CN209882217U

CN209882217U - Inner layer scattering type glue blocking structure of multilayer circuit board

Info

Publication number: CN209882217U
Application number: CN201920342183.3U
Authority: CN
Inventors: 李鸿光; 陈子安
Original assignee: Guangdong Hetong Technology Co Ltd
Current assignee: Guangdong Hetong Technology Co Ltd
Priority date: 2019-03-18
Filing date: 2019-03-18
Publication date: 2019-12-31
Anticipated expiration: 2029-03-18

Abstract

The utility model discloses a multilayer circuit board inlayer scattering formula hinders glued structure, including component layer and first inlayer, component layer below is pasted first inlayer, first inlayer below is pasted the circuit layer, circuit layer below is pasted the second inlayer, second inlayer below has the welding layer in the year, first inlayer is because 2mm department of second inlayer upper and lower both sides edge has all laid the copper bar, the thickness of copper bar is 0.1-0.2mm, the copper bar width is 10-15mm, evenly seted up the opening on the copper bar, wherein, the opening is the formula of outwards radiating from the center and sets up; through the welding copper bar all around at first inlayer and second inlayer, make the opening of the gummosis mouth of formula of dispersing on the copper bar, reach suitable prevention resin and glue and spill over, can make resin glue again because of the appropriate gummosis mouth of passing through of high-pressure process flows, reach the even packing of middle resin insulating cement and do not overflow again and lack gluey, guarantee the bonding effect of effectual adhesive force.

Description

Inner layer scattering type glue blocking structure of multilayer circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is multilayer circuit board inlayer scattering formula hinders glued structure.

Background

The circuit board has the name: the printed circuit board comprises a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board, a printed circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, and the FPC circuit board and a rigid-flexible printed circuit board (FPC) and PCB are born and developed, so that a new product of the rigid-flexible printed circuit board is promoted. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.

The circuit board among the prior art is carrying out the pressfitting in-process, and outside the board was spilled over to the resin glue high temperature flow back on the circuit board, benefit back because its resin glue is not even enough on the circuit board, the life greatly reduced when letting it use, perhaps the condition emergence of short circuit appears, so can't satisfy prior art needs.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multilayer circuit board inlayer scattering formula hinders glued structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the scattering type glue blocking structure for the inner layer of the multilayer circuit board comprises an element layer and a first inner layer, wherein the first inner layer is pasted below the element layer, a circuit layer is pasted below the first inner layer, a second inner layer is pasted below the circuit layer, a welding layer is arranged below the second inner layer, copper strips are paved at 2mm positions of the edges of the upper face and the lower face of the second inner layer of the first inner layer, the thickness of each copper strip is 0.1-0.2mm, the width of each copper strip is 10-15mm, openings are uniformly formed in the copper strips, and the openings are formed in a mode of radiating outwards from the center.

Preferably, the element layer further comprises an element surface text layer, an element surface solder mask layer and an element circuit layer.

Preferably, the welding layer further comprises a welding surface solder mask layer and a welding surface character layer.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a welding copper bar all around at first inlayer and second inlayer, make the opening of the gummosis mouth of formula of dispersing on the copper bar, reach appropriate prevention resin and glue and spill over, can make the resin glue flow out because of the suitable gummosis mouth that passes through of high-pressure process again, reach the resin insulation glue of centre and evenly fill and do not have the overflow to lack gluey again, guarantee the bonding effect of effectual adhesive force to avoid its inhomogeneous and can not appear the condition of short circuit.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic view of a first inner layer structure of the present invention;

fig. 3 is a schematic view of the structure of the present invention.

In the figure: 1-an element layer; 2-a first inner layer; 21-copper bar; 22-an opening; 3-a line layer; 4-a second inner layer; 5-welding layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: multilayer circuit board inlayer scattering formula hinders glued structure, including component layer 1 and first inlayer 2, component layer 1 below is pasted first inlayer 2, first inlayer 2 below is pasted circuit layer 3, circuit layer 3 below is pasted second inlayer 4, second inlayer 4 below has welded layer 5 in the year, first inlayer 2 is because 2mm departments of second inlayer 4 upper and lower two sides edge have all been laid copper bar 21, the thickness of copper bar 21 is 0.1-0.2mm, copper bar 21 width is 10-15mm, opening 22 has evenly been seted up on copper bar 21, wherein, opening 22 is the formula of outwards scattering from the center department and sets up.

The element layer 1 further comprises an element surface character layer, an element surface solder mask layer and an element circuit layer, the welding layer 5 further comprises a welding surface solder mask layer and a welding surface character layer, and the first inner layer 2 and the second inner layer 3 are the same in structural form.

The working principle is as follows: when the circuit board is processed, the adhered copper strips 21 are paved on the first inner layer 2 and the second inner layer 4 to form a buffer isolation strip region, in addition, the copper strips 21 are provided with openings 22 which are diverged outwards from the center to be used as glue flowing channels, and resin glue can be uniformly attached to the surfaces of the circuit and the base material in the pressing process to be used as an insulating isolation layer in two layers of circuits.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Multilayer circuit board inlayer scattering formula hinders glued structure, including component layer (1) and first inlayer (2), its characterized in that: the component layer (1) below is pasted with first inlayer (2), line layer (3) have been pasted to first inlayer (2) below, second inlayer (4) have been pasted to line layer (3) below, second inlayer (4) below year has welded layer (5), first inlayer (2) are because copper bar (21) have all been laid in second inlayer (4) upper and lower two sides edge 2mm department, the thickness of copper bar (21) is 0.1-0.2mm, copper bar (21) width is 10-15mm, opening (22) have evenly been seted up on copper bar (21), wherein, opening (22) are the formula of outwards dispersing from the center department and set up.

2. The multilayer circuit board inner layer scattering type glue blocking structure according to claim 1, characterized in that: the element layer (1) further comprises an element surface character layer, an element surface solder mask layer and an element circuit layer.

3. The multilayer circuit board inner layer scattering type glue blocking structure according to claim 1, characterized in that: the welding layer (5) further comprises a welding surface anti-welding layer and a welding surface character layer.