JPS63137912U - - Google Patents
Info
- Publication number
- JPS63137912U JPS63137912U JP3019787U JP3019787U JPS63137912U JP S63137912 U JPS63137912 U JP S63137912U JP 3019787 U JP3019787 U JP 3019787U JP 3019787 U JP3019787 U JP 3019787U JP S63137912 U JPS63137912 U JP S63137912U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- leads
- coil
- conductive layers
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
第１図は本考案の実施例に係わるコイル部品を
モールド前の状態で示す正面図、第２図は第１図
のコイル部品の左側面図、第３図は第１図の絶縁
基板の正面図、第４図は第１図のコイル部品の一
部を示す断面図、第５図は本考案の別の実施例の
コイル部品の一部を示す正面図である。
１…コイル、２…絶縁基板、３，４…リード、
５…絶縁包囲体、８，９…端末、１０，１１…導
体層、１２，１３…貫通孔、１４，１５…半田。
FIG. 1 is a front view showing a coil component according to an embodiment of the present invention before molding, FIG. 2 is a left side view of the coil component in FIG. 1, and FIG. 3 is a front view of the insulating substrate in FIG. 1. 4 is a sectional view showing a part of the coil component of FIG. 1, and FIG. 5 is a front view showing a part of the coil component of another embodiment of the present invention. 1... Coil, 2... Insulating board, 3, 4... Lead,
5... Insulating enclosure, 8, 9... Terminal, 10, 11... Conductor layer, 12, 13... Through hole, 14, 15... Solder.
Claims (1)
３，４とを少なくとも具備して構成され、 前記絶縁基板２に導体層１０，１１が設けられ
、 前記リード３，４と前記コイル１の端末８，９
とが前記導体層１０，１１に共通の導電性接合材
で電気的及び機械的に結合されていることを特徴
とするコイル部品。 (2) 前記絶縁基板２に貫通孔１２，１３が設け
られ、前記貫通孔１２，１３に前記リード３，４
の一端と前記端末８，９とが挿入されていること
を特徴とする実用新案登録請求の範囲第１項記載
のコイル部品。[Claims for Utility Model Registration] (1) The device is configured to include at least a coil 1, an insulating substrate 2 for relay, and leads 3, 4, the insulating substrate 2 is provided with conductive layers 10, 11, and the insulating substrate 2 is provided with conductive layers 10, 11, Leads 3, 4 and terminals 8, 9 of the coil 1
and are electrically and mechanically coupled to the conductive layers 10 and 11 using a common conductive bonding material. (2) Through holes 12 and 13 are provided in the insulating substrate 2, and the leads 3 and 4 are provided in the through holes 12 and 13.
The coil component according to claim 1, wherein one end of the coil component and the terminals 8 and 9 are inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3019787U JPS63137912U (en) | 1987-03-02 | 1987-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3019787U JPS63137912U (en) | 1987-03-02 | 1987-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63137912U true JPS63137912U (en) | 1988-09-12 |
Family
ID=30834787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3019787U Pending JPS63137912U (en) | 1987-03-02 | 1987-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63137912U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS445647Y1 (en) * | 1965-05-26 | 1969-02-28 | ||
| JPS6219718B2 (en) * | 1979-07-05 | 1987-04-30 | Mitsubishi Heavy Ind Ltd |
-
1987
- 1987-03-02 JP JP3019787U patent/JPS63137912U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS445647Y1 (en) * | 1965-05-26 | 1969-02-28 | ||
| JPS6219718B2 (en) * | 1979-07-05 | 1987-04-30 | Mitsubishi Heavy Ind Ltd |