JP2002246703A - Method for producing separate board piece, board piece and assembled board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a board piece, in which unnecessary conductor patterns can be surely removed, at cutting of a board into board pieces. SOLUTION: The method for producing a board piece comprises a step for sectioning a planar board 6 into a plurality regions 7 of a specified size, interconnecting a connector part 9 for through hole surrounding each of a plurality of through-holes 8 penetrating the board 6 in the thickness direction and an adjacent conductor part 9 for through-hole on the boundary of adjacent regions 7 and forming a conductor part 11 for plating extending along the boundary 7, and a step for cutting the board 6 along the boundary 7, passing through the axis of the through hole 8 to produce board pieces 1, where the board 6 is provided with a resist layer 2 for securing the conductor part 11 for plating to the surface of the board 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to, for example, IrD
The present invention relates to a technique for manufacturing an individual substrate on which an infrared data communication module using the A method is mounted.

[0002]

2. Description of the Related Art Conventionally, in portable telephones, notebook personal computers, and the like, IrDA (Infrared) has been used between these devices or peripheral devices such as printers.
Infrared data communication using the DataAssociation method is performed. In such an infrared data communication, for example, an infrared data communication module (hereinafter, simply referred to as a “module”) internally provided with a light emitting element and a light receiving element for infrared rays is used.

[0003] This module, as shown in FIG.
For example, they may be mounted on an individual substrate 1 slightly larger than the size and combined to be used as an electronic component. The electronic component is mounted on, for example, a mother board (not shown) provided inside the mobile phone. In this case, the individual board 1 is used to set the height of the module 2 with respect to the mother board. . That is, the individual substrate 1 allows the light emitting and receiving elements of the module 2 to be arranged in correspondence with an opening (not shown) formed in, for example, a case of a mobile phone. Infrared data communication can be favorably performed with another module via the opening.

The individual substrate 1 is made of, for example, glass epoxy resin and is formed in a substantially rectangular parallelepiped shape. A predetermined conductor pattern 3 made of copper or the like is formed on the front and back surfaces 1a and 1b of the individual substrate 1. A plurality of grooves 4 are formed on the side surface 1 c of the individual substrate 1 along the thickness direction of the individual substrate 1. A conductor layer (not shown) is formed on the inner peripheral surface of each groove 4, and the conductor pattern 3 formed on the front surface 1a of the individual substrate 1 by this conductor layer is formed on the back surface 1b. Conducted with no conductor pattern. The module 2 to which the shield case 5 is mounted is soldered and mounted on the conductor pattern 3 on the surface 1a side of the individual substrate 1.

As shown in FIGS. 16 and 17, for example, the individual substrate 1 is obtained by cutting a plate-like substrate 6 into rectangular sections 7 (see the dotted lines in FIG. 16). Formed by That is, in the substrate 6, a plurality of regions 7 are vertically and horizontally arranged and partitioned, and the region 7 is a portion that eventually becomes the individual substrate 1.

[0006] At a boundary portion in the lateral direction of the adjacent region 7, an appropriate number of through holes 8 penetrating in the thickness direction of the substrate 6 and having a conductor layer (not shown) on the inner peripheral surface are formed. . The through hole 8 is cut along the axial direction when the substrate 6 is cut, and becomes the groove 4 described above.
As shown in FIG. 17, a predetermined conductor pattern 3 made of, for example, copper is formed on the front and back surfaces of the substrate 6 (the back surface is not shown). In the conductor pattern 3, a conductor portion 9 for a through hole is formed particularly around the opening of the through hole 8 on the surface of the substrate 6. The conductor portion 9 for through hole is electrically connected to the conductor layer of the through hole 8.

A connecting conductor pattern 11 is formed between the adjacent through-hole conductors 9 and extends along the boundary of the region 7 to connect them. The conductor pattern 11 for connection is provided for supplying a current to each conductor pattern 3 when, for example, applying solder plating or the like to the conductor portion 9 for through hole or another conductor pattern 3 by an electrolytic plating method. And has a predetermined pattern width (for example, about 0.2 mm) (hereinafter, the connecting conductor pattern 11 is referred to as a “plating conductor portion 11”).
That. ). In addition, since the plating conductor portion 11 connects the conductor layers of the adjacent groove portions 4 to each other, it is finally cut off. In FIG. 16, reference numeral 40 denotes an engagement hole for fixing the substrate 6 as necessary in the manufacturing process of the individual substrate 1.

[0008] The substrate 6 is formed by alternate long and short dash lines L1, L shown in FIG.
The wafer is cut along the area 2 into each region 7 and divided into individual substrates 1. In this dividing step, a blade (not shown) having a width of about 0.5 mm is used, and first, each region 7 is cut along a boundary in the lateral direction. In this case, since the pattern width of the plating conductor 11 is sufficiently smaller than the width of the blade, the substrate 6 is cut off when the substrate 6 is cut by the blade.

[0009]

However, when the substrate 6 is actually cut along the boundary of each region 7 using the above-mentioned blade, the pattern width of the plating conductor 11 is smaller than the width of the blade. In spite of the presence, there is a case where the sheet is divided right and left while being separated from the surface of the substrate 6 and spread. Then, as shown in FIG. 18, the plating conductor portion 11 is not cut off at the side edge portion of the cut substrate 6, but remains in a state where the adjacent through-hole conductor portions 9 are short-circuited. If the plating conductor 11 remains in the above state, it is not preferable in terms of an electric circuit. Further, if the plating conductor portion 11 remains, there is a problem that after the substrate 6 is cut, an operation of removing it for each individual substrate 1 occurs, which increases the operation cost.

In this case, in order to completely cut off the conductor 11 for plating, it is conceivable to form the pattern width of the conductor 11 for plating as small as possible. A pattern width of about 0.2 mm is required at a minimum.

[0011]

DISCLOSURE OF THE INVENTION The present invention has been conceived in view of the above circumstances, and when a substrate is cut and divided into individual substrates, unnecessary conductor patterns can be reliably removed. An object of the present invention is to provide a method of manufacturing an individual substrate, and an individual substrate and an aggregate substrate.

In order to solve the above problems, the present invention employs the following technical means.

According to a method of manufacturing an individual substrate provided by the first aspect of the present invention, a flat substrate is divided into a plurality of regions having a predetermined size, and the plurality of regions are formed on boundaries between the adjacent regions. Forming a through-hole conductor pattern surrounding each of the plurality of through-holes penetrating in the thickness direction of the substrate; and forming a connection conductor pattern connecting the adjacent through-hole conductor patterns and extending along the boundary. A method for manufacturing an individual substrate, comprising the steps of: cutting along the boundary passing through the axis of the through hole to form an individual substrate, wherein the substrate has the connecting conductor pattern. It is characterized in that a substrate on which a resist layer for fixing to a surface of a substrate is formed is used. Specifically, the lateral width of the resist layer is larger than the pattern width of the connection conductor pattern, and the resist layer is formed so as to cover the connection conductor pattern. Here, the connection conductor pattern is used as a plated wire for applying, for example, solder plating on at least the through hole conductor pattern.

According to this manufacturing method, when the substrate is cut into predetermined pieces by using, for example, a blade and divided into individual pieces, the board is formed with a plurality of through-holes formed at boundaries between the respective areas. It is cut along a line passing through the axis.
In this case, the conductor pattern for connection formed between the conductor patterns for through-holes formed along the boundary of each region is conventionally exposed to the outside,
When cut by a blade, the substrate may be divided right and left and spread while peeling off from the surface of the substrate, and may remain at the side edges of the substrate after cutting.

However, according to the present invention, since the connection conductor pattern is firmly fixed on the substrate by the resist layer, the connection conductor pattern is reliably cut off without peeling off from the substrate at the time of cutting by the blade. Moreover, since the resist layer is formed so as to cover the connection conductor pattern, it is possible to suppress the connection conductor pattern from being spread right and left while being divided, so that the connection conductor pattern is more reliably cut off. Is done. Therefore, it is possible to prevent the adjacent through-hole conductor patterns from being short-circuited in an electric circuit after the substrate is cut. In addition, after the substrate is cut, the operation of removing the remaining plating conductor pattern for each individual substrate can be omitted, and the manufacturing cost can be reduced.

According to a preferred embodiment, the resist layer may be made of the same material as the substrate. According to this, the adhesion between the resist layer and the substrate is further improved, and the connection conductor pattern can be more firmly fixed to the substrate.

According to another preferred embodiment, the resist layer is formed in the same step as the step of forming a protective layer for protecting another conductor pattern formed on the substrate. Good. As described above, if the resist layer is formed in the same step as the protective layer, there is no need to separately provide a step of forming the resist layer, and the manufacturing time can be reduced.

According to another preferred embodiment, in the step of cutting the substrate, the substrate may be cut by cutting with a predetermined blade from the side on which the resist layer is formed. According to this, since the order of cutting by the blade is the resist layer and then the connection conductor pattern, the possibility that the connection conductor pattern is peeled from the substrate can be reduced.

The individual substrate provided by the second aspect of the present invention is characterized by being manufactured by the manufacturing method provided in the first aspect. According to this configuration, the individual substrate can be easily obtained by the manufacturing method according to the first aspect, and as a result, the same functions and effects as those of the first aspect can be obtained.

The collective substrate provided by the third aspect of the present invention has a flat plate-shaped main body, is divided into a plurality of regions having a predetermined size, and is formed on a boundary between the adjacent regions. A through-hole conductor pattern surrounding each of the plurality of through-holes penetrating in the thickness direction of the substrate is formed, and a connection conductor connecting the adjacent through-hole conductor patterns and extending along a boundary of the region A pattern is formed, a collective substrate that is cut along the boundary passing through the axis of the through hole and used to manufacture an individual substrate, and on the connection conductor pattern, A resist layer for fixing to the surface of the main body is formed.

[0021] Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings. In addition,
In the following description, FIG. 15 described in the section of the related art will be referred to again.

As shown in FIG. 15, the individual substrate 1 is made of, for example, glass epoxy resin and is formed in a substantially rectangular parallelepiped shape, and has an infrared data communication module (hereinafter, simply referred to as "module") 2 mounted on its surface 1a. are doing. The individual substrate 1 on which the module 2 is mounted is mounted as an electronic component on, for example, a mother substrate (not shown) provided inside a portable telephone. In this case, the individual substrate 1
It is used to set the height of the module 2 with respect to the motherboard.

The individual substrate 1 has a thickness of, for example, about 3.
It is set to 5 mm. In the individual substrate 1, a substrate having a value different from this thickness can also be manufactured. The individual substrate 1 having a thickness corresponding to the height of the module 2 with respect to the mother substrate is appropriately manufactured and used as needed. Can be As will be described later, the individual substrate 1 is formed by dividing a flat substrate 6 by cutting it vertically and horizontally.

On the front and back surfaces 1a and 1b of the individual substrate 1, a predetermined conductor pattern 3 made of, for example, copper is formed. More specifically, as shown in FIG.
On the front surface 1a of the individual substrate 1, when the module 2 is mounted, the terminal portion conductor portion 16 connected to the external terminal portion 31 (described later) of the module 2 and the shield case 5 (described later) of the module 2 The shield case conductor 17 connected to a part thereof and the substantially semi-cylindrical inner surface groove 4 formed along the side surface 1c of the individual substrate 1
a through-hole conductor portion 9 formed so as to surround on a
And a routing conductor 19 connecting the conductors 16, 17, 9 to each other.

As shown in FIG. 2, on the back surface 1b of the individual substrate 1, a plurality of through-hole back surface conductor portions 18 as conductor patterns 3 formed so as to surround the groove portions 4 are formed.
Are formed. A conductor layer (not shown) in which the inner peripheral surface of the groove portion 4 is plated with copper is formed. The conductor layer includes a conductor portion 9 for a through-hole on the front surface 1 a of the individual substrate 1 and a back surface. 1b is connected to the back surface conductor portion 18 for a through hole, respectively, to electrically conduct both.

A resist layer 20 is formed on the side edge of the surface 1a of the individual substrate 1. As will be described later, the resist layer 20 is formed to cut off the conductor portion 11 for plating, and a part thereof remains when the individual substrate 1 is divided.

On the other hand, as shown in FIGS. 3 and 4, the module 2 comprises a substantially rectangular substrate 21, a light emitting device 22 composed of a light emitting diode and the like mounted on the substrate 21, and a light receiving device composed of a PIN photodiode and the like. 23, an integrated circuit element 24 for controlling transmission / reception operations by the light emitting element 22 and the light receiving element 23, and a molded body integrally sealed with a molding resin so as to cover the elements 22, 23, 24 so as to cover them. 25.
A light-emitting lens portion 2 is provided on a top surface 25 a of the mold body 25 corresponding to the light-emitting element 22 and the light-receiving element 23.
6 and a light receiving lens portion 27 are formed.

A predetermined wiring pattern 28 is formed on the front and back surfaces 21a and 21b of the substrate 21. In particular, substrate 2
An external terminal portion 31 as a wiring pattern 28 is formed on one back surface 21b. A substantially arc-shaped groove-shaped concave portion 32 is formed on the side surface 21c of the substrate 21. The wiring pattern 28 on the front surface 21a of the substrate 21 and the external terminal portion 31 on the rear surface 21b are formed on the inner peripheral surface of the groove-shaped concave portion 32. Conduction is performed via the conductor layer (not shown).

The shield case 5 is mounted around the mold 25 and the substrate 21. The shield case 5 is made of metal and is intended to prevent the influence of external noise (noise due to electromagnetic waves or light). The shield case 5 covers the outer surface of the module 2 and extends between the light emitting and light receiving lens portions 26 and 27.
3a is mounted on the module 2 so as to be arranged. At the tip of the extension portion 33a, an overhang portion 33b connected to the shield case conductor portion 17 on the front surface 1a of the individual substrate 1 is formed.

The individual substrate 1 is manufactured, for example, by the following manufacturing process. That is, in this manufacturing method, as shown in FIG. 5, a flat substrate 6 made of, for example, glass epoxy resin and formed in a substantially rectangular shape is used. The substrate 6 has a size such that a number of individual substrates 1 can be arranged vertically and horizontally, and a region 7 having a fixed size is defined corresponding to each individual substrate 1. An engagement hole 40 for fixing the substrate 6 is formed on the side edge portion of the substrate 6 as necessary in the manufacturing process of the individual substrate 1.

Next, as shown in FIG. 6, a predetermined conductor pattern 3 is formed on the front surface and the back surface (not shown) of the substrate 6 for each region 7 of the substrate 6 by a known photolithography method. As the conductor pattern 3, the substrate 6
Terminal portion 16 and shield case conductor portion 1 formed at predetermined positions in region 7 on the surface of
7, conductor portion 9 for through hole, conductor portion 19 for routing,
And a conductor portion 11 for plating formed along the boundary between the adjacent regions 7. Further, although not shown, the back surface conductor portion 18 for a through hole formed on the back surface of the substrate 6.
(See FIG. 2).

The conductor pattern 3 is formed, for example, by applying a resist material to a substrate 6 having a copper foil on the surface, exposing and developing using a mask on which a desired pattern is drawn, and etching unnecessary portions of the copper foil by etching. Is formed.

The plating conductor 11 is provided between the adjacent through-hole conductors 9, that is, in each region 7.
Are formed to extend linearly along a boundary portion in the short direction and have a predetermined width (for example, about 0.2 mm). The plating conductor portion 11 is provided to energize each conductor pattern 3 when the through-hole conductor portion 9 is subjected to metal plating by an electrolytic plating method. Since the plating conductor portion 11 is formed so as to connect the through-hole conductor portion 9, portions of the conductor pattern 3 that require plating are electrically connected to each other,
Thereby, favorable plating treatment can be performed. Since the plating conductor portion 11 short-circuits between the through-hole conductor portions 9, it is finally cut off.

Next, a through hole 8 is formed in each of the substantially circular conductors 9 for through holes, as shown in FIG. The through-hole 8 is formed concentrically with the through-hole conductor 9 by a predetermined drill or the like, and has a hole diameter smaller than the diameter of the through-hole conductor 9. In addition, through hole 8
May be formed before the conductor pattern 3 is formed in the state of the flat substrate 6 shown in FIG. Subsequently, a conductor layer (not shown) is formed on the inner peripheral surface of the through hole 8 by, for example, electroless plating. Above through hole 8
Is a groove 4 for finally conducting the front and back surfaces of the substrate 6.
(See FIG. 15).

Next, a resist layer 20 for fixing the plating conductor 11 to the surface of the substrate 6 is formed. Specifically, as shown in FIGS. 8 and 9, the resist layer 20
The width A is larger than the pattern width B of the plating conductor portion 11, and is formed so as to cover the plating conductor portion 11 at a portion between the adjacent through-hole conductor portions 9.

The resist layer 20 is formed using, for example, a photolithography method.
Using a mask (not shown) having a window hole corresponding to a portion to be exposed, a layer formed in advance on the entire surface of the substrate 6 is subjected to an exposure process, and then developed to form an opening. The portion other than the opening is the portion that becomes the resist layer 20 in this case.

As described above, by forming the resist layer 20, the plating conductor 11 is fixed on the substrate 6 by the resist layer 20, so that the adhesion to the substrate 6 can be maintained. Moreover, since the resist layer 20 is made of the same epoxy resin as the substrate 6, the resist layer 20
The adhesion between the substrate and the substrate 6 is further enhanced, whereby the plating conductor 11 can be more firmly fixed to the substrate 6.

On the surface of the substrate 6, in addition to the resist layer 20, the surface of the substrate 6 and other conductive patterns 3
A protective layer 34 having an electrical insulation property for protecting the like may be formed, and the protective layer 34 may cover a portion other than a portion that needs to be exposed to the outside. In this case, when the protective layer 34 is formed of the same material as the resist layer 20, both may be formed in the same step. As described above, the resist layer 20 includes the protective layer 34.
If it is formed in the same step as above, there is no need to separately provide a step of forming the resist layer 20, and there is an advantage that the manufacturing time can be reduced.

As described above, in the manufacturing method of the individual substrate 1, the resist layer 20 is formed so as to cover the conductor 11 for plating.
Is used, and after being subjected to electrolytic plating, the module 1 is mounted and cut as shown below, so that the individual substrate 1 on which the module 1 is mounted is formed.
Is produced.

That is, for example, gold plating or solder plating is applied to each exposed conductor pattern 3 by electrolytic plating. Specifically, the exposed conductor pattern 9 for the through-hole, the conductor 17 for the shield case, the conductor 16 for the terminal as the exposed conductor pattern 3 are used as a cathode, the plating metal is used as an anode, and the electrolysis including the plating metal is used. The plating metal adheres to the exposed conductor pattern 3 by immersing the substrate 6 in the liquid and passing a direct current. In this case, since the plating conductor 11 is formed so as to connect the adjacent through-hole conductors 9, the conductor pattern 3 including the through-hole conductor 9 is electrically conducted. .

Next, a separately manufactured module 2 is mounted on each area 7 of the substrate 6. In detail, as shown in FIG. 10, in each region 7 of the substrate 6, the external terminal portion 31 (not shown) of the module 2 is connected to the terminal portion conductor portion 16 on the front surface 25 a and the shield case conductor portion 17 is formed. The projecting portions 33b of the shield case 5 are connected to each other, and the module 2 is mounted on each area 7 of the substrate 6 by performing, for example, a reflow process.

Thereafter, the area 7 in which the module 2 is mounted
Each time, the substrate 6 is cut vertically and horizontally to obtain a single-piece individual substrate 1. Specifically, the substrate 6 is cut in the horizontal direction along the alternate long and short dash line L1 shown in FIG. 11 to obtain a horizontally long intermediate product. As shown in FIGS. 12 and 13, a disk-shaped blade 35 that can be driven to rotate is used for cutting the substrate 6. This blade 3
5 has a width of about 0.5 mm, which is smaller than the hole diameter of the through hole 8 and larger than the pattern width B of the conductor portion 11 for plating. The blade 35 is cut from the front surface of the substrate 6 toward the rear surface thereof, thereby cutting the substrate 6 in the thickness direction of the substrate 6.

As a result, the through-hole conductor 9 is
It is formed in an arc shape in plan view. The plating conductor 11 formed between the adjacent through-hole conductors 9 is cut off by the blade 35 together with a part of the resist layer 20 formed on the upper surface thereof.

Conventionally, since the plating conductor portion 11 is exposed to the outside, when it is cut by the blade 35, the plating conductor portion 11 is separated from the surface of the substrate 6 and is divided into right and left portions to expand. The portion 9 may remain in a short-circuited state. However, in this embodiment, since the plating conductor 11 is covered with the resist layer 20, it is firmly fixed on the substrate 6, and is prevented from spreading left and right during cutting. Therefore, the conductor portion 11 for plating is
At the time of cutting by 5, it is held without being separated from the substrate 6, so that it is reliably cut off.

Therefore, it is possible to prevent the adjacent through-hole conductors 9 from being short-circuited in an electric circuit after the substrate 6 is cut. Further, as in the related art, after the substrate 6 is cut, the operation of removing the remaining plating conductor portion 11 for each individual substrate 1 can be omitted, and the manufacturing cost can be reduced.

When the substrate 6 is cut, the substrate 6 is cut from the side on which the resist layer 20 is formed with a blade 35. Therefore, since the order of cutting by the blade 35 is the resist layer 20 and then the plating conductor 11, the possibility that the plating conductor 11 is separated from the substrate 6 can be further reduced.

Thereafter, in the horizontally long intermediate product, each region 7
In order to remove unnecessary portions positioned on the left and right of the intermediate product, that is, the intermediate product is cut along the dashed line L2 shown in FIG. In this manner, the substrate 6 is cut to obtain the individual substrate 1 on which the plurality of modules 2 are mounted.

The module 2 obtained as described above
Is mounted on a mother board 41 provided inside a portable telephone, for example, as an electronic component, as shown in FIG. That is, the back surface conductor portion 18 for the through hole formed on the back surface 1 b of the individual substrate 1 is soldered to the wiring pattern 42 of the mother substrate 41 by, for example, a solder reflow process, so that the individual substrate on which the module 2 is mounted. 1 is mounted on the motherboard 41.

The module 2 is raised to a predetermined height with respect to the mother substrate 41 by the individual substrate 1, so that, for example, an opening (not shown) formed in a case of a portable telephone is inserted into the module 2. Light receiving and emitting elements 22, 23
Can be arranged correspondingly. Then, by being arranged opposite to another module (not shown) of the partner device, data communication by infrared rays is performed. That is, the light emitting element 22 converts an electric signal sent from the integrated circuit element 24 into an optical signal, and emits infrared light as the optical signal to another module through the opening. On the other hand, the light receiving element 23 converts infrared light, which is an optical signal received from another module through the opening, into an electric signal, and provides the electric signal to the integrated circuit element 24.

Of course, the scope of the present invention is not limited to the above embodiment, and various changes can be made within the scope of the invention. For example, instead of the module 2, another electronic component may be mounted as the electronic component mounted on the individual substrate 1. In that case, a conductor pattern corresponding to the terminal form of the electronic component is formed on the surface 1a of the substrate piece 1.

The above-described manufacturing method for completely removing the plating conductor 11 may be applied, for example, when manufacturing the module 2. Also, the substrate 6,
The shape, size, material, and the like of the individual substrate 1 and the conductor pattern 3 are not limited to the above-described embodiment.

[Brief description of the drawings]

FIG. 1 is a plan view of an individual substrate according to the present invention.

FIG. 2 is a rear view of the individual substrate shown in FIG.

FIG. 3 is a perspective view of the infrared data communication module.

FIG. 4 is an internal configuration diagram of the infrared data communication module.

FIG. 5 is a plan view of a conventional substrate.

FIG. 6 is a partially enlarged plan view of a substrate.

FIG. 7 is a partially enlarged plan view of a substrate in which a through hole is formed.

FIG. 8 is a partially enlarged plan view of a substrate on which a resist layer is formed.

9 is a cross-sectional view of the substrate as viewed in the direction IX-IX of FIG.

FIG. 10 is a partially enlarged plan view of a substrate on which the infrared data communication module is mounted.

FIG. 11 is a partially enlarged plan view of the substrate, showing a cutting line.

FIG. 12 is a diagram showing a cutting state of the substrate as viewed in the XII-XII direction of FIG. 11;

FIG. 13 is a diagram showing a cutting state of a substrate.

FIG. 14 is a cross-sectional view showing a state where an individual substrate is mounted on a mother substrate.

FIG. 15 is a perspective view of an individual substrate on which the infrared data communication module is mounted.

FIG. 16 is a plan view of a conventional substrate.

FIG. 17 is a partially enlarged plan view of a conventional substrate.

FIG. 18 is a partially enlarged plan view of the substrate after cutting.

[Explanation of symbols]

 Reference Signs List 1 piece substrate 2 infrared data communication module 6 substrate 7 area 8 through hole 9 conductor for through hole 11 conductor for plating 20 resist layer

Claims (8)

[Claims] 1. A flat substrate is divided into a plurality of regions having a predetermined size, and each of a plurality of through holes penetrating in a thickness direction of the substrate is surrounded on a boundary between the regions adjacent to each other. Forming a conductor pattern for a through-hole and a conductor pattern for connection connecting the adjacent conductor patterns for a through-hole and extending along the boundary; cutting along the boundary passing through the axis of the through-hole; And a step of forming an individual substrate, wherein the substrate has a resist layer formed thereon for fixing the connection conductor pattern to the surface of the substrate. A method for manufacturing an individual substrate. 2. The connection layer according to claim 1, wherein a width of the resist layer is larger than a pattern width of the connection conductor pattern, and the resist layer is formed so as to cover the connection conductor pattern. A method for manufacturing an individual substrate. 3. The method according to claim 1, wherein the resist layer is made of the same material as the substrate. 4. The method according to claim 1, wherein the resist layer is formed in the same step as a step of forming a protective layer for protecting another conductive pattern formed on the substrate. 4. The method for manufacturing an individual substrate according to 1. 5. The method for manufacturing an individual substrate according to claim 1, wherein the connection conductor pattern is used as a plating wire for electroplating at least on the conductor pattern for a through hole. . 6. The individual substrate according to claim 1, wherein, in the step of cutting the substrate, the substrate is cut by cutting with a predetermined blade from the side on which the resist layer is formed. Production method. 7. An individual substrate manufactured by the manufacturing method according to any one of claims 1 to 6. 8. A plurality of through-holes each having a plate-shaped main body, divided into a plurality of regions having a predetermined size, and each of a plurality of through-holes penetrating in a thickness direction of the substrate on a boundary between the adjacent regions. A conductor pattern for a through hole surrounding the conductor pattern for the through hole is formed, and a conductor pattern for the connection that connects the adjacent conductor patterns for the through hole and extends along the boundary of the region is formed. A collective substrate that is cut along the boundary passing through the heart and is used for manufacturing an individual substrate, and a resist layer for fixing it to the main body surface is formed on the connection conductor pattern. A collective substrate, characterized by being made.