wherein, an insulating sheet 40 is further disposed on the side of the wrinkle region 20 of the fin heat sink 2 (on the side facing the circuit board 60 in FIG. 4), so that the fin heat sink 2 can be ensured When the electronic component 50 is fixed, the wrinkle region 20 extending in the bonding region 10 is blocked by the insulating sheet 40 and does not come into contact with other electronic components on the circuit board 60 to cause a short circuit.
本發明所揭露的鰭片式散熱裝置用於安裝空間受限制的電子裝置內，當鰭片式散熱裝置的片狀接合區藉由接合材料固接於一電子元件上時，自接合區兩側水平延伸的皺摺區具有的複數個皺摺可增加鰭片式散熱裝置的散熱面積，有效將電子元件在運作時所產生的熱能帶走。接合區以及皺摺區係以導熱金屬一體成型製成，且皺摺區可配合所接合的電子元件周邊的元件分佈而相對接合區產生適當的彎折變形，使鰭片式散熱裝置不需要另外加工即可使用於各種場合，並可有效避免元件間的干擾。The fin-type heat dissipating device disclosed in the present invention is used in a space-constrained electronic device. When the chip-shaped joint region of the fin-type heat dissipating device is fixed to an electronic component by a bonding material, both sides of the self-joining region The horizontally extending corrugated area has a plurality of wrinkles which increase the heat dissipating area of the fin-type heat dissipating device and effectively carry away the heat energy generated by the electronic components during operation. The lands and the creases are integrally formed of a heat conductive metal, and the creases can be combined with the components of the periphery of the joined electronic components to generate appropriate bending deformations with respect to the joint regions, so that the fin heat sink does not require an additional Processing can be used in a variety of applications, and can effectively avoid interference between components.
以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
1、2‧‧‧鰭片式散熱裝置1, 2‧‧‧Fin-type heat sink
10‧‧‧接合區10‧‧‧ junction area
20‧‧‧皺摺區20‧‧‧Wrinkle area
21‧‧‧第一皺摺區21‧‧‧First wrinkle zone
22‧‧‧第二皺摺區22‧‧‧second wrinkle zone
30‧‧‧接合材料30‧‧‧Material materials
40‧‧‧絕緣片40‧‧‧Insulation sheet
50‧‧‧電子元件50‧‧‧Electronic components
51‧‧‧晶粒51‧‧‧ grain
60‧‧‧電路板60‧‧‧ boards
211、221‧‧‧皺摺211, 221‧‧‧ wrinkles
L1 ,L2 ,D1 ,D2 ‧‧‧方向L 1 , L 2 , D 1 , D 2 ‧‧‧ directions
第1圖為本發明所揭露的一體成型的鰭片式散熱裝置一第一實施例之示意圖。1 is a schematic view of a first embodiment of an integrally formed fin heat sink according to the present invention.
第2圖為第1圖的散熱裝置的側面示意圖。Fig. 2 is a side view showing the heat sink of Fig. 1.
第3圖為第1圖的散熱裝置第一實施例固接於一電子元件之側面示意圖。3 is a schematic side view of the first embodiment of the heat sink of FIG. 1 fixed to an electronic component.
第4圖為散熱裝置一第二實施例固接於一電子元件之側面示意圖。Figure 4 is a schematic side view of a second embodiment of the heat sink fixed to an electronic component.
2．．．鰭片式散熱裝置2. . . Fin fin heat sink
10．．．接合區10. . . Junction area
20．．．皺摺區20. . . Wrinkle area
21．．．第一皺摺區twenty one. . . First wrinkle area
22．．．第二皺摺區twenty two. . . Second wrinkle area
30．．．接合材料30. . . Bonding material
40．．．絕緣片40. . . Insulating sheet
50．．．電子元件50. . . Electronic component
51．．．晶粒51. . . Grain
60．．．電路板60. . . Circuit board
211、221．．．皺摺211, 221. . . Wrinkle
L1 ,L2 ,D1 ,D2 ．．．方向L 1 , L 2 , D 1 , D 2 . . . direction
Claims (9)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100121951A TWI479983B (en) | 2011-06-23 | 2011-06-23 | Monolithical fin-type heat sink |
| US13/253,305 US20120325453A1 (en) | 2011-06-23 | 2011-10-05 | Monolithic Fin-type Heat Sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100121951A TWI479983B (en) | 2011-06-23 | 2011-06-23 | Monolithical fin-type heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201302035A TW201302035A (en) | 2013-01-01 |
| TWI479983B true TWI479983B (en) | 2015-04-01 |
Family
ID=47360726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100121951A TWI479983B (en) | 2011-06-23 | 2011-06-23 | Monolithical fin-type heat sink |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120325453A1 (en) |
| TW (1) | TWI479983B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105594074B (en) * | 2013-10-04 | 2019-05-31 | 飞利浦照明控股有限公司 | Lighting apparatus connector including radiator |
| US10653038B2 (en) * | 2016-04-14 | 2020-05-12 | Microsoft Technology Licensing, Llc | Heat spreader |
| US10319609B2 (en) | 2017-06-21 | 2019-06-11 | International Business Machines Corporation | Adhesive-bonded thermal interface structures |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101193537A (en) * | 2006-12-01 | 2008-06-04 | 英业达股份有限公司 | Heat radiator |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3509429A (en) * | 1968-01-15 | 1970-04-28 | Ibm | Heat sink assembly for semiconductor devices |
| US5550326A (en) * | 1994-07-13 | 1996-08-27 | Parker-Hannifin Corporation | Heat dissipator for electronic components |
| US5829512A (en) * | 1995-08-29 | 1998-11-03 | Silicon Graphics, Inc. | Heatsink and method of forming a heatsink |
| JP3406753B2 (en) * | 1995-11-30 | 2003-05-12 | 三菱電機株式会社 | Semiconductor device and semiconductor module |
| US5917700A (en) * | 1997-09-16 | 1999-06-29 | Lucent Technologies Inc | Heat sink and attachment process for electronic components |
| US6208517B1 (en) * | 1999-09-10 | 2001-03-27 | Legerity, Inc. | Heat sink |
| US6385047B1 (en) * | 1999-12-06 | 2002-05-07 | Cool Shield, Inc. | U-shaped heat sink assembly |
| US20020118511A1 (en) * | 2001-02-28 | 2002-08-29 | Dujari Prateek J. | Heat dissipation device |
| KR20020074073A (en) * | 2001-03-16 | 2002-09-28 | 엘지전자 주식회사 | Heat dissipation structure of ic |
| JP2003218294A (en) * | 2002-01-23 | 2003-07-31 | Mitsubishi Electric Corp | Radiator |
| US6936919B2 (en) * | 2002-08-21 | 2005-08-30 | Texas Instruments Incorporated | Heatsink-substrate-spacer structure for an integrated-circuit package |
| US7079396B2 (en) * | 2004-06-14 | 2006-07-18 | Sun Microsystems, Inc. | Memory module cooling |
| KR100904391B1 (en) * | 2008-06-30 | 2009-06-26 | 박교양 | Heatproof lamp |
| JP5216602B2 (en) * | 2009-01-08 | 2013-06-19 | 株式会社日立製作所 | Image display device |
-
2011
- 2011-06-23 TW TW100121951A patent/TWI479983B/en not_active IP Right Cessation
- 2011-10-05 US US13/253,305 patent/US20120325453A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101193537A (en) * | 2006-12-01 | 2008-06-04 | 英业达股份有限公司 | Heat radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120325453A1 (en) | 2012-12-27 |
| TW201302035A (en) | 2013-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |