JP4297538B2 - Manufacturing method of printing mask and printing mask manufactured by the method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a printing mask, and more specifically, a printing method in which a through-opening portion having a predetermined pattern is formed in a mask material, and the opening is filled with a resin for protecting the inner wall of the opening, followed by half-etching. The present invention relates to a mask manufacturing method.
[0002]
[Prior art]
As a printing mask for printing paste such as cream solder, ink, adhesive, paste-like resin, etc. on a printed material such as a printed circuit board, a through opening of a printing pattern was formed on a metal plate by a punch press. A punch press mask, a YAG laser mask with a printed pattern penetrating opening formed on a metal plate with a YAG laser, a photomask with a resist layer formed by applying a photosensitive resin on both sides of the metal plate, and a photomask depicting the pattern of the opening And then developing the resist layer to remove the portion of the resist layer corresponding to the opening pattern and etching it to form an etching mask and a plating mother in which a through opening of the printed pattern is formed on the metal plate A slightly thick photosensitive resin layer is formed on the material, exposed through a photomask having an opening pattern, and then exposed to light. By developing the resin layer, the photosensitive resin layer other than the portion corresponding to the opening pattern is removed, and a female mold is produced leaving the photosensitive resin layer corresponding to the opening pattern. There is known a metal mask such as an additive mask in which the surface is plated (mainly nickel) to a necessary thickness as a mask and a through opening of a printed pattern is formed on a metal plate. In addition, as a mask for printing that can improve the defects of metal masks and form high-definition fine pitch through-openings and print fine pitches on the substrate, plastic is used as the mask material. A plastic mask is known in which a through-opening portion of a printed pattern is formed on a plastic plate by an excimer laser or other methods (Japanese Patent Laid-Open No. 7-81027).
[0003]
In particular, a half-etching process may be applied to a printing mask in which fine openings are perforated. This half-etching process is a processing method for digging the surface of a relatively thick mask material to a certain depth. For example, a fine solder cream solder with finer holes than a peripheral opening formed in a printing mask. For the purpose of improving the detachability of paste such as ink and ink, it is used as a processing method for reducing the plate thickness of the fine hole forming portion of the printing mask.
[0004]
The half-etching process is conventionally performed by attaching a plastic film for surface protection to one side of a printing mask on which a through-opening portion of a printing pattern is formed, with the processing surface on the opposite side of the surface facing up, A method is employed in which after the resin for protecting the inner wall of the through opening is filled in the through opening, masking is performed, and then etching is performed with an etching solution so that the surface is dug down to a certain depth.
[0005]
Here, when filling the resin in the through opening, as shown in FIG. 2A, the resin is processed with a squeegee so that no excessive resin remains on the processed surface other than the through opening. The opening was filled so as to rub against the surface and filled with resin. However, when squeegee is excessive because the squeegee is rubbed against the processed surface, the upper part of the resin filled in the through opening may be swept away by the squeegee. This is shown in FIG. Further, as shown in FIG. 2C, when the etching depth by half etching is 30 μm, if the depth of the resin removed by the squeegee exceeds 30 μm, an edge portion A is generated on the processed surface. Then, when the etching proceeds with the edge portion A generated, the edge portion A is affected by the etching solution from above and from the side, so that etching is performed more than the other processed surface as shown in FIG. As a result, there arises a problem that the shape of the through opening cannot be kept good.
[0006]
On the other hand, when the resin squeezing is insufficient, the resin may remain on the processed surface as indicated by B in FIG. When the resin having resistance to the etching solution remains on the processed surface, as shown in FIG. 2C, there is a problem that uniform etching is not performed during half etching, and etching unevenness occurs.
[0007]
As described above, in the half etching process, the resin is not left on the processing surface, and the depth etched by the squeezing of the resin filled in the through opening is the desired etching depth by the half etching process. Although it is necessary to control squeezing so as not to exceed, accurate and constant squeezing of about several tens of microns has been very difficult.
[0008]
The above-described problem occurs when an etching solution is used for half-etching. However, the problem of etching unevenness due to the resin residue B as shown in FIG. This also occurs in an etching method, for example, excimer laser processing.
[0009]
[Problems to be solved by the invention]
The present invention has been made in view of the above problems, and its purpose is to deform the opening due to excessive squeezing of the resin for protecting the inner wall of the through opening when half-etching is performed. It is another object of the present invention to provide a printing mask manufacturing method and a printing mask manufactured by the method, which can prevent etching unevenness due to insufficient squeezing.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the invention of claim 1 is a printing in which a through-opening portion having a predetermined pattern is formed in a mask material and the opening inner wall protecting resin is filled in the opening portion, and then half-etching is performed. In the method for manufacturing a mask, a step of affixing a plastic film for surface protection on the first surface of the mask material, and then the second surface opposite to the first surface facing up to the opening Filling the resin, then sticking the film to the second surface, then removing the film from the first surface, and then processing the first surface to the processed surface And a half-etching process.
[0011]
According to a second aspect of the present invention, there is provided a printing mask manufactured by the method for manufacturing a printing mask according to the first aspect.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1A to 1E are views showing a method for manufacturing a printing mask according to an embodiment of the present invention. The illustrated example can be applied mainly to a method of manufacturing a half-etched product of a metal mask or a plastic mask that can be etched with an etching solution. In this embodiment, stainless steel is used as the mask material.
In the present embodiment, first, as shown in FIG. 1A, large and small through openings 5 and 6 each having a predetermined pattern are drilled in the mask material 1. The through openings 5 and 6 can be formed by punch press, YAG laser, etching, plating, etc. in the metal mask, and excimer laser in the plastic mask. Then, after the through openings 5 and 6 are formed, a laminate film 2 as a plastic film for surface protection is attached to the A surface which is one side of the mask material 1 with an adhesive.
[0013]
Next, as shown in FIG. 1B, the inner wall of the openings 5 and 6 is protected from the B surface, which is the surface opposite to the A surface on which the laminate film 2 is pasted, to the through openings 5 and 6. The resin 3 is filled. Here, the resin 3 only needs to be completely filled in the through openings 5 and 6, and may overflow from the upper portions of the openings 5 and 6 and spread on the upper surface of the mask material 1. In addition, it is desirable to arrange a flat support member under the laminate film 2 in order to prevent peeling of the laminate film 2 from the A surface of the mask material 1 when filling the resin. Then, after drying the resin 3, the laminate film 2 a is attached to the B surface of the mask material 1.
[0014]
Next, as shown in FIG. 1C, the mask material 1 is turned upside down, and the laminate film 2 is removed from the A surface of the mask material 1. Since the A surface from which the laminate film 2 was removed was covered with the laminate film 2 when the resin 3 was filled, the through openings 5 and 6 were filled with the resin 3 to the same height as the A surface, Resin 3 is never present in Thereafter, the portions other than the half-etching portion 7 are masked, and the half-etching processing is dug down to a certain depth from the B surface as shown in FIG. 1 (d) using an etching solution such as ferric chloride. Part 7 is formed. Then, by removing the resin 3 and the laminate film 2a from the mask material 1, a mask material 1 having a half-etched portion 7 as shown in FIG. 1 (e) can be obtained.
[0015]
As described above, in this embodiment, half etching is performed from the surface opposite to the surface filled with the resin 3, and therefore, the resin 3 is even filled in the through openings 5 and 6 when filling the resin. What is necessary is that conventional resin squeezing is not required. Therefore, it is possible to perform a favorable half-etching process without deformation of the through opening due to excessive squeezing or etching unevenness due to insufficient squeezing.
[0016]
In the present embodiment, the half etching process using the etching solution has been described as an example. However, the present invention can also be applied to other half etching process methods. For example, in the case of performing half-etching with an excimer laser, the problem of etching unevenness due to the resin residue as described above can be solved.
[0017]
【The invention's effect】
According to the first aspect of the present invention, since the first surface to which the laminate film is attached is the bottom surface, the through opening is filled with the resin from the second surface. The resin is filled to the same position, and the resin does not exist on the first surface. And since half etching is performed from the first surface, squeezing of the resin is unnecessary, and there is no deformation of the through opening due to excessive squeezing, and no etching unevenness due to insufficient squeezing. There is an excellent effect that half-etching can be performed.
[0018]
According to the second aspect of the present invention, since the mask is manufactured by the manufacturing method of the first aspect, the mask has a half-etched portion free from deformation of the through opening due to excessive squeezing and etching unevenness due to insufficient squeezing. There is an excellent effect that a material can be obtained.
[Brief description of the drawings]
FIGS. 1A to 1E are schematic cross-sectional views for explaining a method for manufacturing a printing mask according to the present embodiment.
FIGS. 2A to 2D are schematic cross-sectional views of a printing mask for explaining problems of the prior art.
[Explanation of symbols]
1 Mask material 2, 2a Laminate film 3 Resin 4 Squeegee 5 Through opening (large)
6 Through opening (small)
7 Half-etched part

Claims (2)

In a manufacturing method of a printing mask for forming a through-opening portion of a predetermined pattern in a mask material and filling the opening portion with the resin for protecting the inner wall of the opening portion, then performing a half etching process,
A step of affixing a plastic film for surface protection on the first surface of the mask material, and a step of filling the resin into the opening with the second surface opposite to the first surface facing up. Then, the step of attaching the film to the second surface, the step of removing the film from the first surface, and the step of performing half-etching using the first surface as a processing surface A method for producing a printing mask, comprising: A printing mask manufactured by the method for manufacturing a printing mask according to claim 1.

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