CN102681360A - Alignment method for realizing circuit board double-sided figure alignment in laser imaging system - Google Patents
Alignment method for realizing circuit board double-sided figure alignment in laser imaging system Download PDFInfo
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- CN102681360A CN102681360A CN2012101228868A CN201210122886A CN102681360A CN 102681360 A CN102681360 A CN 102681360A CN 2012101228868 A CN2012101228868 A CN 2012101228868A CN 201210122886 A CN201210122886 A CN 201210122886A CN 102681360 A CN102681360 A CN 102681360A
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Abstract
The invention discloses an alignment method for realizing circuit board double-sided figure alignment in a laser imaging system. A circuit board carrier plate is placed on a working platform; small holes are formed on the carrier plate; a CCD video camera is arranged above the carrier plate; an ink jet machine is arranged below the carrier plate; when the side A of the circuit board is exposed, the ink jet machine prints an alignment mark figure on the side B of the circuit board and the side B of the circuit board is exposed by turning over the circuit board; and when the side B of the circuit board is exposed, the CCD video camera grabs the alignment mark figure to perform alignment, so that the exposed figures on the side A and the side B of the circuit board are aligned. By adopting the alignment method, the exposed figures on two sides are aligned when the internal circuit board is exposed by a laser direct writing exposure machine, and the risk of exposure deviation of the figures on the two sides is avoided.
Description
Technical field:
The present invention relates to the printed-wiring board (PWB) equipment technical field, especially a kind of be used for that laser imaging system realizes that circuit board two sides exposure figure aims to method for position.
Technical background:
Laser direct-writing exposure machine exposure aligning method is through the centre coordinate of the centre coordinate of registration holes or feature pattern on the extraction circuit board and the loci on the CAM image and calculates; Make the CAM image carry out convergent-divergent harmomegathus and translation, realize the principle that CAM figure and circuit board are complementary.But inner plating does not have feature pattern in partial circuit plate production process, and what traditional exposure machine then adopted is the two-sided exposure simultaneously of keeping to the side, and contraposition is carried out on the two sides when setting up egative film.The then not exposure simultaneously of two sides of laser direct-writing exposure machine behind the A face that made public, needs again sheet up and down, and the circuit board that overturns and made public, and makes original downward B face, transfers to upwards, then the B face is begun exposure.Need with the position of the exposure figure of the upper and lower surface of a slice circuit board corresponding one by one, so must carry out contraposition.In processes such as sheet up and down, twice placement location in the front and back of circuit board necessarily has x, the translation of y direction and the variations such as deviation of angle.If when exposure B face, the change in location of twice circuit board placement before and after system can not measure, so same circuit board A, the position of the exposure figure on B two sides is had no idea corresponding one by one.So need to solve the problem that two-side graph is aimed at, the alignment of realization two-side graph just must use other approach that inner plating is produced alignment mark.During the A face, ink jet printer produces alignment mark at the B face so gordian technique of the present invention just is to make public, and during exposure B face, through CCD the alignment mark of B face is aimed at post-exposure, thereby realizes the aligning of two-side graph.Other produce the mode of alignment mark relatively, and technological process of the present invention is simple, and alignment precision is high, and applicability is strong.
Summary of the invention:
Technical matters to be solved by this invention provide in a kind of laser imaging system realize that circuit board two sides exposure figure aims to method for position.
The present invention realizes through following technical scheme:
Realize in the laser imaging system that circuit board two sides exposure figure aims to method for position, it is characterized in that, place the circuit board support plate on the workbench, have aperture on the support plate, the top of support plate is provided with ccd video camera, the below of support plate is provided with ink jet printer;
Specifically may further comprise the steps:
1) circuit board places on the circuit board support plate; Circuit board A faces up; Use the mechanical positioning device that circuit board is located; Circuit board A face when exposure, according to the size dimension decision mobile working platform or ink jet printer to the suitable aperture place of circuit board, in the A face exposure process ink jet printer simultaneously with the alignment mark graphic printing on circuit board B face;
2) the reverse circuit plate makes public to circuit board B face; During the exposure of circuit board B face; Ccd video camera grasps the alignment mark figure of circuit board B face, based on the position of the suitable alignment mark figure of the size dimension decision ccd video camera extracting B face of circuit board, realizes the exposure of B face;
3) if circuit board A face placement location edge equates to the position of alignment mark in circuit board B face placement location and the step 1), then circuit board B face is made public; Otherwise, with the circuit board location, one of them alignment mark figure is arranged in contraposition CCD visual field again, again circuit board B face is made public.
Any figure that described alignment mark figure prints for the ink-jet function.
Hole on the said support plate can be a hole, also can be a plurality of holes.
Said circuit board is an inner layer circuit board, is promptly being had no the circuit board that can do the alignment mark figure by the preceding two sides of exposure.
Advantage of the present invention is:
1) with respect to the keep to the side mode of steady arm of common machinery, the alignment precision of common mechanical location can not be accomplished in the 200u, can not satisfy the requirement of location progress about 10u far away.
2) utilize drilling machine to inner plating boring earlier before exposure relatively, and method of the present invention simplified technological process, and, improved precision owing to be to aim at machine.
3) utilize the mode of UV-Marker relatively, UV-Marker has restriction to the applicability of dry film, and it can only be directed against indivedual dry films, and the precision of different dry film contrapositions differs greatly.Corresponding all dry films of method of the present invention all are suitable for, and can aligning accuracy not change because of the variation of dry film.
Description of drawings:
Fig. 1 is the synoptic diagram in face of the exposure circuit plate A of the present invention.
Synoptic diagram when Fig. 2 is an exposure circuit plate A face of the present invention.
Synoptic diagram when Fig. 3 is an exposure circuit plate B face of the present invention.
Embodiment:
Shown in Fig. 1-3, realize in the laser imaging system that circuit board two sides exposure figure aims to method for position, place circuit board support plate 1 on the workbench, have aperture 3 on the support plate 1, the top of support plate 1 is provided with ccd video camera 4, the below of support plate 1 is provided with ink jet printer 5;
Specifically may further comprise the steps:
1) circuit board 2 places on the circuit board support plate 1; Circuit board A faces up; Use the mechanical positioning device with circuit board 2 location, mobile working platform or ink jet printer 5 be to suitable aperture place, in the A face exposure process ink jet printer 5 simultaneously with the alignment mark graphic printing on circuit board B face;
2) 2 couples of circuit board B of reverse circuit plate face makes public; During the exposure of circuit board B face; The alignment mark figure that ccd video camera 4 grasps circuit board B face grasps the position of circuit board B in the face of the position marker graphic based on circuit board plate 2X direction size decision ccd video camera 4, realizes the exposure of circuit board B face;
3) equate with the position of circuit board 2 A face placement location edges as if circuit board 2 B face placement locations, then circuit board 2 B faces are made public to alignment mark; Otherwise, with board circuit plate location, one of them alignment mark figure is arranged in CCD visual field, left side again, again circuit board B face is made public.
The alignment mark figure is any figure that ink jet printer 5 can print.
Hole on the support plate 1 can be a hole, also can be a plurality of holes.
Claims (4)
1. realize in the laser imaging system that circuit board two sides exposure figure aims to method for position, it is characterized in that, place the circuit board support plate on the workbench, have aperture on the support plate, the top of support plate is provided with ccd video camera, the below of support plate is provided with ink jet printer;
Specifically may further comprise the steps:
1) circuit board places on the circuit board support plate; Circuit board A faces up; Use the mechanical positioning device that circuit board is located; Circuit board A face when exposure, according to the size dimension mobile working platform or ink jet printer to the suitable aperture place of circuit board, in the A face exposure process ink jet printer simultaneously with the alignment mark graphic printing on circuit board B face;
2) the reverse circuit plate makes public to circuit board B face; During the exposure of circuit board B face, ccd video camera grasps the alignment mark figure of circuit board B face, based on the size dimension of circuit board; Ccd video camera grasps the position of the suitable alignment mark figure of B face, realizes the exposure of B face;
3) if circuit board A face placement location edge equates to the position of alignment mark in circuit board B face placement location and the step 1), then circuit board B face is made public; Otherwise, with the circuit board location, one of them alignment mark figure is arranged in contraposition CCD visual field again, again circuit board B face is made public.
2. realize in the laser imaging system according to claim 1 that circuit board two sides exposure figure aims to method for position, it is characterized in that: any figure that described alignment mark figure prints for the ink-jet function.
3. realize in the laser imaging system according to claim 1 that circuit board two sides exposure figure aims to method for position, it is characterized in that: the hole on the said support plate can be a hole, also can be a plurality of holes.
4. realize in the laser imaging system according to claim 1 that circuit board two sides exposure figure aims to method for position; It is characterized in that: described circuit board can be inner layer circuit board, is promptly being had no the circuit board that can do the alignment mark figure by the preceding two sides of exposure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101228868A CN102681360A (en) | 2012-04-24 | 2012-04-24 | Alignment method for realizing circuit board double-sided figure alignment in laser imaging system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101228868A CN102681360A (en) | 2012-04-24 | 2012-04-24 | Alignment method for realizing circuit board double-sided figure alignment in laser imaging system |
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| CN102681360A true CN102681360A (en) | 2012-09-19 |
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| CN2012101228868A Pending CN102681360A (en) | 2012-04-24 | 2012-04-24 | Alignment method for realizing circuit board double-sided figure alignment in laser imaging system |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980109A (en) * | 2012-12-10 | 2013-03-20 | 京东方科技集团股份有限公司 | Backlight and assembly method thereof |
| CN104407502A (en) * | 2014-11-19 | 2015-03-11 | 江苏影速光电技术有限公司 | Method for producing inner layer non-porous circuit board by utilizing laser direct imaging device |
| CN105115426A (en) * | 2015-09-06 | 2015-12-02 | 合肥芯硕半导体有限公司 | Detection method of figure splicing errors of laser direct imaging device |
| CN105278261A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method for measuring alignment accuracy of inner layer of laser direct-writing exposure machine |
| CN106371298A (en) * | 2016-11-25 | 2017-02-01 | 天津津芯微电子科技有限公司 | LDI inner layer alignment method and system |
| CN106814552A (en) * | 2017-01-16 | 2017-06-09 | 上海誉刻智能装备有限公司 | A kind of inversion exposure sources of two sides alignment |
| CN109613803A (en) * | 2018-12-19 | 2019-04-12 | 江苏影速科技有限公司 | A kind of alignment device of double-sided exposure, method and apparatus |
| CN110441993A (en) * | 2019-07-29 | 2019-11-12 | 合肥芯碁微电子装备有限公司 | A kind of marking method for the imaging contraposition of laser direct imaging equipment front and back sides |
| CN110453221A (en) * | 2018-05-08 | 2019-11-15 | 住友重机械工业株式会社 | Plate processing unit and board processing method |
| CN111221223A (en) * | 2019-12-05 | 2020-06-02 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
| WO2020124406A1 (en) * | 2018-12-19 | 2020-06-25 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
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| JP2005014012A (en) * | 2003-06-24 | 2005-01-20 | Pentax Corp | Drawing aparatus and drawing method |
| CN102262358A (en) * | 2011-04-13 | 2011-11-30 | 合肥芯硕半导体有限公司 | Inner laminate side-to-side aligning apparatus and method |
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Patent Citations (2)
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| JP2005014012A (en) * | 2003-06-24 | 2005-01-20 | Pentax Corp | Drawing aparatus and drawing method |
| CN102262358A (en) * | 2011-04-13 | 2011-11-30 | 合肥芯硕半导体有限公司 | Inner laminate side-to-side aligning apparatus and method |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980109B (en) * | 2012-12-10 | 2015-07-01 | 京东方科技集团股份有限公司 | Backlight and assembly method thereof |
| CN102980109A (en) * | 2012-12-10 | 2013-03-20 | 京东方科技集团股份有限公司 | Backlight and assembly method thereof |
| CN104407502A (en) * | 2014-11-19 | 2015-03-11 | 江苏影速光电技术有限公司 | Method for producing inner layer non-porous circuit board by utilizing laser direct imaging device |
| CN105115426A (en) * | 2015-09-06 | 2015-12-02 | 合肥芯硕半导体有限公司 | Detection method of figure splicing errors of laser direct imaging device |
| CN105278261A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method for measuring alignment accuracy of inner layer of laser direct-writing exposure machine |
| CN106371298A (en) * | 2016-11-25 | 2017-02-01 | 天津津芯微电子科技有限公司 | LDI inner layer alignment method and system |
| CN106371298B (en) * | 2016-11-25 | 2018-09-14 | 天津津芯微电子科技有限公司 | LDI position alignment of inner layer plates method and system |
| CN106814552A (en) * | 2017-01-16 | 2017-06-09 | 上海誉刻智能装备有限公司 | A kind of inversion exposure sources of two sides alignment |
| CN106814552B (en) * | 2017-01-16 | 2019-05-10 | 江苏影速科技有限公司 | A kind of inversion exposure sources of two sides alignment |
| CN110453221A (en) * | 2018-05-08 | 2019-11-15 | 住友重机械工业株式会社 | Plate processing unit and board processing method |
| CN109613803A (en) * | 2018-12-19 | 2019-04-12 | 江苏影速科技有限公司 | A kind of alignment device of double-sided exposure, method and apparatus |
| WO2020124406A1 (en) * | 2018-12-19 | 2020-06-25 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
| CN109613803B (en) * | 2018-12-19 | 2021-05-28 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
| KR20210076114A (en) * | 2018-12-19 | 2021-06-23 | 장쑤 와이에스포테크 인테그레이티드 서킷 에큅먼트 컴퍼니 리미티드 | Alignment apparatus, method and apparatus for double-sided exposure |
| KR102667209B1 (en) | 2018-12-19 | 2024-05-17 | 장쑤 와이에스포테크 인테그레이티드 서킷 에큅먼트 컴퍼니 리미티드 | Alignment device, method and device for double-sided exposure |
| CN110441993A (en) * | 2019-07-29 | 2019-11-12 | 合肥芯碁微电子装备有限公司 | A kind of marking method for the imaging contraposition of laser direct imaging equipment front and back sides |
| CN110441993B (en) * | 2019-07-29 | 2021-08-13 | 合肥芯碁微电子装备股份有限公司 | Marking method for front and back imaging alignment of laser direct imaging equipment |
| CN111221223A (en) * | 2019-12-05 | 2020-06-02 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
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Application publication date: 20120919 |