CN117255500A - PCB manufacturing method with golden finger and PCB - Google Patents
PCB manufacturing method with golden finger and PCB Download PDFInfo
- Publication number
- CN117255500A CN117255500A CN202311168273.2A CN202311168273A CN117255500A CN 117255500 A CN117255500 A CN 117255500A CN 202311168273 A CN202311168273 A CN 202311168273A CN 117255500 A CN117255500 A CN 117255500A
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- Prior art keywords
- slot
- ink
- pcb
- golden finger
- manufacturing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 229910000679 solder Inorganic materials 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 41
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052737 gold Inorganic materials 0.000 claims abstract description 33
- 239000010931 gold Substances 0.000 claims abstract description 33
- 230000001681 protective effect Effects 0.000 claims abstract description 29
- 239000003814 drug Substances 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 238000004381 surface treatment Methods 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 13
- 238000005553 drilling Methods 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- 238000007650 screen-printing Methods 0.000 claims description 13
- 238000011161 development Methods 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 20
- 229910052759 nickel Inorganic materials 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to the technical field of PCBs (printed Circuit Board), and discloses a PCB manufacturing method with golden fingers and a PCB. The PCB manufacturing method comprises the following steps: s1, firstly drilling slot grooves on a circuit board, and then manufacturing golden finger patterns; s2, coating ink on a solder resist area of the circuit board, filling the ink in the slot, and then exposing and developing the ink; s3, gold plating is carried out on the golden finger graph; s4, firstly, attaching a first protective film on the surface of the golden finger graph on the circuit board, then, carrying out surface treatment on the circuit board, and then, removing the first protective film; s5, covering the whole plate surface of the circuit board with a second protective film, windowing a position of the second protective film corresponding to the slot, removing ink in the slot, and removing the second protective film. The embodiment of the invention can not only improve the nickel thickness uniformity of the golden finger, but also prevent the liquid medicine from entering the slot in the surface treatment process, and prevent the liquid medicine tank from being polluted.
Description
Technical Field
The invention relates to the technical field of PCBs (Printed Circuit Board, printed circuit boards), in particular to a PCB manufacturing method with golden fingers and a PCB.
Background
As shown in fig. 1 and 2, a slot (2) is usually formed near the golden finger pattern (3) for connecting the insertion and positioning of the components. For the slot (2), the customer often has certain tolerance requirements (for example, slot width requirements, slot center-to-golden finger center distance requirements, slot edge-to-golden finger center distance requirements), golden finger width and size requirements, golden finger nickel thickness uniformity requirements and the like.
For this reason, the complete fabrication process of such PCBs is typically: the method comprises the steps of inner layer pattern lamination, drilling (drilling a drilling hole and slot (2)) at the same time, copper deposition, electroplating, outer layer pattern (comprising a circuit pattern and a golden finger pattern (3)), solder resist, gold-plated fingers, tape sticking (golden finger protection), surface treatment, tape tearing, plate milling, electric measurement and packaging. The steps of the solder resist, the gold-plated finger, the adhesive tape (protecting the gold finger), the surface treatment and the adhesive tape tearing are shown in figure 4.
The conventional manufacturing process adopts the steps that the slot groove (2) is drilled when a drill is drilled, so that the tolerance requirement of a customer on the distance between the slot groove (2) and a golden finger can be ensured, but the following problems exist:
(1) in the gold plating process of the golden finger, the golden finger can be influenced by the characteristic of quick liquid medicine exchange near the slot hole, so that the nickel thickness of the golden finger near the slot (2) is about 3um-8um thicker than that of the golden finger far away from the slot (2).
(2) When the surface treatment (gold melting, silver melting, tin spraying, OSP (open shortest path) and the like) is carried out on the non-golden finger position of the PCB, the golden finger is required to be protected by using an adhesive tape, but the adhesive tape cannot completely seal the slotted hole after the golden finger is covered (the welding pad 4 is required to be avoided because of the slotted hole edge), as shown in fig. 2 and 3, in the surface treatment process, the slot groove (2) which is not completely sealed can lead the front liquid medicine tank to bring the liquid medicine into the rear liquid medicine tank, so that the rear liquid medicine tank is polluted, and quality problems such as plating shortage, gold bad and the like in the gold melting process are influenced.
Disclosure of Invention
The invention aims to provide a PCB manufacturing method with a golden finger and the PCB, which are used for solving various problems caused by slot grooves in gold plating and surface treatment processes of the golden finger.
To achieve the purpose, the invention adopts the following technical scheme:
a PCB manufacturing method with golden fingers comprises the following steps:
s1, drilling slot grooves on a circuit board, and manufacturing a golden finger pattern after copper deposition electroplating;
s2, coating ink on a solder resist area of the board surface of the circuit board, filling the ink in the slot, and then exposing and developing the ink;
s3, gold plating is carried out on the golden finger graph;
s4, firstly, attaching a first protection film on the surface of an arrangement area of the gold finger pattern on the circuit board, then carrying out surface treatment on the circuit board, and then removing the first protection film;
s5, covering the whole plate surface of the circuit board with a second protective film, windowing a position of the second protective film corresponding to the slot, removing ink in the slot, and removing the second protective film.
Optionally, the method for filling the slot with the ink comprises the following steps:
providing a solder resist aluminum sheet, and manufacturing a lower oil hole at a position of the solder resist aluminum sheet corresponding to the slot;
aligning the lower oil hole of the solder resist aluminum sheet with the slot, and then performing silk-screen printing ink so as to fill the slot with the ink;
and taking the corresponding position of the slot groove as a light transmission area, and performing exposure development.
Optionally, in the process of performing silk-screen printing ink after aligning the lower oil hole of the solder resist aluminum sheet with the slot, the ink is covered to the periphery of the slot while the ink is filled in the slot.
Optionally, the light transmission area is larger than a single side of the slot, so that the ink in the slot after exposure and development is connected with the ink at the periphery of the slot into a whole.
Optionally, in the process of performing silk-screen printing ink after aligning the lower oil hole of the solder mask aluminum sheet with the slot, the method further comprises: and extruding the ink covered on the surface layer of the slot by using a solder resist aluminum sheet and a screen printing plate, so that the ink on the surface layer is filled into the slot and is attached to the wall of the slot.
Optionally, the lower oil hole is larger than a single side of the slot groove.
Optionally, the second protective film is a protective tape.
Optionally, in step S5, the second protective film is specifically an alkali-resistant protective film, and the ink in the slot is removed by using an alkaline liquid medicine.
A PCB with a gold finger, the PCB being manufactured according to the PCB manufacturing method with a gold finger as described in any one of the above.
Compared with the prior art, the invention has the beneficial effects that:
unlike conventional solder resist process, in the solder resist process, the embodiment of the invention fills the ink in the slot while coating the ink in the solder resist area, and removes the ink in the slot after finishing the surface treatment process. Based on the method, in the gold plating process after the solder resist, the flow speed of the liquid medicine in the slot area is blocked because the slot is filled and blocked by the ink, so that the reaction speed of the reaction substances near the slot and the reaction substances in other areas is basically consistent, and finally, the nickel thickness of the gold finger close to the slot edge area is basically the same as the nickel thickness of the gold finger far from the slot edge area, and the nickel thickness uniformity of the gold finger is improved. In addition, in the subsequent surface treatment process, the slot is filled and blocked by the ink, so that the liquid medicine cannot enter the slot, and the problems that the liquid medicine tank in front is polluted and the quality is affected due to the fact that the liquid medicine tank in front is brought into the liquid medicine tank because the first protective film cannot completely seal the slot can be avoided.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of a conventional PCB with gold fingers;
FIG. 2 is a schematic diagram of a conventional PCB golden finger design;
FIG. 3 is a schematic diagram of a conventional PCB with a protective tape attached to the golden finger;
FIG. 4 is a schematic diagram of a conventional PCB with golden fingers;
FIG. 5 is a flowchart of a method for fabricating a PCB with gold fingers according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a PCB manufacturing process with a golden finger according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a solder resist process according to an embodiment of the present invention.
Illustration of:
the device comprises a circuit board 1, a slot 2, a golden finger pattern 3, a bonding pad 4, ink 5, a protective adhesive tape 6, an alkali-resistant protective film 7, a scraper 8 and a solder-resisting aluminum sheet 9.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the prior art, a PCB with a gold finger generally adopts a manufacturing process of firstly manufacturing a slot 2, then manufacturing a gold finger pattern 3, plating the gold finger, and performing surface treatment, and the slot 2 manufactured firstly causes various adverse effects including uneven gold plating thickness and liquid medicine pollution in the subsequent gold finger plating and surface treatment processes.
For this reason, referring to fig. 5 and 6, the embodiment of the invention provides a new method for manufacturing a PCB with gold fingers, which includes:
s1, drilling slot grooves 2 on a circuit board 1, and manufacturing a golden finger pattern 3 after copper deposition electroplating.
S2, coating the ink 5 on the solder resist area of the board surface of the circuit board 1, simultaneously filling the ink 5 in the slot 2, and then exposing and developing the ink 5.
And S3, gold plating is carried out on the golden finger graph 3.
S4, firstly, attaching a first protection film on the surface of the arrangement area of the golden finger graph 3 on the circuit board 1, then carrying out surface treatment on the circuit board 1, and then removing the first protection film.
S5, covering the second protective film on the whole surface of the circuit board 1, windowing a position of the second protective film corresponding to the slot 2, removing the ink 5 in the slot 2, and removing the second protective film.
It should be noted that in the field of PCB production, solder resist refers to coating solder resist ink on a circuit and a substrate (i.e., a solder resist area) of a board surface that do not require soldering, forming a protective layer that prevents bridging between the circuits during soldering, and acting as a protective layer for permanent electrical environment and chemical resistance, and at the same time, the solder resist of the circuit board also plays a role in beautifying the appearance. The circuit board is usually soldered by screen printing, and then is subjected to alignment exposure and development, so that the circuit board is also called as screen printing solder resist.
In the prior art, the solder resist process is to only coat the surface of the solder resist area of the circuit board 1 with the ink 5, and the solder resist area does not include the area where the slot 2 is located because the slot 2 is adjacent to the golden finger and is used for inserting and positioning the connecting component. Unlike this conventional solder mask process, the present embodiment improves this: as described in step S2, the solder resist area is coated with the ink 5, and the slot 2 is filled with the ink 5; and as described in step S5, after the surface treatment process is completed, the ink 5 in the slot 2 is removed.
Based on this, in the gold plating process described in step S3, the slot 2 is filled with the ink 5 to block the flow velocity of the liquid medicine in the area of the slot 2, so that the reaction velocity of the reactive substance near the slot 2 and the reactive substance in other areas is kept substantially consistent, and finally the nickel thickness of the gold finger near the slot 2 is substantially the same as the nickel thickness of the gold finger far from the slot 2, and the uniformity of the nickel thickness of the gold finger is improved.
Meanwhile, in the subsequent surface treatment process described in S4, since the slot 2 is filled with the ink 5 for blocking, the liquid medicine cannot enter the slot 2, and the problem that the liquid medicine tank in front of the liquid medicine tank is polluted and the quality is affected due to the fact that the first protective film (such as the protective adhesive tape 6) cannot completely seal the slot 2 is avoided.
Further, the step S2 can be divided into "making a solder mask aluminum sheet 9-solder mask printing-solder mask exposure-solder mask development", as shown in fig. 7, and the following descriptions will be provided respectively:
manufacturing a solder mask aluminum sheet 9: and (3) manufacturing a lower oil hole at a position of the solder mask aluminum sheet 9 corresponding to the slot 2, wherein the lower oil hole is used for covering the slot 2 with the ink 5 in the process of plugging (the plug hole positions which are not required by customers are designed as oil blocking designs). To ensure the hole plugging effect, the lower oil hole is 1-2 mil larger than the single side of the slot 2.
Solder mask printing: the slot 2 is designed to be an oil discharging area, and the ink 5 at the slot 2 is extruded by using the solder mask aluminum sheet 9 and the screen printing screen in the silk screen printing process, so that the ink 5 is filled in the slot 2 to ensure that the ink 5 and the inner wall of the slot 2 are seamless, the ink 5 is covered on the periphery of the slot 2 and flattened, a good filling effect is ensured after exposure, and the problem of medicine collection is avoided when the surface treatment is performed (the prior art is designed to form an equal-sized oil blocking area at the position of the screen printing screen corresponding to the slot 2, so that the ink 5 is prevented from flowing into the slot 2).
And (3) solder resist exposure and solder resist development: and the position of the slot 2 is used as a light transmission area for exposure, the design that the single side of the light transmission area is 2mil larger than a hole is adopted, after development, the ink 5 in the slot 2 and the ink 5 at the periphery of the slot 2 are connected into a whole, so that the gap of the inner wall formed by shrinkage of Kong Nasai ink due to stress in the conventional process is avoided, and the liquid medicine is prevented from entering the hole along the gap during subsequent surface treatment.
In addition, the second protective film may be an alkali-resistant film specifically, and is used for covering the circuit board 1 entirely and exposing the position of the slot 2, so as to remove the ink 5 in the slot 2 during the washing. Based on this, the ink 5 in the slot 2 can be removed using an alkaline aqueous solution.
Based on the same inventive concept, the embodiment of the invention also provides a PCB with the golden finger, which is manufactured by adopting the PCB manufacturing method with the golden finger. Due to the adoption of different conventional manufacturing processes, the consistency of the flowing speed of the liquid medicine at each position of the golden finger can be ensured in the gold plating process of the golden finger, the nickel thickness uniformity of the golden finger is improved, and the liquid medicine can be prevented from entering the slot 2 in the surface treatment process, so that the problem of pollution of the liquid medicine caused by the slot 2 is prevented.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. The PCB manufacturing method with the golden finger is characterized by comprising the following steps of:
s1, drilling slot grooves (2) on a circuit board (1), and manufacturing a golden finger pattern (3) after copper deposition and electroplating;
s2, coating ink (5) on a solder resist area of the board surface of the circuit board (1), filling the ink (5) in the slot groove (2), and then exposing and developing the ink (5);
s3, gold plating is carried out on the golden finger graph (3);
s4, firstly, attaching a first protection film on the surface of an arrangement area of the golden finger graph (3) on the circuit board (1), then carrying out surface treatment on the circuit board (1), and then removing the first protection film;
s5, covering a second protective film on the whole plate surface of the circuit board (1), windowing a position of the second protective film corresponding to the slot groove (2), removing the ink (5) in the slot groove (2), and removing the second protective film.
2. The method for manufacturing the PCB with the golden finger according to claim 1, wherein the method for filling the slot (2) with the ink (5) comprises the following steps:
providing a solder resist aluminum sheet (9), and manufacturing a lower oil hole at a position of the solder resist aluminum sheet (9) corresponding to the slot groove (2);
aligning the lower oil hole of the solder resist aluminum sheet (9) with the slot groove (2) and then performing silk-screen printing on the ink (5) so that the ink (5) fills the slot groove (2);
and taking the corresponding position of the slot groove (2) as a light transmission area, and performing exposure development.
3. The method for manufacturing the PCB with the gold finger according to claim 2, wherein in the process of performing the silk-screen printing of the ink (5) after aligning the lower oil hole of the solder mask aluminum sheet (9) with the slot (2), the ink (5) is covered to the periphery of the slot (2) while the ink (5) is filled in the slot (2).
4. The method for manufacturing the PCB with the golden finger according to claim 3, wherein the light transmission area is larger than one side of the slot (2) so that the ink (5) in the slot (2) is connected with the ink (5) on the periphery of the slot (2) into a whole after exposure and development.
5. The method for manufacturing the PCB with the golden finger according to claim 2, wherein in the process of performing the silk-screen printing of the ink (5) after aligning the lower oil hole of the solder mask aluminum sheet (9) with the slot (2), the method further comprises: and extruding the ink (5) covered on the surface layer of the slot groove (2) by using a solder mask aluminum sheet (9) and a screen printing plate, so that the ink (5) on the surface layer is filled into the slot groove (2) and is attached to the wall of the slot groove (2).
6. The method for manufacturing the PCB with the golden finger according to claim 2, wherein the lower oil hole is larger than a single side of the slot groove (2).
7. The method for manufacturing the PCB with the golden finger according to claim 1, wherein the first protective film is a protective adhesive tape (6).
8. The method for manufacturing the PCB with the golden finger according to claim 1, wherein in the step S5, the second protective film is specifically an alkali-resistant protective film (7), and the ink (5) in the slot (2) is removed by using an alkaline liquid medicine.
9. A PCB with a gold finger, characterized in that the PCB is manufactured according to the PCB manufacturing method with a gold finger as claimed in any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311168273.2A CN117255500A (en) | 2023-09-11 | 2023-09-11 | PCB manufacturing method with golden finger and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311168273.2A CN117255500A (en) | 2023-09-11 | 2023-09-11 | PCB manufacturing method with golden finger and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117255500A true CN117255500A (en) | 2023-12-19 |
Family
ID=89132308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311168273.2A Pending CN117255500A (en) | 2023-09-11 | 2023-09-11 | PCB manufacturing method with golden finger and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117255500A (en) |
-
2023
- 2023-09-11 CN CN202311168273.2A patent/CN117255500A/en active Pending
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