TWI624217B - Thermally diffusing electronic device - Google Patents

Abstract

A thermal diffusion electronic device is disclosed to improve component mounting of thin electronic products to avoid component peeling and system collapse. A primary heat source integrated circuit component is eccentrically mounted on the system connection plate and has a first heat generating surface. The plurality of secondary heat source integrated circuit components are mounted on the system connection board and located on one side of the main heat source integrated circuit component, and the secondary heat source integrated circuit component has a second heat generating surface, the main heat source integrated circuit component and the secondary heat source integrated body There is a gap between the circuit elements. A flexible heat-diffusing patch has a vertical thickness to guide the heat rate and a surface-conducting heat rate conforming to the surface, the surface-guided heat rate is greater than five times the thickness of the thickness of the guide, and the flexible heat-dissipating patch is a full-chip type The extending surface covers the gap while being attached to the first heat generating surface and the second heat generating surface to convert the second heat generating surface into a heated surface.

Description

Thermal diffusion electronic device

The invention relates to an electronic device, in particular to a thermal diffusion type electronic device, which can be applied to an electronic device whose product thickness is limited by specifications, such as a solid state disk (SSD), a portable data storage device... and many more.

With the evolution of integrated circuit processes, electronic devices have continued to grow toward thinner thicknesses and lighter weights. When the electronic device is flattened, the heat generated by the internal specific components will become less likely to be dissipated during the operation. Conventionally, the electronic device is equipped with a heat dissipating mechanism such as a metal heat sink fin or a heat pipe, which not only increases the height and weight of the electronic device, but also requires the installation hole of the heat sink mechanism to be added to the main circuit board of the electronic device, which affects the main device. The circuit layout of the board.

In order to solve the above problems, the main object of the present invention is to provide a thermal diffusion type electronic device, which comprises a main heat source integrated circuit component without local heat accumulation, for improving component fixing of a thin electronic product. Avoid component stripping and system crash issues.

A second object of the present invention is to provide a thermal diffusion type electronic device in which the mounting position of the main heat source integrated circuit component is not limited, and when the main heat source integrated circuit component is eccentrically mounted on a system connection board, Can also reach The effective lateral horizontal heat conduction allows the component mounting arrangement to have greater design flexibility.

Still another object of the present invention is to provide a thermal diffusion type electronic device in which the heat interface material can be omitted or the amount of use of the thermal interface material can be reduced, except that the heat dissipation fins can be omitted. Moreover, the system connection board does not need to be provided with a mounting hole of the heat dissipation mechanism.

The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses a thermal diffusion electronic device comprising a system connection board, a main heat source integrated circuit component, at least a first heat source integrated circuit component and a flexible heat diffusion patch. The system connection plate has a component engagement surface. The main heat source integrated circuit component is eccentrically mounted on the component joint surface of the system connection board, and the main heat source integrated circuit component has a first heat generating surface. The first heat source integrated circuit component is mounted on the component bonding surface of the system connection board and located on one side of the main heat source integrated circuit component, and the first heat source integrated circuit component has a second heat generation. The surface of the main heat source integrated circuit component and the first heat source integrated circuit component are spaced apart. The flexible thermal diffusion patch has an attachment surface and a thermal diffusion surface opposite to the attachment surface, the attachment surface contacting the first heat generating surface and the second heat generating surface, the flexibility The heat diffusion patch has a thickness from the attachment surface to the heat diffusion surface, a guide heat rate and a surface compliance heat rate conforming to the heat diffusion surface, the surface conduction heat rate is greater than the thickness of the guide heat At least five times the rate, the flexible thermal diffusion patch covers the first heat-generating surface of the main heat source integrated circuit component and the first heat source integrated body over the interval The second heat generating surface of the circuit component to convert the second heat generating surface into a heated surface surface.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.

In the above thermal diffusion type electronic device, the surface conduction heat rate is more specifically ten times or more than the thickness of the thickness, and is between 450 and 1700 W/mK to accelerate the heat diffusion in the lateral horizontal plane.

In the above thermal diffusion type electronic device, the first heat generating surface to the system connecting plate may have a first height, and the second heat generating surface to the system connecting plate may have a second height, preferably the first The two heights are not the same as the first height, and one of the segments in which the flexible heat diffusion patch is suspended is soft and resettable. Therefore, the flexible heat-dissipating patch can be thermally conductive across the element and is not subject to the height difference of component mounting, and requires the addition of a thermal interface material such as a thermal paste.

In the thermal diffusion type electronic device, an identification pattern may be further formed on the thermal diffusion surface of the flexible thermal diffusion patch, and an area occupied by the identification pattern on the flexible thermal diffusion patch It is larger than the first heat generating surface. Therefore, the identification pattern is not peeled off by the influence of surface temperature unevenness.

In the above thermal diffusion type electronic device, one of the first side edges of the system connecting plate is specifically provided with a plurality of contact fingers, and one of the second side edges of the system connecting plate is specifically disposed with respect to the first side Having a positioning groove, the flexible heat diffusion patch covers the main heat source integrated circuit component and the first heat source integrated circuit component to expose the contact fingers and the positioning groove, thereby the flexible The thermal diffusion patch does not interfere with the external electrical connection of the system connection plate and the mechanical fixation of the sheet.

In the above thermal diffusion type electronic device, at least one passive component and a power module may be further mounted on the component bonding surface of the system connection board, and the flexible thermal diffusion patch at least partially covers the component Passive components and the power module to achieve dust protection.

In the above thermal diffusion type electronic device, specifically, the main heat source integrated circuit component is a controller chip package, and the first heat source integrated circuit component comprises a non-volatile memory chip package.

In the above thermal diffusion type electronic device, at least one second heat source integrated circuit component may be further disposed on the component bonding surface of the system connection board and located on an opposite side of the main heat source integrated circuit component. And the main heat source integrated circuit component is spaced between the first heat source integrated circuit component and the second heat source integrated circuit component, wherein the second heat source integrated circuit component has a third heat generating surface. The flexible heat diffusion patch is also attached to the third heat generating surface of the second heat source integrated circuit component.

In the above thermal diffusion type electronic device, specifically, the second heat source integrated circuit component comprises a volatile memory chip package.

In the above thermal diffusion type electronic device, preferably, the flexible thermal diffusion patch comprises a metal core and a thermal diffusion layer and a thermal diffusion layer on one of the metal cores, one of the upper thermal diffusion layers. The outer surface is covered with a coating film for providing the heat diffusion surface, and one of the bottom surfaces of the lower heat diffusion layer covers an adhesive layer for providing the adhesion surface.

In the above thermal diffusion type electronic device, preferably, the coating film is more Extendingly coating a first circumference of the metal core, a second circumference of one of the upper thermal diffusion layers and a third circumference of the lower thermal diffusion layer for preventing the upper thermal diffusion layer and the lower thermal diffusion layer The debris is detached and the side edges of the metal core are prevented from being exposed.

In the above thermal diffusion type electronic device, specifically, the upper thermal diffusion layer and the lower thermal diffusion layer comprise a plurality of planar crystals stacked to increase a difference in the surface conduction heat rate with respect to the thickness.

According to the above technical means, the present invention provides a thermal diffusion type electronic device, wherein the surface thermal conductivity of the flexible thermal diffusion patch is greater than five times the thermal conductivity of the thickness, and the flexible thermal diffusion The chip extends over the interval and is attached to the first heat generating surface of the main heat source integrated circuit component and the second heat generating surface of the first heat source integrated circuit component to make the The second heat generating surface of the first heat source integrated circuit component is converted into a heated surface for improving the component fixing of the thin electronic product to avoid component peeling and system collapse.

H1‧‧‧ first height

H2‧‧‧second height

S‧‧‧ interval

100‧‧‧ Thermal diffusion electronic device

110‧‧‧System connection board

111‧‧‧Component joint

112‧‧‧Contact finger

113‧‧‧ positioning groove

120‧‧‧Main heat source integrated circuit components

121‧‧‧First heating surface

130‧‧‧First heat source integrated circuit components

131‧‧‧second heating surface

140‧‧‧Flexible Thermal Diffusion Patch

141‧‧‧ Attachment

142‧‧‧ Thermal diffusion surface

143‧‧‧Metal core

143A‧‧‧First Week

144‧‧‧Upper thermal diffusion layer

144A‧‧‧second circumference

145‧‧‧ Lower thermal diffusion layer

145A‧‧‧ third week

146‧‧‧ Cover film

147‧‧‧Adhesive layer

150‧‧‧ identification pattern

160‧‧‧ Passive components

170‧‧‧Second heat source integrated circuit components

171‧‧‧ Third heating surface

180‧‧‧Power Module

200‧‧‧ Thermal diffusion electronic device

221‧‧‧First heating surface

Figure 1 is a schematic cross-sectional view of a thermal diffusion electronic device in accordance with a first embodiment of the present invention.

Figure 2 is a front elevational view of the thermal diffusion electronic device in accordance with a first embodiment of the present invention.

Figure 3 is a perspective view of the thermal diffusion electronic device prior to attachment of a flexible heat spreadable patch in accordance with a first embodiment of the present invention.

Figure 4: According to a first embodiment of the present invention, the thermal diffusion electronic device is not A front view of the flexible heat spreadable patch prior to attachment.

FIG. 5 is a perspective view showing the flexible heat diffusion patch of the thermal diffusion type electronic device in a hierarchical partial cut according to the first embodiment of the present invention.

Figure 6 is a partial cross-sectional view of the flexible thermal diffusion patch of the thermal diffusion electronic device in accordance with a first embodiment of the present invention.

Figure 7 is a cross-sectional view showing another heat diffusion type electronic device in accordance with a second embodiment of the present invention.

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings in which FIG. The components and combinations related to this case, the components shown in the figure are not drawn in proportion to the actual number, shape and size of the actual implementation. Some size ratios are proportional to other related sizes or have been exaggerated or simplified to provide clearer description of. The actual number, shape and size ratio of the implementation is an optional design, and the detailed component layout may be more complicated.

According to a first embodiment of the present invention, a thermal diffusion type electronic device 100 is illustrated in a schematic cross-sectional view of FIG. 1 and a front view of FIG. The thermal diffusion electronic device 100 includes a system connection board 110, a main heat source integrated circuit component 120, at least a first heat source integrated circuit component 130, and a flexible thermal diffusion patch 140. The form of the thermal diffusion type electronic device 100 in which the flexible heat diffusion patch 140 is not attached can be seen in the front view of FIG. 3 and the front view of FIG. 4 . FIG. 5 illustrates the partial section of the flexible heat diffusion patch 140 in a hierarchical manner. The three-dimensional schematic below. FIG. 6 is a partial cross-sectional view showing the flexible heat diffusion patch 140. In this embodiment, the thermal diffusion electronic device 100 is a solid state disk (SSD).

Referring to Figures 1 to 4, the system connection plate 110 has a component engaging surface 111. The specific structure of the system connection board 110 can be a printed circuit board, and the component bonding surface 111 is formed with lines and pads (not shown). In this embodiment, the first side of the system connection board 110 is specifically provided with a plurality of contact fingers 112 for plugging the electrical connection to a computer device or for communicating a portable electronic product. One of the adapter connectors or the adapter box, the second side of the system connection plate 110 is specifically provided with a positioning recess 113 relative to the first side. The combination of the contact fingers 112 can specifically form an M.2 interface. The positioning groove 113 can be semi-circular. The component bonding surface 111 is surrounded by a metal layer around the positioning groove 113.

The main heat source integrated circuit component 120 is eccentrically mounted on the component bonding surface 111 of the system connection board 110, and the main heat source integrated circuit component 120 has a first heat generating surface 121. Under the operation of a predetermined voltage, the heat generated by the main heat source integrated circuit component 120 should be greater than the unit heat of the secondary heat source integrated circuit component. In this embodiment, specifically, the main heat source integrated circuit component 120 is a controller chip package. The package form of the main heat source integrated circuit component 120 is a ball grid array package, which comprises a controller chip, and a plurality of solder balls can be disposed on the bottom surface of the package. The first heat generating surface 121 can be a wafer back surface. In different embodiments, the first heat generating surface 121 can be a top surface of a packaging material or A top surface of a built-in heat sink. The above-mentioned "eccentrically assembled" means that the center point of the main heat source integrated circuit component 120 is not aligned with the center point of the component bonding face 111.

The first heat source integrated circuit component 130 is mounted on the component bonding surface 111 of the system connection board 110 and located on one side of the main heat source integrated circuit component 120. The first thermal source integrated circuit component 130 is There is a second heat generating surface 131 having a space S between the main heat source integrated circuit component 120 and the first heat source integrated circuit component 130. In this embodiment, the first heat source integrated circuit component 130 includes a non-volatile memory chip package. For example, the interior of the first heat source integrated circuit component 130 can seal a plurality of NAND flash wafers. The package pattern of the first heat source integrated circuit component 130 may also be a ball grid array package. However, without limitation, the above-mentioned "assembly" method is a "surface mounting" using solder balls in the preferred embodiment; however, in various variations, "assembly" may also be "direct dies". "direct die attaching". The second heat generating surface 131 and the first heat generating surface 121 may not be in the same horizontal plane based on the difference in specifications of the various integrated circuit components or the difference in wafer stack, wafer thickness, and mold thickness. In this embodiment, the first heat generating surface 121 to the system connecting plate 110 may have a first height H1, and the second heat generating surface 131 to the system connecting plate 110 may have a second height H2. The second height H2 is not the same as the first height H1. Specifically, the first height H1 is smaller than the second height H2. Further, the above-described interval S formed in a section should be no more than one-half the width of the main heat source integrated circuit component 120 formed in the same section.

Please refer to the figures 1, 2, 5 and 6, the flexible heat diffusion patch 140 And a heat dissipating surface 142 opposite to the attaching surface 141, the attaching surface 141 contacting the first heat generating surface 121 and the second heat generating surface 131, the flexible heat diffusion The patch 140 further has a thickness guiding velocity from the bonding surface 141 to the heat diffusing surface 142 and a surface guiding heat rate obeying the heat diffusing surface 142, the surface guiding heat rate is greater than the thickness The guide heat rate is more than five times, in other words, the flexible heat spread patch 140 should have a longitudinal heat transfer speed greater than five times the surface guide heat speed. In this embodiment, the surface conduction heat rate is more specifically greater than ten times the thickness of the thickness, and is between 450 and 1700 W/mK to accelerate the thermal diffusion of the lateral horizontal plane. Usually, the thickness of the thickness guide is about 5 to 15 W/mK. The surface guiding heat rate should be at least greater than the thermal conductivity of pure copper (about 350~400 W/mK).

In addition, the flexible heat diffusion patch 140 covers the first heat generating surface 121 of the main heat source integrated circuit component 120 and the first heat source product while extending over the interval S. The second heat generating surface 131 of the bulk circuit component 130 converts the second heat generating surface 131 into a heated surface. Preferably, one section of the flexible thermal diffusion patch 140 suspended on the interval S is soft and resettable. As used herein, "soft resettable" means that the suspension section of the flexible heat diffusion patch 140 is subjected to force deformation under external force of the finger; and thereafter, the suspension section is elastically reset without external force. The initial state at the time of attachment. Therefore, the flexible thermal diffusion patch 140 can be thermally conductive across the element and is not subject to the height difference of component mounting, and requires the addition of a thermal interface material such as a thermal paste. The heat of operation of the main heat source integrated circuit component 120 does not locally accumulate heat in the main heat source integrated circuit component 120, but the main heat source product The sum of the calculated heat of the bulk circuit component 120 and all of the secondary heat source integrated circuit components is evenly distributed over the primary heat source integrated circuit component 120 and all of the secondary heat source integrated circuit components, greatly reducing the defects caused by thermal shock. In addition, as shown in FIG. 2, the flexible heat diffusion patch 140 may have a length to width dimension that is close to but not greater than the length and width of the system connection board 110. In particular, the width of the flexible thermal diffusion patch 140 may be between 80% and 100% of the width of the system connection board 110, and the flexible thermal diffusion patch 140 is oriented toward one side of the contact fingers 112. The length to the other side of the positioning groove 113 should be greater than the width of the flexible heat diffusion patch 140. That is, the width ratio of the flexible thermal diffusion patch 140 relative to the system connection board 110 is between 0.8 and 1.0, and is greater than the ratio of the length of the flexible thermal diffusion patch 140 to the system connection panel 110. So that the flexible thermal diffusion patch 140 does not cover the contact fingers 112 and the positioning recess 113, and the flexible thermal diffusion patch 140 has a sufficiently large thermal diffusion area, and is connected via the system. During the process of transporting and securing the heat-dissipating electronic device 100, the flexible heat-dissipating patch 140 is used to calculate that the sides of the width are not subjected to frictional contact.

As shown in Figures 1, 5, and 6, the flexible thermal diffusion patch 140 is a multilayer composite structure. In this embodiment, the flexible thermal diffusion patch 140 preferably includes a metal core 143 such as a copper layer and a thermal diffusion layer 144 and a lower thermal diffusion layer 145 on one of the metal cores 143. The outer surface of one of the upper thermal diffusion layers 144 is covered with a coating film 146 for providing the thermal diffusion surface 142 and serving as an exposed protective layer for the patch. One of the bottom surfaces of the lower heat diffusion layer 145 is covered with an adhesive layer 147 for providing the adhesion surface 141 and having thermal conductivity. The metal core 143 is an intermediate layer of the flexible heat diffusion patch 140 for reinforcing the structure. Thickness of the metal core 143 The degree can be between 1.5 and 5 mils. In this embodiment, specifically, the upper thermal diffusion layer 144 and the lower thermal diffusion layer 145 comprise a plurality of planar crystals, such as a horizontally crystallizable graphite layer, for increasing the surface conduction heat rate relative to the thickness. The difference in the heat rate of the guide. The flexible thermal diffusion patch 140 may have an overall thickness of 0.02 to 0.1 mm, specifically 0.05 mm.

As shown in FIG. 1 , in the embodiment, the coating film 146 is further extended to cover the first circumference 143A of the metal core 143 and the second circumference of the upper thermal diffusion layer 144 . The third peripheral edge 145A of the 144A and the lower thermal diffusion layer 145 serves to prevent the debris of the upper thermal diffusion layer 144 and the lower thermal diffusion layer 145 from falling off and to prevent the lateral edges of the metal core 143 from being exposed.

As shown in FIGS. 1 and 2, the flexible thermal diffusion patch 140 covers the main heat source integrated circuit component 120 and the first heat source integrated circuit component 130 to expose the contact fingers 112 and the positioning. The recess 113, whereby the flexible thermal diffusion patch 140 does not interfere with the external electrical connection of the system connection board 110 and the mechanical reinforcement of the sheet. In this embodiment, the thermal diffusion electronic device 100 can further include at least one passive component 160 and a power module 180 mounted on the component bonding surface 111 of the system connection board 110. The diffusion patch 140 at least partially covers the passive component 160 and the power module 180 to achieve a dustproof protection effect. The flexible heat diffusion patch 140 can be further attached to the power module 180. When the height of the power module 180 is too low, the flexible heat diffusion patch 140 may not be attached to the power module 180 and the passive component 160.

In this embodiment, the thermal diffusion electronic device 100 can further include An identification pattern 150 is formed on the thermal diffusion surface 142 of the flexible thermal diffusion patch 140. The occupation pattern of the identification pattern 150 on the flexible thermal diffusion patch 140 is larger than the first heat generating surface. 121. Therefore, the identification pattern 150 is not peeled off by the influence of surface temperature unevenness. Specifically, the meaning of the identification pattern 150 can be a brand logo or a product specification. The structure of the identification pattern 150 can be an adhesive label or a printed layer.

In this embodiment, the thermal diffusion type electronic device 100 further includes at least one second heat source integrated circuit component 170 mounted on the component bonding surface 111 of the system connection board 110 and located in the main heat source product. The main heat source integrated circuit component 120 is spaced between the first heat source integrated circuit component 130 and the second secondary heat source integrated circuit component 170, the second secondary heat source The integrated circuit component 170 has a third heat generating surface 171 which is also attached to the third heat generating surface 171 of the second heat source integrated circuit component 170. In this embodiment, specifically, the second heat source integrated circuit component 170 includes a volatile memory chip package, for example, including a DRAM chip. The package pattern of the second heat source integrated circuit component 170 may also be a ball grid array package.

In accordance with a second embodiment of the present invention, another thermal diffusion electronic device 200 is illustrated in cross-section in FIG. The thermal diffusion electronic device 200 includes a system connection board 110, a main heat source integrated circuit component 120, at least a first heat source integrated circuit component 130, and a flexible thermal diffusion patch 140. In addition to the variation of the first height and the second height, the component of the second embodiment has a large detail structure The same as the component details of the first embodiment, the same reference numerals will be used and will not be described again.

The main heat source integrated circuit component 120 has a first heat generating surface 221 . The first heat generating surface 221 may specifically be a top surface of a packaging material. The first heat source integrated circuit component 130 has a second heat generating surface 131. In this embodiment, the first heat generating surface 221 to the system connecting plate 110 may have a first height H1, and the second heat generating surface 131 to the system connecting plate 110 may have a second height H2. The two height H2 is not the same as the first height H1. Specifically, the first height H1 is greater than the second height H2.

By the above technical means, the present invention provides a thermal diffusion type electronic device 100, 200, for example, by using the flexible heat diffusion patch 140 to cover the interval S in a one-piece manner while being attached to the main heat source. The first heat generating surface 121, 221 of the integrated circuit component 120 and the second heat generating surface 131 of the first heat source integrated circuit component 130, and the surface conduction heat rate is greater than five times the thickness of the thickness guide, The second heat generating surface 131 of the first heat source integrated circuit component 130 is converted into a heated surface for improving component fixing of the thin electronic product to avoid component peeling and system collapse.

The thermal diffusion type electronic device 100, 200 provided by the invention has the following effects:

1. The main heat source integrated circuit component 120 included does not have local heat accumulation to improve the component fixing of the thin electronic product to avoid component peeling and system collapse.

2. The mounting position of the main heat source integrated circuit component 120 included is not limited. When the main heat source integrated circuit component 120 is eccentrically mounted on a system connecting plate 110, effective lateral horizontal heat conduction can also be achieved, so that the component The mounting arrangement provides greater design flexibility.

Third, in addition to the heat sink fins can be omitted, the thermal interface material can be omitted or the amount of thermal interface material can be reduced. Moreover, the system connection plate 110 does not need to be provided with a mounting hole of the heat dissipation mechanism.

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and thus equivalent changes made in the claims of the present invention are still within the scope of the present invention.

Claims (12)

A thermal diffusion type electronic device comprising: a system connecting plate having a component joint surface; and a main heat source integrated circuit component eccentrically mounted on the component joint surface of the system connecting plate, the main heat source integrated body The circuit component has a first heat generating surface; at least one first heat source integrated circuit component is mounted on the component bonding surface of the system connection board and located on one side of the main heat source integrated circuit component, the first The secondary heat source integrated circuit component has a second heat generating surface, the main heat source integrated circuit component and the first heat source integrated circuit component have a space therebetween; and a flexible heat diffusion patch having a bonding surface and a thermal diffusion surface opposite to the attachment surface, the attachment surface contacting the first heat generating surface and the second heat generating surface, the flexible heat diffusion patch having a more The thickness of the attachment surface to the direction of the heat diffusion surface is guided by a heat transfer rate that is compliant with the surface of the heat diffusion surface, and the surface conduction heat rate is greater than five times the thickness of the thickness, and the flexible heat diffusion Patch system Covering the gap and simultaneously attaching the first heat generating surface of the main heat source integrated circuit component and the second heat generating surface of the first heat source integrated circuit component to convert the second heat generating surface into heat surface. The thermal diffusion type electronic device of claim 1, wherein the surface conduction heat rate is greater than ten times the thickness of the thickness, and Between 450~1700 watts/(meters x gram) (W/mK). The thermal diffusion electronic device of claim 1, wherein the first heat generating surface to the system connecting plate has a first height, and the second heat generating surface to the system connecting plate has a second height The second height is different from the first height, and a section of the flexible heat diffusion patch suspended on the interval is softly resettable. The thermal diffusion electronic device of claim 1, further comprising an identification pattern formed on the thermal diffusion surface of the flexible thermal diffusion patch, the identification pattern being thermally diffused in the flexible The occupied area on the patch is larger than the first heat generating surface. The thermal diffusion type electronic device of claim 1, wherein the first side of the system connecting plate is provided with a plurality of contact fingers, and the second side of the system connecting plate is opposite to the first side A positioning groove is disposed on one side, and the flexible heat diffusion patch covers the main heat source integrated circuit component and the first heat source integrated circuit component to expose the contact fingers and the positioning groove. The thermal diffusion electronic device of claim 5, further comprising at least one passive component and a power module mounted on the component bonding surface of the system connection board, the flexible thermal diffusion patch The passive component and the power module are at least partially covered. The thermal diffusion type electronic device according to claim 6, wherein the main heat source integrated circuit component is a controller chip package, and the first heat source integrated circuit component comprises a non-volatile memory. Chip package. The thermal diffusion type electronic device according to claim 1, further comprising at least one second heat source integrated circuit component mounted on the component bonding surface of the system connection board and located in the main heat source integrated circuit One of the opposite sides of the element, the main heat source integrated circuit component being spaced between the first heat source integrated circuit component and the second secondary heat source integrated circuit component, the second secondary heat source integrated circuit component having And a third heat generating surface, the flexible heat diffusion patch is also attached to the third heat generating surface of the second heat source integrated circuit component. The thermal diffusion electronic device of claim 8, wherein the second thermal source integrated circuit component comprises a volatile memory chip package. The thermal diffusion type electronic device according to any one of claims 1 to 9, wherein the flexible thermal diffusion patch comprises a metal core and a thermal diffusion layer on one of the metal cores and a heat The diffusion layer, the outer surface of the upper thermal diffusion layer is covered with a coating film for providing the thermal diffusion surface, and one of the bottom surfaces of the lower thermal diffusion layer covers an adhesive layer for providing the adhesion surface. The thermal diffusion type electronic device according to claim 10, wherein the coating film is further extended to cover a first circumference of the metal core, a second circumference of the upper thermal diffusion layer, and the lower portion. One of the third periphery of the thermal diffusion layer. The thermal diffusion type electronic device according to claim 11, wherein the upper thermal diffusion layer and the lower thermal diffusion layer comprise a plurality of planar crystals stacked in a plurality.