JPS51125865A - Method of manufacturing ceramic wiring substrate - Google Patents

Method of manufacturing ceramic wiring substrate

Info

Publication number
JPS51125865A
JPS51125865A JP4969675A JP4969675A JPS51125865A JP S51125865 A JPS51125865 A JP S51125865A JP 4969675 A JP4969675 A JP 4969675A JP 4969675 A JP4969675 A JP 4969675A JP S51125865 A JPS51125865 A JP S51125865A
Authority
JP
Japan
Prior art keywords
wiring substrate
ceramic wiring
manufacturing ceramic
manufacturing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4969675A
Other languages
Japanese (ja)
Other versions
JPS5842639B2 (en
Inventor
Kanji Ootsuka
Michiaki Furukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4969675A priority Critical patent/JPS5842639B2/en
Publication of JPS51125865A publication Critical patent/JPS51125865A/en
Publication of JPS5842639B2 publication Critical patent/JPS5842639B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP4969675A 1975-04-25 1975-04-25 Manufacturing method of ceramic wiring board Expired JPS5842639B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4969675A JPS5842639B2 (en) 1975-04-25 1975-04-25 Manufacturing method of ceramic wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4969675A JPS5842639B2 (en) 1975-04-25 1975-04-25 Manufacturing method of ceramic wiring board

Publications (2)

Publication Number Publication Date
JPS51125865A true JPS51125865A (en) 1976-11-02
JPS5842639B2 JPS5842639B2 (en) 1983-09-21

Family

ID=12838334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4969675A Expired JPS5842639B2 (en) 1975-04-25 1975-04-25 Manufacturing method of ceramic wiring board

Country Status (1)

Country Link
JP (1) JPS5842639B2 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561595A (en) * 1979-06-15 1981-01-09 Matsushita Electric Works Ltd Method of forming electric path for circuit board
JPS57184240A (en) * 1981-02-09 1982-11-12 British Telecomm Integrated circuit chip carrier and method of producing same
JPS58170041A (en) * 1982-03-31 1983-10-06 Narumi China Corp Laminate for package and manufacture thereof
JPS6024093A (en) * 1984-06-04 1985-02-06 株式会社日立製作所 Method of producing ceramic circuit board
JPS624348A (en) * 1985-07-01 1987-01-10 Nec Corp Manufacture of semiconductor device package
JPS6381892A (en) * 1986-09-25 1988-04-12 双信電機株式会社 Method of dividing breakable board for electric circuit
JPH01157468U (en) * 1988-11-24 1989-10-30
JPH0274056A (en) * 1988-09-09 1990-03-14 Matsushita Electric Ind Co Ltd Chip carrier and chip carrier array
JPH0550731U (en) * 1991-12-05 1993-07-02 オリジン電気株式会社 Insulating substrate, semiconductor device and circuit device using the same
JPH0832204A (en) * 1994-07-19 1996-02-02 Dowa Mining Co Ltd Production of ceramic wiring board
JP2002246703A (en) * 2001-02-13 2002-08-30 Rohm Co Ltd Method for producing separate board piece, board piece and assembled board
JP2007043061A (en) * 2005-06-28 2007-02-15 Kyocera Corp Multi-pattern wiring board
JP2015119092A (en) * 2013-12-19 2015-06-25 京セラ株式会社 Multi-piece wiring board, wiring board and electronic apparatus

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561595A (en) * 1979-06-15 1981-01-09 Matsushita Electric Works Ltd Method of forming electric path for circuit board
JPS57184240A (en) * 1981-02-09 1982-11-12 British Telecomm Integrated circuit chip carrier and method of producing same
JPS58170041A (en) * 1982-03-31 1983-10-06 Narumi China Corp Laminate for package and manufacture thereof
JPS6248384B2 (en) * 1982-03-31 1987-10-13 Narumi China Corp
JPS6024093A (en) * 1984-06-04 1985-02-06 株式会社日立製作所 Method of producing ceramic circuit board
JPS6155280B2 (en) * 1984-06-04 1986-11-27 Hitachi Ltd
JPS624348A (en) * 1985-07-01 1987-01-10 Nec Corp Manufacture of semiconductor device package
JPS6381892A (en) * 1986-09-25 1988-04-12 双信電機株式会社 Method of dividing breakable board for electric circuit
JPH0274056A (en) * 1988-09-09 1990-03-14 Matsushita Electric Ind Co Ltd Chip carrier and chip carrier array
JPH01157468U (en) * 1988-11-24 1989-10-30
JPH0346518Y2 (en) * 1988-11-24 1991-10-01
JPH0550731U (en) * 1991-12-05 1993-07-02 オリジン電気株式会社 Insulating substrate, semiconductor device and circuit device using the same
JPH0832204A (en) * 1994-07-19 1996-02-02 Dowa Mining Co Ltd Production of ceramic wiring board
JP2002246703A (en) * 2001-02-13 2002-08-30 Rohm Co Ltd Method for producing separate board piece, board piece and assembled board
JP4554831B2 (en) * 2001-02-13 2010-09-29 ローム株式会社 Method for manufacturing individual substrate, individual substrate and collective substrate
JP2007043061A (en) * 2005-06-28 2007-02-15 Kyocera Corp Multi-pattern wiring board
JP2015119092A (en) * 2013-12-19 2015-06-25 京セラ株式会社 Multi-piece wiring board, wiring board and electronic apparatus

Also Published As

Publication number Publication date
JPS5842639B2 (en) 1983-09-21

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