JPH05273288A - Method and apparatus for inspection of printed-circuit board - Google Patents

Abstract

PURPOSE:To correct the dislocation of a printed-circuit board from a probe group not only on the surface side but also from that on the rear surface side when wiring patterns on both the surface and the rear surface are inspected. CONSTITUTION:Probes 8, 22 for inspection, dislocation detection mechanisms 5, 15, 26 and suction pads 12, 23 are installed at upper and lower jigs 3, 18. When a printed-circuit board 11 is sandwiched between, and pressed by, the jigs 3, 18 and a continuity and short circuit inspection is performed, a dislocation detection is performed simultaneously. When any dislocation exists, the jigs 3, 18 are separated from each other while the printed-circuit board 11 is being gripped and held by the suction pads 12, 23 at the jig on one side. Then, the jugs 3, 18 are moved from each other transversely by using an X-Y-theta driving gear 2, and the dislocation between the jig on the other side and the printed- circuit board is corrected. The dislocation is corrected for both the surface and the rear surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring pattern (print pattern) on both front and back surfaces of a printed circuit board (bare board).
The present invention relates to a printed circuit board inspection device for simultaneously inspecting electrical continuity and short circuit. More specifically, it is possible to detect the positional deviation between the three of the two probe holding plates on which the printed circuit board and the inspection probes for each surface are arranged, and correct the positional deviation of the three based on the detected data. The present invention relates to a printed circuit board inspection device.

[0002]

2. Description of the Related Art A conventional printed circuit board inspection apparatus generally has a structure shown in FIG. In FIG. 9, reference numeral 61 is a base, and a vertical drive mechanism 62 such as an air cylinder is provided on the base 61. Further, a lower inspection jig 64 for supporting the printed circuit board 63 is attached thereon. Posts 65 standing on the four corners of the base 61
A probe holding plate 66 is attached to the upper end of the. A probe (pin probe) 68 corresponding to a predetermined inspection point on the circuit pattern 67 of the printed board 63 is embedded in the probe holding plate 66. A guide pin 72 is provided upright on the lower inspection jig 64, and the printed board 63 is positioned by the guide pin 72 and the reference hole 73 of the printed board 63.

When using this, the printed board 63 to be inspected is first placed on the lower inspection jig 64 by fitting the guide pin 72 and the reference hole 73. Then, the printed circuit board 63 is brought into contact with the probe holding plate 66 with a predetermined pressure by the vertical drive mechanism 62. Then, through the probe group 68, the presence or absence of disconnection or short circuit in the wiring pattern 67 and the magnitude of conduction resistance are inspected (actual 1-18).
0780). In such a conventional device,
When inspecting printed wiring provided on the upper and lower surfaces, see FIG.
As shown in FIG. 7, the upward probe group 69 is also arranged on the lower surface side of the printed circuit board 63. The probe group 69 is held by the lower probe holding plate 70. When the substrate 63 is sandwiched by the vertical drive mechanism, the upper and lower probe groups 68, 69
Are simultaneously brought into contact with the wiring patterns on both surfaces, and the continuity is inspected as described above. By the way, in recent years, the wiring pattern has been densified (made finer). Therefore, it becomes difficult to accurately apply the tip of the probe 68 to the circuit pattern by using the outer shape of the printed circuit board 63 as a reference or by simply fitting the guide pin 72 into the reference hole 73 as described above.

Therefore, the positional deviation between the probe holding plate 66 and the printed circuit board 63 is measured by an image processing apparatus using an industrial television camera, and the positional deviation is corrected based on the data. Reference numeral 74 in FIG. 10 denotes an XY-θ movable table that is interposed between the upper frame 75 and the upper inspection jig 76 to correct the positional deviation.

In the method of detecting the positional deviation which is generally used at present, a camera 77 is inserted between the upper probe holding plate 66 and the printed circuit board 63 as shown in FIG. Then, with the camera 77, the alignment pin 78 of the probe holding plate 66 and the reference mark 7 of the printed circuit board 63.
The position shift of 9 is measured. The camera 77 used here is equipped with an optical system (half mirror or prism) 81 capable of simultaneously displaying both upper and lower images on the monitor 80 of FIG. When this is illuminated at the same time, the alignment pin 78 and the reference mark 79 appear to overlap. However, in actuality, the respective images are captured by alternately illuminating each one or alternately opening and closing the mechanical shutter (see FIG. 11).

[0006]

The position shift detecting / correcting method only detects and corrects the position shift between the upper surface of the printed board 63 and the upper probe group 68.

That is, since the printed board 63 needs to be set on the lower inspection jig 64, it is difficult to move the probe holding plate 70 and the printed board 63 relative to each other as in the case of the upper side. The upper and lower inspection jigs 64,
If an XY-θ table is provided in each of 72, the structure becomes complicated and the control becomes complicated. Therefore, the guide pin 72 and the reference hole 73 of the lower probe holding plate 70 are unavoidable.
We are dealing with it by increasing the mating accuracy with. However, mechanical fitting does not provide sufficient positioning accuracy, and conversely, if the fitting accuracy is increased, the guide pins are fitted tightly, making it difficult to mount and remove the printed circuit board 63.

The present invention solves the problems of the conventional double-sided printed circuit board inspecting apparatus, detects the positional deviation between the upper and lower probe groups on both sides of the printed circuit board, and detects the positional deviation not only on one side but also on both sides. An object of the present invention is to provide a printed circuit board inspection method and apparatus capable of performing correction.

[0009]

According to a first aspect of the present invention, there is provided a printed circuit board inspection method, wherein a printed circuit board is disposed between a first jig and a second jig, and a wiring pattern on the first jig side of the printed circuit board is provided. When there is a positional deviation between the probe of the first jig and the probe, the jig is displaced while the printed board is being held by the second jig, and the positional deviation is corrected. When there is a positional deviation between the wiring pattern on the second jig side and the second jig, the positional deviation is corrected by shifting the jigs while holding the printed board on the first jig. When there is no positional deviation, or after the positional deviation has been corrected, the continuity inspection result of the wiring pattern by the inspection probe provided on each jig is output.

According to a second aspect of the present invention, there is provided a printed circuit board inspecting method, wherein the upper and lower surfaces of the printed circuit board are respectively brought into contact with a probe group of an upper jig and a probe group of a lower jig to conduct a continuity inspection of a wiring pattern. Detects the deviation between the printed wiring and the probe group, and if there is a deviation, correct the deviation by horizontally shifting the upper and lower jigs while holding the blind substrate on the upper jig. After that, the lower probe group and the wiring pattern are brought into contact with each other.

According to a third aspect of the present invention, there is provided an inspection device comprising: (a) a first holder for holding a first surface of a printed circuit board, a first inspection probe group contacting a wiring pattern on the first surface, a printed circuit board and A first jig having a first positional deviation detecting mechanism for detecting relative positional deviation with respect to one inspection probe group;
A second holder that holds the second surface of the printed circuit board, a second probe group that is in contact with the wiring pattern on the second surface, and a relative positional deviation between the printed circuit board and the second probe group are detected. Based on the data from the second jig provided with the second positional deviation detection mechanism, (c) the driving mechanism for moving the jigs closer to each other, and (d) the data from the respective positional deviation detection mechanisms, It is characterized in that it is provided with a correction mechanism for correcting the positional deviation between the tools.

[0012]

In the inspection method of the first aspect, first, the positional deviation between the first jig and the printed circuit board is detected. Then, while the printed circuit board is held by the second jig, the jigs are displaced from each other to the first
Correct the positional deviation between the jig and the printed circuit board. Further, the printed circuit board is held by the first jig in this corrected state, and the jigs are again displaced to correct the positional deviation between the second jig and the printed circuit board.

As described above, according to the method of the present invention, the jigs are used as so-called gripping means, and the jigs and the printed board are aligned with each other by alternately passing the printed boards by the jigs. Alternatively, the jig on the side required for the inspection and the printed board are aligned in order. Therefore X-
Only one correction mechanism such as Y-θ table is required. Further, the double-sided printed circuit board can be efficiently inspected by the single-sided inspection mechanism.

Such an inspection method can be implemented by the device of claim 3.

In the inspection method of the second aspect, when there is a gap between the lower wiring pattern and the probe, the printed board is sucked and held by the upper jig to float. Then, the jigs are horizontally shifted in the meantime to correct the deviation. In this way, it is possible to perform the lower side shift correction, which was not possible with the method of claim 2.

In the apparatus according to the fourth aspect, the positional deviation inspection between the printed circuit board and the jig is performed in a state where the printed circuit board is sandwiched between the jigs and the energization inspection is performed. Therefore, the accuracy of the displacement inspection is high.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the device of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment of the apparatus of the present invention, showing a state in which a printed circuit board is inserted between upper and lower jigs by a supply device (not shown).

In FIG. 1, reference numeral 1 denotes an upper fixed base, and a head base 4 of an upper inspection jig 3 which is a second jig is attached to the lower surface of the fixed base 1 via an XY-θ drive device 2. .. A camera 5 is attached to the lower surface of the head base 4, and probe holding plates 7 are attached to the lower surface of the head base 4 at intervals by columns 6. The probe holding plate 7 is composed of a base plate 9 that holds the base portion of the upper probe 8 that constitutes the second probe group, and a guide plate 10 that is provided on the lower surface thereof. The guide plate 10 is for ensuring the positional accuracy of the pin portion of the probe 8.

The probe holding plate 7 is further provided with suction pads 12 for adsorbing the second surface of the printed circuit board 11, which is the second surface, by negative pressure. Normally, the suction pad is 3 ~
Four is sufficient, but when the printed circuit board becomes large, the diameter of the suction pads is increased or the number of suction pads is increased to increase the suction force. A through hole 13 having a large diameter is formed in a portion of the base plate 9 corresponding to the camera 5, and a bottomed hole 14 is formed in the guide plate 10 so as to be coaxial with the through hole 13. Further, a reference hole 15 is concentrically formed on the bottom plate of the hole 14.

On the other hand, a head base 19 of a lower inspection jig 18 which is a first jig is provided on the lower fixed base 16 via a main press 17 which is a drive mechanism.
As in the case of the upper side, a probe holding plate 21 is mounted on the head base 19 via four columns 20. A large number of probes 22 are attached to the lower probe holding plate 21 as a first probe group, and three or more suction pads 23 are attached as a first holder for adsorbing the lower surface (first surface) of the printed circuit board. Has been. A camera 5 is attached to the head base 19. Further, the lower probe holding plate 21 is provided with four guide pins 24 for receiving and supporting the printed circuit board 11 on the feed line. The guide pin 24 is connected to a rod of an air cylinder 25 such as a so-called pen cylinder that has a weak pressing force. As a result, the guide pin 24 is vertically driven, and when it is projected upward, it is constantly elastically biased upward by the spring action of air.

The suction pads 12 and 23 are usually connected via a tube to a vacuum pressure generator such as a vacuum pump or a Venturi nozzle. In some cases, in addition to the suction pad, for example, a clamp claw or a magnet may be provided on the first and second sides.
It can be used as a holder.

Reference marks 26 are provided on both upper and lower surfaces of the printed circuit board 11 at positions corresponding to the reference holes 15. That is, the camera 5, the reference hole 15, and the reference mark 2
It is arranged almost in a line so that the three parties of 6 correspond. The diameter of the reference hole 15 is larger than that of the reference mark 26,
For example, about 1.2 to 2 times is preferable.

Reference numerals 27 and 28 in FIG. 1 denote a part of a wiring pattern to be brought into contact with the probes 8 and 22, respectively.
Is an image processing unit for sending a correction signal to the XY-θ driving device 2 based on image signals from the upper and lower cameras 5.

The reference mark 26 on the upper surface of the printed board 11, the reference hole 15 of the guide plate 10, the camera 5 and the like constitute a second positional deviation detecting mechanism for detecting positional deviation between the upper probe and the wiring pattern. There is. Similarly, the reference mark 26 on the lower surface of the printed circuit board 11, the reference hole of the guide plate, the camera 5 and the like constitute a first positional deviation detection mechanism. Note that the XY-θ driving device 2 directly moves only the upper jig 3, but there is a relative positional deviation between the lower (first) jig and the upper (second) jig. Can be corrected. This constitutes the correction mechanism in claim 2.

FIG. 2 is an enlarged view of the monitor screen showing the image captured by the camera 5. In this embodiment, the reference marks 26 at the right and left sides are detected by the cameras 5 on the upper side and the lower side respectively, and the image processing unit 2
9, the error ΔX in the X-axis direction between the center O _a of the contour of the reference hole 15 and the center O _m of the reference mark 26 and the error Δ in the Y-axis direction.
Measure Y for each fiducial mark. Then, based on these four detection values, the Y-axis direction of the printed circuit board 11 and Y
Axial misalignment and around vertical axis (in horizontal plane)
The positional deviation in the rotation direction is calculated, and the correction amount is output to the XY-θ drive device 2.

FIG. 3 is a block diagram illustrating the control circuit of the apparatus of FIG. 1 in more detail.

In FIG. 3, 3 is the above-mentioned upper inspection jig, and 29 is an XY-
An image processing unit that sends a correction signal to the motors M ₁ , M ₂ , and M ₃ of the θ drive device 2. Reference numerals 30 and 31 are a mechanical operation panel and a sequencer for operating the mechanism such as the main press 17, respectively. They are a sensor for confirming the operation of the mechanical part and an actuator 32 for performing the operation.
Is combined with.

Numeral 33 is a scanner for taking in signals from the probes 8 and 22, and numeral 34 is a tester operation panel. Reference numeral 35 is a printer for the tester operation panel 34, and 36 is a recording medium (floppy disk or the like) for setting data for continuity inspection prepared for each printed circuit board. 37 is a tester controller for controlling the procedure of the continuity test. A monitor 38 corresponding to each camera is connected to the image processing unit 29.

In such a device, as described below,
Since the upper and lower surfaces of the printed circuit board are sequentially aligned, the image processing unit 29, the monitor 38, and the like need to be prepared for only one surface.

Next, the operation of the inspection apparatus constructed as described above will be described with reference to FIGS. In the following description, “press” and “release the press” mean that the main press 17 is raised to clamp the printed circuit board 11 between the upper and lower jigs 3 and 18, and to release it. To do. Before starting the continuity inspection, the lower inspection jig 18 and the upper inspection jig 3 corresponding to the printed circuit board 11 to be inspected are respectively attached to the main press 17 and
Set it on the XY-θ drive 2.

A: Board setting step (a) The printed board 11 is sent by the feed rail (not shown) of the feeder and arrives between the upper and lower jigs 3 and 18 ("board arrival" in FIG. 4). And FIG. 1).
At this time, the end face of the printed circuit board 11 is brought into contact with a stopper (not shown) to position the end face.

(B) Next, the main press 17 is raised to some extent to receive the printed circuit board 11 by the guide pins 24, the feed rail and the stopper are released, and further pressed to move the printed circuit board 11 between the upper and lower jigs 3 and 18. Pinch (see "press" in Figure 4 and Figure 5).

At this time, air is supplied to the air cylinder 25 which supports the guide pin 24, and the printed circuit board 11 is lifted by this. However, since the cylinder diameter is small and the generated pressure is weak as described above, it can be retracted in the same manner as the spring by the press pressure.

B: Inspecting process and lower-side position shift checking process The probes 8 and 22 are used while the printed circuit board 11 is pressed.
Conduct a continuity check by. At the same time, the image data of the lower jig 18 is sampled to detect the positional deviation of the printed circuit board 11 with respect to the lower probe 22.

If the detection result is "PASS",
The process proceeds to the printed circuit board take-out step (G) without performing the alignment operation (step).

If the detection result is "FAIL", the process proceeds to the next lower jig alignment step (C). Needless to say, when the alignment check of the lower jig 18 is “good”, the lower jig alignment process is not performed and the process is immediately advanced to the upper position deviation check process (D) described later. C: Lower jig alignment step (a) First, the air supply to the air cylinder 25 for the guide pin is cut off, the suction pad 12 of the upper jig 3 is set to a negative pressure, and the printed board 11 is sucked to the upper jig 3 side. To do.

(B) Then, the press is released. At this time, it is preferable that the main press 17 does not lower the entire stroke but lowers the distance by which the alignment operation (positional deviation correction operation) can be performed. Thereby, the tact time can be shortened.

(C) Further, with the printed circuit board 11 held by the upper jig 3, the correction amount is calculated from the previously sampled positional deviation data (positional deviation calculation), and based on this
Move the XY-θ drive 2. This allows printed circuit board 1
1 and the lower jig 18 are aligned.

In this way, the alignment process with the lower jig 18 is completed.

D: Upper position displacement check process After the lower jig alignment process is completed, pressing is performed again as shown in FIG. 6 to make the suction pad 23 of the lower jig 18 a negative pressure, and The negative pressure of the suction pad 12 is released. As a result, the printed board 11 is switched from the upper jig 3 to the lower jig 18, so to speak. At this time, the suction pad 23 of the lower jig 18 maintains the correct position after the displacement is corrected. In addition, an electrical inspection is performed even in the second pressing state, and at that time, the upper side image data is sampled again to detect the positional deviation between the upper jig 3 and the printed board 11.

E: Upper Jig Alignment Step When there is a displacement, the upper jig is aligned, and therefore the press is released again. In this case as well, as in the case described above, the main press 1 is moved by the distance allowing the alignment operation.
You can lower 7.

With the printed circuit board 11 held at the correct position of the lower jig 18, the XY-θ driving device 2 is moved based on the previously sampled data, and the alignment operation of the upper jig 3 is performed. Needless to say, when the alignment check of the upper jig 3 is “good”, the alignment operation is not performed and the next electrical inspection is immediately performed.

F: Electrical inspection process After each alignment operation is completed and the upper and lower surfaces are aligned at the correct positions, they are sufficiently pressed to perform the third probe 8 and 2
Conduct continuity / short circuit inspection according to 2. At this time, in order to confirm that there is no slippage due to the suction pad, it is desirable to detect the third positional deviation.

G: Printed circuit board take-out step After the electric inspection, before releasing the press, the vacuum pressure of the suction pads 12 and 23 of the upper jig 3 and the lower jig 18 is released in advance, and the air cylinder of the guide pin 24 is released. Supply 25 air.

After that, the press is released, the printed circuit board 11 supported by the guide pins 24 is taken out by the feed rail, and is flown to the next step.

In the above embodiment, the lower jig alignment is performed first, but the upper jig alignment is performed first, and then the printed circuit board is held on the upper jig side to perform the lower jig alignment. Even if it does so, the same effect can be obtained. In this case, the upper jig is the first jig and the lower jig is the second jig. The same applies to the holder and the like.

Further, in the flow chart of FIG. 4, the electric inspection is performed every time the press is performed. This is because when the inspection result is “good”, the next alignment step is omitted and the inspection tact is shortened. However, the electrical inspection is performed up to three times (when alignment is required on both sides), and the time required for this is increased. Therefore, the second electrical inspection may be omitted, and the alignment operation on the upper surface side may be started immediately after the alignment (image sample, displacement calculation) on the lower surface side is completed. As a result, the inspection tact can be shortened. Further, if correction is required every time, the first electrical inspection may be omitted. Also, the upper and lower alignment checks may be performed simultaneously during the first press, and the upper alignment check during the second press may be omitted.

Further, in the inspection apparatus of the present invention, it is preferable that the inspection mode in which the electric inspection is performed three times, two times or once can be switched depending on each other. Thereby, the most appropriate inspection mode can be selected and the inspection tact can be shortened. The switching may be manual, or may be automatically switched based on the correction status up to that point.

In the above embodiment, after the inspection of one printed circuit board is completed, the XY-θ driving device is not returned to the original state,
We accept the next printed circuit board as it is. The arrangement of the upper and lower jigs is such that the deviation ΔK between the upper and lower wiring patterns 27, 28 of the (previous) printed circuit board 11 is absorbed (FIG. 7A). On the other hand, since the deviation ΔX when the printed circuit board 11 is arranged between the upper and lower jigs 3 and 18 by the supply device occurs every time, the alignment check and the alignment operation (FIG.
B to C) must be provided for each printed circuit board. Since the upper jig 3 is moved by ΔX for the alignment operation of the lower jig 18 (FIG. 7B), the upper jig 3 is again moved by −Δ.
Only X needs to be undone (Fig. 7C).

By the way, the deviation Δ of the upper and lower wiring patterns
Neither K nor the deviation ΔX when the sheet is placed by the supply device has a property of largely changing each time. In other words, it is determined to some extent by the production lot, and some random error (deviation on the error curve) occurs around the average value. Therefore, the alignment amount ΔX for the lower surface and the alignment amount −ΔX for the upper surface are almost constant. Moreover, as is clear from the above description, the directions are opposite and the absolute values are almost equal.

From this point of view, the average value of the correction data for a plurality of printed circuit boards is used as the predicted correction amount,
A method of moving the XY-θ drive device by that amount in advance can be adopted. As the average value, since the alignment amount gradually shifts depending on the production lot, it is preferable to adopt the average value of the immediately preceding plural (for example, 20) printed boards, that is, the moving average value.

That is, as shown in FIG. 8, the XY-θ driving device is moved in advance by the above moving average while the inspected printed circuit board is replaced with a new one (arrow N1), and the first pressing is performed. At this time, the printed board 11 is immediately held by the upper suction pad 12 (the upper alignment is completed at this time), the XY-θ drive device is returned to its original position (arrow N2, the lower alignment is completed), and the second press is performed. To do. As a result, in most cases, the pressing operation only needs to be performed twice, and the electrical inspection and the displacement check need only be performed once. That is, the alignment operation on the upper surface side can be substantially excluded from the inspection takt time. Of course, an electrical inspection was performed during the first press and "PASS"
In case of, it may be taken out as it is.

Further, in the case of a substrate in which one surface has a conventional wiring pattern and the other surface has been made fine, it is desirable to set the conventional wiring pattern on the lower surface side, which is difficult to correct.
In that case, the electrical inspection of the lower surface becomes "PASS" simply by positioning the position of the printed circuit board by the outer shape or the like, and therefore the alignment operation is performed only on the finer upper surface side. In such a case, once the positional deviation of the wiring pattern on the upper surface with respect to the outer shape is corrected by the upper jig, it will be 1
It is highly possible that both presses will become "PASS" on both sides. Also in this case, it is preferable to successively calculate the moving average and shift the upper jig by the moving average.
Thereby, there is an advantage that a stable continuous inspection can be performed without making an unnecessary correction for a random error.

To obtain the moving average, the means for storing the correction data of a plurality of times immediately before, the means for updating the oldest data every time the correction data is calculated, and the means for calculating the average value of the updated data group are used. The moving average calculation device may be incorporated in, for example, the image processing unit 29 shown in FIG.

In the inspection method of the above-described embodiment, since the positional deviation is detected in the actual pressed state, there is an advantage that the positional deviation detection error is small. That is, as shown in FIG. 10, when the positional deviation is detected in a state where the printed board 63 and the probe group 68 are separated from each other, an operation of bringing the printed board 63 and the probe group into contact with each other for a test such as continuity, An error occurs based on the pressure at the time of contact. On the other hand, in the above-described embodiment, since the positional deviation in the actual conduction inspection (probing) state is detected, there is an advantage that it is not affected by such an error.

However, the present invention is not limited to such a case, and may be applied to a method of moving a camera as shown in FIG. 10 or a method of detecting a positional deviation in a state where the probe group and the printed board are separated. Can be applied. For example, in the inspection device of FIG. 10, suction pads are provided on the upper jig 76 and the lower jig 64, respectively. Then, with the printed board 63 held by the lower jig 64,
The positional deviation between the wiring pattern 67 on the upper surface of the printed board 63 and the upper probe group 68 is detected by the camera 77, and XY-
The θ movable table 74 corrects the positional deviation. Then, the jigs 64 and 76 are pressed to each other so that the printed board 63 is held by the upper jig 76 and the press is released. Then, the positional deviation between the wiring pattern 71 on the lower surface of the printed board 63 and the lower probe group 69 is performed. A method of detecting with the camera 77 and correcting the positional deviation with the XY-θ movable table 74 can be considered.

[0058]

According to the method of the present invention, not only the positional deviation between the printed circuit board and the upper probe group but also the lower probe group is checked at the time of the conduction / short circuit inspection of the wiring patterns on the upper and lower surfaces of the printed circuit board. It is possible to correct the positional deviation between and. Further, since a device for performing the positional deviation check and the positional deviation correction operation for both the upper and lower surfaces can be shared in a considerable part, there is an advantage that the configuration is simple and the cost is low.

By using the apparatus of the present invention (claim 3), it is possible to efficiently carry out the inspection method of the present invention having the above-mentioned excellent effects.

Further, by using the inspection apparatus according to the fourth aspect, it is possible to detect the positional deviation in the state where the continuity test is actually performed. Therefore, the error caused by the operation of bringing the printed circuit board and the probe group closer to each other and the error caused by applying the pressing force are not included in the positional deviation detection. Therefore, the accuracy of the positional deviation detection can be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of an apparatus of the present invention.

FIG. 2 is an enlarged view of a monitor image in the apparatus of FIG.

FIG. 3 is a block diagram showing a control system of the apparatus of FIG.

FIG. 4 is a sequence diagram showing an operation of the apparatus of FIG.

FIG. 5 is a process drawing showing the first half of one embodiment of the method of the present invention.

FIG. 6 is a process drawing showing the second half of the method of FIG.

FIG. 7 is a schematic process diagram of the method of FIGS. 5 and 6.

FIG. 8 is a schematic process chart showing another embodiment of the method of the present invention.

FIG. 9 is a perspective view showing an example of a conventional printed circuit board inspection device.

FIG. 10 is a configuration diagram showing another example of a conventional printed circuit board inspection device.

11 is an explanatory diagram showing an example of a monitor image in the apparatus of FIG.

[Explanation of symbols]

 2 X-Y-θ driving device 3 Upper inspection jig 5 Camera 8 Probe 11 Printed circuit board 12 Suction pad 15 Reference hole 17 Main press 18 Lower inspection jig 23 Suction pad 26 Reference mark 27 Wiring pattern 28 Wiring pattern

Claims (4)

[Claims] 1. A printed circuit board is arranged between a first jig and a second jig, and there is a displacement between a wiring pattern on the first jig side of the printed circuit board and a probe of the first jig. At this time, the positional deviation is corrected by shifting the jigs while the printed board is being held by the second jig, and the wiring pattern on the second jig side of the printed board and the second jig
When there is a positional deviation between the jig and the probe, the jig is displaced while the printed circuit board is held by the first jig, and the positional deviation is corrected. A printed circuit board inspection method for outputting a continuity inspection result of a wiring pattern by an inspection probe provided on a tool. 2. A method for inspecting the continuity of a wiring pattern by contacting the upper and lower surfaces of a printed circuit board with a probe group of an upper jig and a probe group of a lower jig, respectively. If there is a deviation, the upper and lower jigs are attracted and held by the upper jig, and the upper and lower jigs are horizontally displaced to correct the deviation, and then the lower probe group And a wiring pattern are brought into contact with each other, a printed circuit board inspection method. 3. (a) A first holder for holding a first surface of a printed circuit board, a first probe group in contact with a wiring pattern on the first surface, and a relative relationship between the printed circuit board and the first probe group. A first jig having a first positional deviation detection mechanism for detecting various positional deviations, and (b) a second holder for holding the second surface of the printed circuit board, and a wiring pattern on the second surface. A second jig including a second probe group that detects the relative positional deviation between the printed circuit board and the second probe group, and (c) the jigs are moved toward and away from each other. A printed circuit board inspecting apparatus comprising: a driving mechanism for performing the above; and (d) a correction mechanism that corrects the positional deviation between the jigs based on the data from the respective positional deviation detection mechanisms. 4. The displacement detection mechanism is larger than a reference mark provided on a printed circuit board and the reference mark penetrating a holding plate holding the probe group so as to correspond to the reference mark. A reference hole and a camera provided on each jig apart from the probe holding plate so as to detect the reference mark and the inner edge of the reference hole at the same time, and the printed board and the probe are in contact with each other. 4. The printed circuit board inspecting apparatus according to claim 3, wherein the positional deviation between the printed circuit board and the probe holding plate is detected with reference to the relative position between the reference mark and the contour of the inner edge of the reference hole.