JP2002026512A - Printed solder inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed solder inspection device which can quickly and easily inform an inspector of the formed state of solder balls on a printed board in detail and, accordingly, can improve the manufacturing quality of the printed board. SOLUTION: A sensor head 20 is positioned oppositely to the printed board and detects the displacement of the solder balls. An itemized computing means 36 computes the arranging position, height, area, and volume of each solder ball based on three-dimensional data obtained from the displacement detected by means of the sensor head 20 and the scanning position of the head 20. A state discriminating means 37 discriminate the formed state of each solder ball with respect to the height, height unevenness, volume, and defects by comparing the computed results of the computing means 36 with a database DB. A displaying means 39 causes a displaying means 40 to display the arrangement of the solder balls on the printed board obtained by means of the sensor head 20 in a plane. The means 39 also causes the displaying means 40 to display the displaying spot of each solder ball with a color which is different from a usually used color at every inspection results of the plurality of items discriminated by means of the discriminating means 37.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed solder inspecting apparatus for inspecting a printed circuit board, and more particularly to a printed solder inspecting apparatus capable of accurately inspecting a solder projection on a printed circuit board.

[0002]

2. Description of the Related Art When manufacturing a printed circuit board, the printed state of solder on the printed circuit board and the mounting state of components are inspected by an inspection apparatus. The board production line is composed of, for example, a solder printing machine, an inspection device, and a component mounting machine. The printed circuit board on which the solder is printed by the preceding solder printing machine is carried into the inspection apparatus on the line, and the state of the solder printed on the printed circuit board is inspected and carried out to the subsequent component mounting machine. In the component mounting machine, electronic components are mounted on a printed circuit board.

In an inspection apparatus, an inspection means inspects a printed circuit board on which solder printing has been performed by a preceding solder printing machine, and inspects a state of solder printing (height, presence or absence of a defect, etc.). This inspection means uses a CC arranged on a printed circuit board.
The arrangement position and area of each solder are detected based on the image of the D camera.

[0004]

In the above inspection apparatus,
Although the displacement and area of the solder can be detected, the height and volume of each solder could not be obtained, and the formation state of the solder could not be obtained in more detail. In addition, a solder printing machine at the preceding stage generally has a configuration in which solder having a constant height is printed on a printed circuit board P using a squeegee. For this reason, on the inspection device side, it is necessary to detect height unevenness and the like on the entire printed circuit board P, but this cannot be performed. In the solder printing machine at the preceding stage, the height of the solder may be partially varied depending on the type of electronic components to be mounted and the like, and a corresponding partial inspection is also required.

As described above, conventionally, the state of the formed solder can be detected only with a limited number of inspection items, so that it has not been possible to inform the administrator or the like in detail of the state of forming the solder. Further, since a large number of solders are formed on a printed circuit board, it has been desired that an administrator can quickly and easily grasp the formation state of each item for each solder, particularly the state of abnormal formation.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and can provide a quick and easy notification of the state of formation of solder on a printed circuit board with detailed items, thereby improving the manufacturing quality of the printed circuit board. The purpose is to provide a printed solder inspection device.

[0007]

In order to achieve the above object, a printed solder inspection apparatus according to the present invention is a printed solder inspection apparatus for inspecting the state of formation of solder on each printed circuit board to be carried in. Display processing means for displaying the arrangement of the solder in a plane on the image display unit, and switching the display position of each solder to a display state different from the normal state for each of a plurality of inspection results set in advance. Features.

According to another aspect of the present invention, there is provided a printed solder inspection apparatus for inspecting a state of formation of solder on each printed circuit board to be carried in, wherein the sensor is disposed to face the printed circuit board and detects a displacement of the solder on the printed circuit board. A head, an amount of displacement of the solder output from the sensor head, and an item-by-item calculating means for calculating the arrangement position, height, area, and volume of each solder based on the scanning position of the sensor head on the printed circuit board; Comparing the operation result of the item-by-item operation means with a database, displaced position of each solder, height, uneven height,
Area determination means for determining the state of formation of solder for each item of area, volume, and defect; and displaying the layout of the solder on the printed circuit board obtained by the sensor head on an image display unit in a plane, and the state determination means. Display processing means for switching the display position of each solder to a display state different from a normal state for each of the inspection results of the plurality of items determined in the above and displaying the same.

Further, the display processing means may be configured to display, in a predetermined color, a location of the solder determined to be defective as a result of the inspection.

[0010] The display processing means may be arranged to display a solder arrangement position determined to be defective in the inspection result in a predetermined color for each of the inspection results of the plurality of items determined by the state determination means.

Further, the display processing means may be configured to display the item of the formation state of each solder and the location of the solder in association with each other.

According to the above configuration, the sensor head 20
The printed circuit board P is scanned to detect and output the displacement amount corresponding to the solder protrusion. The item-by-item calculation means 36 calculates the arrangement position, height, area, and volume of each solder. State determination means 3
7 compares the formation state of the solder with the database and determines the formation state of the solder for each of the items such as the displacement of the solder, the height, the unevenness of the height, the area, the volume, and the defect. The display processing means 39 displays the corresponding solder displayed in a plane on the image display unit in a predetermined color if there is a solder having a defective inspection result for each inspection item. In addition, each inspection item can be selected and displayed in a predetermined color for each item of the inspection result failure.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a printed solder inspection apparatus according to the present invention will be described. FIG. 1 is a front view of a printed solder inspection apparatus,
FIG. 2 is a plan view of the same. A transport unit 2 is provided inside the housing of the inspection apparatus 1 and transports the printed circuit board P in the X-axis direction in the figure. An unloading section of the upstream device is provided on the front side in the transport direction, and a loading section of the downstream device is provided on the rear end side in the transport direction.

The transport means 2 has a pair of rails 3 (3a, 3b) and a belt 4 (4a, 4b) arranged with a predetermined width in the Y-axis direction in FIG. The Y axis is a direction orthogonal to the X axis (transport direction). One is a fixed rail 3a, and the belt 4a is formed in an endless shape that moves on the fixed rail 3a. The other is a movable rail 3b that is parallel to the fixed rail 3a, and similarly has an endless belt 4b. Both ends of the belts 4a and 4b are supported by a rotation shaft 5, and the motor 6 rotates to convey and move the printed circuit board P in the X-axis direction.

The fixed rail 3a and the movable rail 3b
Is provided on the Y-axis table 7. The Y-axis table 7 is movable in the Y-axis direction by a Y-axis moving means 8 including a plurality of spindles extending in the Y-axis direction, ball screws, a motor, and the like. On the Y-axis table 7, a W-axis moving means 10 including a support shaft, a ball screw, a motor, and the like is provided, and supports the movable rail 3b movably in the W-axis direction. The W axis is in the same direction as the Y axis. Thereby, the movable rail 3b moves in the Y-axis direction with respect to the fixed rail 3a,
Printed circuit board P to be conveyed, with the distance between them being variable
Can be accommodated. Although not shown,
The fixed rail 3a and the movable rail 3b are provided with side plates for guiding the printed board P at side positions.

At a position above the Y-axis table 7, an inspection means 12 for inspecting the printed circuit board P is provided. A laser displacement meter is used for the sensor head 20 of the inspection means 12 to detect a solder protrusion (a displacement amount in the height direction Z) on the front surface side of the printed circuit board P. The inspection means 12 includes X,
It is moved and scanned in the Y-axis direction and outputs three-dimensional data of the printed circuit board P. The detection signal of the inspection means 12 is processed by the processing means 32
Is output to

FIG. 3 is a schematic diagram showing the principle of detecting the amount of displacement by a laser displacement meter as the sensor head 20. A laser beam from the light source 51 is irradiated on the substrate surface of the printed circuit board P, and an image formed by the reflected light at the irradiation point S is formed on the imaging lens 5.
3 forms an image on the light receiving surface 54a of the light receiving element 54.

As a result, the printed circuit board P is moved in the height direction Z.
(If there is a protrusion such as solder), the irradiation point S moves to S ′ or S ″, and the position of the imaging point K on the light receiving surface 54a of the light receiving element 54 correspondingly moves to K ′ or K ″. Moving. The light receiving element 54 outputs a detection signal corresponding to the position of the image forming point K, and outputs a displacement amount (height and outer shape) of the projection (solder) on the printed circuit board P based on a change amount of the signal. The detection range that can be detected by the laser displacement meter has a predetermined range as illustrated.

The inspection means 12 includes the sensor head 20 and the scanning movement means 27. The scanning moving means 27
X-axis moving means 28 and Z-axis moving means 29
The sensor head 20 is provided on the shaft moving means 29.
The X-axis moving unit 28 includes a horizontal support shaft, a ball screw, a motor, and the like in the X-axis direction above the inspection position of the printed circuit board P. The length in the X-axis direction is about the length of the printed circuit board P.

The Z-axis moving means 29 includes a moving body 29a movable in the X-axis direction by the motor of the X-axis moving means 28;
It comprises a support shaft, a ball screw, a motor, and the like provided in the vertical direction (Z-axis direction) of the moving body 29a. The moving body 29a (sensor head 20) is configured to be able to move up and down by rotating a ball screw. Thereby, the sensor head 20 can scan and move in the transport direction (X-axis direction) of the printed circuit board P. Here, the Z-axis moving unit 29 moves the sensor head 20 in the height direction in order to perform scanning measurement for measuring a displacement amount while maintaining a predetermined distance from the printed circuit board P.

The printed circuit board P is provided with a motor 6
Moves on the belts 4a and 4b in the X-axis direction by rotation. A fixing stopper 13 protrudes at a substantially central inspection position, and the printed circuit board P stops at this inspection position. After detecting that the printed board P has reached the inspection position by a position detection sensor (not shown), the printed circuit board P is located immediately below the inspection means 12 by stopping the motor 6.
In this state, the warpage of the printed board P in the transport direction is corrected by a correction mechanism (not shown). Specifically, the rails 3a,
3b sandwiches both ends of the printed circuit board P in the length direction, and the both ends are corrected for warpage in the length direction.

In this state, the inspection by the inspection means 12 is executed. The sensor head 20 scans the displacement amount (solder protrusion) on the printed circuit board P in the X and Y axis directions. Of which X
The scanning in the axial direction is performed by the scanning movement means 27 using the sensor head 2.
0 is performed by controlling the movement. The scanning in the Y-axis direction is performed by controlling the movement of the Y-axis table 7 of the transport device 1.

Specifically, as shown in the plan view of FIG.
The irradiation point of the laser beam by the sensor head 20 is started from the four corners (position T1) of the printed circuit board P, and simultaneously the motor is driven to move the Y-axis table 7 in the Y1 direction by a distance corresponding to the width D of the printed circuit board P. (The same Y-axis direction is set as the main scanning direction), and the displacement amount of the solder protrusion is continuously detected. When the Y-axis table 7 moves, the distance between the fixed rail 3a and the movable rail 3b does not change, so that the printed circuit board P moves in the Y1 direction. When the irradiation point of the laser beam moves to the other end of the printed circuit board P (position T2), the driving of the motor 8b is stopped.

Thereafter, the motor of the X-axis moving means 28 of the scanning moving means 27 is driven to move (sub-scan) the sensor head 20 in the X-axis direction to a predetermined amount (position T3). This X
The amount of movement in the axial direction is the scanning range xA of the sensor head 20.
It corresponds to. As shown in FIG.
Scans the laser beam in the X-axis direction with a width of xA in the figure, the sensor head 20 is moved in the X-axis direction by a predetermined amount corresponding to the scanning width xA.

After the sub-scanning, the Y-axis table 7 is moved in the Y2 direction to continuously detect the displacement of the solder protrusion. Thereafter, the motor of the X-axis moving unit 28 of the scanning moving unit 27 is driven to move the sensor head 20 in the X-axis direction by a predetermined amount (position T).
4) (moving (sub-scanning)). The displacement amount of the solder protrusion on the printed circuit board P is continuously detected by repeating the above-described movement scanning in the X and Y axes.

As described above, the sensor head 20 is controlled to move only in the X-axis direction during the inspection processing of the printed circuit board P by utilizing the configuration in which the transfer device 1 is movable in the Y-axis direction. Has become.

As described above, by scanning the sensor head 20 in the X and Y axes relative to the printed circuit board P, the printed circuit board P is continuously output from the sensor head 20.
The height data (detection signal) corresponding to the upper solder protrusion is continuously output. After the inspection means 12 completes the inspection of the printed circuit board P, the stopper 13 is retracted and the printed board P is carried out to the subsequent device in the X-axis direction by driving the motor 6.

In the above configuration, the sensor head 20 is moved in the X-axis direction, and the printed circuit board P is moved in the Y-axis direction. In addition, the sensor head 20 is moved in the X and Y axes. Alternatively, any configuration may be used as long as the sensor head 20 and the printed circuit board P relatively move in the X and Y axis directions.

FIG. 4 is a block diagram showing the electrical configuration of the apparatus. The processing means 32 includes a CPU, a ROM, a RAM,
It has a timer or the like and determines the state of formation of solder on the printed circuit board P measured by executing a predetermined processing program. The setting unit 33 sets various parameters necessary for the determination process by using a keyboard or inputting external data. For example, the calculation item of the item-by-item calculation means 36, the state determination means 37
And the like. The three-dimensional data (detection signal) output from the sensor head 20 is data that continuously changes corresponding to the protrusion of the solder by scanning the X-axis moving means 28 and the Y-axis moving means 8 on the X and Y axes. is there.

The image data for each area is converted into three-dimensional data by the three-dimensional data expanding means 35. That is,
The three-dimensional data is generated based on the two-dimensional data corresponding to the scanning positions on the X and Y axes and the displacement amount data output from the sensor head 20. At this time, only the state of formation of the solder on the surface of the printed circuit board P is extracted and converted into data.

The item-by-item calculating means 36 calculates various items with respect to the state of solder formation based on the three-dimensional data. Inspection items for formation include an arrangement position, an area, a height, and a volume for each solder. The itemized data after the calculation is output to the state determination unit 37 and stored in the storage unit 38.

The state determining means 37 determines whether or not the formation state of each solder is normal, based on the itemized data after the calculation. At this time, an arrangement displacement is detected by comparing the arrangement position (X, Y coordinate format) of the reference solder data stored in the database DB. In addition, loss and unevenness in height are detected by comparing with the height of reference solder data. Further, an abnormality in height, area and volume is detected in comparison with the height, area and volume of the reference solder data, stored in the storage means 38, and output to the display processing means 38. Display processing means 39
Displays information on the detection result of the solder formation state by the state determination unit 37 on the display unit 40 in a predetermined display format.

FIG. 5 is a diagram showing a display screen of the display means 40. The display processing means 39 includes the display means 4 as shown in FIG.
0 on the printed circuit board information item section 41 and the image display section 4
2. Solder status item section 43, display item selection section 44, and solder detail item section 45 are displayed as images. The printed circuit board information item 41 includes a printed circuit board 41 to be inspected.
(The board name, the number of measurement sheets, the number of OK sheets, the number of NG sheets, the number of error sheets, the defect rate, etc.) are displayed. On the image display unit 42, the arrangement state of the printed circuit board P and the respective solders S on the printed circuit board P is displayed as a two-dimensional image. The image data is obtained by imaging the state of protrusion of each solder S obtained by scanning the sensor head 20. Each solder S is displayed as an image in a predetermined same color. In the example shown in the drawing, the state of formation of solder when each of chip components QFP, CSP and 0603 is mounted as an electronic component is shown.

The solder status item section 43 displays the measurement time, the measurement result, and each item of the NG solder list. When an abnormal value is detected for any one of the items by the state determination means 37, the measurement result is displayed as "NG" as shown in the figure. “OK” is displayed during normal operation. In the item of the NG solder list, a defective portion of each solder formed on the printed circuit board P is displayed for each chip of the electronic component. In the NG solder list, the type of the electronic component displayed on the image display unit 42 is displayed.

The display item selection section 44 includes an image display section 42
Solder S formed on the printed circuit board P indicated by
Is displayed for each item and can be selected.
When the item of “height” is selected, a portion where the formation state of the solder S is defective in height on the image display section 42 is displayed in a predetermined color, for example, “red”. In addition, the solder S corresponding to each of the items of height unevenness, area, volume, displacement, and loss is displayed in a predetermined color, for example, “red”. Note that the image display unit 42 has a different display color for each of the plurality of defective items.
Above solder S can be displayed as abnormal. When the item “NG” is selected, the image display unit 4
2, the solder S in which the formation state of the solder S is determined to be defective in any one of the above items is displayed in a predetermined color, for example, “red” color (for convenience, the corresponding solder S is “black” color). It is shown in solid). The display form of “NG” can be displayed in different colors for a plurality of defective items. When a plurality of defective items are detected for one solder S, a display color different from a set color for each item or a blinking color may be displayed. Further, when the item "OK" is selected, each solder S in a normal formation state is displayed in a predetermined color, for example, "blue".

The solder detailed item section 45 includes a printed circuit board P
The state of solder formation is displayed for each of the electronic components formed. If OK, "OK" is displayed. If there is a defect, "NG" is displayed, and the content of NG is displayed.

The display processing means 39 includes the image display section 42, the solder state item section 43, and the solder detailed item section 45.
Is associated with the corresponding solder. For example, as shown in FIG.
Solder S displayed in "red" color indicating "NG" above
When (Solder S included in QFP type electronic component) is selected with a mouse or the like, the chip name “QFP” of the electronic component including the selected solder S is highlighted on solder state item section 43. At the same time, the chip name “QFP” of the corresponding electronic component is also highlighted on the solder detail item section 45.
Similarly, when the chip name of the electronic component is selectively highlighted on the solder state item section 43 or the solder detail item section 45,
At the same time, the corresponding solder S on the image display unit 42 has a predetermined color,
The image is displayed in "blue" if OK and "red" if NG.

As described above, the formation state of the solder S on the printed circuit board P can be displayed for a plurality of items.
Since the defective item and the arrangement position can be displayed in association with each other, the state of formation of the solder can be confirmed in more detail.

[0039]

According to the present invention, the arrangement of the solder on the printed circuit board is displayed on the image display unit in a plane, and the display position of each solder is switched to a display state different from the normal state for each of the inspection results of a plurality of items. Since the display is configured, a defective portion of the solder can be easily specified for each item, and the manufacturing quality of the printed circuit board can be improved. In addition, the position, height,
Calculate the area and volume, determine the state of solder formation for each item of solder misalignment, height, height unevenness, area, volume, defect, and display the solder arrangement on the printed circuit board in the image display section If the configuration is such that the display position of each solder is switched to a display state different from the normal state and displayed for each of the inspection results of the plurality of items determined by the state determination unit, the defective portion of the solder is displayed as an item. It can be obtained separately and is displayed on the image display unit at the same time, so that a defective portion can be easily specified. The above-described solder formation failure portion is configured to be displayed in a predetermined color or is configured to be displayed in a predetermined color for each of a plurality of inspection results, so that a solder formation failure portion can be easily specified. Also, by displaying the item of the formation state of each solder and the location of the solder in association with each other, the corresponding location can be displayed on the image display unit based on the item selection, or the arrangement of the solder on the image display unit. Since the item of the corresponding formation state can be displayed by selecting a location, the formation state of the solder can be verified from multiple angles.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a printed solder inspection apparatus according to the present invention.

FIG. 2 is a plan view of the device.

FIG. 3 is a schematic diagram showing a principle of detecting a displacement amount by a sensor head.

FIG. 4 is a block diagram showing an electrical configuration of the device.

FIG. 5 is a diagram showing display contents of a display unit.

[Explanation of symbols]

2 ... conveying means, 8 ... Y-axis moving means, 12 ... inspection means, 2
0 ... Sensor head, 28 ... X-axis moving means, 29 ... Z-axis moving means, 32 ... Processing means, 33 ... Setting means, 35 ... Three-dimensional data creating means, 36 ... Item-by-item calculating means, 37 ... State discriminating means, 38 storage means, 39 display processing means, P ...
Printed circuit board, S ... solder.

Claims (5)

[Claims] 1. A printed solder inspection apparatus for inspecting a state of formation of solder on each printed circuit board to be carried in, wherein an arrangement of the solder on the printed circuit board is displayed in a plane on an image display unit, and a plurality of solder arrangements are set in advance. A printed solder inspection apparatus, comprising: display processing means for switching and displaying a display position of each solder in a display state different from a normal state for each inspection result of an item. 2. A printed solder inspection apparatus for inspecting the state of formation of solder on each printed board to be carried in, comprising: a sensor head arranged to face the printed board and detecting a displacement of solder on the printed board; An item-by-item calculating means for calculating an arrangement position, a height, an area, and a volume of each solder based on a displacement amount of the solder output from the sensor head and a scanning position of the sensor head on the printed circuit board; A state discriminating unit that compares the operation result of the operation unit with the database and determines the solder formation state for each item of the disposition position of each solder, height, unevenness in height, area, volume, and defect, and the sensor head. The obtained arrangement of the solder on the printed circuit board is displayed in a plane on an image display unit, and the display items of each solder are displayed for each of the inspection results of the plurality of items determined by the state determination unit. Printing solder inspection apparatus characterized by comprising a display processing means for displaying is switched to a different display state and normal to. 3. The printed solder inspection apparatus according to claim 1, wherein the display processing means displays a solder arrangement position determined as the inspection result failure in a predetermined color. 4. The display processing means displays a solder arrangement location determined to be defective in the inspection result in a predetermined color for each of the plurality of inspection results determined by the state determination means. The printed solder inspection device according to any one of the above. 5. The printed solder inspection apparatus according to claim 1, wherein the display processing unit displays the items of the formation states of the respective solders and the locations of the solders in association with each other.