JP6108380B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component such as an IC chip on a printed board. In this specification, an electronic component mounting apparatus is simply referred to as a mounting apparatus, an electronic component is simply referred to as a component, and a printed circuit board is simply referred to as a board.

  The mounting apparatus is configured so that an electronic component is sucked from a component supply unit by a mounting head having a suction nozzle, transferred onto a printed board, and mounted at a predetermined position on the printed board.

  The suction nozzle is incorporated in the mounting head so as to be movable up and down. As a vertical movement mechanism that enables the suction nozzle to move up and down, a feed screw mechanism (ball screw mechanism) using a servo motor, a linear motor is generally used. Further, a linear motion actuator such as an air cylinder and a combination thereof are employed (Patent Documents 1 to 4). There is also known a vertical movement mechanism having a load control means for controlling a pressing load when an electronic component is mounted on a printed board (Patent Documents 5 and 6).

  A feed screw mechanism using a servo motor can increase the vertical movement stroke and can move up and down with high accuracy, and is therefore suitable for mounting large-sized atypical parts with high accuracy. A linear actuator is suitable for mounting small parts at high speed because it can move up and down at a high speed although its vertical movement stroke is small. In addition, when mounting electronic components that are particularly vulnerable to impact, the vertical movement mechanism having the above-described load control means is suitable. For this reason, in the past, each vertical movement mechanism, including the presence or absence of load control means, was used properly for each process, and components suitable for the vertical movement mechanism were mounted in each process to construct a mounting line. It was.

  However, in such a conventional mounting line, since only one type of component can be mounted in one process, it cannot necessarily be said that it is an efficient mounting method for mounting many types of components.

Japanese Patent Laid-Open No. 7-266154 International Publication No. 2007/111296 Japanese Patent Laid-Open No. 5-198988 International Publication No. 2006/114836 JP-A-8-330790 JP 2001-203497 A

  The problem to be solved by the present invention is to provide an electronic component mounting apparatus capable of realizing different vertical movement speeds and vertical movement strokes according to the components with the same mounting head.

The present invention relates to an electronic component mounting apparatus including a mounting head in which a plurality of nozzles are mounted so as to move up and down in order to suck and mount an electronic component on a printed circuit board. It is characterized by moving up and down by a kind of vertical movement mechanism.

  In the present invention, the mounting head is attached to an X-direction beam that is arranged perpendicular to the Y-direction beam and is movable along the Y-direction beam so as to be movable in the X direction, and supports the plurality of nozzles. It is assumed that a plate is provided, and the plurality of nozzles can be arranged along one surface of the support plate.

  The plurality of nozzles may be arranged in a line in the X direction along one surface of the support plate.

  Further, two X-direction beams may be arranged at a predetermined interval in the Y direction, and the mounting head may be attached to each X-direction beam.

  In the present invention, as the vertical movement mechanism, a vertical movement mechanism using a feed screw mechanism and a linear actuator can be used.

  Furthermore, at least one of the vertical movement mechanisms may have a load control means for controlling a pressing load when the electronic component is mounted on the printed board.

According to the present invention, since the nozzles that move up and down by different types of vertical movement mechanisms are provided in the same mounting head, different vertical movement speeds and vertical movement strokes according to the components can be realized with the same mounting head. . As a result, various types of components can be mounted with a single mounting head, and the number of mounting line steps can be reduced, so that mounting efficiency can be improved and space saving of the mounting line can be realized.

It is a conceptual diagram which shows the basic composition of the electronic component mounting apparatus of this invention. It is a figure which shows the structure of the mounting head of the electronic component mounting apparatus of FIG. 1, and is the front view seen from the Y direction in FIG. FIG. 3 is a side view showing the configuration of a nozzle that moves up and down by a linear motor in the mounting head of FIG. 2. FIG. 3 is a side view showing a configuration of a nozzle that moves up and down by a ball screw mechanism using a servomotor in the mounting head of FIG. 2.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a conceptual diagram showing a basic configuration of an electronic component mounting apparatus according to the present invention. The electronic component mounting apparatus has a mounting head 10 for sucking electronic components and mounting them on a printed board. As will be described later, a plurality of nozzles are incorporated in the mounting head 10 so as to be movable up and down.

  The mounting apparatus of FIG. 1 includes two mounting heads 10 that are mounted so as to face a pair of (two) X-direction beams 20 arranged at predetermined intervals in the Y direction. It has been. The mounting head 10 is attached to the X direction beam 20 so as to be movable in the X direction. Further, the X-direction beam 20 is bridged between a pair (two) of Y-direction beams 30 that are orthogonal to the X-direction beam and disposed at a predetermined interval in the X direction, and also along the Y direction beam 30 along the Y direction. It is movably attached. As described above, the combination of the X direction beam 20 and the Y direction beam 30 allows the mounting head 10 to freely move in the X direction and the Y direction within a horizontal plane. The mounting head 10 is moved to a component supply unit (not shown) by a combination of movements in the X direction and the Y direction, sucks the electronic components, and is further transported to the mounting position (not shown). The electronic component is mounted at a predetermined position on the printed circuit board.

  FIG. 2 is a view showing the configuration of the mounting head 10 of FIG. 1, and is a front view seen from the Y direction in FIG.

  The mounting head 10 includes a support plate 11 having one surface parallel to the X direction, and eight nozzles 12 and one nozzle 13 are arranged in a row in the X direction along the one surface of the support plate 10. . The nozzles 12 and 13 are supported by the support plate 10 so as to be movable up and down, the nozzle 12 is moved up and down by a vertical movement mechanism by a linear motor 12a (linear actuator), and the nozzle 13 is a ball screw using a servo motor 13a. It moves up and down by a mechanism (feed screw mechanism). That is, the mounting head 10 includes nozzles that move up and down by different vertical movement mechanisms in the same mounting head.

  FIG. 3 is a side view showing the configuration of the nozzle 12. The nozzle 12 includes a shaft 12b extending vertically. A nozzle tip 12c that adsorbs components is attached to the lower end of the shaft 12b. The upper end of the shaft 12b is connected to the drive shaft of the linear motor 12a via a bearing so that the shaft 12b can rotate around its axis (θ direction). The linear motor 12a is fixed to the support plate 11 and has a built-in linear encoder for detecting the vertical position of the nozzle 12 (shaft 12b). That is, the linear motor 12a moves the nozzle 12 up and down while detecting the vertical position of the nozzle 12 using a linear encoder.

  The nozzle 12 includes a rotation motor 12d for rotating the shaft 12b in the θ direction, and all eight nozzles 12 are rotated in the θ direction by the single rotation motor 12d. Specifically, the timing belt 12e is wound around all the eight nozzles 12 with respect to the rotation motor 12d, and each nozzle 12 rotates in the θ direction by rotating the rotation motor 12d.

  FIG. 4 is a side view showing the configuration of the nozzle 13. The nozzle 13 includes a shaft 13b extending vertically. A nozzle tip 13c that adsorbs components is attached to the lower end of the shaft 13b. The upper end of the shaft 13b is connected to a rotation shaft of a rotary motor 13d that rotates the shaft 13b around its axis (θ direction). Therefore, the nozzle 13 is rotated in the θ direction by rotating the rotary motor 13d.

  The shaft 13b and the rotary motor 13d are supported by the subframe 13e. The nozzle 13 is moved up and down by moving the subframe 13e up and down by a ball screw mechanism using a servo motor 13a. Specifically, a ball screw 13f is connected to a rotation shaft of a servo motor 13a fixed to the support frame 11, and a nut portion 13g that is screwed to the ball screw 13f is provided to the sub frame 13e. Therefore, when the ball screw 13 f rotates by driving the servo motor 13 a, the sub frame 13 e moves up and down with respect to the support frame 11.

  Further, the vertical movement mechanism of the nozzle 13 of this embodiment has a load control means 13h for controlling the pressing load when the electronic component is mounted on the printed board. Such a load control means 13h itself is publicly known. Simply, a load cell for detecting a pressing load is provided in the shaft 13b portion, and the drive of the servo motor 13a is controlled based on the load value detected by the load cell. The pressing load can be controlled and adjusted. In addition, the load control means 13h can be configured by a combination of a load cell and an air cylinder or a spring.

  As described above, in this embodiment, the nozzle 12 that moves up and down by the linear motor 12a and the nozzle 13 that moves up and down by the ball screw mechanism are incorporated in one mounting head 10, so that these nozzles correspond to the components. By using 12 and 13 properly, different types of components can be mounted by one mounting head 10.

  In this embodiment, the vertical movement mechanism using the linear motor 12a and the ball screw mechanism are used as the vertical movement mechanism. However, the combination of the vertical movement mechanisms is not limited to this, and two known vertical movement mechanisms are used. You may use it in combination of seed | species or 3 or more types. Further, in this embodiment, the load control means 13h is added to the vertical movement mechanism of the nozzle 13, but this can be omitted when the load control means 13h is not necessary. Further, the load control means can be added to at least one vertical movement mechanism on the nozzle 12 side. Furthermore, it goes without saying that the number of nozzles 12 and nozzles 13 is variable.

DESCRIPTION OF SYMBOLS 10 Mounting head 11 Support plate 12 Nozzle 12a Linear motor 12b Shaft 12c Nozzle tip 12d Rotation motor 12e Timing belt 13 Nozzle 13a Servo motor 13b Shaft 13c Nozzle tip 13d Rotation motor 13e Subframe 13f Ball screw 13g Nut part 13h Load control means 20X Direction beam 30 Y direction beam

Claims (6)

In an electronic component mounting apparatus including a mounting head in which a plurality of nozzles are incorporated so as to move up and down in order to suck and mount an electronic component on a printed circuit board,
The electronic component mounting apparatus according to claim 1, wherein a part and a remaining part of the plurality of nozzles are moved up and down by different types of vertical movement mechanisms.   The mounting head is attached to an X-direction beam that is arranged perpendicular to the Y-direction beam and is movable along the Y-direction beam, and is movably attached in the X direction, and a support plate that supports the nozzles The electronic component mounting apparatus according to claim 1, wherein the plurality of nozzles are arranged along one surface of the support plate.   The electronic component mounting apparatus according to claim 2, wherein the plurality of nozzles are arranged in a line in the X direction along one surface of the support plate.   4. The electronic component according to claim 2, wherein two X-direction beams are arranged at a predetermined interval in the Y direction, and the mounting head is attached to face each X-direction beam. Mounting device.   The electron according to any one of claims 1 to 4, wherein a vertical movement mechanism of some of the plurality of nozzles is a feed screw mechanism, and a vertical movement mechanism of the remaining nozzles is a vertical movement mechanism by a linear actuator. Component mounting equipment.   The electronic component mounting apparatus according to claim 1, wherein at least one of the vertical movement mechanisms includes a load control unit that controls a pressing load when the electronic component is mounted on a printed board.

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