CN111163591A - Method for manufacturing depth-control metallized micro-hole on circuit board - Google Patents
Method for manufacturing depth-control metallized micro-hole on circuit board Download PDFInfo
- Publication number
- CN111163591A CN111163591A CN202010090217.1A CN202010090217A CN111163591A CN 111163591 A CN111163591 A CN 111163591A CN 202010090217 A CN202010090217 A CN 202010090217A CN 111163591 A CN111163591 A CN 111163591A
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- CN
- China
- Prior art keywords
- hole
- copper
- drilling
- board
- thickness
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing depth-control metallized micro holes on a circuit board. According to the invention, the back drilling processing is carried out after the copper deposition processing, and as the thickness of copper deposited on the first through hole by the copper deposition processing is very thin, compared with the design requirement of electroplating the thickness of a copper layer to a final product at one time, the aperture of the first through hole is relatively large during the back drilling, so that the drilling slag can be led out from the first through hole, the amount of the drilling slag formed during the back drilling, especially the amount of the copper drilling slag, can be reduced, and meanwhile, the granularity of the copper drilling slag is small, the hole blockage caused by the large-particle copper drilling slag can be avoided, the risk of hole blockage is reduced, and the potential reliability hazard in the aspect of line conduction caused by the copper drilling slag remaining in the hole can be eliminated. The method reduces the procedures of removing copper drilling slag in the hole by tinning and alkaline etching, shortens and simplifies the production procedure, improves the production efficiency and reduces the production cost.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing depth-control metallized micro holes on a circuit board.
Background
For the multilayer circuit board, in order to transmit signals at high speed, meet impedance matching and the like, the mutual conduction among different layers is realized by manufacturing metallized holes. For part of multilayer circuit board products, metallized holes with small aperture and certain hole depth, namely depth-control metallized micropores, need to be arranged on the board. Because the aperture is small and the aspect ratio of the hole is large, it is difficult to manufacture the depth-controlled metallized micro-hole by a method of laser blind hole and electroplating hole filling, and the function of the micro metallized blind hole is realized by manufacturing a micro back drilling hole by a depth-controlled back drilling process. Backdrilling refers to the process of removing a copper layer from the wall of a hole at one end of a metallized through hole with a drill to make one end of the wall of the through hole free of copper and the other end of the wall of the through hole have copper, and is called backdrilling. For micro-sized metallized through holes, the process of making back-drilled holes, i.e. depth-controlled metallized micro-holes, is generally: drill out miniature through-hole when the outer drilling, make miniature through-hole metallization and make copper layer thickness thicken to the final thickness requirement of product design through heavy copper and full board electroplating, plate to finished product thickness requirement through heavy copper and full board electroplating once only with the copper layer thickness on the multilayer production board promptly, need not to carry out the electrolytic copper processing in the figure is electroplated, directly carry out electrotinning processing, then carry out the back drilling, carry out back processes such as alkaline etching, tin that moves back in proper order behind the back drilling again. The method is used for manufacturing a miniature back drilling hole, particularly for a metalized through hole with the aperture smaller than 0.15mm, the hole is easy to form more and larger copper drilling slag during back drilling, even a sheet block is formed, the copper drilling slag cannot be smoothly led out from the hole to cause drilling slag blocking, the drilling slag in the hole cannot be completely removed during alkaline etching, so that etching liquid medicine and liquid medicine in a subsequent wet process are remained in the hole, the quality of the back drilling hole is influenced, the back drilling hole is even scrapped, and the copper drilling slag remained in the hole can also influence the reliability in the aspect of circuit conduction.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a method for manufacturing depth-control metallized micro holes on a circuit board, which can prevent drilling slag from blocking the holes.
In order to achieve the purpose, the invention adopts the following technical scheme.
A method for manufacturing a depth-controlled metallized micropore on a circuit board comprises the following steps:
and S1, performing outer layer drilling on the multilayer production board, wherein the drilled holes comprise first through holes for forming back drilled holes.
Further, the hole drilled in step S1 further includes a second through hole and/or a blind hole.
Further, the aperture of the first through hole in the step S1 is less than or equal to 0.15 mm.
Further, the multilayer production board described in step S1 is a multilayer board in which an inner core board and an outer copper foil are laminated into a whole by prepreg.
And S2, carrying out copper deposition processing on the multilayer production board to metalize the first through hole.
Further, when the hole diameter of the first through hole is less than or equal to 0.15mm in step S1, the hole wall copper thickness of the first through hole is 0.3-0.7 μm by copper deposition processing in step S2.
And S3, carrying out back drilling processing on the first through hole on the multilayer production board to form a back drilling hole.
And S4, carrying out full-plate electroplating processing on the multilayer production plate until the thickness of hole copper of the back drilling hole and the thickness of surface copper on the multilayer production plate meet the design requirements of final products.
Further, in step S4, the hole wall copper plated to the back-drilled hole was 28 μm thick.
And S5, manufacturing an outer layer circuit pattern on the multilayer production board according to a negative film process, and then sequentially performing acid etching and film stripping treatment on the multilayer production board to form an outer layer circuit on the multilayer production board.
And S6, sequentially carrying out solder mask layer manufacturing processing, surface treatment and molding processing on the multilayer production board to obtain the circuit board.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the back drilling processing is carried out after the copper deposition processing, and as the thickness of copper deposited on the first through hole by the copper deposition processing is very thin, compared with the design requirement of electroplating the thickness of a copper layer to a final product at one time, the aperture of the first through hole is relatively large during the back drilling, so that the drilling slag can be led out from the first through hole, the amount of the drilling slag formed during the back drilling, especially the amount of the copper drilling slag, can be reduced, and meanwhile, the granularity of the copper drilling slag is small, the hole blockage caused by the large-particle copper drilling slag can be avoided, the risk of hole blockage is reduced, and the potential reliability hazard in the aspect of line conduction caused by the copper drilling slag remaining in the hole can be eliminated. Especially for the first through hole with the aperture of 0.15mm, the copper thickness of the hole wall formed by copper deposition is controlled to be 0.3-0.7 mu m, no hole blocking phenomenon occurs, and the problem of hole blocking caused by back drilling is completely solved. The whole board is electroplated until the thickness of copper meets the design requirement of a final product, and then the outer layer circuit is manufactured through a negative film process, so that the process of removing copper drilling slag in holes by tinning and alkaline etching is reduced, the production process is simplified, the production efficiency is improved, and the production cost is reduced.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
Examples
The embodiment provides a manufacturing method of a circuit board, in particular to a method for manufacturing a depth-control metallized micropore on the circuit board. The copper thickness of the hole wall of the depth-control metallized micro-hole manufactured in the embodiment is 28 μm, and the aperture of the through hole before metallization is 0.15 mm.
The specific preparation method of the circuit board comprises the following steps:
1. cutting: the core board is cut according to the size of the jointed board, and the thickness of the core board is 0.15mm and 0.5OZ/0.5 OZ.
2. Inner layer: coating wet films on two surfaces of the core plate, and controlling the film thickness to be 8 mu m; the exposure of the inner layer circuit is completed by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); and etching a circuit pattern after development, wherein the minimum line width/line gap of the inner layer is 0.09mm/0.09 mm.
3. Inner layer AOI: and (4) detecting defects of open short circuit, circuit notch, pin hole and the like of the inner layer, scrapping the defective inner layer core plate, and enabling the non-defective inner layer core plate to enter the next flow.
4. And (3) laminating: and performing brown oxidation treatment on the inner core plate, selecting copper foil and prepregs, stacking the plates according to the product design sequence, then selecting proper lamination conditions according to the Tg of the plates for lamination, and laminating to form the multilayer production plate.
5. Drilling an outer layer: and drilling holes in the multilayer production board according to the drilling tape information, wherein the drilled holes comprise a first through hole, a second through hole and a blind hole. The aperture of the first through hole is 0.15mm, and the first through hole is used for forming a back drilling hole in subsequent processing and manufacturing. The second through hole is only used for forming a metalized through hole in subsequent processing and manufacturing, and is not a back drilling hole.
6. Copper deposition: and (3) chemically removing the glue residues once on the multilayer production board before copper deposition, then metallizing the hole drilled in the previous step by copper deposition, and controlling the copper deposition processing time until the thickness of copper deposited on the hole wall of the first through hole is in the range of 0.3-0.7 mu m.
7. Back drilling: and carrying out back drilling processing on the first through hole on the multilayer production board to form a back drilling hole, namely the depth-control metallized micropore.
In the back drilling process, copper drilling slag particles are small, and flaky and blocky copper drilling slag is avoided, so that the copper drilling slag and other base material drilling slag can be smoothly led out from the hole, and the hole is not blocked.
8. Electroplating the whole plate: and (3) carrying out full-plate electroplating processing on the multilayer production plate until the thickness of hole copper of the back drilling hole and the thickness of surface copper on the multilayer production plate meet the design requirement of a final product, wherein the thickness of hole wall copper of the back drilling hole is 28 microns.
9. Outer layer circuit pattern: and manufacturing an outer layer circuit pattern on the multilayer production board according to a negative film process.
10. Outer layer circuit: and sequentially carrying out acid etching and film stripping treatment on the multilayer production board according to the outer layer circuit pattern to form an outer layer circuit on the multilayer production board.
11. Outer layer AOI: and using an automatic optical detection system to detect whether the outer layer circuit has defects such as open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
12. Solder resist and silk screen printing of characters: the green oil layer (solder mask layer) is manufactured on the outer layer of the multilayer production board and characters are printed in a silk screen mode, and the thickness of the solder mask layer is 20 mu m, so that the influence of environmental change on the multilayer production board in the subsequent use process can be reduced.
13. Surface treatment (electroless nickel gold): uniformly electroplating nickel layers and gold layers with certain required thickness on copper surfaces such as pads at the windowing positions of the solder mask layer on the multilayer production board, wherein the thickness of the nickel layers is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.025-0.05 μm.
14. Molding: according to the prior art and according to the design requirement, routing the shape, and manufacturing the PCB with the tolerance of +/-0.05 mm.
15. Electrical testing: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
16. FQC: and checking whether the appearance, the hole wall copper thickness, the medium layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers.
17. Packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
The depth-control metallized micropores are manufactured on the circuit board by the method, the problem of back drilling and hole plugging does not occur, and the hole plugging rate is zero.
The technical contents of the present invention are further illustrated by the examples, so as to facilitate the understanding of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention.
Claims (6)
1. A method for manufacturing a depth-controlled metallized micropore on a circuit board is characterized by comprising the following steps:
s1, performing outer layer drilling processing on the multilayer production board, wherein the drilled holes comprise first through holes for forming back drilled holes;
s2, carrying out copper deposition processing on the multilayer production board to metalize the first through hole;
s3, carrying out back drilling processing on the first through hole on the multilayer production board to form a back drilling hole;
s4, carrying out full-plate electroplating processing on the multilayer production plate until the thickness of hole copper of the back drilling hole and the thickness of surface copper on the multilayer production plate meet the design requirement of a final product;
s5, manufacturing an outer layer circuit pattern on the multilayer production board according to a negative film process, and then sequentially performing acid etching and film stripping treatment on the multilayer production board to form an outer layer circuit on the multilayer production board;
and S6, sequentially carrying out solder mask layer manufacturing processing, surface treatment and molding processing on the multilayer production board to obtain the circuit board.
2. The method of claim 1, wherein the holes drilled in step S1 further comprise second through holes and/or blind holes.
3. The method of claim 1, wherein the multilayer board in step S1 is a multilayer board formed by laminating an inner core layer and an outer copper foil layer together with a prepreg.
4. The method of claim 1, wherein the first via hole has a diameter of 0.15mm or less in step S1.
5. The method of claim 4, wherein in step S2, the copper thickness of the hole wall of the first via is 0.3-0.7 μm by copper deposition.
6. The method of claim 1, wherein in step S4, the copper thickness of the hole wall electroplated to the back-drilled hole is 28 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010090217.1A CN111163591A (en) | 2020-02-12 | 2020-02-12 | Method for manufacturing depth-control metallized micro-hole on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010090217.1A CN111163591A (en) | 2020-02-12 | 2020-02-12 | Method for manufacturing depth-control metallized micro-hole on circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111163591A true CN111163591A (en) | 2020-05-15 |
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ID=70565864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010090217.1A Pending CN111163591A (en) | 2020-02-12 | 2020-02-12 | Method for manufacturing depth-control metallized micro-hole on circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN111163591A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211539A (en) * | 2021-04-21 | 2021-08-06 | 科益展智能装备有限公司 | Back drilling tool, machining method thereof and method for controlling deep drilling of multilayer circuit board |
| CN115413151A (en) * | 2022-08-26 | 2022-11-29 | 苏州浪潮智能科技有限公司 | Conduction method for micro metallized hole of super-thick copper product and manufacturing method for outer layer of PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100238635A1 (en) * | 2007-12-14 | 2010-09-23 | Huawei Technologies Co., Ltd. | Printed circuit board, manufacturing method thereof and radio-frequency device |
| CN103298273A (en) * | 2013-05-07 | 2013-09-11 | 深圳崇达多层线路板有限公司 | Method for preventing bottom holes of circuit board from being blocked in copper plating |
| CN209420019U (en) * | 2018-08-28 | 2019-09-20 | 深南电路股份有限公司 | The system of processing and printed circuit board of micropore back drill |
-
2020
- 2020-02-12 CN CN202010090217.1A patent/CN111163591A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100238635A1 (en) * | 2007-12-14 | 2010-09-23 | Huawei Technologies Co., Ltd. | Printed circuit board, manufacturing method thereof and radio-frequency device |
| CN103298273A (en) * | 2013-05-07 | 2013-09-11 | 深圳崇达多层线路板有限公司 | Method for preventing bottom holes of circuit board from being blocked in copper plating |
| CN209420019U (en) * | 2018-08-28 | 2019-09-20 | 深南电路股份有限公司 | The system of processing and printed circuit board of micropore back drill |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211539A (en) * | 2021-04-21 | 2021-08-06 | 科益展智能装备有限公司 | Back drilling tool, machining method thereof and method for controlling deep drilling of multilayer circuit board |
| CN113211539B (en) * | 2021-04-21 | 2023-01-03 | 汇专机床有限公司 | Back drilling tool, machining method thereof and method for controlling depth drilling of multilayer circuit board |
| CN115413151A (en) * | 2022-08-26 | 2022-11-29 | 苏州浪潮智能科技有限公司 | Conduction method for micro metallized hole of super-thick copper product and manufacturing method for outer layer of PCB |
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Application publication date: 20200515 |