JPS51125865A - Method of manufacturing ceramic wiring substrate - Google Patents
Method of manufacturing ceramic wiring substrateInfo
- Publication number
- JPS51125865A JPS51125865A JP4969675A JP4969675A JPS51125865A JP S51125865 A JPS51125865 A JP S51125865A JP 4969675 A JP4969675 A JP 4969675A JP 4969675 A JP4969675 A JP 4969675A JP S51125865 A JPS51125865 A JP S51125865A
- Authority
- JP
- Japan
- Prior art keywords
- wiring substrate
- ceramic wiring
- manufacturing ceramic
- manufacturing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4969675A JPS5842639B2 (en) | 1975-04-25 | 1975-04-25 | Manufacturing method of ceramic wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4969675A JPS5842639B2 (en) | 1975-04-25 | 1975-04-25 | Manufacturing method of ceramic wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51125865A true JPS51125865A (en) | 1976-11-02 |
JPS5842639B2 JPS5842639B2 (en) | 1983-09-21 |
Family
ID=12838334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4969675A Expired JPS5842639B2 (en) | 1975-04-25 | 1975-04-25 | Manufacturing method of ceramic wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5842639B2 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS561595A (en) * | 1979-06-15 | 1981-01-09 | Matsushita Electric Works Ltd | Method of forming electric path for circuit board |
JPS57184240A (en) * | 1981-02-09 | 1982-11-12 | British Telecomm | Integrated circuit chip carrier and method of producing same |
JPS58170041A (en) * | 1982-03-31 | 1983-10-06 | Narumi China Corp | Laminate for package and manufacture thereof |
JPS6024093A (en) * | 1984-06-04 | 1985-02-06 | 株式会社日立製作所 | Method of producing ceramic circuit board |
JPS624348A (en) * | 1985-07-01 | 1987-01-10 | Nec Corp | Manufacture of semiconductor device package |
JPS6381892A (en) * | 1986-09-25 | 1988-04-12 | 双信電機株式会社 | Method of dividing breakable board for electric circuit |
JPH01157468U (en) * | 1988-11-24 | 1989-10-30 | ||
JPH0274056A (en) * | 1988-09-09 | 1990-03-14 | Matsushita Electric Ind Co Ltd | Chip carrier and chip carrier array |
JPH0550731U (en) * | 1991-12-05 | 1993-07-02 | オリジン電気株式会社 | Insulating substrate, semiconductor device and circuit device using the same |
JPH0832204A (en) * | 1994-07-19 | 1996-02-02 | Dowa Mining Co Ltd | Production of ceramic wiring board |
JP2002246703A (en) * | 2001-02-13 | 2002-08-30 | Rohm Co Ltd | Method for producing separate board piece, board piece and assembled board |
JP2007043061A (en) * | 2005-06-28 | 2007-02-15 | Kyocera Corp | Multi-pattern wiring board |
JP2015119092A (en) * | 2013-12-19 | 2015-06-25 | 京セラ株式会社 | Multi-piece wiring board, wiring board and electronic apparatus |
-
1975
- 1975-04-25 JP JP4969675A patent/JPS5842639B2/en not_active Expired
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS561595A (en) * | 1979-06-15 | 1981-01-09 | Matsushita Electric Works Ltd | Method of forming electric path for circuit board |
JPS57184240A (en) * | 1981-02-09 | 1982-11-12 | British Telecomm | Integrated circuit chip carrier and method of producing same |
JPS58170041A (en) * | 1982-03-31 | 1983-10-06 | Narumi China Corp | Laminate for package and manufacture thereof |
JPS6248384B2 (en) * | 1982-03-31 | 1987-10-13 | Narumi China Corp | |
JPS6024093A (en) * | 1984-06-04 | 1985-02-06 | 株式会社日立製作所 | Method of producing ceramic circuit board |
JPS6155280B2 (en) * | 1984-06-04 | 1986-11-27 | Hitachi Ltd | |
JPS624348A (en) * | 1985-07-01 | 1987-01-10 | Nec Corp | Manufacture of semiconductor device package |
JPS6381892A (en) * | 1986-09-25 | 1988-04-12 | 双信電機株式会社 | Method of dividing breakable board for electric circuit |
JPH0274056A (en) * | 1988-09-09 | 1990-03-14 | Matsushita Electric Ind Co Ltd | Chip carrier and chip carrier array |
JPH01157468U (en) * | 1988-11-24 | 1989-10-30 | ||
JPH0346518Y2 (en) * | 1988-11-24 | 1991-10-01 | ||
JPH0550731U (en) * | 1991-12-05 | 1993-07-02 | オリジン電気株式会社 | Insulating substrate, semiconductor device and circuit device using the same |
JPH0832204A (en) * | 1994-07-19 | 1996-02-02 | Dowa Mining Co Ltd | Production of ceramic wiring board |
JP2002246703A (en) * | 2001-02-13 | 2002-08-30 | Rohm Co Ltd | Method for producing separate board piece, board piece and assembled board |
JP4554831B2 (en) * | 2001-02-13 | 2010-09-29 | ローム株式会社 | Method for manufacturing individual substrate, individual substrate and collective substrate |
JP2007043061A (en) * | 2005-06-28 | 2007-02-15 | Kyocera Corp | Multi-pattern wiring board |
JP2015119092A (en) * | 2013-12-19 | 2015-06-25 | 京セラ株式会社 | Multi-piece wiring board, wiring board and electronic apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS5842639B2 (en) | 1983-09-21 |
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