JPS6381892A - Method of dividing breakable board for electric circuit - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a method for dividing a multi-layer board for electric circuits.

[Conventional technology]

When dividing a multi-board board for electrical circuits into individual boards,
Conventionally, through-holes and cutting grooves are first provided on the edges of the double-sided connection parts of the ends of each V plate to be divided, and then terminal electrodes and through-hole connections are formed by printing, and then the cutting grooves are formed. The board was divided along the lines.

[Problem that the invention seeks to solve]

However, if the terminal electrodes and through-hole connections are formed by printing after forming the cut grooves in this way, the base] will flow into the cut grooves, and after dividing,
There is a drawback that short circuits easily occur between adjacent terminal electrodes.

Accordingly, one object of the present invention is to promote a method for dividing a multi-section board for electric circuits that prevents paste from flowing into the cuts 1j6 and prevents short circuits between adjacent terminal electrodes.

(Means for solving the problem) [In order to achieve one target, the present invention uses J3 and multiple targets! A through hole is provided around the edge of the double-sided connection part at the end of each board to be divided into five boards, and after printing and forming the terminal 111 pole and through ball 1a connection, cut grooves are formed by laser scribing or the like. It is characterized by dividing along the cut 11'i.

[For production]

In this way, by forming and dividing the printing grooves, it is possible to prevent the paste from flowing into the cutting grooves, and to prevent short circuits between the terminal electrodes.

〔Example〕

EMBODIMENT OF THE INVENTION Hereinafter, one example of dividing a multi-chip board for electric circuits using the method of the present invention will be described based on the drawings.

A dielectric substrate, for example, an alumina substrate 1, which is a multi-layer substrate for electric circuits, is a rectangular flat plate with a thickness of several millimeters.
Through holes 2 are laterally formed at a predetermined interval in the center of the upper half and the center of the lower half of the alumina substrate 1, which are on the edges of the parts corresponding to the double-sided connection parts of the ends of the individual boards to be processed. Multiple holes are drilled.

Next, as shown in FIG. 1, this through hole 2
A plurality of terminal electrodes 3 are printed in a rectangular shape on both sides of the top surface of the alumina substrate 1 around the terminal electrodes 1, and the through holes 2 are also connected thereto. At this time, if there are other components, they are printed at the same time.

Next, as shown in FIG. 2, a laser beam or the like is used to scribe horizontally between the upper and lower halves of the alumina substrate 1 and on the through holes 2 at the center of the first half and the center of the lower half. Alternatively, form a cut such as a perforation.

Finally, as shown in Fig. 3, scribe the 4th grade rF+groove along the multiple 8! ! Alumina substrate 1 with M plate C is cut into individual substrates 1a, 1b, and 1c.

1d is divided and formed.

As described above, cutting grooves such as swivel groove 1 and 4 can be formed in one of the electrode printing and through-hole connections, and paste can be prevented from flowing into the cutting grooves such as minute υIJ'' and scribe groove 4. , short circuit between terminal electrodes can be prevented.

Although the dielectric alumina substrate 1 is used as the beam in the above embodiment, other substrates may be used, and the method of the present invention can also be applied to substrates made of other magnetic materials.

〔Effect of the invention〕

As described above, the present invention involves drilling through holes on the edges of the double-sided connection parts of the individual board ends to be divided into multiple circuit boards for electric circuits, printing and forming terminal electrodes and through-hole connections, and then cutting. Since it is divided by forming 1t, the paste will not flow into the dividing cut f+'l'+, and short circuits between the terminal electrodes can be prevented.

[Brief explanation of the drawing]

The figures show one embodiment of the method of the present invention. Fig. 1 is a plan view showing a state in which through-holes are formed in an alumina substrate and terminal electrodes and through-hole connections are printed.
The figure is a plan view showing a state in which scribe grooves are further formed.
FIG. 3 is a plan view showing a state in which the alumina substrate is divided along the scribe grooves. 1...Alumina substrate 2...Through hole 3.
...Terminal electrode 4...Scribe groove age 1 factor
cum 20

Claims (1)

[Claims] 1. In a method for dividing a multi-layer board for electric circuits in which a multi-layer board made of dielectric material, magnetic material, etc. is divided into individual boards along cutting grooves, the edges of the double-sided connection parts of the ends of the individual boards to be separated. A multi-chip board for electrical circuits, characterized in that a through-hole is formed on the top, a terminal electrode and a through-hole connection are formed by printing, a cutting groove is formed, and the multi-cavity board is then divided into individual boards. Substrate division method.