JP2012206400A - Screen printing device, adsorption plate thereof, and method for production of flexible printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deformation of a wiring board due to protrusion occurred in the previously printed solder resist to eliminate partial thickness unevenness of the solder resist to be printed afterward.SOLUTION: There is provided a screen printing device which prints a solder resist covering the prescribed portion of a wiring pattern on one surface of a flexible printed wiring board and then, prints the solder resist on the other surface. The device includes an adsorption plate for fixing the wiring board by adsorbing one surface thereof in vacuum, and a squeegee for printing the solder resist afterward by moving to the other surface via a screen mask. The adsorption plate comprises an adsorption hole for fixing the wiring board, and a recess for flatly holding the wiring board by absorbing the protrusion generating on the solder resist toward one surface of the previously printed board when fixing the board by adsorbing one surface thereof in vacuum.

Description

  The present invention relates to a screen printing apparatus, a suction plate thereof, and a method for manufacturing a flexible printed wiring board.

  Some screen printing apparatuses print a solder resist on a flexible printed wiring board, for example, a TAB tape for the purpose of insulating and protecting the wiring pattern. When screen-printing the solder resist on the TAB tape, the TAB tape is fixed by vacuum suction in a suction hole provided in the suction plate so that the TAB tape does not move during printing. Without this fixing, the TAB tape moves during printing, and the dimensional tolerance of about 100 to 300 μm cannot be satisfied. Therefore, the suction plate is an indispensable jig for screen printing. Generally, the suction plate has a large number of suction holes, and in the region other than the suction holes, the surface is flat and has no unevenness.

  As a related technique, there is known a technique in which a convex portion is provided on a suction plate to prevent deformation of a lead due to squeegee pressure (see, for example, Patent Documents 1 and 2).

Japanese Patent Laid-Open No. 7-45668 Japanese Patent Laid-Open No. 2003-23045

  When a solder resist for the purpose of insulating and protecting the wiring pattern is printed on the wiring board, there is no big problem when the solder resist is printed only on one side of the insulating film. Even when the solder resist is printed on both sides, no problem occurs when the solder resist is printed on the surface to be printed in advance. However, when the solder resist is printed on the back surface later, if the solder resist on the printed surface has an uneven shape, the thickness of the solder resist on the back surface to be printed later is affected. As a result, there is a problem that the wiring board shape is distorted, and the film thickness of the solder resist printed on the back surface is uneven.

  The object of the present invention is to solve the above-mentioned problems of the prior art, and later on the other surface due to the deformation of the wiring board shape caused by the convex portion of the solder resist printed on one surface. It is an object of the present invention to provide a screen printing apparatus capable of eliminating uneven thickness of a solder resist to be printed, its suction plate, and a method for manufacturing a flexible printed wiring board.

According to one embodiment of the present invention,
A flexible printed wiring board having a wiring pattern formed on both sides of an insulating film is printed with a solder resist covering a predetermined portion of the wiring pattern on one surface, and then a predetermined portion of the wiring pattern on the other surface. A screen printing apparatus for printing the solder resist covering
The solder resist is printed later by moving it to the other surface through a screen mask by sucking one side of the wiring board on which the solder resist has been printed first by vacuum suction and fixing the wiring board. With a squeegee to
In the suction plate,
A suction hole for fixing the wiring board by vacuum-sucking one surface of the wiring board on which the solder resist has been printed;
When fixing the wiring board by vacuum-adsorbing one surface of the wiring board on which the solder resist has been printed first, a convex portion generated in the solder resist on the one surface of the wiring board printed in advance. A screen printing apparatus is provided that is housed and provided with a recess for holding the wiring board flat.

Preferably, the concave portion accommodates a pair of convex portions of the solder resist generated at both ends of the solder resist on one surface of the printed wiring board, and holds the wiring substrate flat. A pair of parallel elongated grooves,
The solder resist is printed on the other surface of the wiring board that is sucked and fixed to the suction plate through the aligned screen mask so as to be substantially orthogonal to the moving direction of the squeegee. Is provided.

According to another embodiment of the invention,
A screen printing apparatus for fixing the wiring board by vacuum suction in order to print a solder resist covering a predetermined portion of the wiring pattern on both sides of a flexible printed wiring board having wiring patterns formed on both sides of an insulating film. An adsorption plate,
A suction hole for vacuum-adsorbing one surface of the wiring board on which the solder resist has been printed in advance and fixing the wiring board flat;
When fixing the wiring board by vacuum-adsorbing one surface of the wiring board on which the solder resist has been printed first, a convex portion generated in the solder resist on the one surface of the wiring board printed in advance. There is provided a suction plate for a screen printing apparatus which is housed and provided with a recess for holding the wiring board flat.

Preferably, the concave portion accommodates a pair of convex portions of the solder resist generated at both end portions of the solder resist on one surface of the printed wiring board, and holds the wiring base flat. A pair of parallel elongated grooves,
The solder resist is printed on the other surface of the wiring board that is sucked and fixed to the suction plate through the aligned screen mask so as to be substantially orthogonal to the moving direction of the squeegee. Is provided.

According to another embodiment of the invention,
A solder resist that covers a predetermined portion of the wiring pattern is printed on one surface of a flexible printed wiring board in which a wiring pattern is formed on both surfaces of the insulating film, and then the predetermined portion of the wiring pattern is printed on the other surface. A method of manufacturing a flexible printed wiring board for printing the solder resist to be coated,
A suction hole for fixing one side of the wiring board by vacuum suction and the wiring printed earlier when fixing the wiring board by vacuum suctioning one side of the wiring board Accommodating convex portions generated in the solder resist on one surface of the substrate, preparing a suction plate provided with concave portions for holding the wiring substrate flat,
After first printing the solder resist that covers a predetermined portion of the wiring pattern on one surface of the wiring board,
In the state where the convex portion generated in the solder resist on the one surface of the printed wiring board previously printed is aligned with the concave portion provided in the suction plate, and the convex portion is accommodated in the concave portion, A step of vacuum housing one side of the wiring board and fixing the wiring board flatly;
A step of printing the solder resist that covers a predetermined portion of the wiring pattern later by moving a squeegee through a screen mask aligned with the other surface of the wiring substrate fixed flatly;
A method of manufacturing a flexible printed wiring board including the above is provided.

  According to the present invention, due to the deformation of the wiring board caused by the convex portion of the solder resist previously printed on one surface, the partial thickness unevenness of the solder resist printed later on the other surface is eliminated. be able to.

It is explanatory drawing which shows the state before and behind vacuum suction of the convex part of the soldering resist printed on the flexible printed wiring board which concerns on one embodiment of this invention, (a) is a state figure before adsorption | suction, (b) is It is a state diagram after adsorption. It is explanatory drawing of the suction plate which concerns on one embodiment of this invention, Comprising: (a) is a top view of the suction plate which drew the solder resist printed previously, (b) is xx of (a). 'Cross section. It is process drawing of the soldering resist printing to the 2 metal structure TAB tape of a prior art example, (a) is sectional drawing of the 2 metal structure TAB tape before printing, (b) is the step figure of the soldering resist printing to the surface, ( c) is a step diagram of solder resist printing on the back surface. It is a state figure explaining the deformation | transformation mechanism of the TAB tape by the vacuum suction of a prior art example, (a1) is a state figure before vacuum suction, (a2) is the principal part enlarged view of (a1), (b) is after vacuum suction. (C) is an enlarged view showing a state after solder resist printing on the back surface, and (d) is an enlarged explanatory view showing a partial solder resist film thickness abnormality after separating the suction plate. It is explanatory drawing of a general 2 metal structure TAB tape manufacturing process, (a) is a double-sided copper foil board, (b) is punching (guide drilling), (c) is laser processing, (d) is copper plating, ( (e) is a patterning, (f) a photo solder resist, and (g) is a diagram showing Au / Ni plating steps. It is a schematic explanatory drawing of the screen printing apparatus which concerns on one embodiment of this invention.

  An embodiment of the present invention will be described below.

  First, the problems of the prior art of the present invention will be described in more detail. When printing a solder resist on both sides where a wiring pattern is formed, such as a two-metal TAB tape (also simply called a TAB tape), the uneven shape generated in the solder resist on the printed surface is printed later. This will affect the thickness of the solder resist on the backside. The cause is as follows. The thickness of the polyimide film that bears the substrate of the two-metal structure TAB tape is as thin as 15 μm to 25 μm. For this reason, in the printing of the solder resist on the back surface, the influence of the uneven shape of the shape of the solder resist on the front surface S printed on the back surface becomes noticeable on the back surface by vacuum-adsorbing the TAB tape to the suction plate. If the solder resist is printed flat on the back surface of the TAB tape which is distorted due to the uneven shape, the thickness of the solder resist is uneven due to the distortion of the TAB tape on the printing surface.

(2-metal TAB tape)
This will be described with reference to FIG. 3, taking a two-metal TAB tape as a flexible printed wiring board as an example. A two-metal structure TAB tape 100 shown in FIG. 3A is formed from a back surface G side on a base material in which a copper foil as a metal foil is formed on a front surface S and a back surface G of a polyimide film 110 as an insulating film. By irradiating the laser, an opening that penetrates the copper foil on the back surface G side and the polyimide film 110 is formed. Next, a resist pattern (not shown) is formed on both sides of the copper foil by photolithography, and the exposed copper foil is etched to form copper wiring patterns 161 and 162. Then, copper plating 180 is applied on the copper wiring pattern on the back surface G side and in the opening so as to achieve conduction on both sides.

  As shown in FIG. 3B, a solder resist 171 is first printed on a predetermined portion of the wiring pattern 161 on the surface S of such a TAB tape 100. At this time, convex portions (swelled portions) 173 are generated at both ends of the solder resist 171. Thereafter, as shown in FIG. 3C, a solder resist 172 is printed on a predetermined portion of the wiring pattern 162 on the back surface G. Then, a thin portion 175 is formed due to the convex portion 173 at a portion corresponding to the convex portion 173 of the solder resist 172 on the back surface G, and this causes unevenness in the film thickness of the solder resist 172. Note that, as with the front surface S, the back surface G also has raised portions 174 at both ends of the solder resist 172.

(Causes of unevenness in film thickness)
Here, the process from FIG. 3B to FIG. 3C will be specifically described with reference to FIG. In particular, when using a thermosetting solder resist, as shown in FIG. 4, the solder resist generated when the screen mask is separated at both ends of the solder resist 171 printed on the surface S of the two-metal structure TAB tape 100. Due to the adhesion with 171 or the like, the raised portion 173 usually occurs (FIGS. 4A1 and 4A2). When the TAB tape 100 having such a raised portion 173 on the surface S is vacuum-sucked by the suction plate 200 having a flat surface without unevenness, the TAB tape 100 is deformed together with the polyimide film 110 starting from the raised portion 173 (FIG. 4 (b)). If the solder resist 172 is printed flat on the back surface G while the TAB tape 100 is deformed, the portion 111 corresponding to the raised portion 173 of the solder resist 171 on the front surface S is also printed flat (FIG. 4C). As a result, when the two-metal structure TAB tape 100 released from the suction plate 200 after printing is restored to its original shape, a concave portion 174 having a thin film thickness is formed in the portion 111. Therefore, the solder resist 172 This causes unevenness in the film thickness (FIG. 4D).

  The phenomenon that the film thickness becomes thin is that if there is a step (height variation) in the printing squeegee movement direction (left and right direction in the figure shown by the arrow in FIG. 4C), the solder resist thickness changes at the step part. It is strongly influenced by the solder resist shape in the direction perpendicular to the direction. That is, the film thickness of the solder resist 172 on the back surface G is thin where the raised portion 173 is generated in the solder resist 171 on the front surface S. In the case of a dark-colored solder resist such as black, unevenness in thickness is easily noticeable in appearance, and the thinned portion looks like a solder resist blur on the appearance, so it is considered defective in the inspection process .

(Outline of the embodiment)
Therefore, in the screen printing apparatus having the suction plate according to the present embodiment, when fixing the wiring board by vacuum-sucking one side of the wiring board to the suction plate, one side of the printed wiring board is printed first. A concave portion for holding the convex portion generated in the solder resist and holding the wiring board flat is provided.

  In this way, by providing the suction plate with a concave portion that accommodates the convex portion of the solder resist printed earlier, even if one surface on which the convex portion is generated is vacuum-sucked to the suction plate, the wiring board does not protrude. There is no deformation due to the part. Therefore, when the printed surface is vacuum-sucked, the other surface of the wiring board can be held flat, so that it is possible to reduce the occurrence of unevenness in the film thickness of the solder resist to be printed later.

[Screen printing device]
Next, the screen printing apparatus will be specifically described.

  The screen printing apparatus prints, for example, a solder resist as a corrosion prevention layer for preventing corrosion of wiring on a two-metal TAB tape that is intermittently conveyed. A solder resist covering a predetermined portion of the wiring pattern is printed on both sides of the TAB tape.

FIG. 6 shows a schematic diagram of the screen printing apparatus of the present embodiment.
The screen printing apparatus includes a printing stage 2 and a suction plate 200 that is installed on the printing stage 2 and vacuum-sucks any one printing surface of the two-metal TAB tape 100 to fix the two-metal TAB tape 100 flatly. It is mainly composed of a screen mask 9 on which a printing pattern to be transferred is formed, and a squeegee 13 that applies a solder resist 170 to the printing surface of the two-metal TAB tape 100 by moving through the screen mask 9.

  The solder resist 170 is printed on both sides of the two-metal structure TAB tape 100 as follows. Since the wiring patterns are different between the front and back of the TAB tape, different screen masks 9 and suction plates 200 for covering those wiring patterns are used on the front and back, but the same ones are used here for convenience.

  First, the solder resist 170 is first printed on the surface S. The screen mask 9 is aligned on the TAB tape 100 installed on the suction plate 200. The back surface G of the TAB tape 100 is adsorbed on the adsorption plate 200 from the adsorption hole 210 and fixed to the printing stage 2. The solder resist ink 16 on the screen mask 9 is pushed out by the pressure of the squeegee 13 and transferred to the surface S of the TAB tape 100.

  After the solder resist 170 is printed on the front surface S, the solder resist 170 is also printed on the back surface G. The screen mask 9 is aligned on the TAB tape 100 on the suction plate 200. First, the surface A on which the solder resist 170 is printed is adsorbed on the adsorption plate 200 through the adsorption hole 210 and the TAB tape 100 is fixed to the printing stage 2. The solder resist ink 16 on the screen mask 9 is pushed out by the pressure of the squeegee 13 and transferred to a predetermined portion of the wiring pattern 160 on the back surface G of the TAB tape 100.

  Here, in the suction plate 200 used in the subsequent printing, in addition to the suction holes 210, when the surface S of the TAB tape 100 is vacuum-sucked to fix the TAB tape 100, the surface of the TAB tape 100 printed earlier. A concave portion for accommodating the convex portion generated in the solder resist 170 to S and holding the TAB tape 100 flat is provided. By providing this concave portion, a raised portion generated at the end portion of the solder resist 170 on the surface S of the TAB tape 100 printed earlier is accommodated. Depending on the embodiment, the recess may be a groove.

(Accommodation of rising part by groove)
In the embodiment shown in FIG. 1 in which the main portion is enlarged, the suction plate 200 is provided with a groove 220 as a concave portion on the suction surface side separately from the suction hole 210 penetrating the front and back. FIG. 1 shows a TAB tape 100 with a solder resist 171 printed on the surface S, and a suction plate 200 for vacuum-sucking the TAB tape 100 with a solder resist 171 printed thereon. , (B) shows after adsorption.

As shown in FIG. 1, the two-metal TAB tape 100 includes a polyimide film 110, a wiring pattern 161 is formed on the front surface S, and a wiring pattern 162 is formed on the back surface G. A solder resist covering the wiring pattern 161 formed on the front surface S is printed before the back surface G. As described above, when the thermosetting solder resist is used, the swelled portion 173 is inevitably generated at the end of the solder resist 171 printed on the surface S.

  In the present embodiment, a groove 220 that accommodates the raised portion 173 is formed in the suction plate 200. The groove 220 of the suction plate 200 is formed so that the end portion generated at the raised portion 173 of the solder resist 171 on the surface S comes into contact with the TAB tape 100 when the suction plate 200 is sucked.

  The cross-sectional depth and opening width of the groove 220 are determined by the height and width of the raised portion at the end of the solder resist 171 printed on the surface S. The height of the raised portion 173 is about 3 μm on average when measured from the center of the solder resist area. The width is less than 0.5 mm. Therefore, the depth of the groove that absorbs the raised portion 173 at the end is about 3 μm, and the opening width of the groove is about 1 mm. Further, it is desirable that the groove 220 has, for example, a U-shaped cross section or a circular arc shape and no sharp corners so that the TAB tape 100 is not scratched.

  As shown in FIG. 1A, the TAB tape 100 is aligned with the suction plate 200 so that the groove 220 comes directly below the raised portion 173 generated at the end of the solder resist 171. As shown in FIG. 1B, the solder resist 171 formed on the surface S of the TAB tape 100 is vacuum-sucked on the suction plate 200 through the suction holes 210 to fix the TAB tape 100. Then, the raised portion 173 at the end of the solder resist 171 fits in the groove 220 of the suction plate 200, and the printing surface becomes flat. As a result, it is possible to eliminate the uneven thickness of the solder resist on the back surface G due to the deformation of the TAB tape shape caused by the rising shape of the end portion of the solder resist 171 printed on the front surface S.

[Suction plate]
Next, the suction plate will be described in detail. The suction plate is for fixing the TAB tape by vacuum suction in order to print a solder resist covering a predetermined portion of the wiring pattern on both sides of the TAB tape having the wiring pattern formed on both sides of the polyimide film. Here, it refers to a suction plate that is used particularly when a solder resist is printed on the back surface G.

  The suction plate is provided with suction holes and recesses. The suction hole is for vacuum-sucking one surface of the TAB tape on which the solder resist is first printed to fix the TAB tape flat. The concave portion accommodates a convex portion generated in the solder resist on one surface of the TAB tape printed earlier when the TAB tape is fixed by vacuum-adsorbing one surface of the TAB tape previously printed with the solder resist. The TAB tape is held flat.

  By providing the suction plate with a concave portion that accommodates the convex portion of the previously printed solder resist, the TAB tape is caused by the convex portion even if one surface where the convex portion is generated is vacuum-sucked to the suction plate. There is no deformation. Therefore, since the other surface of the TAB tape can be held flat during vacuum suction, it is possible to reduce the occurrence of unevenness in the film thickness of the solder resist to be printed later.

In the embodiment shown in FIG. 2, a groove 220 is formed on the suction surface of the suction plate 200. The grooves 220 are a pair of parallel grooves 220 that respectively accommodate a pair of raised portions 173 of the solder resist formed at both ends of the first solder resist 171 when the first solder resist 171 is printed. It is configured. The number of pairs of grooves 220 is
Although it differs depending on the type of the TAB tape 100, two pairs are formed in the illustrated example. The groove 220 is perpendicular to the moving direction of the squeegee 13 with respect to the suction plate 200 (white arrow) when the solder resist is printed later, and the length of the transport direction of the TAB tape 100 with respect to the suction plate 200 is long. It consists of a long groove that forms a direction. It should be noted that the positional relationship between the groove and the squeegee in the moving direction does not necessarily need to intersect at a right angle, and may be a substantially orthogonal positional relationship.

  In this way, by configuring the groove with a long groove provided in a direction substantially perpendicular to the moving direction of the squeegee, both ends of the solder resist corresponding to the start and end of the movement of the squeegee are more than the other parts. Since the solder resist is printed thickly, the both end portions can be surely absorbed. In addition, by configuring the groove with a long groove whose length direction is the TAB tape 100 conveyance direction, it can be shared with the ends of a plurality of solder resists adjacent in the conveyance direction, thus simplifying the groove pattern. It can be done.

  When the TAB tape on which the solder resist 171 is printed is positioned and sucked on the suction plate 200 with the solder resist side facing the suction surface, as shown in FIG. The solder resist 171 is positioned across the flat portion 230 between the pair of grooves 220, and both end portions thereof are applied to the pair of grooves 220. When adsorbed, the pair of raised portions 173 formed at both ends of the first solder resist 171 are accommodated in the pair of grooves 220 as shown in FIG. Note that the upper solder resist 171 in FIG. 2B schematically shows before adsorption, and the lower solder resist 171 schematically shows after adsorption.

  The suction plate 200 is provided with a plurality of suction holes 210 penetrating the front and back surfaces so as to avoid the groove 220, and the TAB tape 100 placed on the suction plate 200 is fixed by vacuum suction. It has become. In order to maintain the flatness of the TAB tape 100, it is preferable to provide a large number of suction holes 210 so as to be regularly arranged. In the illustrated example, it is provided in a grid pattern. The suction holes 210 can be sufficiently sucked if they are formed with a diameter of ˜1 mm and an interval of ˜5 mm.

  The material of the suction plate 200 is preferably a material that can be easily processed, and hard materials such as stainless steel and brass are used. Granite is particularly preferable.

(Operation of the embodiment)
In the above configuration, when the surface S side of the TAB tape 100 on which the solder resist 171 has been printed is evacuated by a vacuum pump (not shown) through the suction hole 210 of the suction plate 200, the TAB tape 100 is printed on the printing stage. It is adsorbed and fixed to the adsorption surface of the second adsorption plate 200. At this time, the raised portions 173 at both ends of the solder resist 171 protruding from the surface S of the TAB tape 100 are accommodated in the pair of long grooves 220, and the surface S of the TAB tape 100 and the suction surface of the suction plate 200 are It will be in close contact. In this state, while squeezing the screen mask 9 against the TAB tape 100 with the squeegee 13, the squeegee 13 is moved in a direction substantially orthogonal to the long groove 220 to print the solder resist 172 on the back surface G of the TAB tape 100. . Then, the solder resist 172 is printed on a predetermined portion of the wiring pattern 162 with a substantially uniform thickness.

(Effect of embodiment)
According to the present embodiment, since the suction plate 200 is provided with the groove 220, the front surface S side is vacuum-sucked to the suction plate 200 on the surface S with the solder resist 171 printed on the surface S. In this state, when the solder resist 172 is printed on the back surface G, the groove 220 accommodates the raised portion 173 of the solder resist 171 on the front surface S. Therefore, the front surface S side of the TAB tape 100 can be fixed to the suction plate 200 flatly, and the partial thickness unevenness of the solder resist 172 on the back surface G due to the deformation of the TAB tape 100 can be reduced.

  Moreover, since the groove | channel provided in the adsorption | suction plate 200 was comprised by a pair of parallel groove | channel 220, a pair of raised part 173 of the soldering resist 171 printed on the surface S can be accommodated effectively.

  In the embodiment, since the groove is formed of a pair of elongated grooves that are substantially orthogonal to the operation direction of the squeegee, the raised portions at both ends of the solder resist corresponding to the start and end of the movement of the squeegee Can be securely accommodated. In addition, since the groove is constituted by a long groove whose length direction is the TAB tape 100 conveyance direction, it can be made common to the ends of a plurality of solder resists adjacent to the conveyance direction, so that the groove pattern is simplified. Can be

  In addition, since the unevenness of the thickness of the backside solder resist caused by the rising shape of the edge of the solder resist printed on the surface of the two-metal structure TAB tape is eliminated, it is rejected as a solder resist scrap in appearance. Can be improved and the inspection good product rate can be improved. By the way, the average non-defective product rate improved by 3%. As a result, the yield is stable and stable supply of products is possible.

(Method for manufacturing flexible printed circuit board)
Next, the manufacturing method of the flexible printed wiring board by embodiment of this invention is demonstrated.

  In the method for producing a flexible printed wiring board, a solder resist covering a predetermined portion of the wiring pattern is printed on both sides of the flexible printed wiring board in which the wiring pattern is formed on both sides of the insulating film. In this case, when the one side of the wiring board is vacuum-sucked to fix the wiring board and the one side of the wiring board is vacuum-sucked to fix the wiring board, A suction plate is prepared which accommodates a convex portion generated in the solder resist on one surface of the printed wiring board and has a concave portion for holding the wiring board flat. In a state where the convex portion of the wiring substrate is accommodated by the concave portion of the accommodating plate using the suction plate, one surface of the wiring substrate on which the solder resist has been printed first is vacuum-sucked to attach the wiring substrate. A step of printing the solder resist covering a predetermined portion of the wiring pattern by moving the squeegee through a screen mask to the other surface of the wiring substrate fixed flat; And including.

  According to this, by using the suction plate provided with the concave portion that accommodates the convex portion of the solder resist printed in advance, even if one surface where the convex portion is generated is vacuum-sucked to the suction plate, the wiring board Does not deform due to the convex portion. Therefore, since the other surface of the wiring board can be held flat during vacuum suction, it is possible to reduce the occurrence of unevenness in the film thickness of the solder resist to be printed later.

(All steps of TAB tape manufacturing method)
In FIG. 5, the whole process of the manufacturing method of the TAB tape including a soldering resist printing process is shown.
A double-sided copper-clad plate with copper foils 121 and 122 pasted on both sides of the polyimide film 110 is prepared (FIG. 5A). A guide hole is punched in this double-sided copper-clad plate (FIG. 5 (b)), the back surface is laser processed to form an opening (FIG. 5 (c)), and Cu plating is performed on the back surface (FIG. 5 (d). )). The front and back surfaces are patterned (resist coating, exposure, development, etching, resist peeling) to form a wiring pattern (FIG. 5 (e)). First, solder resist is printed on both sides (FIG. 5 (f)), and Au / Ni plating is performed on the portion not covered with the solder resist (FIG. 5 (g)).

  In FIG. 5F, since the TAB tape 100 can be positioned substantially flat, the thickness unevenness of the solder resist 170 on the back surface caused by the edge of the solder resist 170 on the front surface can be eliminated.

(Other Examples / Modifications)
Of course, the present invention can be variously modified without departing from the scope of the invention. For example, in the above-described embodiment, the shape of the groove 220 is a letter U or a circular arc shape of the cross section U, but the shape of the groove 220 is not limited to this, and may be a polygonal cross section, for example.
Also, in the embodiment, the surface of the solder resist is printed first, the front side is printed first, and then the back side is printed later. Conversely, when the back side is printed first, the front side is printed later. However, application of the present invention is possible. Further, in the embodiment, the long groove provided in the suction plate is formed so as to be perpendicular to the moving direction of the squeegee, but may be formed so as to be parallel.

S surface (one side)
G Back side (the other side)
13 Squeegee 100 2-metal TAB tape (flexible printed circuit board)
110 Polyimide film 161 Wiring pattern 162 Wiring pattern 171 Solder resist 172 Solder resist 173 Swelling part (convex part)
200 Suction plate 210 Suction hole 220 Groove (concave)

Claims (5)

A flexible printed wiring board having a wiring pattern formed on both sides of an insulating film is printed with a solder resist covering a predetermined portion of the wiring pattern on one surface, and then a predetermined portion of the wiring pattern on the other surface. A screen printing apparatus for printing the solder resist covering
The solder resist is printed later by moving it to the other surface through a screen mask by sucking one side of the wiring board on which the solder resist has been printed first by vacuum suction and fixing the wiring board. With a squeegee to
In the suction plate,
A suction hole for fixing the wiring board by vacuum-sucking one surface of the wiring board on which the solder resist has been printed;
When fixing the wiring board by vacuum-adsorbing one surface of the wiring board on which the solder resist has been printed first, a convex portion generated in the solder resist on the one surface of the wiring board printed in advance. A screen printing apparatus provided with a recess for accommodating and holding the wiring board flat. The concave portion accommodates a pair of convex portions of the solder resist generated at both ends of the solder resist on one side of the printed wiring board, and is used to hold the wiring base flat. Parallel long grooves,
The solder resist is printed on the other surface of the wiring board that is sucked and fixed to the suction plate through the aligned screen mask so as to be substantially orthogonal to the moving direction of the squeegee. The screen printing apparatus according to claim 1, wherein the screen printing apparatus is provided. A screen printing apparatus for fixing the wiring board by vacuum suction in order to print a solder resist covering a predetermined portion of the wiring pattern on both sides of a flexible printed wiring board having wiring patterns formed on both sides of an insulating film. An adsorption plate,
A suction hole for vacuum-adsorbing one surface of the wiring board on which the solder resist has been printed in advance and fixing the wiring board flat;
When fixing the wiring board by vacuum-adsorbing one surface of the wiring board on which the solder resist has been printed first, a convex portion generated in the solder resist on the one surface of the wiring board printed in advance. A suction plate for a screen printing apparatus, which is provided with a recess for accommodating and holding the wiring board flat. The concave portion absorbs a pair of convex portions of the solder resist generated at both ends of the solder resist on one surface of the printed wiring board, and is used to hold the wiring base flat. Parallel long grooves,
The solder resist is printed on the other surface of the wiring board that is sucked and fixed to the suction plate through the aligned screen mask so as to be substantially orthogonal to the moving direction of the squeegee. The suction plate of the screen printing apparatus of Claim 3 provided. A solder resist that covers a predetermined portion of the wiring pattern is printed on one surface of a flexible printed wiring board in which a wiring pattern is formed on both surfaces of the insulating film, and then the predetermined portion of the wiring pattern is printed on the other surface. A method of manufacturing a flexible printed wiring board for printing the solder resist to be coated,
A suction hole for fixing one side of the wiring board by vacuum suction and the wiring printed earlier when fixing the wiring board by vacuum suctioning one side of the wiring board A suction plate provided with a concave portion for absorbing the convex portion generated in the solder resist on one side of the substrate and holding the wiring substrate flat,
After first printing the solder resist that covers a predetermined portion of the wiring pattern on one surface of the wiring board,
The concave portion provided in the suction plate is aligned with the convex portion generated in the solder resist on the one surface of the printed wiring board, and the convex portion is absorbed in the concave portion, A step of vacuum-absorbing one surface of the wiring board and fixing the wiring board flat;
A step of printing the solder resist that covers a predetermined portion of the wiring pattern later by moving a squeegee through a screen mask aligned with the other surface of the wiring substrate fixed flatly;
A method for manufacturing a flexible printed circuit board including:

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