JPS58170041A - Laminate for package and manufacture thereof - Google Patents

Abstract

PURPOSE:To enable to cover a plating layer uniformly on the lower member forming a wall member and the peripheral side of a substrate by forming a hole which extends to the outside of the first zone line from the inside of the prescribed region in the first and second members and forming the second hole which communicates with the above hole at the outside of the second zone line of the third member. CONSTITUTION:A plurality of through holes 31 which extends across the first snap line from the prescribed region 20 to a dummy region 21 are opened at the first ceramic sheet 26, and substantially coincide in the shape and the positions with through holes 32 on the second ceramic sheet 27. The holes 31, 32 are considered to be in various shape such as long elliptical, rectangular or long holes formed at the end in semicircular shape. On the other hand, the through holes 33 are opened at a dummy region along the second snap line at the third ceramic sheet 28. The through holes 33 of the sheet 28 are positioned to communicated with the dummy regions of the hole 31, 32 of the sheets 26, 27.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to packages used to house semiconductor chips and methods of manufacturing the same, and more particularly.

The present invention relates to a laminate used in manufacturing a chip carrier of a package and a method for manufacturing the same.

Generally, this type of package has a structure in which a wall member and a lid member are laminated on a substrate that supports a semiconductor chip,
The substrate and wall members are made of an insulating material such as ceramic. in this case.

A metallized pattern is usually deposited on the outer peripheral side surface of the chip carrier, which is constituted by a substrate and a wall member, for electrical connection with a semiconductor chip to be placed inside.

As a method of forming a metallized pattern on the outer circumferential side of a chip carrier, through holes are provided in a laminate of ceramic sheets that are to become the substrate and wall members, and after through hole metallization is performed in this state, at the position of the through hole, A method is adopted in which the laminate is divided. In this method, a recess is formed on the outer peripheral side of the laminate after it has been divided into nine parts,
The metallization pattern is applied only to this recess. Therefore, this method is very advantageous in that a metallized pattern can be formed accurately.

Semiconductor chips housed in this type of package tend to become larger as their degree of integration or capacity increases. However, the reality is that the external dimensions of packages that house these increasingly large semiconductor chips cannot be increased in order to improve the characteristics or downsize equipment, etc. in which the packages are mounted. Therefore, it is necessary to reduce the sealing area, that is, the sealing path between the wall member and the lid member.

However, maintaining airtightness requires a minimum sealing path, and there is a limit to the reduction of the sealing path.

In particular, in the case of a package in which a recess is formed on the outer circumferential side surface of the wall member described above, the formation of the recess.

Since the sealing path necessary for sealing with the lid member has been reduced, there is a problem in terms of airtightness.

On the other hand, there is also a package in which the wall member on the substrate is divided into two members, upper and lower, and the above-mentioned recesses for the metallization pattern are provided only on the side surfaces of the lower member and the substrate, but no recesses are formed on the side surfaces of the upper member. However, this type of package presents significant manufacturing problems. Specifically, on the metallized pattern to prevent its oxidation.

A plating layer of nickel, gold, etc. is deposited by electrolytic plating or the like. This plating layer is usually applied before dividing the laminate. When the above-mentioned wall member is formed by two members, upper and lower, as will be described later, before it is divided into 9 parts, a hole is formed from the sheet serving as the substrate to the sheet serving as the lower member, and the upper member The hole does not extend.

That is, no through hole is formed like this 9
Even if ordinary electrolytic plating is applied to the portion of the hole that does not penetrate through the hole, it is very difficult to uniformly apply the plating layer.

Therefore, it is difficult to manufacture a wall member formed by two upper and lower members using a normal method.

An object of the present invention is to provide a sheet-like laminate having a structure in which a plating layer can be uniformly applied to the peripheral sides of a lower member and a substrate constituting a wall member.

Another object of the present invention is to provide a method for manufacturing a sheet-like laminate that allows a plating layer to be uniformly applied to the lower part of the wall member and the sides of the substrate.

According to the present invention, the first member has a predetermined area surrounded by a first dividing line, an aperture smaller than the predetermined area, and a contact area around the aperture that contacts the predetermined area. a second member positioned on the first member;
A package having a third member stacked on the second member with a space left in a predetermined area surrounded by the first dividing line and an area surrounded by the second dividing line opposite to the predetermined area surrounded by the first dividing line. In the laminate, the first and second members have a first hole extending from inside the predetermined region to the outside of the first dividing line, and the third member has a first hole extending from inside the predetermined area to the outside of the first dividing line. first on the outside
A package laminate having a second hole communicating with the hole is obtained.

When this laminate is plated, the plating solution flows through the first and second holes, so that the plating layer is uniformly applied to the metallized portions on the sides surrounding the first holes formed in the first and second members. can be coated. In addition, the first
If a predetermined area is separated along the second dividing line, the plating layer is applied only around the sides of the first and second members, and the plating layer is applied around the sides of the third member. A chip carrier is obtained that does not get stained.

1 The following explanation will be given with reference to nine drawings.

Referring to FIG. 1, a chip carrier used in a conventional package includes a substrate 11 for mounting a semiconductor chip (not shown), and a wall member 1 laminated on this substrate 11.
2. A mounting metallized pattern 13 is provided in the chip mounting area of the substrate 11. on the other hand,
The wall member 12 laminated in the peripheral area of the substrate 11 is provided with a step on the inside, and the upper end surface 14 of the wall member 12 and
An intermediate surface 15 is formed between the chip mounting area and the chip mounting area. A bonding metallized pattern 16 for connection with a semiconductor chip is deposited on the intermediate surface 15. Further, the upper end surface 14 is coated with metallization 19 for a seal path.

A lid member (not shown) is hermetically sealed.

A plurality of recesses 17 are provided on the peripheral sides of the substrate 11 and the wall member 12, and the recesses 17 are continuous from the substrate 11 to the upper end surface 14 of the wall member 12. The recess 17 extending from the bottom of the substrate 11 to the intermediate surface 15 of the wall member 12 is metalized through-hole, and each metallized layer 18 is electrically connected to the metalized pattern 16 on the inner intermediate surface 15. There is.

When a concave portion extending to the upper end surface 14 of the wall member 12 is formed in this manner, the area required for sealing with the lid member becomes narrow, resulting in the above-mentioned drawbacks.

Referring to FIG. 2, the chip carrier also obtained by applying the present invention has a wall member 12 and a recess 17' on the peripheral side of the substrate 11.

This recess 17' extends from the bottom surface of the substrate 11 to the height position of the intermediate surface 15 of the wall member 12, and the recess 17' includes:
A metallized layer 18 is formed.

In this configuration, the sealing path defined by the upper end surface 14 of the wall member 12 is not reduced by the formation of the recess 17', so that the sealing path metallization 19 is not reduced, and therefore in terms of hermetic sealing.

This is superior to the chip carrier shown in Figure 1.

However, a chip carrier of the type shown in FIG. 2 has the disadvantage in practice that it is difficult to apply a uniform plating layer on the metallization layer 18 in the recess 17'.

The above reason will be explained in more detail with reference to FIG. As shown in FIG. 3, the chip carrier is usually fabricated from a laminate of three layers of ceramic sheets. Third
In the figure, the sheet to become the substrate 11 and the sheet to become the wall member 12 have metalized layers 13, 16, 18 as appropriate.
In addition, a dummy area 21 is provided in the vicinity of an area 20 (hereinafter referred to as a predetermined area) used as a substrate and wall member of each sheet in consideration of convenience of cutting, etc. There is. Further, a hole 22 is formed in the lower part of the substrate 11 and the wall member 12 between the predetermined area 20 and the dummy area 21 .

Laminate metallized layer 13,16゜18 shown in Figure 3
K) IF, after being plated, it is cut or divided along the dashed line, and the hole 22 is divided to form the recess 17'.
Thus, a chip carrier as shown in FIG. 2 is manufactured.

Alternatively, it is difficult to generate a uniform plating layer due to residual air or the like. Therefore, in order to obtain a uniform plating layer, during electrolytic plating.

Use ultrasonic pulses or reduced pressure, or
It is necessary to separate the product into nine parts in advance and apply electroless plating to each part individually.

In any case, it is difficult to obtain a high-quality plating layer economically and with a high yield.

Referring to FIG. 4, a laminate according to an embodiment of the present invention is shown broken down into three parts.

Similarly, here, the state after firing the ceramic green sheet in a reducing atmosphere is shown. The illustrated sheet is a raw ceramic sheet that is made by forming holes, etc. as described later.
A metallized pattern (not shown) is formed by printing a conductive paste.

Next, these sheets are laminated to obtain a laminated sheet, then a snap line is added to this laminated sheet, and further,
It is obtained by firing in the reducing atmosphere described above.

Specifically, the package laminate according to one embodiment of the present invention has a first ceramic sheet 26t including a predetermined region 20 to become the substrate 11 and a dummy region 21 surrounding this region, This first ceramic sheet 26
As shown by the broken line, a first snap line is placed on the back surface of the paper, and the predetermined area 20 is defined by this snap line. Furthermore, the second ceramic sheet 27, which has a region that is to become the lower member of the wall member, is provided with apertures 34 in the above-mentioned region.

The region to be the lower member has substantially the same dimensions as the predetermined region 20 on the first ceramic sheet 26, and therefore the dimensions of the apertures 34 provided in the second ceramic sheet 27 are the same as the predetermined region 20 on the first ceramic sheet 26. smaller. In FIG. 4, in order to clarify the size of the area that is to become the lower member of the second ceramic sheet 27, the area is shown divided by dashed dotted lines.

Further, the third ceramic sheet 28 to be mounted on the second ceramic sheet 27 is divided into a region to become the upper member and a dummy region by a second snap line, and the region to be the upper member is divided into a region to be the upper member and a dummy region. It has dimensions substantially equal to the predetermined area 20 on the first ceramic sheet 26 .

A second ceramic sheet 2 is placed in the area that is to become the upper member.
An aperture 35 larger in size than the aperture 34 of No. 7 is provided. With this configuration, the first to sixth ceramic sheets 2
When layers 6 to 28 are stacked, a step as shown in FIG. 2 can be formed in the predetermined area 20.

With further reference to FIG. 4, the first ceramic sheet 26
A plurality of through-holes 31 are bored therein, and extend from the predetermined region 20 to the dummy region 21 across the first snap line.

This through hole 31 substantially matches the through hole 32 on the second ceramic sheet 27 in shape and position. The through holes 31 and 32 can have nine different shapes, such as an elongated oval, a rectangle, or a long hole whose end is semicircular.

On the other hand, the third ceramic sheet 28 is provided with a through hole 33 in a dummy region along the second snap line. The through holes 33 of the third ceramic sheet 28 are connected to the first and second ceramic sheets 26 and 2.
It is positioned so as to communicate with the dummy region portions of the through holes 31 and 32 of No. 7.

Referring to FIG. 5, the first to third ceramic sheets 2
The above-mentioned positional relationships of numbers 6 to 28 are shown more specifically. As is clear from FIG. 5, the through hole 33 of the third ceramic sheet 28 is provided closer to the dummy region 21 than the snap line indicated by the dashed line, and this through hole 33 is located between the first and second ceramic sheets. ceramic sheet 2
6 and 27 through holes 31 and 32 and dummy area 2
It communicates on the 1st side.

Electrolytic plating is applied to the laminate on which the metallized patterns 1, 5, 16, and 18 have been deposited in the state shown in FIG.

Due to the communication between the through holes 31 to 33, the plating solution circulates within these through holes 31 to 33.

Conductive metals such as Ni and gold are sufficiently replenished even after deposition. Further, by forming the through hole, air will not remain inside the hole as in the case of FIG. 3. Therefore, the plating layer can be uniformly applied to the metallized layer 18 within the through hole.

The sheet-like laminate thus plated is separated from the snap line and becomes a single chip carrier. The resulting chip carrier had no problems in both the bake test and the moisture resistance test.

In the embodiments described above, a case has been described in which a chip carrier having a shape in which a substrate and a wall member are combined in three layers is manufactured, but a case in which the chip carrier has a shape in which a substrate and a wall member are combined in three layers is also possible.

Furthermore, the present invention can be similarly applied to a substrate formed by laminating sheets. In this case.

A through hole is provided in the dummy area on the top layer sheet,
A through hole may be provided in the other sheets so as to span the predetermined area and the dummy area.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a part of a conventional chip carrier, Fig. 2 is a perspective view partially showing another conventional chip carrier, and Fig. 3 is a perspective view showing a part of a conventional chip carrier. 4 is an exploded view illustrating a laminate according to an embodiment of the present invention and its manufacturing process, and FIG. 5 is a sectional view of the laminate shown in FIG. 4. FIG. 3 is a diagram for explaining the state in more detail. Explanation of symbols 11: Substrate 12: Wall member 13.16.18: Metallized pattern 14: Upper end surface 15: Intermediate surface 17.1
7': Concave portion 19: Metallization for seal path 20: Predetermined area 21: Dummy area 26: First ceramic sheet 27: Second ceramic sheet) 28: Third ceramic sheet) 31.32 Varnish through hole 33 Varnish through hole 34.35: Open hole

Claims (1)

[Claims] 1. A first sheet having a predetermined area surrounded by a first dividing line, a second sheet having a portion in contact with the first sheet within the predetermined area, and a second sheet having a predetermined area surrounded by a first dividing line; a third sheet that is surrounded by a dividing line of No. 2, has a region facing the predetermined region, and is in contact with the second sheet within the region; The sheet has a first hole extending from inside the predetermined area to outside the first dividing line, and the third sheet has a second hole communicating with the first hole outside the second dividing line. A laminate for packaging characterized by having holes. 2. When manufacturing a ceramic package configured by sequentially laminating a wall member and a lid member on a substrate. In the method for manufacturing a package laminate used for forming the substrate and wall members, after opening a first through hole extending from the inside to the outside of the first region, a predetermined metal 2 size printing is performed. a step of preparing a first ceramic sheet subjected to a process, and having an opening and a through hole identical to that of the first ceramic sheet. A step of preparing a second ceramic sheet with a predetermined metallization printing, and a step of preparing a second ceramic sheet having a predetermined metallization printed thereon.
having an aperture in a second region of substantially equal dimensions to the first region; A second through hole is formed at a position partially overlapping with a portion of the first through hole outside the first area, and metallization printing for sealing the lid member is applied, and a second ceramic sheet is formed. No. 1. When the territory is stacked, the first
. within the area. providing a third ceramic sheet If capable of contacting the first region; A method for manufacturing a laminate for a package, comprising a step of sintering in a free state to form a laminate.