JP2739123B2 - Manufacturing method of electronic component mounting board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component mounting substrate, and more particularly to a method for mounting electronic components in electronic component mounting recesses formed on a substrate. The present invention relates to a method for manufacturing an electronic component mounting substrate having the above electrodes.

[0002]

2. Description of the Related Art Electronic component mounting substrates used for electrically connecting electronic components such as semiconductor chips to the outside are:
Conventionally, various things have been devised.

There have been various types of methods for mounting electronic components on this type of electronic component mounting board. Conventionally, however, due to the demand for high-density mounting, small electronic devices as shown in FIG. 2. Description of the Related Art A laminated type in which another large electronic component is mounted on a component has been adopted.

[0004] However, the mounting of electronic components by the stacking method can achieve high density in terms of area, but is disadvantageous in terms of thickness. For example, a flat package IC such as QFP or the like can be used. In the case of an electronic component such as TSOP, another electronic component (for example, a chip component such as a capacitor) cannot be mounted thereunder.

In recent years, therefore, as shown in FIG. 5, an electronic component mounting recess 20 for accommodating an electronic component is formed on the base material 10 and electrically connected to the electronic component in the recess 20. Electronic component mounting substrate 100 on which two or more electrodes 23 are formed.

However, the electronic component mounting substrate 1 having two or more electrodes 23 in such an electronic component mounting recess 20.
In order to manufacture the electrode 00, it is necessary to form two or more electrodes 23 by etching or the like. It is difficult to manufacture the electronic component mounting board 100 having a problem.

Therefore, the following method has been considered. That is, as shown in FIGS. 6A to 6D, the electronic component mounting concave portion 20 is formed in the base material 10 by spot facing.
Thereafter, a conductor such as copper plating is plated 22 on the side and bottom surfaces to form a solid pattern 23a, and finally the solid pattern 23a is divided into two or more poles by an end mill to form two or more pole electrodes 23. Is the way.

[0008]

However, the conventional method of dividing a solid pattern into two or more poles by an end mill as described above tends to cause burrs and peeling of plating, which greatly affects the reliability of products. In addition, since the end mill has a cutting tool diameter of at least about 0.6 mm, a small electrode cannot be formed, and a substrate for mounting an electronic component for mounting a small chip component or the like cannot be manufactured. there were.

The present invention was devised in view of the above circumstances, and an object of the present invention is to easily manufacture an electronic component mounting substrate which is highly reliable and can mount a small chip component. It is an object of the present invention to provide a manufacturing method capable of performing the above.

[0010]

Means adopted by the present invention to solve the above-mentioned problems will be described with reference to the reference numerals used in the drawings corresponding to the embodiments. The electronic component mounting substrate 100 having two or more electrically independent electrodes 23 for mounting the electronic component in the formed electronic component mounting concave portion 20 is manufactured including the following steps. (A) a step of forming at least the number of the independent primary recesses 21 on the base material 10 by the number of the electrodes 23; and (b) a side surface and a bottom surface of each of the primary recesses 21. Plating 22
(C) the base material 10 between the adjacent primary recesses 21
Of removing together with the side surface plating 22 ".

In other words, the method of manufacturing the electronic component mounting substrate 100 includes the steps of:
When forming 3, first, the number of primary recesses 21 corresponding to the number of connection terminals of electronic components to be mounted on the base material 10 is formed in a state independent of each other by a counterbore process or the like (step (a)). Then, a solid pattern 2 formed by conductor plating 22 such as copper plating 22 is formed on the side and bottom surfaces of the primary recess 21.
3a is formed and turned into an electrode (step (b)), and then the base material 10 left between the adjacent primary concave portions 21 is spotted by an end mill together with the plating 22 applied to the side surfaces of the primary concave portions 21. By removing by processing or the like (step (c)), the primary concave portions 21 which are independent from each other are integrated to form the electronic component mounting concave portion 20 and the two or more electrodes 23 are formed in the electronic component mounting concave portion 20. Is formed.

In the step (c), the primary recess 21
When removing the base material 10 between the primary recesses 21, the depth of the counterbore processing is 0.05 to 0 mm from the bottom surface of the primary recess 21 in order to prevent the plating 22 applied on the bottom surface from being peeled off. .1m
It is desirable that the depth be as small as about m.

In this step, the diameter of the end mill for performing the counterbore processing is set to be smaller than the distance between the adjacent primary recesses 21 in order to reduce the burrs of the plating 22 and to ensure sufficient insulation. It is desirable to use one having a diameter as large as about 0.5 to 1.0 mm.

[0014]

By adopting the means as described above, the manufacturing method according to the present invention operates as follows. That is, in the steps (a) and (b), the electrode 23 is formed in the primary recess 21 in advance in a manner independent of each other, so that the insulation with the other electrodes 23 is sufficiently performed.

In the step (c), the burrs of the plating 22 applied to the side surface of the primary recess 21 do not escape to the adjacent primary recess 21 side when the spot facing is performed. In this case, the insulation of each electrode 23 formed by this manufacturing method is reliably ensured. Also, by this step, the burrs of the plating 22 on the side face are convex within the gap between the electronic component mounting concave portion 20 and the primary concave portion 21 formed by this method, which hinders mounting of the electronic component. Never. Further, in this step, the plating 22 applied to the bottom surface of the primary recess 21 is peeled off along the elongated hole shape of the primary recess 21, so that the electrode 23 is not chipped or short-circuited.

Further, since the very small electrode 23 can be easily formed by forming the primary concave portion 21 to a minimum, the electronic component mounting substrate 100 on which a small chip component can be mounted can be easily manufactured. Becomes

[0017]

Next, an electronic component mounting substrate 10 according to the present invention will be described.
An example of the manufacturing method of No. 0 will be described in the order of steps with reference to the drawings.

FIGS. 1 and 2 show an electronic component mounting recess 2.
Electronic component mounting substrate 100 having two electrodes 23 at zero
Is shown.

First, as shown in FIGS. 1 (a) and 2 (a), an elongated primary recess 21 having a depth of 1.1 mm and a length of 3 mm is formed in a base material 10 by an end mill of 2.0 mm. 1
mm at two places with an interval of
The necessary conductor circuit 30 is formed on the zero.

Next, as shown in FIGS. 1 (b) and 2 (b), a 15 μm thick copper plating 22 is applied to the side and bottom surfaces of the primary recess 21 and the surface of the conductor circuit 30.

Finally, as shown in FIGS. 1 (c) and 2 (c), the base material 10 left between the two primary concave portions 21 is covered with the inner side provided on the side surfaces of the two primary concave portions 21. Copper plating 2
2 and a depth of 1.0 by a 2.0 mm end mill.
The two primary recesses 21 which were removed by counterbore processing of 5 mm and were independent from each other were integrated to form the electronic component mounting recess 2.
0, and 2 in this electronic component mounting concave portion 20.
One electrode 23 is formed.

As shown in FIGS. 1D and 2D, the electronic component mounting board 100 manufactured as described above is mounted with the electronic component by the copper plating 22 left on the side surface of the primary concave portion 21. In this case, the soldering is performed firmly, and the electronic component is stored in the electronic component mounting concave portion 20, so that the alignment is easy and the so-called tombstone phenomenon is less likely to occur.

It should be noted that the present invention is directed to the electronic component mounting recess 20.
This can be easily applied to the case where two or more electrodes 23 are formed. For example, when three electrodes 23 are formed, as shown in FIGS. A primary recess 21 is formed in advance, and a plating 22
, And the base material 10 of each primary recess 21 is removed by spot facing in the same manner as described above, thereby making it easy to manufacture.

[0024]

As described above in detail, the method for manufacturing an electronic component mounting board according to the present invention is described as follows. A method for manufacturing an electronic component mounting substrate, comprising: manufacturing an electronic component mounting substrate having two or more electrically independent electrodes including the following steps; (B) plating the side and bottom surfaces of each of the primary recesses; and (c) forming a base material between the adjacent primary recesses together with the plating of the side surfaces. The "removing step" is a feature of the configuration.

Therefore, according to this manufacturing method, the insulation of each electrode is reliably ensured, and the electrodes are not chipped or short-circuited. Electronic component mounting substrate with high reliability can be easily manufactured.

Further, by forming the primary concave portion to be extremely small, an extremely small electrode can be easily formed, so that an electronic component mounting substrate on which a small chip component can be mounted can be easily manufactured. .

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a manufacturing method according to the present invention in the order of steps.

FIG. 2 is a cross-sectional view of each of the manufacturing methods shown in FIG.

FIG. 3 is a plan view partially showing another embodiment of the manufacturing method according to the present invention.

FIG. 4 is a cross-sectional view showing a mounting format of a conventional electronic component.

FIG. 5 is a cross-sectional view illustrating an example of an electronic component mounting board having two or more electrodes in an electronic component mounting recess.

6 is a cross-sectional view showing a conventional method for manufacturing the electronic component mounting board shown in FIG. 5 in the order of steps.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 substrate for mounting electronic component 10 base material 20 concave portion for mounting electronic component 21 primary concave portion 22 plating 23 electrode 23a solid pattern 30 conductive circuit

Claims (1)

(57) [Claims] An electronic component mounting device for mounting an electronic component in an electronic component mounting recess formed on a substrate.
A method for manufacturing an electronic component mounting substrate, comprising: manufacturing an electronic component mounting substrate having the above-described electrodes, including the following steps: (a) forming at least primary recesses independent from each other on a base material; (B) plating the side and bottom surfaces of each of the primary recesses; (c) removing the base material between the adjacent primary recesses together with the plating on the side surfaces.