JP2007234661A - Multipiece wiring board and its inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multipiece wiring board in which the spread width of a plating layer formed on the multipiece wiring board can be judged easily, and to provide an inspection method of the multipiece wiring board. <P>SOLUTION: The multipiece wiring board 100 has a plurality of wiring board regions 1 and a dummy region 2. A wiring conductor 3 to which a plating layer 4 is applied is formed in the wiring board region 1, at least a pair of identification members 5 for identifying an allowable spread width when the plating layer 4 is applied to the wiring conductor 3 are provided in the dummy region 2, and the identification members 5 are arranged oppositely through a fixed gap. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention provides a plurality of wiring board regions in which a plurality of wiring board regions used for an electronic component storage package for housing electronic components, a hybrid integrated circuit board, and the like are arranged, and plating is performed on the wiring board region, and It relates to the inspection method.

  In general, a wiring board that is a substrate for mounting electronic components such as semiconductor elements, surface acoustic wave elements, and piezoelectric vibrators is formed by laminating a plurality of insulating layers on which wiring conductors are formed on the main surface of the laminated body. It has a structure in which an electronic component mounting portion is provided. Such a wiring board is usually as small as a few millimeters on a side, so that it is easy to handle a plurality of wiring boards, and to efficiently manufacture wiring boards and electronic devices. The circuit board is manufactured in the form of a so-called multi-layer wiring board in which a plurality of wiring board regions are arranged in a matrix on the mother board.

  A multi-layer wiring board is usually formed by laminating a plurality of insulating layers made of a ceramic sintered body, etc., and a rectangular wiring board region is arranged vertically and horizontally at the center and a dummy region is formed at the outer periphery. And a wiring board formed in the wiring board region. The dummy area is provided in order to facilitate handling of a plurality of wiring boards. A plurality of wiring boards are formed by dividing the plurality of wiring boards into individual wiring boards.

  In addition, a plating layer of nickel, gold or the like is deposited on the exposed portion of the wiring conductor of each wiring board, and the electrodes of the electronic component are connected via solder or the like.

This plating layer is used to prevent oxidative corrosion of the exposed part of the wiring conductor and to make the connection easy and strong when connecting the electronic component to the wiring conductor via a connecting material such as solder. And attached to the wiring conductor. Such a plating layer is usually formed by supplying a current for plating to the wiring conductor from the outside through a jig or the like while dipping a plurality of wiring boards in a plating solution such as nickel. .
JP 2002-54000 A JP-A-6-349976

  In recent years, with the miniaturization of electronic components, the multi-wiring circuit boards are also required to be smaller in the area of each circuit board and higher in density of the wiring conductors, and the distance between adjacent wiring conductors is becoming narrower. Yes. However, in the conventional multi-wiring substrate, since the plating layer is deposited on the exposed wiring conductor, the width of the wiring conductor (the width in the direction perpendicular to the longitudinal direction of the wiring conductor in plan view) , Hereinafter also simply referred to as line width) becomes thicker.

  And in the exposed part where line | wire width became large by having adhered the plating layer, the problem that wiring conductors contacted via a plating layer and electrically short-circuited came to generate | occur | produce.

  In order to cope with this problem, it is necessary to set the spread width of the plating layer, that is, to set the spread of the plating layer so that the wiring conductors are not electrically short-circuited.

  In this case, since the electrical short circuit between the wiring conductors is induced by the plating layer, the spread width from the wiring conductor of the plating layer (between the outer edge of the wiring conductor and the outer edge of the plating layer in plan view) It is conceivable to measure whether or not there is an electrical short by measuring whether or not the length is within a set value.

  However, it is difficult to measure whether the spread width of the plating layer of the wiring conductor on the wiring board is within the set value, and there is a problem that the measurement method is difficult, takes time, and the workability is extremely reduced. .

  The present invention has been completed in order to solve such a conventional problem, and the object of the present invention is to easily determine the spread width of a plating layer formed on a wiring conductor of a plurality of wiring boards. It is an object of the present invention to provide a plurality of wiring board, and further to provide an inspection method for a plurality of wiring boards.

  The multiple-taken wiring board of the present invention is a multiple-taken wiring board having a plurality of wiring board regions and a dummy region, and a wiring conductor on which a plating layer is deposited is formed in the wiring board region. The dummy region has at least one pair of identification members for identifying a spread width allowed when the plating layer deposits the wiring conductor, and the identification member has a constant gap. It is characterized by being arranged facing each other.

  The multiple wiring board according to the present invention is preferably characterized in that at least one of the opposing identification members is a conductor pattern.

  In the multiple wiring board according to the present invention, it is preferable that the predetermined gap is at least the allowable spread width.

  Also, the multiple wiring board of the present invention is preferably characterized in that the pair of opposing identification members is a pair of opposing conductor patterns.

  The multiple wiring substrate of the present invention is preferably characterized in that the pair of opposing conductor patterns are opposing sides in a frame shape.

  In the multiple wiring board of the present invention, preferably, the pair of opposing conductor patterns is a pair of quadrangular shapes.

  In the multiple wiring board according to the present invention, the fixed gap is at least twice the allowable spread width.

  In addition, the multiple wiring substrate of the present invention is preferably characterized in that the dummy region has a plurality of pairs of identification members facing each other.

  In the multiple wiring substrate of the present invention, preferably, the plating layer includes at least one of a copper plating layer and a nickel plating layer.

  The method of inspecting a plurality of wiring boards according to the present invention includes a plurality of wiring board areas and a dummy area, and wiring conductors are arranged in the wiring board area so as to face the dummy areas at regular intervals. Inspecting a multi-wiring board for inspecting a spread width of a plating layer deposited on the wiring board region and the conductor pattern on a multi-wiring board provided with at least one pair of identification members. In the method, the plurality of wiring boards are immersed in a plating solution to form a plating layer on the surface of the wiring conductor, and then in the gap between at least one pair of identification members in the dummy region. By identifying the degree of plating, it is determined whether or not the plating layer in the wiring board region is acceptable.

  The multi-piece wiring board of the present invention has at least one pair of identification members for identifying the spread width allowed when the plating layer deposits the wiring conductor in the dummy region, Since it is arranged to face each other with a certain gap, it can be determined whether or not the spread width of the plating layer on the wiring conductor in the wiring board region is within an allowable range by checking the gap of the identification member. .

  That is, when the plating layer is applied to the wiring conductor in the wiring board region, the plating layer is also applied to the identification member in the dummy region simultaneously in the plating solution. Therefore, the spread width of the plating layer in the wiring conductor can be detected by measuring the spread width of the plating layer in the identification member. In this case, since the width of the gap between the pair of identification members facing each other is reduced by the spread width of the plating layer, the spread width of the plating layer is easily measured based on the predetermined gap width. can do. Therefore, it can be easily and reliably detected whether or not the spread width of the plating layer is within the allowable range. Therefore, it is possible to provide a multiple wiring board that can easily determine the spread width of the plating layer in the wiring board region.

  Furthermore, the multi-piece wiring board of the present invention can be formed of the same material as the wiring conductor formed in the wiring board region because at least one of the opposing identification members is a conductor pattern. The deposition conditions of the plating layer deposited on the identification member and the wiring conductor are the same. Therefore, the spread width of the plating layer deposited on the identification member and the wiring conductor can be made even more accurate. Further, for example, when the plating layer is deposited by an electrolytic plating method, the plating layer can be deposited on the identification member in the same manner as when the wiring conductor is plated. Therefore, by confirming the identification member (gap), the spread width of the plating layer of the wiring conductor can be determined more accurately.

  Still further, in the multiple wiring substrate of the present invention, since the constant gap is at least the allowable spread width, the spread width of the plating layer is within the allowable range depending on the presence or absence of this gap after the plating layer is deposited. It can be determined more easily.

  That is, when the gap is the same as the allowable spread width, it is possible to easily detect whether or not the spread width of the plating layer is within the allowable range based on the presence or absence of the gap. More specifically, when the gap can be confirmed, it can be determined that the spreading width of the plating layer is within the allowable range, and when the gap cannot be confirmed, it can be determined that the spreading width of the plating layer is not within the allowable range. . In addition, when the gap is wider than the allowable spread width, it is easy to detect whether the spread width of the plating layer has reached the allowable width by measuring the width of the remaining gap. Can do.

  Furthermore, in the multiple wiring substrate of the present invention, since the pair of opposing identification members is a pair of opposing conductor patterns, the spread of the plating layer can be achieved using two conductor patterns at a time. The width can be determined. Therefore, the spread width of the plating layer of the wiring conductor can be determined more accurately. It should be noted that the pair of conductor patterns may have ends connected to each other as long as a part thereof is opposed. Examples of such include a frame shape.

  Furthermore, in the multiple wiring substrate of the present invention, since the pair of opposing conductor patterns is one side facing each other in the frame shape, the plating layer is formed between the pair of identification members facing each other. Since it spreads in the direction (inward direction), by confirming the gap between the pair of opposing conductor patterns, it is possible to confirm the plating layer spread width on both sides allowed for the wiring conductor.

  Furthermore, in the multiple wiring board of the present invention, since the pair of opposing conductor patterns is square, not only can the spreading of the plating layer in one direction be confirmed, but also the plating layers in different two directions can be confirmed. You can check the spread.

  Furthermore, the multiple wiring substrate of the present invention can obtain the following effects when the constant gap is at least twice the allowable spread width.

  That is, it is possible to form the identification member with the same material as that of the wiring conductor as the opposing identification member, and the deposition conditions of the plating layers deposited on the identification member and the wiring conductor are the same. Therefore, a state similar to the case where the plating layer spreads between the adjacent wiring conductors can be formed between the two adjacent wiring conductors. Therefore, the spread width of the plating layer of the wiring conductor can be determined more accurately.

  Furthermore, since the multiple wiring substrate of the present invention has a plurality of opposing identification members in the dummy area, the plating layer in the desired direction can be easily confirmed.

In addition, since the spread width of the plating layer can be confirmed by a plurality of identification members, even if the spread width of the plating layer varies between the identification members, it is necessary to confirm the plurality of identification members (for example, each spread width) It is possible to more accurately determine whether or not the spread width of the plating layer in the wiring conductor is within an allowable range. Since the plating layer includes at least one of a copper plating layer and a nickel plating layer, the individual wiring board corresponds to the base plating layer to be attached to the wiring conductor. Therefore, the electrical characteristics and reliability of the wiring conductor are effectively ensured. Therefore, according to this configuration, it is possible to more accurately determine the spread of the plating layer of the wiring conductor in which characteristics and reliability are ensured.

  The method for inspecting a multiple wiring board according to the present invention has a plurality of wiring board regions and a dummy region, and wiring conductors are arranged in the wiring substrate region so as to be opposed to the dummy region at regular intervals. A method of inspecting a multi-piece wiring board for inspecting a spread width of a plating layer deposited on a wiring board region and a conductor pattern on a multi-ply wiring board provided with a pair of identification members, By immersing a plurality of wiring boards in a plating solution to form a plating layer on the surface of the wiring conductor, and then identifying the degree of plating in the gap between the at least one pair of identification members in the dummy region, Since it is judged whether or not the plating layer in the wiring board area is acceptable, it is easy to determine whether or not it is within the range of the allowable plating layer spreading width without measuring the spreading width of the wiring conductor plating layer in the wiring board area. It can be confirmed.

  Therefore, it is possible to provide a method for inspecting a multi-chip wiring board that can easily determine the spread width of the plating layer formed on the multi-chip wiring board.

(Embodiment 1)
First, a multiple wiring board according to claims 1 to 3 will be described with reference to FIG.

  Fig.1 (a) is a top view which shows an example of the multi-wiring wiring board concerning Embodiment 1 of this invention. FIG. 1B is a detailed view of the portion X1 in FIG.

  1A and 1B, 1 is a wiring board region, 2 is a dummy region, 3 is a wiring conductor, and 4 is a plating layer. The wiring board region 100, the dummy region 2, the wiring conductor 3, and the plating layer 4 basically constitute a plurality of wiring substrates 100.

  Each wiring board region 1 and dummy region 2 are made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, a silicon carbide sintered body, and glass. It is made of an electrically insulating material such as a ceramic sintered body.

  Each of the wiring board regions 1 is an area serving as an insulating base of a wiring board (not shown) on which electronic components (not shown) are mounted. In the present embodiment, the wiring board region 1 has a quadrangular shape in plan view, and has a mounting portion (not shown) for mounting electronic components at the center of each upper surface.

  The electronic components are various functional elements such as semiconductor elements including semiconductor integrated circuit elements and optical semiconductor elements, surface acoustic wave elements, piezoelectric vibrators, acceleration sensor elements, capacitors, resistors, inductors, and passive elements.

  The dummy area 2 is formed so as to surround the wiring board areas 1 arranged in the vertical and horizontal directions, and has a function of facilitating the handling of the plurality of wiring board 100.

  The multi-wiring board 100 is basically rectangular in shape, but each corner is rounded, or each side is not a straight line and some irregularities are provided. However, it is preferably a square or rectangular shape.

  For example, when the wiring board region 1 and the dummy region 2 are made of an aluminum oxide sintered body, they are produced as follows. First, an appropriate organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide to produce a slurry ceramic slurry. A ceramic green sheet (ceramic green sheet) is obtained by adopting the sheet forming technique of the above and forming a sheet. Thereafter, ceramic green sheets are laminated in the predetermined order in the vertical direction to form a green ceramic molded body. By firing this green ceramic molded body in a reducing atmosphere at a high temperature of about 1600 ° C., a plurality of wiring boards 100 are manufactured.

  Further, the multi-layer wiring substrate 100 has dividing grooves 7 formed vertically and horizontally on the boundary between the wiring substrate regions 1 and the boundary between the wiring substrate region 1 and the dummy region 2 on at least one of the upper and lower main surfaces thereof. Yes.

  The dividing groove 7 has a function of concentrating bending stress when the plurality of wiring board 100 is bent along the dividing board 7 to divide each wiring board region 1 into each wiring board.

  The dividing groove 7 presses a metal blade (blade) having a predetermined cross-sectional shape against the main surface of a green sheet to be a plurality of wiring boards 100 (wiring board area 1 and dummy area 2), and the cutting edge is predetermined. Formed by penetrating depth.

  The method for dividing the plurality of arranged wiring board regions 1 into the individual wiring board regions 1 is not limited to the method of previously forming the dividing grooves 7 as described above, but other methods such as dicing. May be used.

  Each wiring board region 1 has a wiring conductor 3 made of a metal material such as tungsten, manganese, copper, silver, gold, palladium, or platinum from the periphery of the mounting portion to the lower surface. When the wiring conductor 3 is made of, for example, tungsten, a plurality of metal pastes obtained by adding and mixing an appropriate organic binder, solvent, etc. to copper powder are taken, and the upper surface of the green sheet that becomes each ceramic insulating layer of the wiring board 100 It is formed by previously printing and applying a predetermined pattern by a screen printing method or the like.

  The wiring conductor 3 is electrically connected to an electronic component mounted on the mounting portion, and functions as a conductive path that leads the electrode of the electronic component to the lower surface side of each wiring board region 1 or the like. The electrical connection between the wiring conductor 3 and the electrode of the electronic component is performed via a conductive connecting material (not shown) such as a bonding wire or solder.

  That is, an electrode (not shown) of an electronic component is electrically connected to a mounting portion of the wiring conductor 3 via a conductive connecting material (not shown) such as solder or a bonding wire. By electrically connecting a portion led out to the surface outside the mounting portion to an external electric circuit via solder or the like, the electrode of the electronic component is electrically connected to the external electric circuit.

  The wiring conductor 3 is formed with a high density of, for example, about 50 μm to 100 μm in order to cope with downsizing as a wiring board, high functionality and high integration of mounted electronic components, and the like. . Note that the wiring conductor 3 may extend to the inside of the surface other than the upper surface of the wiring board region 1. Further, the plating layer 4 is deposited on the exposed surface of the wiring conductor 3.

  The plating layer 4 functions to prevent oxidative corrosion of the wiring conductor 3 and to make connection of a connecting material such as solder easy and reliable. The plating layer 4 is made of a metal such as nickel, gold, copper, cobalt, platinum, or palladium, or an alloy thereof, and also includes a metal or alloy that contains a component other than a metal, such as nickel-phosphorus, nickel-boron. It is a waste.

  The plating layer 4 can be deposited and formed by a plating method such as an electrolytic plating method or an electroless plating method.

  For example, a plurality of wiring boards 100 are taken in an electrolytic nickel plating solution (so-called Watt bath) containing nickel sulfate as a main nickel supply source and nickel chloride, boric acid or the like added thereto, and a plating jig (not shown). And the like, and a plating current is supplied to the wiring conductor 3 from an external power source via a jig or the like, so that a nickel plating layer is deposited on the exposed portion of the wiring conductor 3.

  Moreover, if it is a copper plating layer, the electroless copper plating solution which contains copper sulfate as a copper supply source and formalin as a reducing agent as a main component, and a complexing agent, a pH adjusting agent, etc. are added to this. A plurality of wiring substrates 100 are dipped in a predetermined time, so that they are attached to the exposed portions of the wiring conductor 3.

  For gold plating layers, multiple wiring is provided in an electrolytic gold plating bath in which an additive such as an organic acid (salt) such as potassium citrate or a phosphate such as potassium phosphate is added to a gold cyanide compound. The substrate 100 is dipped and applied to the exposed portion of the wiring conductor 3 by supplying a predetermined plating current to the wiring conductor 3 via a plating jig or the like.

  The thickness of the plating layer 4 on the wiring conductor 3 is preferably 3 μm or more in consideration of securing the connection strength of the conductive bonding material. If the thickness is 3 μm or less, the plating layer 4 may melt into the conductive connection material such as solder when connecting the electronic component with the conductive connection material such as solder or when connecting the wiring board to the external circuit board or the like. Thus, the wiring conductor 3 and the conductive connecting material cannot be connected with sufficient strength. In this case, for example, a nickel plating layer or a copper plating layer having a thickness of 2 μm or more and a gold plating layer having a thickness of 1 μm or more are sequentially deposited. The nickel plating layer and the copper plating layer are bonded to the conductive bonding material and have a function of firmly bonding the conductive bonding material to the wiring conductor 3. The gold plating layer has a function of further improving the connectivity of the conductive bonding material and suppressing oxidative corrosion of the nickel plating layer and the copper plating layer.

  When the plating layer 4 having such a thickness is deposited without setting the spreading width of the plating, the wiring conductor is formed in the portion where the plating layer 4 is deposited between the wiring conductors 3 having a narrow adjacent interval as described above. There is a possibility that the three are electrically short-circuited.

  Therefore, the multiple wiring substrate 100 of the present invention has at least one pair of identification members 5 for identifying the spread width allowed when the plating layer 4 deposits the wiring conductor 2 on the dummy region 2. And the identification member 5 is arranged to face each other with a certain gap.

  Since such an identification member 5 is provided, it is determined whether or not the spread width of the plating layer 4 on the wiring conductor 3 in the wiring board region 1 is within an allowable range by checking the gap between the identification members 5. it can.

  That is, when depositing the plating layer 4 on the wiring conductor 3 in the wiring board region 1, the plating layer 4 is also deposited on the identification member 5 in the dummy region 2 at the same time in the plating solution. Therefore, the spreading width of the plating layer 4 in the wiring conductor 3 can be detected by measuring the spreading width of the plating layer 4 in the identification member 5. In this case, since the width of the gap between the pair of identification members 5 facing each other is reduced by the spread width of the plating layer 4, the spread of the plating layer 4 can be easily made based on the predetermined gap width. The width can be measured. Therefore, it can be easily and reliably detected whether or not the spread width of the plating layer 4 is within an allowable range. Accordingly, it is possible to provide a multiple-wiring board 100 that can easily determine the spreading width of the plating layer 4.

  Such an identification member 5 is, for example, a metal material such as tungsten, manganese, copper, silver, gold, palladium, platinum, aluminum oxide sintered body (alumina ceramic), aluminum nitride sintered body, mullite quality. It is formed of a ceramic material such as a sintered body, a silicon nitride sintered body, a silicon carbide sintered body, and a glass ceramic sintered body.

  For example, if the identification member 5 is made of tungsten, the same metal paste as that for forming the wiring conductor 3 is printed on the surface of the ceramic green sheet forming the wiring board region 1 in a predetermined pattern. Can be formed.

  Further, the multi-piece wiring board 100 of the present invention can be formed of the same material as the wiring conductor 3 formed in the wiring board region 1 because at least one of the opposing identification members 5 is a conductor pattern. It is possible, and the deposition conditions of the plating member 4 deposited on the identification member 5 and the wiring conductor 3 are the same. Therefore, the spread width of the plating layer 4 deposited on the identification member 5 and the wiring conductor 3 can be made more accurate. Further, for example, when the plating layer 4 is deposited by an electrolytic plating method, the plating layer 4 can be deposited on the identification member 5 in the same manner as when the wiring conductor 3 is plated.

  Accordingly, by confirming the identification member 5 (gap), the spread width of the plating layer 4 deposited on the wiring conductor 3 can be determined more accurately.

  When the plating layer 4 is deposited on the identification member 5 by electrolytic plating, for example, the identification member 5 is electrically connected to the wiring conductor 3 via a connection conductor (not shown). In this case, a current for plating is also supplied to the identification member 5. The connecting conductor can be formed, for example, in the wiring board region 1 and the dummy region 2 with the same material and method as the wiring conductor 3.

  Furthermore, in the multiple wiring substrate 100 of the present invention, since a certain gap is at least an allowable spread width, the spread of the plating layer is allowed depending on the presence or absence of the gap after the plating layer 4 is deposited. Whether it is within the range can be determined more easily.

  That is, when the gap is the same as the allowable spread width, whether or not the spread width of the plating layer 4 is within the allowable range can be easily detected based on the presence or absence of the gap. More specifically, when the gap can be confirmed, it can be determined that the spread width of the plating layer 4 is within the allowable range, and when the gap cannot be confirmed, the spread width of the plating layer 4 is not within the allowable range. I can judge. When the gap is wider than the allowable spread width, it is easily detected whether or not the spread width of the plating layer 4 has reached the allowable width by measuring the width of the remaining gap. be able to.

(Embodiment 2)
Next, a multiple wiring substrate 100 according to claim 5 will be described with reference to FIG.

  FIG. 2A is a plan view showing an example of the multiple wiring substrate 100 according to Embodiment 2 of the present invention. FIG. 2B is a detailed view of a portion X2 in FIG. In addition, about the structure which is common in Embodiment 1 described previously, the same referential mark is attached | subjected and the overlapping description shall be abbreviate | omitted.

  In the multiple wiring substrate 100 according to the present invention, the pair of opposing identification members 5 is such that the opposing pair of conductor patterns is one side facing each other in a frame-like shape. The pair of discriminating members 5 spreading toward each other (inward direction). Therefore, by confirming the gap between the pair of identification members 5 facing each other, the spread of the plated layers on both sides allowed for the wiring conductor 3 can be confirmed.

(Embodiment 3)
Next, a multiple wiring substrate 100 according to claim 6 will be described with reference to FIG.

  FIG. 3A is a plan view showing an example of the multiple wiring substrate 100 according to Embodiment 3 of the present invention. FIG. 3B is a detailed view of a portion X3 in FIG.

In addition, about the structure which is common in Embodiment 1 described previously, the same referential mark is attached | subjected and the overlapping description shall be abbreviate | omitted.

  In the multiple wiring substrate 100 of the present invention, since the opposing identification member 5 has a quadrangular shape, not only the spreading of the plating layer 4 in only one direction can be confirmed, but also the spreading of the plating layer 4 in different two directions. Can be confirmed.

  Furthermore, the multi-wiring board 100 of the present invention has a wiring conductor since the opposing identification member 5 is a conductor pattern and a certain gap is at least twice the allowable spread width. Thus, it is possible to form a state similar to that in which the third plating layer 4 spreads outward of the wiring conductor 3 and to more accurately determine the spread of the plating layer 4 of the wiring conductor 3.

  Furthermore, since the multiple wiring substrate of the present invention has a plurality of opposing identification members in the dummy area, the plating layer in the desired direction can be easily confirmed.

In addition, since the spread width of the plating layer can be confirmed by a plurality of identification members, even if the spread width of the plating layer varies between the identification members, it is necessary to confirm the plurality of identification members (for example, each spread width) It is possible to more accurately determine whether or not the spread width of the plating layer in the wiring conductor is within an allowable range. Since the plating layer includes at least one of a copper plating layer and a nickel plating layer, the individual wiring board corresponds to the base plating layer to be attached to the wiring conductor. Therefore, the electrical characteristics and reliability of the wiring conductor are effectively ensured. Therefore, according to this configuration, it is possible to more accurately determine the spread of the plating layer of the wiring conductor in which characteristics and reliability are ensured.

  The method for inspecting a multi-layer wiring board according to the present invention has a plurality of wiring board regions 1 and a dummy region 2, and a wiring conductor 3 is opposed to the dummy region 2 at a certain interval. A plurality of samples for inspecting the spread width of the plating layer 4 deposited on the wiring substrate region 1 and the conductor pattern on the plurality of wiring substrates 100 provided with at least one pair of identification members 5 arranged. A method for inspecting a wiring board 1, wherein a plurality of wiring boards 1 are immersed in a plating solution to form a plating layer 4 on the surface of the wiring conductor 3, and then at least one pair of dummy regions 2 is formed. By identifying the degree of plating in the interval between the identification members 5, it is determined whether or not the plating layer 4 in the wiring board region 1 is acceptable.

  The above description of the inspection method is performed using a plurality of wiring boards 100 as shown in FIGS. 1 to 3 as an example, and drawings showing the inspection method along the procedure are omitted. Each code | symbol is quoted from FIGS. 1-3.

  Since it was set as such an inspection method, it can be easily confirmed whether it is in the range of the allowable plating layer 4 without measuring the spread width of the plating layer 4 of the wiring conductor 3 in the wiring board region 1.

  Therefore, it is possible to provide a method for inspecting a multi-chip wiring board that can easily determine the spread width of the plating layer 4 formed on the multi-chip wiring board 100.

  It should be noted that at least one pair of identification members having a plurality of wiring board regions 1 and dummy regions 2, wherein the wiring conductors 3 are disposed in the wiring substrate region 1 and are opposed to the dummy region 2 at a predetermined interval. The multiple wiring substrate 100 provided with 5 can be manufactured by the manufacturing method described above.

  Further, the degree of plating in the interval between the at least one pair of identification members 5 in the dummy region 2 is identified, for example, in visual inspection (including a case where a binocular microscope or the like is used) or an appearance inspection using an image recognition apparatus. This can be done by inspecting the gap of the working member 5 and confirming its width.

  Specifically, for example, a pair of identification members 5 are formed in a conductor pattern, and the width of the gap is set to be twice the permissible spreading width, and a plurality of wiring boards 100 are plated to form a wiring conductor. 2 and the identification member 5 are made to adhere the plating layer 4. Then, it is confirmed whether or not the spread width is within an allowable range by checking whether or not the gap remains by visual observation or an image recognition device.

  In this case, in order to identify the degree of plating, there are few (or no) other portions where the conductors such as the wiring conductors 3 are exposed in the dummy region 2, or a plating layer of nickel, gold, etc. and the dummy region 2 are formed. This can be easily performed because of a large difference in color tone and brightness (light reflectance) between the ceramic material and the like.

  The present invention is not limited to the first, second, and third embodiments described above, and various modifications and improvements can be made without departing from the scope of the present invention.

  For example, in Embodiment 3 described above, by making the quadrangular shape of the opposing identification member 5 a rectangular shape, in the plating process in which the plating layer 4 is deposited, the plurality of wiring substrate 100 is placed in the plating bath. By forming the side direction of the rectangular identification member 5 in accordance with the two perpendicular directions to be swung, the spread of the plating layer 4 occurring in the swinging direction can be confirmed more accurately.

(A), (b) is the top view which shows an example of the wiring board concerning Embodiment 1 of this invention, and the detail drawing of the part X1. (A), (b) is the top view which shows an example of the wiring board concerning Embodiment 2 of this invention, and the detail drawing of the part X2. (A), (b) is the top view which shows an example of the wiring board concerning Embodiment 3 of this invention, and the detail drawing of the part X2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wiring board area | region 2 ... Dummy area | region 3 ... Wiring conductor 4 ... Plating layer 5 ... Identification member 7 ... Dividing groove 100 ... Plural picking wiring board

Claims (10)

A plurality of wiring board regions having a plurality of wiring board regions and dummy regions, wherein a wiring conductor to which a plating layer is deposited is formed in the wiring substrate region;
The dummy region has at least one pair of identification members for identifying a spread width allowed when the plating layer deposits the wiring conductor, and the identification members are opposed to each other with a certain gap. A plurality of wiring boards, characterized in that they are arranged in the same manner. 2. The multiple wiring substrate according to claim 1, wherein at least one of the opposing identification members is a conductor pattern. 3. The multiple wiring substrate according to claim 1, wherein the certain gap is at least the allowable spread width. 2. The multiple wiring substrate according to claim 1, wherein the pair of identification members facing each other is a pair of conductor patterns facing each other. 5. The multiple wiring substrate according to claim 4, wherein the pair of opposing conductor patterns is one side facing each other in a frame shape. 5. The multiple wiring substrate according to claim 4, wherein the pair of opposing conductor patterns is a pair of quadrangular shapes. 7. The multiple wiring substrate according to claim 4, wherein the predetermined gap is at least twice the allowable spread width. The multi-piece wiring board according to claim 1, wherein the dummy region has a plurality of pairs of identification members facing each other. 9. The multiple wiring substrate according to claim 1, wherein the plating layer includes at least one of a copper plating layer and a nickel plating layer. There are provided a plurality of wiring board regions and a dummy region, and a wiring conductor is provided in the wiring board region, and at least one pair of identification members is provided in the dummy region so as to face each other at a predetermined interval. A method for inspecting a multi-cavity wiring board for inspecting a spread width of a plating layer deposited on the wiring board area and the conductor pattern on a multi-cavity wiring board, wherein the multi-cavity wiring board is placed in a plating solution. So as to form a plating layer on the surface of the wiring conductor, and then identify the degree of plating in the gap between the at least one pair of identification members in the dummy region, thereby forming the plating layer in the wiring substrate region. A method for inspecting a multi-circuit board, characterized by determining whether or not it is possible.

Images