JPS6186987U - - Google Patents
Info
- Publication number
- JPS6186987U JPS6186987U JP17285584U JP17285584U JPS6186987U JP S6186987 U JPS6186987 U JP S6186987U JP 17285584 U JP17285584 U JP 17285584U JP 17285584 U JP17285584 U JP 17285584U JP S6186987 U JPS6186987 U JP S6186987U
- Authority
- JP
- Japan
- Prior art keywords
- metal container
- circuit wiring
- connection part
- circuit
- conductive wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Description
第１図は本考案の一実施例の要部の斜視図、第
２図は従来例の要部の斜視図、第３図は本考案の
別の実施例の要部の斜視図である。
１：回路基板、２：金属容器、３：回路端子、
４：導線、５：はんだ、６：接続部、７：溶接導
体。
FIG. 1 is a perspective view of a main part of an embodiment of the present invention, FIG. 2 is a perspective view of a main part of a conventional example, and FIG. 3 is a perspective view of a main part of another embodiment of the present invention. 1: circuit board, 2: metal container, 3: circuit terminal,
4: Conductor, 5: Solder, 6: Connection, 7: Welding conductor.
Claims (1)
基板が金属容器中に収容され、該容器と前記回路
配線とが導線によつて接続されるものにおいて、
金属容器に導体からなり該金属容器に比して著し
く断面の小さい接続部が備えられ、該接続部に回
路配線に接続される導線がろう付けされたことを
特徴とする電子装置。 An insulated circuit board equipped with circuit wiring on which circuit components are mounted is housed in a metal container, and the container and the circuit wiring are connected by a conductive wire,
An electronic device characterized in that a metal container is provided with a connection part made of a conductor and having a significantly smaller cross section than the metal container, and a conductive wire connected to circuit wiring is brazed to the connection part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17285584U JPS6186987U (en) | 1984-11-14 | 1984-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17285584U JPS6186987U (en) | 1984-11-14 | 1984-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6186987U true JPS6186987U (en) | 1986-06-07 |
Family
ID=30730513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17285584U Pending JPS6186987U (en) | 1984-11-14 | 1984-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6186987U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63195977A (en) * | 1987-02-10 | 1988-08-15 | 株式会社東芝 | Grounding mechanism of electric circuit unit |
| DE102017003977A1 (en) * | 2017-04-25 | 2018-10-25 | e.solutions GmbH | Housing component for an electronic device, method for manufacturing the housing component and electronic device with the housing component |
-
1984
- 1984-11-14 JP JP17285584U patent/JPS6186987U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63195977A (en) * | 1987-02-10 | 1988-08-15 | 株式会社東芝 | Grounding mechanism of electric circuit unit |
| DE102017003977A1 (en) * | 2017-04-25 | 2018-10-25 | e.solutions GmbH | Housing component for an electronic device, method for manufacturing the housing component and electronic device with the housing component |
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