JP6375512B2 - Component mounting line and board inspection method - Google Patents

Description

  The present invention relates to a component mounting line including a plurality of component mounting apparatuses and a mounting inspection apparatus, and a substrate inspection method using the component mounting line.

  The component mounting line includes a plurality of component mounting apparatuses that mount components on a board, and a mounting inspection apparatus that is disposed on the downstream process side of these component mounting apparatuses and inspects the board. The mounting inspection apparatus images the board on which the component is mounted, and inspects whether there is a location where there is a mounting failure (mounting failure location) such as a component misalignment or a missing part.

  When it is found by the board inspection of the mounting inspection apparatus that there is a mounting failure portion, the worker performs a cause investigation operation to identify at which stage the mounting failure has occurred. In order to investigate the cause of mounting failure, it is certain to check the previous image history of the location where the mounting failure occurred, so each component mounting device images the board after mounting the component and leaves the image history What was made is known (for example, patent document 1).

JP 2009-26973 A

  However, if the image history of the board is left in all the component mounting apparatuses in order to acquire the data necessary to investigate the cause of the mounting defect, each component mounting apparatus will eventually include all the boards including the board that was not defective. There is a problem that it is necessary to take an image of the board, and the productivity of the component mounting line is lowered.

  Therefore, an object of the present invention is to provide a component mounting line and a board inspection method capable of easily acquiring data necessary for pursuing the cause of mounting failure while suppressing a decrease in productivity.

In the component mounting line of the present invention, a plurality of component mounting apparatuses for mounting components on a substrate by a mounting head, and components mounted on the downstream process side of the plurality of component mounting apparatuses are mounted by the plurality of component mounting apparatuses. A component mounting line including a mounting inspection device that images a board and inspects the mounting state of the component, and the display means includes at least one of the mounting inspection devices determined to be defective on the substrate. The position of the mounting failure location is displayed, and when the display means selects one of the at least one mounting failure location, the display of the selected mounting failure location is enlarged, and the mounting inspection apparatus notifies the mounting failure information including location information of the selected mounting failure portion in said each component mounting apparatus, the mounting failure information receiving said each component mounting unit is provided in said mounting head The imaging means images a portion corresponding to the selected mounting failure portion of the substrate after the component mounting, the display means corresponds to the mounting failure portion wherein the selected captured by the respective component mounting apparatus An image of a location and an image of the selected mounting failure location imaged by the mounting inspection apparatus are displayed.

In the substrate inspection method of the present invention, a plurality of component mounting apparatuses for mounting components on a substrate by a mounting head, and components mounted on the downstream process side of the plurality of component mounting apparatuses are mounted by the plurality of component mounting apparatuses. A board inspection method by a component mounting line including a mounting inspection apparatus that images a board and inspects a mounting state of a component , wherein the display means determines that the mounting inspection apparatus is defective on the board. A first display step for displaying the position of at least one mounting failure location, and when the display means selects one of the at least one mounting failure location, an image of the selected mounting failure location is displayed. a second display step to enlarge a notifying step of notifying a mounting failure information including location information of the selected mounting failure portion in said each component mounting apparatus, before receiving the mounting failure information Each component mounting apparatus, the image pickup means provided in said mounting head, an imaging step of imaging a portion that corresponds to the selected mounting failure portion of the substrate after the component mounting, the display means, wherein each component mounting A third display step of displaying an image of a location corresponding to the selected mounting failure location imaged by the apparatus and an image of the selected mounting failure location imaged by the mounting inspection device.

  According to the present invention, it is possible to easily acquire data necessary to investigate the cause of mounting failure while suppressing a decrease in productivity.

The block diagram of the component mounting line in one embodiment of this invention The figure which shows an example of the image displayed on the display part of the mounting inspection apparatus which comprises the component mounting line in one embodiment of this invention The figure which shows an example of the image displayed on the display part of the mounting inspection apparatus which comprises the component mounting line in one embodiment of this invention The figure which shows an example of the image displayed on the display part of the mounting inspection apparatus which comprises the component mounting line in one embodiment of this invention The figure which shows an example of the image displayed on the display part of the mounting inspection apparatus which comprises the component mounting line in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a component mounting line 1 according to an embodiment of the present invention. The component mounting line 1 is arranged in order from the upstream process side (left side in FIG. 1), the printing device 2, the printing inspection device 3, The apparatus includes a plurality of component mounting apparatuses 4 and a mounting inspection apparatus 5, and a host computer 6 connected to these apparatuses through a communication line 6a. The printing apparatus 2, the printing inspection apparatus 3, the plurality of component mounting apparatuses 4 and the mounting inspection apparatus 5 can communicate with each other via the host computer 6 and can share information.

  The printing apparatus 2 includes a conveyor 11, a mask 12, and a squeegee 13. When the conveyor 11 carries in the substrate 7, a substrate moving mechanism (not shown) brings the substrate 7 into contact with the mask 12. When the substrate 7 comes into contact with the mask 12, the squeegee 13 slides on the mask 12. As a result, the paste is scraped on the mask 12, and the paste is printed on the electrode 7 d on the substrate 7. When the paste printing is completed, the conveyor 11 carries the substrate 7 to the downstream process side.

  The print inspection apparatus 3 includes a conveyor 21 and a print inspection camera 22. The print inspection camera 22 has an imaging field of view downward and is moved by a camera moving mechanism 22M. When the conveyor 21 carries the substrate 7 and positions it, the print inspection camera 22 moves, images each part on the substrate 7, and inspects the printing state of the paste on each electrode 7d. When the inspection of the printing state is completed, the conveyor 21 carries the substrate 7 to the downstream process side.

  Each component mounting apparatus 4 includes a conveyor 31, a parts feeder 32, a mounting head 33, and a board camera 34. The mounting head 33 is moved by the head moving mechanism 33M. The substrate camera 34 is provided on the mounting head 33 with the imaging field of view facing downward. When the conveyor 31 carries the substrate 7 and positions it, the mounting head 33 moves and the substrate camera 34 images the substrate 7. Thereby, the position shift from the regular position of the substrate 7 is detected. When the positional deviation of the substrate 7 is calculated, the mounting head 33 picks up the component 8 supplied by the parts feeder 32 and mounts it on the substrate 7 so as to correct the positional deviation of the substrate 7 and the like. When the mounting of the component 8 is finished, the conveyor 31 carries the substrate 7 to the downstream process side.

  The mounting inspection device 5 includes a conveyor 41, a mounting inspection camera 42, and a display unit 43. The mounting inspection camera 42 has its imaging field of view directed downward, and is moved by the camera moving mechanism 42M. When the conveyor 41 carries the substrate 7 and positions it, the mounting inspection camera 42 moves, images each part on the substrate 7 and inspects the mounting state of each component 8. And the part on the board | substrate 7 determined to be mounting defect is memorize | stored as a mounting defect location. When the inspection of the substrate 7 is completed, the conveyor 41 carries the substrate 7 to the downstream process side.

  The mounting inspection apparatus 5 displays the position of the mounting failure location on the display unit 43 in a map format, a coordinate format, or the like for the mounting failure location determined as a mounting failure. FIG. 2 shows a map format (left side) and a coordinate format (location on the substrate 7) where the mounting failure portion (the portion surrounded by the frame W. Here, three locations) determined as mounting failure by the mounting inspection apparatus 5 is located. It is an example represented by both of the right side).

  The operator confirms the position of the mounting failure location on the image displayed on the display unit 43, and selects the mounting failure location to seek the cause of the mounting failure by a predetermined operation. When a mounting failure location is selected, the mounting inspection apparatus 5 displays an enlarged image GZ of the selected mounting failure location on the display unit 43 (FIG. 3). Then, the mounting defect information including the position information of the mounting defect portion B is notified to the print inspection apparatus 3 and each component mounting apparatus 4 through the host computer 6 (notification process). The image GZ in FIG. 3 shows that the upper part 8a of the center part 8 (upper part 8a) and the lower part 8 (lower part 8b), which are to be inspected by the mounting inspection apparatus 5, are connected to the electrode 7d. The state which has produced the position shift is shown. In addition to the coordinates of the part 8 (upper part 8a) to be inspected, various information related to the mounting of the part 8 is displayed on the right side of the image GZ.

  Each component mounting apparatus 4 notified of the mounting failure information in the notification step uses the board camera 34 to mount the substrate 7 after mounting the component (the substrate 7 that has finished mounting the component 8 after the mounting failure information is notified). The part corresponding to the part B is imaged (imaging process). In this imaging process, the print inspection apparatus 3 that has received the mounting defect information mounts the printed board 7 (the board 7 that has finished printing the paste after being notified of the mounting defect information) by the print inspection camera 22. The part corresponding to the defective part B is imaged. Here, each of the board camera 34 and the print inspection camera 22 acquires a captured image of an area that is approximately the same as the area captured by the mounting inspection camera 42.

  When the imaging process is completed, the mounting inspection apparatus 5 mounts images taken by the board camera 34 of each component mounting apparatus 4 and the image of the part corresponding to the defective mounting part B imaged by the print inspection camera 22 of the print inspection apparatus 3. The image corresponding to the defective portion B is displayed on the display unit 43 together with the image of the defective mounting portion B captured by the mounting inspection camera 42 (display process). The display method of the image by the display unit 43 may be to display a plurality of images obtained in the imaging process side by side, or to switch and display the images one by one according to the operation of the operator. Also good.

  4 and 5 show a print inspection when there are three component mounting apparatuses 4 (referred to as a first component mounting apparatus, a second component mounting apparatus, and a third component mounting apparatus from the upstream process side). An image GZ by the camera 22 (printing device image GZP), an image GZ by the first component mounting device 4 (first mounting device image GZ1), an image GZ by the second component mounting device 4 (second mounting device image GZ2), and An example in which an image GZ (third mounting apparatus image GZ3) by the third component mounting apparatus 4 is displayed on the display unit 43 along with an image GZ (mounting inspection apparatus image GZR) by the mounting inspection apparatus 5 is shown.

  4 and 5, of the two upper and lower parts 8 (upper part 8a and lower part 8b) in each image, the upper part 8a is mounted with being shifted with respect to the electrode 7d. It has become. In FIG. 4, as can be seen from the printing device image GZP and the first mounting device image GZ1, the upper part 8a is displaced when mounted alone. For this reason, in this case, it is considered that the first component mounting apparatus 4 has some problem.

  On the other hand, in FIG. 5, as can be seen from the printing device image GZP, the first mounting device image GZ1, and the second mounting device image GZ2, the upper part 8a is normal when mounted alone, and then the lower part 8b is mounted. The position is misaligned. Therefore, in this case, when the second component mounting apparatus 4 mounts the lower part 8b, it is estimated that the lower part 8b interferes with the upper part 8a, and there is some problem in the second component mounting apparatus 4. It is believed that there is. Further, the printing device image GZP, the first mounting device image GZ1, the second mounting device image GZ2, and the third mounting device image GZ3 are captured after the mounting inspection device image GZR, but the upper component 8a. Since the position shift has occurred, it can be said that the position shift of the upper part 8a does not occur accidentally.

  As described above, in the component mounting line 1 and the substrate inspection method thereof according to the present embodiment, each component mounting apparatus 4 has the component 7 mounted on the substrate 7 after the component mounting with respect to the mounting failure portion B determined by the mounting inspection apparatus 5 as a mounting failure. The part corresponding to the mounting defect part B is imaged, and the obtained image is displayed together with the image obtained by the mounting inspection apparatus 5. As a result, it is possible to investigate the cause of the mounting failure that cannot be understood only from the image obtained by the mounting inspection apparatus 5. Each component mounting apparatus 4 results in a board 7 that has not been mounted defective as a result, as compared with the case where each component mounting apparatus 4 mounts a component 8 and images all the boards 7 and leaves an image history. There is no imaging. For this reason, according to the component mounting line 1 (board inspection method) in the present embodiment, it is possible to easily obtain data necessary for investigating the cause of mounting failure while suppressing a decrease in productivity.

  In the above-described embodiment, the display unit 43 is provided in the mounting inspection apparatus 5. However, the display unit 43 is not necessarily provided in the mounting inspection apparatus 5. It may be provided in at least one of the component mounting apparatus 4 and the host computer 6. Further, in the above-described embodiment, the component mounting apparatus 4 is configured to image a portion corresponding to the place determined as the mounting failure place B in the mounting inspection apparatus 5, but in addition to this, the operator An image of an arbitrary place on the designated substrate 7 may be captured.

  Provided are a component mounting line and a board inspection method capable of easily acquiring data necessary for investigating the cause of mounting failure while suppressing a decrease in productivity.

DESCRIPTION OF SYMBOLS 1 Component mounting line 2 Printing apparatus 3 Print inspection apparatus 4 Component mounting apparatus 5 Mounting inspection apparatus 7 Board | substrate 8 Components 33 Mounting head 34 Board | substrate camera (imaging means)
43 Display section (display means)
B Bad mounting location

Claims (3)

Mounting a component by imaging a plurality of component mounting apparatuses that mount components on a substrate by a mounting head, and a board on which the components are mounted by the plurality of component mounting apparatuses arranged on the downstream process side of the plurality of component mounting apparatuses A component mounting line including a mounting inspection device for inspecting a state,
The display means displays the position of at least one mounting failure location that the mounting inspection apparatus determines to be mounting failure on the substrate,
The display means, when one of the at least one mounting failure location is selected, displays an enlarged image of the selected mounting failure location,
The mounting inspection device notifies each component mounting device of mounting failure information including position information of the selected mounting failure portion,
Each of the component mounting apparatuses that has received the mounting defect information images a location corresponding to the selected mounting failure location on the board after component mounting by an imaging unit provided in the mounting head,
Wherein the display means displays an image of the defective mounting portion which is the selected captured by the image and the mounting inspection device portion corresponding to the mounting failure portion wherein the selected captured by the respective component mounting apparatus Component mounting line characterized by that. The mounting failure information includes a printing device that prints a paste on the substrate and a print inspection device that images the printed substrate and inspects the printed state of the substrate on the upstream process side of the plurality of component mounting devices. The printing inspection apparatus that has received the image captures a location corresponding to the selected mounting failure location on the printed circuit board, and the display means images corresponding to the mounting failure location captured by the print inspection device. The component mounting line according to claim 1, wherein the component mounting line is also displayed. Mounting a component by imaging a plurality of component mounting apparatuses that mount components on a substrate by a mounting head, and a board on which the components are mounted by the plurality of component mounting apparatuses arranged on the downstream process side of the plurality of component mounting apparatuses A board inspection method using a component mounting line including a mounting inspection device for inspecting a state,
A first display step of displaying a position of at least one mounting failure location determined by the mounting inspection apparatus as a mounting failure on the substrate;
A second display step for enlarging and displaying an image of the selected mounting failure location when the display means selects one of the at least one mounting failure location;
A notification step of notifying each component mounting apparatus of mounting failure information including position information of the selected mounting failure portion;
Each component mounting apparatus that has received the mounting defect information captures an image of a location corresponding to the selected mounting failure location on the substrate after component mounting by an imaging means provided in the mounting head; and
The third of said display means, said display an image of each component mounting apparatus wherein the selected mounting failure portion captured by the image and the mounting inspection device portion corresponding to the selected mounting failure portion captured by And a display step.

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