CN102883557A - Production process improvement method of flexible printed circuit board containing welding finger - Google Patents
Production process improvement method of flexible printed circuit board containing welding finger Download PDFInfo
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- CN102883557A CN102883557A CN2012103940166A CN201210394016A CN102883557A CN 102883557 A CN102883557 A CN 102883557A CN 2012103940166 A CN2012103940166 A CN 2012103940166A CN 201210394016 A CN201210394016 A CN 201210394016A CN 102883557 A CN102883557 A CN 102883557A
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Abstract
The invention relates to the field of the manufacturing of a flexible printed circuit board (FPC). The invention relates to a production process improvement method of a FPC containing a welding finger, and the method comprises a manufacturing process as: A, blanking; B, drilling; C, sinking copper plating; D, exposing and aligning; E, circuit formation; F, circuit detection; G, surface treatment and electric energy test; H, appearance detection; and I, detection and packaging. The main improved flow is as follows: B, drilling, to be specific, drilling a semi-arc tin climbing hole, a circular hole and a mold positioning hole of a finger soldering pad together; D, exposing and aligning, to be specific, producing a dislocated mark in an area outside a circuit on a film negative, and realizing the aligning of the film negative of an exposed circuit by utilizing the socket Pin aligning; and F, circuit detection, to be specific, besides the detection of conventional items, detecting whether the dislocated mark on the FPC is aligned or not. The method is used for manufacturing the FPC of a welding finger with excellent quality.
Description
Technical field
The present invention relates to the FPC(flexible PCB) the manufacturing field, the manufacturing process that especially contains the flexible PCB of welding finger is improved.
Background technology
A wherein series products of flexible PCB (FPC) is the flexible PCB that contains the welding finger, specifically on the finger of each on the double-deck FPC pad two plated-through holes (PTH) are arranged, one of them is full-round hole, be positioned at the centre of finger pad, another be positioned at finger pad end semi arch climb the tin hole; By these 2 holes on the finger pad, be used for this FPC soft board is welded in the PCB hardboard.
The general manufacturing process that contains the flexible PCB of welding finger is: open material → boring (product semi arch corresponding aperture and full-round hole are to realize by boring, and the mould location hole is to realize by punching) → heavy copper facing → exposure aligning (manual alignment) → circuit formation → line inspection → surface treatment and electric performance test → profile measurement (detecting whether the welding finger has dislocation and whether product has the empty difference in size of semi arch) → test package.
Conventional manufacture method is two-sided pad and the semi arch hole dimension of management and control welding finger effectively, and Shortcomings and limitation namely may cause part welding finger pad dislocation bad phenomenon and semi arch hole quality bad phenomenon.
Summary of the invention
Therefore, the present invention proposes a kind of flexible PCB manufacturing process that contains the welding finger and improves one's methods, can realize overcoming the generation of above-mentioned bad phenomenon, two-sided pad and the semi arch hole dimension of finger welded in management and control effectively, thereby guarantees that this contains the good welds characteristic of the flexible PCB of welding finger.
The following technical scheme of the concrete employing of the present invention:
The flexible PCB manufacture craft modification method that contains the welding finger, wherein, this flexible PCB manufacturing process that contains the welding finger comprises: A, open material → B, boring → C, heavy copper facing → D, exposure aligning → E, circuit formation → F, line inspection → G, surface treatment and electric performance test → H, profile measurement → I, test package.Main modified flow is: B, boring; D, exposure aligning; F, the line inspection; Other flow process adopts common process.Concrete,
B, boring: it together all is to get out by boring that the semi arch of finger pad is climbed tin hole, full-round hole and mould location hole;
D, exposure aligning: make to detect with the dislocation sign at the circuit exterior domain on the film egative film, with overlapping PIN contraposition realize the exposing film egative film contraposition of circuit;
F, line inspection: except the check conventional project, also detect dislocation on the flexible PCB and identify whether contraposition.
The flexible PCB of the welding finger that the flexible PCB manufacture craft modification method that contains welding finger of the present invention is can the production welding performance good, the useful technique effect that has is:
1) can solve welding finger semi arch and rush inclined to one side problem;
2) can solve 2 problem of misalignment of welding finger;
3) the welding finger of guaranteeing FPC welds PCB hardboard electrical property quality.
Description of drawings
Fig. 1 is the folded composition that contains the flexible PCB of welding finger;
Fig. 2 a is the front schematic view that contains the flexible PCB of welding finger;
Fig. 2 b is the reverse side schematic diagram that contains the flexible PCB of welding finger;
Fig. 3 is the schematic diagram that contains the bore operation of the flexible PCB that welds finger;
Fig. 4 is the detection schematic diagram that misplaces and identify that contains the film egative film of the flexible PCB that welds finger.
Embodiment
Now the present invention is further described with embodiment by reference to the accompanying drawings.
Consulting shown in Figure 1 is a kind of structure that contains the flexible PCB of welding finger, is to form a conductive metal layer 2 at a flexible insulation substrate 1; General, also cover one deck welding resisting layer 3 on the described conductive metal layer 2, be not destroyed when the welding with protection conductive metal layer 2, welding finger areas 4 arranges finger pad and boring and realizes.
What Fig. 2 a and Fig. 2 b showed respectively is the obverse and reverse that contains the flexible PCB of welding finger.As seen from the figure: each finger on this bilayer FPC all has two plated-through holes (PTH) on pad, and one of them be full-round hole, is positioned at the centre of finger pad, another be positioned at the semi arch of pointing the pad end climb the tin hole.The qualified flexible PCB that contains the welding finger is that the finger pad locations of requirement obverse and reverse wants fully corresponding, up and down mistake can not occur, and the size of climbing the tin hole of two plated-through holes, especially semi arches will meet normal size.
The applicant finds through practical studies, if 2 welding fingers exceed calculated value, the poor short circuit phenomenon can occur when then welding, its theoretical calculation formula is: adjacent 2 via pad distance value (the d)-0.05mm of Double-side line egative film design dislocation extreme value (y)=welding finger tips.
Contain the flexible PCB manufacture craft of welding finger, comprise following manufacturing process: A, open material → B, boring → C, heavy copper facing → D, exposure aligning → E, circuit formation → F, line inspection → G surface treatment and electric performance test → H, profile measurement → I, test package.Be described as follows:
A, open material: namely base material is opened material, and this is the common process step, therefore launches no longer in detail explanation;
B, boring: consult shown in Figure 3ly, to climb tin hole, full-round hole and mould location hole together all be to get out by boring to the semi arch of finger pad.The applicant finds that the mould location hole in the existing technique is to go out by punching, rather than gets out by boring, is difficult to like this quality that guarantees that the semi arch of contraposition is climbed the tin hole.Because semi arch is climbed the forming process in tin hole: get out the row full-round hole the same with via hole in finger pad edge position, block the hole that forms semi arch during then by die-cut profile, position again die-cut by the mould location hole during die-cut profile.Therefore, it is to pass through first boring that semi arch is climbed the tin hole, comes die-cut formation by mould location hole location again, and the mould location hole then comes punching by the contraposition target center, so this 2 procedure certainly exists combined tolerances.If the mould location hole is together to get out by climbing the tin hole with semi arch, so there is not any combined tolerances, just can guarantee better to point the size that the semi arch of pad is climbed the tin hole; In addition, the precision of bore operation is also higher than punching;
C, heavy copper facing: this is the common process step, therefore launches no longer in detail explanation;
D, exposure aligning: through after the above-mentioned heavy copper facing, carry out successively the front chemical cleaning of circuit, circuit subsides dry film, carry out again the circuit exposure; Wherein, circuit when exposure is with overlapping the PIN contraposition circuit egative film contraposition that realizes exposing.Because 2 welding fingers of this flexible PCB are realized by the egative film exposure when circuit forms; The applicant finds: if adopt conventional manual alignment, will cause like this 2 different benchmark to carry out each artoregistration, thereby cause part welding finger dislocation bad phenomenon; And use cover PIN contraposition, then tolerance can be reduced to minimum.In addition, make detection with the dislocation sign at the circuit exterior domain of film egative film, be used for step F, among line is examined.The dislocation sign is that the film egative film in front and the film egative film of reverse side are the figures of the relation of corresponding to each other.For example preferred, make solid circles on the positive film egative film, make hollow ring on the film egative film of reverse side, the solid circles on the positive film egative film can corresponding be inserted in the hollow ring on the film egative film of reverse side.Preferred again, the circuit of supposing the positive and negative of this flexible PCB allows maximum dislocation value to be ± 0.1mm, then the overall diameter of the solid circles on the positive film egative film is 0.8mm, the inner ring diameter of the hollow ring on the film egative film of reverse side is 1.0mm, then if the wrong error of positive and negative in ± 0.1mm, solid circles must fall in the hollow ring and can not occur overlapping.Perhaps, also can make other figures that other similarly satisfy the positive and negative relation of corresponding to each other.For example, adopting the positive and negative that are similar on the new edition RMB is respectively the false proof means of en circle diagram shape, if when misplacing, 2 en circle diagram shapes may separate or overlap.And for example, positive dislocation sign is circle, and the dislocation sign of reverse side is spider, and the spider correspondence is in circle; Etc. the dislocation sign of other figures of the multiple positive and negative relation of corresponding to each other all can;
E, circuit forms: specifically comprise: circuit development, circuit etching, circuit stripping.This flow process E adopts common process to realize, therefore launches no longer in detail explanation.Need explanation, different from routine, detect with the dislocation sign owing to make at film egative film among the step D, therefore when the circuit of step e formed, inevitable positive and negative at flexible circuit board substrate formed the copper layer of dislocation sign figure;
F, line inspection: this step also detects dislocation on the flexible PCB and identifies whether contraposition except the check conventional project.Because 2 welding fingers of this FPC are to be to realize by the exposure of film egative film when circuit forms, and 2 film egative films in the common process are not made the dislocation sign, thereby cause judging whether 2 welding fingers the dislocation bad phenomenon occurs in processing procedure.Consult shown in Figure 4, and the present invention is at step D, during exposure aligning, making detection at film egative film identifies with dislocation, and in step F, during the line inspection, except the check conventional project, also detect dislocation on the flexible PCB and identify whether contraposition, just can need whether have by the dislocation of 2 welding fingers of dislocation label detection to exceed the tolerance value that requires.Dislocation sign figure with solid circles and hollow ring describes.Because when step D, the solid circles of detection usefulness and the dislocation sign of hollow ring have been made respectively on the film egative film of positive and negative, therefore when the circuit of step e forms just the circuit exterior domain on the positive and negative of the flexible circuit board substrate of printing opacity form respectively the copper layer of solid circles and hollow ring figure, auxiliary or naked eyes are directly observed by the illumination transmission, can find whether solid circles falls within the scope of hollow ring, detect dislocation on the flexible PCB and identify whether contraposition, thereby judge whether whole circuit copper layer misplaces;
G surface treatment and electric performance test: this road flow process also is to adopt common process to realize, specifically comprises: the steps such as soft gold, QC, itemize, breaking process wire, electrical measurement are dried, are plated in primary chemical cleaning, top/coverlay location, the end, pressing, baking, punching, secondary chemical cleaning, front text printout, secondary baking, the inspection of conventional line, nog plate washing;
H, profile measurement: this is the common process step, launches no longer in detail explanation;
I, test package: carry out FQC, FQA check and packing warehouse-in.This is the common process step also, launches no longer in detail explanation.
Although specifically show and introduced the present invention in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present invention that appended claims limits; can make a variety of changes the present invention in the form and details, be protection scope of the present invention.
Claims (3)
1. the flexible PCB manufacture craft modification method that contains the welding finger, wherein this flexible PCB manufacturing process that contains the welding finger comprises: A, open material → B, boring → C, heavy copper facing → D, exposure aligning → E, circuit formation → F, line inspection → G, surface treatment and electric performance test → H, profile measurement → I, test package; It is characterized in that:
B, boring: it together all is to get out by boring that the semi arch of finger pad is climbed tin hole, full-round hole and mould location hole;
D, exposure aligning: make to detect with the dislocation sign at the circuit exterior domain on the film egative film, with overlapping PIN contraposition realize the exposing film egative film contraposition of circuit;
F, line inspection: except the check conventional project, also detect dislocation on the flexible PCB and identify whether contraposition.
2. weld the flexible PCB manufacture craft modification method of pointing according to claim 1 containing, it is characterized in that: the dislocation sign is respectively solid circles and hollow ring.
3. weld the flexible PCB manufacture craft modification method of pointing according to claim 2 containing, it is characterized in that: the overall diameter of solid circles is 0.8mm, and the inner ring diameter of hollow ring is 1.0mm.
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| CN201210394016.6A CN102883557B (en) | 2012-10-17 | 2012-10-17 | Production process improvement method of flexible printed circuit board containing welding finger |
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| CN201210394016.6A CN102883557B (en) | 2012-10-17 | 2012-10-17 | Production process improvement method of flexible printed circuit board containing welding finger |
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| CN102883557A true CN102883557A (en) | 2013-01-16 |
| CN102883557B CN102883557B (en) | 2015-06-03 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582317A (en) * | 2013-10-16 | 2014-02-12 | 镇江华印电路板有限公司 | Method for manufacturing tin leaking semicircular holes in flexible printed wiring board |
| CN103687315A (en) * | 2013-12-12 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Designing method of punching alignment target |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN202145703U (en) * | 2011-07-29 | 2012-02-15 | 索尔思光电（成都）有限公司 | Flexible circuit board |
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2012
- 2012-10-17 CN CN201210394016.6A patent/CN102883557B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN202145703U (en) * | 2011-07-29 | 2012-02-15 | 索尔思光电（成都）有限公司 | Flexible circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582317A (en) * | 2013-10-16 | 2014-02-12 | 镇江华印电路板有限公司 | Method for manufacturing tin leaking semicircular holes in flexible printed wiring board |
| CN103582317B (en) * | 2013-10-16 | 2016-07-06 | 镇江华印电路板有限公司 | Flexible printed wiring board leakage stannum semicircle orifice manufacture method |
| CN103687315A (en) * | 2013-12-12 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Designing method of punching alignment target |
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| CN102883557B (en) | 2015-06-03 |
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