JP2013214588A - Electronic component mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting line which can reduce facility costs, improve area productivity, and reduce production costs.SOLUTION: An electronic component mounting system has: a print inspection unit (print inspection device M2A) for inspecting a solder print state of a substrate in which solder is printed by a solder print unit (printer M1); a mounting inspection unit (mounting inspection device M5A) for inspecting a component mounting state in the substrate where an electronic component is mounted by component mounting units (electronic component mounting devices M2B to M5B); and a substrate delivery device M6 as a single substrate repair work unit for performing repair work for both of a substrate which is provided in a downstream side of the component mounting unit and determined as a defective print state by the print inspection unit and a substrate which is determined as a defective mounting state by the mounting inspection unit, as a target.

Description

  The present invention relates to an electronic component mounting system for mounting electronic components on a substrate.

  In an electronic component mounting system that mounts electronic components on a substrate, the substrate is transported along an electronic component mounting line configured by connecting a plurality of devices such as a solder printing device and an electronic component mounting device in series. A mounting substrate is manufactured by sequentially executing work processes such as solder printing and component mounting on the substrate carried in from (see, for example, Patent Document 1). The electronic component mounting line has an inspection function, and the quality of the work result is determined for a predetermined inspection item for the board after each work process is executed. Substrates that have been judged as defective in these inspections are stopped by a dedicated repair conveyor provided in the electronic component mounting line, and the boards are removed as necessary and discarded according to the contents of each board. Defects such as disposal and defect correction work are performed.

JP 2011-82375 A

  However, in the conventional electronic component mounting system including the above-mentioned patent document example, due to the arrangement of a dedicated repair conveyor for processing a substrate that does not become a normal work target in an electronic component mounting line such as a defective substrate, There were the following problems. In other words, the electronic component mounting line requires at least a solder printing function for bonding components and a component mounting function for mounting electronic components on a printed circuit board. Inspection is performed. For this reason, in the conventional electronic component mounting line, dedicated repair conveyors have been arranged in the inspection sections for solder printing and component mounting, respectively. As a result, the equipment cost is increased and the area productivity is lowered, and the production cost is increased due to an increase in the number of workers in charge of a plurality of repair conveyors.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting line that can reduce equipment costs, improve area productivity, and reduce production costs.

  The electronic component mounting system according to the first aspect of the present invention is configured by connecting in series a component mounting portion for mounting an electronic component on a substrate printed with the solder on a downstream side of a solder printing portion for printing solder on the substrate. An electronic component mounting system that manufactures a mounting substrate by transporting a substrate along a printed electronic component mounting line and sequentially executing a solder printing process and a component mounting process. A first confirmation necessity determination unit and a second confirmation unit, which are provided respectively and detect whether or not there is an abnormal item in the work process or work result of the solder printing process and the component mounting process, and determine whether or not confirmation is necessary in a subsequent process; Any of the confirmation necessity determination unit and the board that is provided on the downstream side of the component mounting unit and is determined to be confirmed by each of the first confirmation necessity determination unit and the second confirmation necessity determination unit. And a single board check work unit to verify operations as elephants.

  According to a third aspect of the present invention, there is provided an electronic component mounting system in which a component mounting portion for mounting an electronic component on a substrate printed with the solder is connected in series downstream of a solder printing portion for printing solder on the substrate. An electronic component mounting system for manufacturing a mounting substrate by transporting a substrate along an electronic component mounting line and sequentially executing a solder printing process and a component mounting process, wherein solder is printed by the solder printing unit. A print inspection unit for inspecting a solder printing state on the printed circuit board, a mounting inspection unit for inspecting a component mounting state on the substrate on which the electronic component is mounted by the component mounting unit, and a downstream side of the component mounting unit, A single board repair that repairs both the board that has been judged to be defective by the print inspection unit and the board that has been judged to be defective by the mounting inspection part. And a working unit.

  According to the present invention, it is provided in each of the solder printing part and the component mounting part, and detects whether or not there is an abnormal item in the work process or work result of the solder printing process and the component mounting process, thereby determining the necessity of confirmation in the subsequent process. A first confirmation necessity determination section and a second confirmation necessity determination section, and a first confirmation necessity determination section and a second confirmation necessity determination section provided on the downstream side of the component mounting section. A single board check working unit that performs a check operation on any of the boards determined to be checked by each, or a print inspection that inspects the solder printing state on the board on which the solder is printed by the solder printing unit A mounting inspection unit that inspects the component mounting state on the board on which the electronic component is mounted by the component mounting unit, and a printing inspection unit that is provided on the downstream side of the component mounting unit determines that the printing state is defective. By having a single board repair work section that performs repair work for both the board and the board that has been judged to be defective by the mounting inspection section, the equipment cost is reduced and the area productivity is reduced. The production cost can be reduced.

Structure explanatory drawing of the electronic component mounting system of one embodiment of this invention Structure explanatory drawing of the screen printing apparatus used for the electronic component mounting system of one embodiment of this invention Structure explanatory drawing of the test | inspection / mounting apparatus used for the electronic component mounting system of one embodiment of this invention The perspective view of the board | substrate delivery apparatus used for the electronic component mounting system of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting system of one embodiment of this invention Explanatory drawing of the display screen in the electronic component mounting system of one embodiment of this invention Explanatory drawing of the display screen in the electronic component mounting system of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, an electronic component mounting system 1 that manufactures a mounting board by mounting electronic components on a board will be described with reference to FIG. In FIG. 1, an electronic component mounting system 1 includes a printing device M1, an inspection / mounting device M2, electronic component mounting devices M3 and M4, an inspection / mounting device M5, a board transfer device M6, and a reflow device M7 (for electronic component mounting). The main component is an electronic component mounting line formed by connecting the apparatus) in the board conveyance direction (X direction). Each device constituting the electronic component mounting line is connected by the communication network 2 and controlled by the host device 3 having the function of a management computer. Thereby, transmission of a control command from the host system and signal exchange between the devices are performed.

  The printing device M1 receives the substrate 4 supplied from the upstream substrate supply device (not shown) (arrow a), and screen-prints a solder paste for component bonding on the component connection land of the substrate 4. The substrate 4 after screen printing is carried into the downstream inspection / mounting apparatus M2 (arrow b). The inspection / mounting device M2, the electronic component mounting devices M3, M4, and the inspection / mounting device M5 are all provided on both sides of the substrate transfer mechanism 16 (see FIG. 3) for transferring the substrate 4 in the substrate transfer direction. It has a configuration in which a work operation mechanism such as a mechanism is arranged.

  The inspection / mounting apparatus M2 includes a print inspection apparatus M2A and an electronic component mounting apparatus M2B. The print inspection apparatus M2A inspects the solder printing state on the printed circuit board 4 after printing. In this solder printing inspection, the position of the solder part formed on the substrate 4 is also measured, and each electronic device on the downstream side is used as solder position data for position correction during the component mounting operation by the downstream electronic component mounting apparatus. Feed forward to the component mounting apparatus.

  The electronic component mounting apparatus M2B mounts electronic components on the substrate 4 after the solder printing inspection. The electronic component mounting apparatuses M3 and M4 include two electronic component mounting apparatuses M3A and M3B and electronic component mounting apparatuses M4A and M4B that can perform work operations independently of each other. The electronic components are mounted sequentially. The inspection / mounting apparatus M5 includes a mounting inspection apparatus M5A and an electronic component mounting apparatus M5B. The electronic component mounting apparatus M5B mounts electronic components on the board 4, and the mounting inspection apparatus M5A is an upstream electronic component mounting apparatus. The component mounting state is optically inspected for the substrate 4 after the component mounting operation by the above is completed. The inspected substrate 4 is carried into the reflow device M7 via the substrate transfer device M6 (arrow c), and the solder is melted and solidified by heating here, and the electronic component is soldered to the substrate 4.

  In the electronic component mounting system 1 configured as described above, the printing apparatus M1 constitutes a solder printing unit that prints solder on the substrate 4, and the electronic component mounting apparatus M2B, the electronic component mounting apparatuses M3A and M3B, the electronic component mounting apparatuses M4A and M4B, and The electronic component mounting apparatus M5B is a component mounting unit that mounts electronic components on the substrate 4 that is connected in series to the downstream side of the solder printing unit and printed with solder. In the present embodiment, the substrate 4 is conveyed along the electronic component mounting line having the above-described configuration, and the mounting substrate is manufactured by sequentially executing the solder printing process and the component mounting process.

  Next, the structure of the printing apparatus M1 will be described with reference to FIG. In FIG. 2, a substrate positioning portion 12 is disposed on the upper surface of the base 5. The substrate positioning unit 12 is a moving table provided with drive mechanisms in the X, Y, Z, and θ directions. The substrate positioning unit 12 is provided with a substrate transfer mechanism 6 including two transfer rails. By driving the substrate positioning unit 12, the substrate 4 carried in by the substrate transport mechanism 6 is received by the substrate lower receiving unit 13, and the substrate 4 positioned in the horizontal plane with respect to the screen mask 11 is the screen mask. 11 is in contact with the lower surface.

  Above the screen mask 11, a squeegee mechanism configured to reciprocate the squeegee head 9 held by the X-axis arm 8 in the Y direction by the Y-axis table 7 is disposed. The squeegee head 9 is provided with a pair of squeegees 10 that can be moved up and down, and screens according to the printing pattern of the substrate 4 by a squeegeeing operation of sliding the squeegee 10 on a screen mask 11 supplied with paste-like solder. Solder is printed on the substrate 4 through the pattern holes formed in the mask 11. The above-described squeezing mechanism and substrate positioning unit 12 constitute a screen printing mechanism 42 (see FIG. 5) that prints solder on the substrate 4.

  Next, the structure of the inspection / mounting apparatuses M2 and M5 will be described with reference to FIG. Since the electronic component mounting apparatuses M3A, M3B, M4A, and M4B of the electronic component mounting apparatuses M3 and M4 have the same configuration as the electronic component mounting apparatuses M2B and M5B shown in FIG. In FIG. 3, a substrate transfer mechanism 16 having two transfer rails is disposed in the X direction at the center of the base 15. The substrate transport mechanism 16 transports the substrate 4 loaded from the upstream device to the downstream side, and positions and holds the substrate 4 at a work position in the device. Then, a predetermined work operation is executed by the print inspection apparatus M2A, the electronic component mounting apparatus M2B, the mounting inspection apparatus M5A, and the electronic component mounting apparatus M5B with respect to the substrate 4 positioned and held by the respective substrate transport mechanisms 16.

  The electronic component mounting apparatuses M2B and M5B are provided with a component supply unit 17, and the component supply unit 17 is provided with a carriage 29 on which a plurality of tape feeders 18 are mounted in parallel. The tape feeder 18 supplies the electronic component to a pickup position by the component mounting portion described below by pulling out and pitch-feeding the carrier tape holding the electronic component from the tape supply reel 30 set on the carriage 29.

  A Y-axis moving table 19 provided with a linear motion mechanism using a linear motor is disposed in the Y direction at one end of the base 15 in the X direction. Similarly, X-axis movement tables 20A and 20B each having a linear motion mechanism using a linear motor are mounted on the Y-axis movement table 19 so as to extend in the X direction and be movable in the Y direction. The X-axis movement tables 20A and 20B correspond to the printing inspection apparatus M2A, the electronic component mounting apparatus M2B, the mounting inspection apparatus M5A, and the electronic component mounting apparatus M5B, respectively.

  A mounting head 25 including a plurality of unit mounting heads 26 is mounted on the X-axis moving table 20B so as to be movable in the X direction. Further, the X-axis moving table 20B is integrated with the mounting head 25 on the lower surface side. A board imaging unit 27 is provided. Further, an imaging head 21 including an imaging camera 22 is mounted on the X-axis movement table 20A so as to be movable in the X direction. A carriage 23 incorporating an image recognition unit 24 is attached to the print inspection apparatuses M2A and M5A.

  The operation of the electronic component mounting apparatuses M2B and M5B will be described. By driving the Y-axis moving table 19 and the X-axis moving table 20B, the mounting head 25 moves horizontally in the X direction and the Y direction, and thereby the component is absorbed by the suction nozzle 26a mounted on the lower end of the unit mounting head 26. The electronic component is taken out from the tape feeder 18 of the supply unit 17, and the electronic component is mounted on the substrate 4 positioned and held by the substrate transport mechanism 16. Therefore, the Y-axis moving table 19, the X-axis moving table 20 B, and the mounting head 25 take out electronic components from the component supply unit 17 by the mounting head 25 and transfer them to the mounting position of the substrate 4 that is positioned and held by the substrate transport mechanism 16. The component mounting mechanism 51 (refer FIG. 5) to mount is comprised. Then, by moving the substrate imaging unit 27 integrally with the mounting head 25, the substrate imaging unit 27 moves above the substrate 4 and images the substrate 4. And the recognition mark provided in the board | substrate 4 and the component mounting position are recognized by recognizing the image acquired by imaging.

  A component imaging unit 28 is disposed on the movement path of the mounting head 25 between the component supply unit 17 and the substrate transport mechanism 16. The mounting head 25 holding the electronic component by the suction nozzle 26 a moves in the X direction above the component imaging unit 28, thereby imaging the electronic component held by the mounting head 25 by the component imaging unit 28. And the positional information which shows the position shift from the normal position of an electronic component is acquired by recognizing the image acquired by imaging. In the component mounting operation on the board 4 by the component mounting mechanism 51, the position correction of the mounting position is performed based on this position information.

  Operations of the print inspection apparatus M2A and the mounting inspection apparatus M5A will be described. By driving the Y-axis movement table 19 and the X-axis movement table 20A, the imaging head 21 moves horizontally in the X direction and the Y direction. As a result, the imaging camera 22 captures an image of the substrate 4 that is operated in the pre-process apparatus and is positioned and held by the substrate transport mechanism 16. Therefore, the Y-axis movement table 19, the X-axis movement table 20A, and the imaging head 21 are inspected mechanisms 46 and 55 that image the substrate 4 after the work is performed in the previous process for a predetermined inspection (see FIG. 5). Configure. Then, the image acquired by the imaging head 21 is processed by the inspection processing units 47 and 56 (see FIG. 5) built in the image recognition unit 24, whereby the inspection corresponding to a predetermined purpose is performed.

  That is, in the printing inspection apparatus M2A, the solder printing state on the substrate 4 on which the solder is printed by the printing apparatus M1 of the pre-process apparatus is inspected. Therefore, the print inspection apparatus M2A is a print inspection unit that inspects the solder printing state on the substrate 4 on which the solder is printed by the solder printing unit. The mounting inspection apparatus M5A is a mounting inspection unit that inspects the component mounting state on the substrate 4 on which the electronic components are mounted by the electronic component mounting apparatuses M2B to M5B of the pre-process apparatus.

  Next, with reference to FIG. 4, the structure of the board | substrate delivery apparatus M6 is demonstrated. As shown in FIG. 4A, the substrate transfer device M6 has a configuration in which a transport rail 33 for guiding and transporting the substrate 4 is horizontally disposed on the transport frame 32 supported by the support bracket 31. Yes. The transport rail 33 is connected to the substrate transport mechanism provided in each of the upstream inspection / mounting device M5 and the downstream reflow device M7, and the upstream device is connected to the downstream device via the transport rail 33. The substrate 4 is transported and delivered.

  As shown in FIG. 4B, the substrate 4 is provided with a barcode label 4a for individually identifying each substrate 4, and the substrate 4 is conveyed downstream along the electronic component mounting line. In the process, the bar code label 4a is read by a bar code reader provided in each apparatus, and the substrate 4 becomes a work target of each apparatus while being individually identified. The substrate transfer device M6 determines whether or not the substrate 4 is a treatment target substrate in the substrate transfer device M6 based on the identification result, and the corresponding substrate 4 is handled as follows.

  In other words, the stopper 37 is operated for a substrate to be confirmed that has been detected as having a need for confirmation in the subsequent process after detecting an abnormal item in the work process or work result of each device, a defective substrate that has been determined to be defective by inspection, and the like. Is temporarily stopped by the substrate transfer device M6, and is subjected to necessary confirmation work and repair work. Further, the substrate 4 determined to be required to be repaired offline is taken out from the substrate transfer device M6 and repaired.

  As shown in FIG. 4A, the transport rail 33 is covered with a cover member 34. The cover member 34 is provided with a door member 35 of a size that allows the substrate 4 to be taken in and out. . The door member 35 is provided with a locking portion 36a, and the cover member 34 is provided with a lock mechanism 36 at a position corresponding to the locking portion 36a. When the door member 35 is closed, the locking portion 36a is fixed by a remotely controllable lock mechanism 36, and the door member 35 is locked and prohibited from being opened. When it is necessary to open the door member 35 and perform work on the substrate 4 or to remove the substrate from the substrate transfer device M6, the host device 3 sends a door opening permission command to the lock mechanism 36 via the communication network 2. By doing so, the door member 35 can be opened.

  Next, the configuration of the control system of the electronic component mounting system 1 will be described with reference to FIG. In FIG. 5, the host device 3 is connected via a communication network 2 to a printing device M1, a printing inspection device M2A, an electronic component mounting device M2B, an electronic component mounting device M3, an electronic component mounting device M4, a mounting inspection device M5A, and an electronic component mounting device. It is connected with M5B and the board | substrate delivery apparatus M6. The printing device M1, the printing inspection device M2A, the electronic component mounting device M2B, the electronic component mounting device M3, the electronic component mounting device M4, the mounting inspection device M5A, the electronic component mounting device M5B, and the board delivery device M6 are respectively connected to the communication units 40, 44, 49, 53, 59 and control units 41, 45, 50, 54, 60, and signals can be exchanged between the host device 3 and each device via the respective communication units.

  The printing apparatus M1 includes a screen printing mechanism 42 and a first confirmation necessity determination unit 43. When the control unit 41 controls the screen printing mechanism 42, a screen printing operation for the substrate 4 is executed. . In the work process or work result by the screen printing mechanism 42, the first confirmation necessity determination unit 43 is set at timings set by detection signals of various sensors provided in the respective parts of the screen printing mechanism 42 and printing operation programs. Based on the signal or the like, a process for determining whether or not there is an abnormal item in the work process or work result and determining whether or not confirmation in a subsequent process is necessary is performed.

  The print inspection apparatus M2A includes an inspection mechanism 46, an inspection processing unit 47, and a print inspection data storage unit 48. When the control unit 45 controls the inspection mechanism 46 and the inspection processing unit 47, screen printing is performed by the printing apparatus M1. An inspection of the solder printing state is performed on the substrate 4 that has been performed, and an inspection result including pass / fail judgment is output together with defect position data indicating a defect position. In this inspection, the print inspection data stored in the print inspection data storage unit 48 is referred to. In addition, about the board | substrate 4 determined to be unsatisfactory by this printing test | inspection, you may not make it perform the following post-process operation | work as a defective board | substrate, and perform the post-process operation | work similarly to the normal board | substrate 4 determined to be favorable. It may be executed continuously.

  The electronic component mounting apparatuses M2B, M3, M4, and M5B include a component mounting mechanism 51 and a second confirmation necessity determination unit 52, and the control unit 50 controls the component mounting mechanism 51, so A component mounting operation for mounting electronic components on the substrate 4 is executed. In the work process or work result by the component mounting mechanism 51, the second confirmation necessity determination unit 52 is a timing set by detection signals of various sensors or printing operation programs arranged in the respective parts of the component mounting mechanism 51. Based on the signal or the like, a process for determining whether or not there is an abnormal item in the work process or work result and determining whether or not confirmation in a subsequent process is necessary is performed.

  The mounting inspection apparatus M5A includes an inspection mechanism 55, an inspection processing unit 56, a mounting inspection data storage unit 57, and a display unit 58. The control unit 54 controls the inspection mechanism 55 and the inspection processing unit 56, so that electronic component mounting is performed. The component mounting state is inspected for the substrate 4 on which the components are mounted by the devices M2B, M3, M4, and M5B, and the inspection result including the pass / fail judgment is output together with the defect position data indicating the defect position. In this inspection, the print inspection data stored in the mounting inspection data storage unit 57 is referred to. The substrate transfer device M6 includes a substrate transfer mechanism 61 and a display unit 62. When the control unit 60 controls the substrate transfer mechanism 61, a substrate transfer operation from the inspection / mounting device M5 to the reflow device M7 is executed. .

  The display unit 58 is a display panel provided on the operation panel. In addition to displaying a guidance screen for operating the apparatus, the display unit 58 is executed by an electronic component mounting apparatus such as the printing apparatus M1 or the electronic component mounting apparatus M2B. Check required position indicating the position of the abnormal item detected in the check necessity determination process, print inspection executed by the print inspection apparatus M2A and the mounting inspection apparatus M5A, print failure detected by the component mounting inspection, and mounting state failure The defect position such as is displayed.

  Instead of displaying these position display screens on the display unit 58 provided in the mounting inspection device M5A, a dedicated display unit 62 for displaying the inspection results and the detection results of the abnormal items is displayed on the board transfer device M6. You may make it provide. That is, in the present embodiment, a single defect position display unit (confirmation position display unit) that displays a defect position of an inspection result or a position that requires confirmation of an abnormal item at the main body of the substrate transfer apparatus M6 or an adjacent position. It has a form with.

  In the board delivery operation by the board delivery apparatus M6, an abnormal item that requires confirmation in a later process is detected in the confirmation necessity determination process executed in the electronic component mounting apparatus such as the printing apparatus M1 or the electronic component mounting apparatus M2B. In some cases, these detection results are transmitted to the board transfer device M6 via the communication network 2. Similarly, when a printing defect or a mounting state defect is detected in the printing inspection or component mounting inspection executed by the printing inspection apparatus M2A or the mounting inspection apparatus M5A, these inspection results are transmitted via the communication network 2. The signal is transmitted to the substrate transfer device M6.

  In these cases, the corresponding substrate 4 is temporarily stopped when the stopper 37 operates in the substrate transfer device M6, and the door member 35 is unlocked. 35 can be opened. Accordingly, the operator can perform necessary treatment by visually observing the substrate 4 while referring to the screen of the confirmation required position or the defective position displayed on the display unit 58 or the display unit 62.

  Next, an example of a screen displayed on the display unit 58 (or the display unit 62) will be described with reference to FIGS. As shown in FIG. 6A, the “necessary confirmation # 1” 58b, “necessary confirmation # 2” 58c, “printing failure” 58d, and “mounting failure” 58e are provided on the confirmation / failure position display screen 58a. By selectively touching these operation buttons, a plurality of position display screens can be switched and displayed on a single display screen. On the confirmation / defective position display screen 58a, the corresponding position information is displayed on the substrate diagram 4 * showing the arrangement of the electrodes 4a1 to 4a4 formed on the substrate 4.

  First, FIG. 6A shows an example in which “confirmation # 1” 58b is selected and the detection result by the first confirmation necessity determination unit 43 of the printing apparatus M1 is displayed. Here, the squeegee head 9 becomes unstable in the squeegeeing operation in which the squeegee 10 is slid on the screen mask 11 for a specific substrate 4. An example is shown in which an abnormal item for which a large variation is predicted in the printing result is displayed as a result of the pressure reduction. In this case, the operator visually observes the board 4 with the board delivery device M6, checks the solder printing state in the range A, and performs necessary measures.

  FIG. 6B shows an example in which “required confirmation # 2” 58c is selected and the detection result by the second confirmation necessity determination unit 52 of the electronic component mounting apparatus M2B to the electronic component mounting apparatus M5B is displayed. Yes. Here, in a component mounting operation in which the electronic component P1 is transferred and mounted on the electrode 4a1 for a specific substrate 4, a different component (indicated by an arrow B) that is different from the normal due to a component recognition error by the component imaging unit 28 is erroneously displayed. An example in which an abnormal item indicating the possibility of mounting is displayed is shown. In this case, the operator visually observes the board 4 with the board delivery device M6, and replaces the part with a regular electronic part P if a different part is erroneously mounted.

  Next, FIG. 7A shows an example in which “printing failure” 58d is selected and the printing state inspection result by the printing inspection apparatus M2A is displayed. Here, in a screen printing operation for a specific substrate 4, an example is shown in which a blur (arrow D) is detected in the solder S printed on the electrode 4a1 and an inspection result indicating that the printing is defective is displayed. Yes. In this case, the operator visually observes the substrate 4 with the substrate transfer device M6, and performs a process of additionally supplying the shortage on the solder S printed on the electrode 4a1 indicated by the arrow D.

  FIG. 7B shows an example in which the “mounting failure” 58e is selected and the mounting state inspection result by the mounting inspection apparatus M5A is displayed. Here, in a component mounting operation in which the electronic component P2 is transferred and mounted on the electrode 4a4 in a component mounting operation for a specific substrate 4, the electronic component P2 exceeds the allowable range due to a position error when mounting the component by the mounting head 25. (Indicated by an arrow E) and an inspection result indicating that the amount of displacement is excessive is displayed. In this case, the operator visually observes the substrate 4 with the substrate transfer device M6, and performs processing such as manually correcting the positional deviation of the electronic component P2 mounted on the electrode 4a4 indicated by the arrow E.

  As described above, in the electronic component mounting system 1 shown in the present embodiment, the printing device M1 that is a solder printing unit and the electronic component mounting devices M2B to M5B that are component mounting units are provided respectively. A first confirmation necessity determination unit 43 and a second confirmation necessity determination unit that determine whether or not confirmation is necessary in a subsequent process by detecting the presence or absence of an abnormal item in the work process or work result of the printing process and the component mounting process. 52 and a board that is provided on the downstream side of the electronic component mounting apparatus M2B to electronic component mounting apparatus M5B and has been determined to be confirmed by each of the first confirmation necessity determination unit 43 and the second confirmation necessity determination unit 52. 4 is configured to include a substrate transfer device M6 as a single substrate verification operation unit that performs a verification operation for any of the four.

  In the electronic component mounting system 1 shown in the present embodiment, the print inspection apparatus M2A as a print inspection unit that inspects the solder printing state on the board on which the solder is printed by the solder printing unit, and the component mounting unit described above. A mounting inspection apparatus M5A as a mounting inspection unit for inspecting a component mounting state on a substrate on which an electronic component is mounted, and a substrate and a mounting inspection unit that are provided downstream of the component mounting unit and are determined to have a printing state failure by the printing inspection unit The board delivery device M6 as a single board repair work unit that performs repair work on any of the boards that are determined to be defective due to the mounting state.

  As a result, the result of monitoring for each of the solder printing work and the component mounting work is confirmed as a result of checking the board having the detected abnormal item, and the inspection result for each of the solder printing work and the component mounting work is determined to be defective. Each of the repaired substrates can be executed by a single substrate transfer device M6. Therefore, compared with the conventional electronic component mounting line that requires a dedicated repair conveyor for each inspection section for solder printing and component mounting, it promotes reduction in equipment costs and improvement in area productivity. In addition, it is possible to reduce the production cost by reducing the number of workers resident on the repair conveyor.

  In the above embodiment, the inspection / mounting apparatus M2 is provided with the print inspection apparatus M2A as the print inspection section and the electronic component mounting apparatus M2B as the component mounting section on both sides of the board conveyance mechanism provided on the common base. Also, the example in which the electronic component mounting system 1 is configured including the inspection / mounting device M5 provided with the mounting inspection device M5A as the mounting inspection unit and the electronic component mounting device M5B as the component mounting unit has been shown. Is not limited to such a configuration. For example, the present invention can be applied to a configuration in which a single device having the functions of the print inspection device M2A, the electronic component mounting devices M2B and M5B, and the mounting inspection device M5A is connected in series on the downstream side of the printing device M1.

  In the above-described embodiment, examples of the inspection / mounting apparatuses M2 and M5 including the imaging head 21 dedicated to the inspection are shown. However, the imaging head 21 and the board imaging unit 27 included in the electronic component mounting apparatuses M2B and M5B You may make it give the same function.

  In the above-described embodiment, an example in which the inspection result is transmitted to the substrate transfer device M6 via the communication network 2 in the substrate transfer operation by the substrate transfer device M6 has been described. The I / O control may be such that the substrate inspection apparatus M6 communicates with the board inspection apparatus M5A) of the present embodiment.

  The electronic component mounting system according to the present invention has an effect of reducing the facility cost, improving the area productivity, and reducing the production cost. The electronic component mounting system manufactures the mounting substrate by mounting the electronic component on the substrate. This is useful in the field of component mounting.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting system 3 Host apparatus 4 Board | substrate 6, 16 Board | substrate conveyance mechanism 9 Squeegee head 10 Squeegee 20A, 20B X-axis movement table 21 Imaging head 22 Imaging camera 25 Mounting head 27 Board imaging part 28 Component imaging part M1 Printing apparatus M2, M5 inspection / mounting equipment M2A printing inspection equipment M5A mounting inspection equipment M3, M4 electronic component mounting equipment P1, P2 electronic components

Claims (4)

Conveying the board along the electronic component mounting line configured by connecting in series the component mounting part for mounting the electronic component on the board printed with the solder on the downstream side of the solder printing part for printing the solder on the board, An electronic component mounting system for manufacturing a mounting board by sequentially executing a solder printing process and a component mounting process,
First provided in the solder printing part and the component mounting part, respectively, for determining whether or not there is an abnormal item in the work process or work result of the solder printing process and the component mounting process, and determining whether or not confirmation is required in the subsequent process A confirmation necessity determination unit and a second confirmation necessity determination unit;
A single unit is provided on the downstream side of the component mounting unit, and performs a confirmation operation on any of the substrates that are determined to be confirmed by the first confirmation necessity determination unit and the second confirmation necessity determination unit. An electronic component mounting system comprising: a single board check working unit.   2. The electronic component mounting system according to claim 1, further comprising a single required check position display unit that displays a check required position on the board at a position adjacent to the main body of the board check work unit. Conveying the board along the electronic component mounting line configured by connecting in series the component mounting part for mounting the electronic component on the board printed with the solder on the downstream side of the solder printing part for printing the solder on the board, An electronic component mounting system for manufacturing a mounting board by sequentially executing a solder printing process and a component mounting process,
A print inspection unit for inspecting a solder printing state on the substrate on which the solder is printed by the solder printing unit;
A mounting inspection unit for inspecting a component mounting state on a substrate on which an electronic component is mounted by the component mounting unit;
A single unit that is provided on the downstream side of the component mounting unit, and that performs repair work on both the substrate determined to be defective in printing state by the print inspection unit and the substrate determined to be defective in mounting state by the mounting inspection unit. An electronic component mounting system comprising a board repair work unit.   The single defective position display part which displays the printing state defect position and mounting state defect position in the said board | substrate in the main body of the said board | substrate repair work part, or the adjacent position is provided. Electronic component mounting system.

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