JP2008053524A - Apparatus for manufacturing circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform positioning of a base film precisely and inexpensively. <P>SOLUTION: The apparatus for manufacturing a circuit board comprises a stage 5 for mounting a base film 4, a fixing frame 3 for arranging a mask 2 fixedly on the stage 5, and a punch 6 for punching the base film 4. The fixing frame 3 and the mask 2 have pins for positioning the mask 2 with respect to the fixing frame 3, respectively, and the mask 2 has holes for positioning the base film 4 with respect to the fixing frame 3. The punch 6 performs punching of the base film 4 through the positioning holes of the mask, thus forming the holes for positioning the base film 4 with respect to the fixing frame 3. After formation of the positioning holes, the adhesive is patterned. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a circuit board manufacturing apparatus suitable for being applied to a manufacturing process of a flexible printed wiring board.

Conventionally, as a method for manufacturing a circuit board, an adhesive is patterned on the surface of the base film using a mask having an opening formed in accordance with the shape of the circuit pattern, and then a metal foil is formed on the surface of the base film. And cut the border line between the metal foil corresponding to the circuit pattern area and the metal foil in the other area using a blade mold or a laser, and peel off the metal foil other than the circuit pattern area as an unnecessary metal foil. The method is known. In such a manufacturing method, (1) a positioning hole for specifying the position of the circuit pattern is previously formed in the base film, and positioning pins provided on the circuit board manufacturing apparatus side are inserted into the positioning hole, 2) When patterning the adhesive, a positioning mark is printed on the base film, the printed mark is recognized using an image processing device, and a positioning hole is punched at the recognized mark position. By doing so, the base film is positioned.
JP 2000-269272 A

  However, in general, since the base film is thin and the base film is deformed once the positioning pins are inserted into the positioning holes, when positioning the base film using the method (1), The positioning holes cannot be used in the process, and the base film cannot be accurately positioned. On the other hand, when the substrate film is positioned using the method (2), the image processing apparatus is expensive, and the positioning operation cannot be performed at a low cost. In addition, when the color of the mark printed on the base film is colorless or nearly colorless, it is difficult to recognize the image of the mark, and there is a restriction on the printing color of the mark.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a circuit board manufacturing apparatus capable of positioning a base film with high accuracy and at low cost.

  In order to solve the above-mentioned problem, a circuit board manufacturing apparatus according to the present invention described in claim 1 uses a mask (2) having an opening (10) formed in accordance with the shape of a circuit pattern as a base material. After patterning the adhesive (9) on the surface of the film (4), a metal foil is pasted on the surface of the base film (4), and the boundary between the metal foil corresponding to the circuit pattern region and the metal foil in other regions In a circuit manufacturing apparatus in which a line is cut and a metal foil other than the circuit pattern area is peeled off as an unnecessary metal foil, a stage (5) on which a base film (4) is placed and a mask (2) on a stage (5 ) And a punch (6) for punching the base film (4). The fixed frame (3) and the mask (2) are respectively fixed frame (3). Position of mask (2) with respect to A positioning pin (22) and a first positioning hole (12), and the mask (2) is a second positioning hole for positioning the base film (4) with respect to the fixed frame (3). (13), and the punch (6) punches the base film (4) through the second positioning hole (13), thereby positioning the base film (4) with respect to the fixed frame (3). A third positioning hole for forming is formed, and the adhesive is patterned after the third positioning hole is formed.

  A circuit board manufacturing apparatus according to a second aspect of the present invention is the circuit board manufacturing apparatus according to the first aspect, wherein the adhesive is patterned on the peripheral portion of the second positioning hole (13). An adhesive inflow prevention part for preventing the adhesive from flowing into the base film (4) from the second positioning hole (13) is formed.

  According to the circuit board manufacturing apparatus according to the first aspect of the present invention, the base film can be positioned accurately and inexpensively.

  According to the circuit board manufacturing apparatus according to the second aspect of the present invention, when the adhesive is patterned, the adhesive can be prevented from flowing into the base film from the second positioning hole.

  Hereinafter, a circuit board manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

[Configuration of circuit board manufacturing equipment]
First, the configuration of a circuit board manufacturing apparatus according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, a circuit board manufacturing apparatus 1 according to an embodiment of the present invention fixes a pattern printing metal mask (hereinafter abbreviated as mask) 2 having an opening formed in accordance with the shape of a circuit pattern. Fixed frame 3, equipment table 5 on which base film 4 is placed, and base film 4 through mask 2 by descending toward through hole 7 formed in equipment table 5. A punch 6 for punching a positioning hole and a squeegee 8 for applying an adhesive on the surface of the base film 4 through the mask 2 are provided as main components. In the present embodiment, the mask 2 is made of metal, but the mask 2 may be formed of glass.

  As shown in FIG. 2, the mask 2 has an opening 10 formed in accordance with the shape of the circuit pattern and a mounting guide hole 11 formed at a position corresponding to a mounting guide pin provided on the fixed frame 3 side. And positioning holes 12 formed at positions corresponding to the positioning pins provided on the fixed frame 3 side, and relief holes 13 of the punch 6 formed in the vicinity of the circuit pattern. Moreover, the escape hole 13 is formed by making a hole in the top part of the convex part formed by embossing, as shown in FIG. According to such a configuration, it is possible to prevent the adhesive from leaking from the escape hole 13 when applying the adhesive on the surface of the base film 4 through the mask 2. In addition, since embossing cannot be performed when the mask 2 is formed of glass, it is possible to prevent leakage of the adhesive from the escape hole 13 by disposing a cylindrical rib on the outer peripheral portion of the escape hole 13. Good.

  As shown in FIG. 1, the fixed frame 3 is formed by a fixed frame main body 3a and a plate presser 3b. On the periphery of the fixed frame main body 3a, as shown in FIG. 4, mounting guide pins 21 and positioning pins 22 are arranged. Is formed. The plate retainer 3b is formed with an installation guide hole (not shown) formed at a position corresponding to the installation guide pin 21 and a positioning hole 32 (see FIG. 5) formed at a position corresponding to the positioning pin 22. Has been. When the mask 2 is fixed, as shown in FIG. 5, the position of the mounting guide pin 21, the position of the mounting guide hole of the mask 2 and the plate press 3b, the position of the positioning pin 22, the mask 2 and the plate press 3b. The mask 2 is sandwiched between the fixed frame main body 3a and the plate presser 3b. Thereby, the mask 2 can be accurately positioned with respect to the apparatus (fixed frame 3).

[Circuit board manufacturing process flow]
Next, a flow of a circuit board manufacturing process using the circuit board manufacturing apparatus 1 will be described with reference to FIG.

  When a circuit board is manufactured using the circuit board manufacturing apparatus 1, first, as shown in FIG. 6A, the mask 2 is moved to the base film 4 by lowering the fixed frame 3 to which the mask 2 is fixed. After making contact with the surface, the punch 6 is lowered toward the through hole 7 to punch the positioning hole in the base film 4 through the escape hole 13 of the mask 2. Next, as shown in FIG. 6B, the adhesive 9 is applied onto the surface of the base film 4 through the openings 10 formed in the mask 2 by scanning the squeegee 8. Next, as shown in FIG. 6 (c), the mask 2 and the base film 4 are separated by raising the fixed frame 3, and the base film 4 is removed from the equipment stage 5 as shown in FIG. 6 (d). Remove. Thereafter, by performing the same process as the conventional circuit board manufacturing process, a series of manufacturing processes is completed.

  As is clear from the above description, the circuit board manufacturing apparatus 1 according to the embodiment of the present invention includes a stage 5 on which the base film 4 is placed, a fixed frame 3 on which the mask 2 is fixedly disposed on the stage 5. , A punch 6 for punching the base film 4, and the fixed frame 3 and the mask 2 each have a positioning pin 22 and a positioning hole 12 for positioning the mask 2 with respect to the fixed frame 3. Has a positioning hole 13 for positioning the base film 4 with respect to the fixed frame 3, and the punch 6 punches the base film 4 through the positioning hole 13 to thereby form the base film 4 with respect to the fixed frame 3. Since the positioning hole for positioning is formed and the adhesive is patterned after the positioning hole is formed, the base film 4 can be positioned with high accuracy and safety. It can be carried out in.

  Moreover, according to the circuit board manufacturing apparatus 1 which becomes embodiment of this invention, when patterning an adhesive agent to the peripheral part of the positioning hole 12, an adhesive agent flows into the base film 4 from the positioning hole 13. FIG. Since the adhesive inflow prevention part for preventing is formed, it can prevent that an adhesive flows in into the base film 4 from the positioning hole 13 when patterning an adhesive.

  As mentioned above, although embodiment which applied the invention made by the present inventors was described, this invention is not limited by the description and drawing which make a part of indication of this invention by this embodiment. That is, it is added lastly that other embodiments, examples, operation techniques, and the like made by those skilled in the art based on the above embodiments are all included in the scope of the present invention.

It is sectional drawing which shows the structure of the circuit board manufacturing apparatus used as embodiment of this invention. It is a top view which shows the structure of the metal mask for pattern printing shown in FIG. It is sectional drawing which shows the structure of the escape hole shown in FIG. It is the top view and sectional drawing which show the structure of the fixed frame shown in FIG. It is a figure for demonstrating the method of attaching the metal mask for pattern printing to a fixed frame. It is a figure for demonstrating the flow of the circuit board manufacturing process used as embodiment of this invention.

Explanation of symbols

1: Circuit board manufacturing apparatus 2: Pattern printing metal mask 3: Fixed frame 3a: Fixed frame body 3b: Plate holder 4: Base film 5: Equipment table 6: Punch 7: Through hole 8: Squeegee 10: Opening 11 : Mounting guide hole 12: Positioning hole 13: Escape hole 21: Mounting guide pin 22: Positioning pin

Claims (2)

After patterning the adhesive (9) on the surface of the base film (4) using the mask (2) having the opening (10) formed in accordance with the shape of the circuit pattern, the base film (4) A circuit manufacturing apparatus for attaching a metal foil on the surface, cutting a boundary line between the metal foil corresponding to the circuit pattern area and the metal foil in the other area, and peeling the metal foil other than the circuit pattern area as an unnecessary metal foil. In
A stage (5) on which the base film (4) is placed, a fixing frame (3) for fixing and arranging the mask (2) on the stage (5), and a punching of the base film (4) A punch (6) for processing, and the fixed frame (3) and the mask (2) are each a positioning pin (22) and a first pin for positioning the mask (2) with respect to the fixed frame (3). The mask (2) has a second positioning hole (13) for positioning the base film (4) with respect to the fixed frame (3), and the punch (6). ) Is a third positioning hole for positioning the base film (4) with respect to the fixed frame (3) by punching the base film (4) through the second positioning hole (13). Forming the third positioning hole Circuit board manufacturing apparatus characterized by patterning the adhesive after.   In the circuit board manufacturing apparatus according to claim 1, when patterning adhesive on the peripheral portion of the second positioning hole (13), the base film (4) is formed from the second positioning hole (13). ), An adhesive inflow prevention portion for preventing the adhesive from flowing in is formed.

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