JPH10256702A - Manufacture of ceramic board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a plurality of ceramic boards for plating simultaneously the patterns of the ceramic boards, while suppressing the variations of their plating thicknesses. SOLUTION: A method of manufacturing ceramic boards has first and second processes. In the first process, connecting successively the ending point of a pattern 21 of a ceramic board belonging to each column in series with the starting point of the pattern 21 of the ceramic board following it, there are formed a paralleling pattern 23 for connecting in parallel with each other starting points 213 of the patterns 21 of the first boards belonging to the respective columns, a paralleling pattern 24 for connecting in parallel with each other ending points 214 of the patterns 21 of the final boards which belong to the respective columns, and inspecting lands 25 belonging to the respective columns, and then the patterns 21 of the boards are plated simultaneously by connecting both the paralleling patterns 23, 24 by a single power supply for plating. In the second process, after plating the patterns 21, cutting off each inspecting land 25 from the paralleling pattern 23, the presence of the current flowing through each land 25 and the paralleling pattern 24 is examined by applying different potentials from each other to both the portions to inspect the presence of any cutting in the patterns 21 connected in series with each inspecting land 25.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic substrate, which simultaneously performs pattern plating on a plurality of ceramic substrates.

[0002]

2. Description of the Related Art When a plurality of ceramic substrates are simultaneously subjected to pattern plating, as shown in FIG.
On the above, the plating patterns 92 of the ceramic substrate are formed in m rows and n columns (5 × 5 in the figure), and the pattern end point 922 of the plating pattern 92 located in the same column is set as the pattern start point 921 of the next pattern 92. One after another, they are connected in series by a connection pattern 931. Then, the end point 924 (or the start point) of the plating pattern 92 in the row located at the end of the column connected in series is connected by the parallel pattern 932, and the parallel pattern 932 is connected to the plating power source shown in FIG. The plating is formed on the pattern 92 by connecting to the cathode side of 94. In FIG. 8, reference numeral 96 denotes a metal plate to be plated.

[0003] As shown in FIG. 7, the start point 9 of the end of the pattern 92 of the row located at the end of the column connected in series
23 and the parallel pattern 932 are connected to different potentials of the power supply 941, respectively, and the pattern is cut to one of the patterns 92 connected in series depending on the presence or absence of a current flowing between the extreme start point 923 and the parallel pattern 932. Inspect for presence. That is, when there is a pattern cut in any of the patterns 92 connected in series, no current flows, so that a pattern defect (cut) can be detected. Then, the switch 99 is switched to sequentially inspect the patterns of all the columns.

[0004]

However, as shown in FIG. 7, the conventional method of pattern plating has an advantage that the inspection of pattern cutting after pattern plating is easy, but the plating thickness is not uniform. There is a problem that it is easy to become. That is, as the plating current (and thus the potential) decreases as the position approaches the extreme start point 923 (end side) from the parallelized pattern 932 (power supply side), as shown in the bar graphs 971 to 977 on the left side of FIG. The thickness gradually decreases with the distance from the parallelization pattern 932 (the power supply side).

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and it is possible to simultaneously perform pattern plating on a plurality of ceramic substrates while suppressing variations in plating thickness, and to easily perform pattern cutting defects. It is an object of the present invention to provide a method of manufacturing a ceramic substrate which can be inspected in a short time.

[0006]

The invention of the present application is a method of manufacturing a ceramic substrate in which pattern plating of a plurality of ceramic substrates having the same wiring pattern is simultaneously formed, wherein the pattern for plating the ceramic substrate is formed on a single substrate. Are formed in m rows and n columns and the pattern end points of the plating patterns located in the same row or column are connected in series to the next pattern start point one after another by a connection pattern, and are located at both ends of the serially connected rows or columns. A parallel pattern is provided to connect between the most extreme start points and the most extreme end points of the plating pattern of the column or row, and between the parallel pattern and each extreme start point or the parallel pattern and each extreme. A first step of forming a test land between the end point and connecting both of the parallelized patterns to the same plating power source to perform pattern plating; After pattern plating, the pattern is cut between the parallelized pattern and the inspection land, the inspection land and the other parallel pattern are connected to different potentials, and the presence or absence of a current flowing between both parts is determined. A second step of inspecting whether or not a pattern connected in series to the inspection land is cut, and a third step of dividing the pattern into m × n single ceramic substrate patterns after the inspection. And a method for manufacturing a ceramic substrate.

The first point of particular interest in the present invention is that the most extreme start point and the most extreme end point of a plating pattern in a column or row located at both ends of a row or column are connected by a parallel pattern. Then, both parallel patterns are connected to the same plating power source to perform pattern plating. Since the end start points and the end end points are connected in parallel patterns, the plating power supply may be connected at two points (parallel patterns), and the plating operation is easy (FIG. 1). reference).

[0008] Unlike the conventional method, both sides of the extreme end start point and extreme end point are connected to the same plating power source to perform pattern plating. Therefore, the extreme start point and extreme end point that produce the maximum potential difference in the conventional method have the same potential in the method of the present invention. In the method of the present invention, the point having the lowest potential (ie, the point at which the plating current is minimized) is an intermediate point between the two extreme points, and is a half distance as compared with the conventional method.

Therefore, the maximum potential difference between the patterns on the substrate at the time of plating (accordingly, the difference in plating current and the difference in plating thickness) is reduced to half of the conventional method, and the maximum value of the difference in plating thickness is halved. (See FIG. 5). In other words, if the same variation in the plating thickness as in the prior art is allowed, it is possible to simultaneously manufacture twice the number of sheets in one process.

A second point of particular interest in the present invention is that a land for inspection is formed between the parallelized pattern and each of the extreme start points or between the parallelized pattern and each of the extreme end points. After pattern plating, the pattern is cut between the parallel pattern and the inspection land, the inspection land and the other parallel pattern are connected to different potentials, and the current flowing between the two parts is reduced. The presence / absence is to inspect whether the pattern connected in series to the inspection land is cut or not.

That is, since an inspection land is formed between the parallel pattern and one of the end points, the substrate is broken between the parallel pattern and the inspection land during pattern inspection. By cutting the pattern by such a method as described above, and connecting the above-mentioned inspection land and the other parallel pattern to different potentials, the pattern cutting inspection can be easily performed as in the conventional case (FIG. 3). , FIG. 7).

If there is a pattern cut in any of the patterns connected in series with the inspection land, no current flows between the inspection land and the parallelized pattern. , A pattern defect (cut) can be easily detected for each column or row. As described above, according to the present invention, a plurality of ceramic substrates can be subjected to pattern plating at the same time while suppressing variations in plating thickness, and a pattern cutting defect can be easily inspected.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment This embodiment is, as shown in FIGS. 1 to 4, a method of manufacturing a ceramic substrate in which pattern plating of a plurality of ceramic substrates 10 (FIG. 4) having the same wiring pattern 11 (FIG. 4) is simultaneously formed. is there. That is, in the first step, as shown in FIG. 1, a wiring pattern is screen-printed on one or more ceramic green sheets with a conductive paste and, if necessary, a plurality of sheets are laminated to form a single substrate 31. The plating pattern 21 of the ceramic substrate 10 is formed on m rows and n rows.
A row formed in a row (m = n = 5) and connected in series with a pattern end point 212 of the plating pattern 21 located in the same row to a start point 211 of the next pattern 21 one after another by a connection pattern 22. Parallelized patterns 23 and 24 connecting between the extreme end points 213 and the extreme end points 214 of the plating patterns in the rows located at both ends of the pattern.
And an inspection land 25 is formed between one of the parallelized patterns 23 and each of the extreme start points 213, and after firing, both the parallelized patterns 23 and 24 are connected to the same plating power source 94. Connect and perform pattern plating.

In the subsequent second step after pattern plating,
First, as shown in FIG. 2, the pattern between the parallel pattern 23 and the inspection land 25 is cut by a method of breaking the end of the substrate 31 or the like. Subsequently, as shown in FIG. 3, the single inspection land 25 and the other parallel pattern 24 are connected to different potentials (positive or negative of the power source 42), respectively, and the presence or absence of a current flowing between the two parts is determined by the presence or absence of the current. An inspection is performed to determine whether or not a pattern connected in series to the inspection land is disconnected. Then, all the inspection lands 25 one after another.
The same inspection is conducted for Then, after the above inspection, in the subsequent third step, as shown in FIG.
It is cut and divided into × 5 single ceramic substrates 10.

In the first step of this embodiment, as shown in FIG.
Since the endmost start point 213 and the endmost end point 214 are connected by the parallel pattern 23 or 24, respectively, the plating power source 94 is two points (parallel patterns 23 and 24).
The plating work is easy. And
Both the extreme start point 213 and extreme end point 214 are powered by power 9
4 and connected to the same potential to perform pattern plating.

Therefore, the point at which the potential is the lowest with respect to the plating power supply during plating (that is, the point at which the plating current is minimized) is an intermediate point between the extreme ends 213 and 214 in this example, and is shown in FIG. This is a point at half the distance of the conventional method. Therefore, the maximum potential difference between the patterns 21 on the substrate 31 during the plating process (therefore, the plating current difference, that is, the plating thickness difference) is reduced to half of the conventional method.

That is, reference numerals 61 and 67 and reference numeral 64 in FIG.
The maximum value of the plating thickness difference is halved with respect to the difference between the reference numerals 971 and 977 in the case of the conventional method, as shown by the difference between the bar graphs of FIG. In other words, if the same variation in plating thickness (difference between 971 and 977) as in the prior art is allowed, the number of sheets (1
(0 rows × 5 columns) can be manufactured simultaneously.

In the second step, as shown in FIG.
By connecting the inspection land 25 and the other parallelized pattern 24 to different potentials, the cutting inspection of the pattern 21 can be easily performed as in the related art.
That is, the pattern 21 connected in series with the inspection land 25.
If any one of the patterns has a pattern cut, no current flows between the inspection land 25 and the parallelized pattern 24. Therefore, by sequentially switching the changeover switch 41, a voltage is applied between the inspection land 25 and the parallelized pattern 24, and a pattern failure (cutting) occurs for each inspection land 25 and each column connected to the inspection land 25. Can be easily detected. As the ceramic substrate, alumina (Al ₂
O _3), aluminum nitride (AlN), may be any one of a glass ceramic or the like, the conductive paste used to them can be selected in each of the ceramic sintering temperature. The plating can be applied to any of Ni, Au, Cu plating and the like.

[0019]

As described above, according to the present invention, it is possible to pattern-plate a plurality of ceramic substrates simultaneously while suppressing variations in plating thickness, and to easily inspect a pattern for cutting defects. Thus, a method for manufacturing a ceramic substrate that can be obtained can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing a connection mode between a plating power supply and a substrate during a plating step in a manufacturing method according to an embodiment.

FIG. 2 is a view showing an aspect of cutting a substrate as a pretreatment of an inspection step in the manufacturing method of the embodiment.

FIG. 3 is a view showing a connection state between an inspection power supply and a substrate during an inspection step in the manufacturing method of the embodiment.

FIG. 4 is a view showing a mode of cutting the ceramic substrate in the manufacturing method of the embodiment.

FIG. 5 shows a case according to the method of the embodiment (reference numerals 61 to 6).
FIG. 7 is a diagram showing a difference in plating thickness between the case 7) and the case of the conventional method (reference numerals 971 to 977).

FIG. 6 is a diagram showing a connection mode between a plating power supply and a substrate during a plating step in a conventional manufacturing method.

FIG. 7 is a diagram showing a connection mode between a plating power supply and a substrate during an inspection step in a conventional manufacturing method.

FIG. 8 is a diagram schematically showing an electrical connection mode in a plating step.

[Explanation of symbols]

 21. . . Pattern, 213. . . End-most starting point, 214. . . End point 23, 24. . . Parallelization pattern, 25. . . Inspection land,

Claims (1)

[Claims] 1. A method of manufacturing a ceramic substrate, comprising simultaneously forming a pattern plating of a plurality of ceramic substrates having the same wiring pattern, wherein the plating patterns of the ceramic substrate are arranged in m rows and n columns on a single substrate. The plating end points of the plating patterns formed and located on the same row or column are connected in series to the next pattern starting point one after another by a connection pattern, and the plating of columns or rows located at both ends of the serially connected rows or columns is performed. A parallel pattern is provided to connect between the end points of the end of the application pattern and between the end points of the end, and between the parallel pattern and each of the end start points or between the parallel pattern and each of the end end points. A first step of forming inspection lands and connecting both of the parallelized patterns to the same plating power source to perform pattern plating; and The pattern is cut between the parallel pattern and the inspection land, the inspection land and the other parallel pattern are connected to different potentials, and the inspection is performed based on the presence or absence of a current flowing between both parts. A second step of inspecting whether or not a pattern connected in series to the land for use is cut, and a third step of dividing the pattern into m × n single ceramic substrate patterns after the inspection. A method of manufacturing a ceramic substrate.