JPH0367473U - - Google Patents
Info
- Publication number
- JPH0367473U JPH0367473U JP12900189U JP12900189U JPH0367473U JP H0367473 U JPH0367473 U JP H0367473U JP 12900189 U JP12900189 U JP 12900189U JP 12900189 U JP12900189 U JP 12900189U JP H0367473 U JPH0367473 U JP H0367473U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- soldered
- electronic component
- prevention structure
- short prevention
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示すリード線のシ
ヨート防止構造の構成図、第２図は第１図の基板
の上部に導電体部を設けて示す構成図、第３図は
従来のリード線のシヨート防止構造を示す構成を
示す構成図、第４図は第３図の基板の上部に導電
体部を設けて示す構成図である。
１１……基板、１２……電子部品、１３……リ
ード線、１４……半田、１５……導電体部。
Fig. 1 is a block diagram of a lead wire shot prevention structure showing an embodiment of the present invention, Fig. 2 is a block diagram showing a conductor section provided on the upper part of the substrate of Fig. 1, and Fig. 3 is a block diagram of a conventional structure. FIG. 4 is a block diagram showing a configuration of a lead wire short prevention structure, and FIG. 4 is a block diagram showing a structure in which a conductor portion is provided on the upper part of the substrate of FIG. 3. DESCRIPTION OF SYMBOLS 11... Board, 12... Electronic component, 13... Lead wire, 14... Solder, 15... Conductor part.
Claims (1)
て設け、該リード線の端部を半田付けするリード
線のシヨート防止構造において、前記電子部品の
上面にリード線を配置して前記リード線の端部を
半田付けすることにより、前記基板上部に設けら
れる導電体部が前記半田付け部に接触しないよう
にすることを特徴とするリード線のシヨート防止
構造。 In a lead wire short prevention structure in which a lead wire is provided adjacent to an electronic component mounted on a board and the end of the lead wire is soldered, the lead wire is arranged on the top surface of the electronic component and the lead wire is 1. A lead wire short prevention structure, characterized in that the end portions are soldered to prevent a conductive portion provided on the upper part of the substrate from coming into contact with the soldered portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12900189U JPH0367473U (en) | 1989-11-02 | 1989-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12900189U JPH0367473U (en) | 1989-11-02 | 1989-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367473U true JPH0367473U (en) | 1991-07-01 |
Family
ID=31676668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12900189U Pending JPH0367473U (en) | 1989-11-02 | 1989-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367473U (en) |
-
1989
- 1989-11-02 JP JP12900189U patent/JPH0367473U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0367473U (en) | ||
| JPH0383952U (en) | ||
| JPS6370133U (en) | ||
| JPH0292967U (en) | ||
| JPH01106074U (en) | ||
| JPH0365276U (en) | ||
| JPS6186987U (en) | ||
| JPS61156265U (en) | ||
| JPH01164673U (en) | ||
| JPH01139418U (en) | ||
| JPS62204371U (en) | ||
| JPH0244264U (en) | ||
| JPS62190374U (en) | ||
| JPH0221776U (en) | ||
| JPH033770U (en) | ||
| JPS6413718U (en) | ||
| JPH0316662U (en) | ||
| JPS5832657U (en) | semiconductor equipment | |
| JPS6157558U (en) | ||
| JPS5812972U (en) | electronic equipment | |
| JPH0395677U (en) | ||
| JPS6157564U (en) | ||
| JPS61131871U (en) | ||
| JPH03124660U (en) | ||
| JPS642468U (en) |