JP2007109937A - Mounting state inspection method and apparatus thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To inspect a plurality of mounting states with high precision without complicating and enlarging the apparatus in a mounting system for mounting a component on a substrate. <P>SOLUTION: In this mounting state inspection method, an individual camera 13 is arranged to be able to shoot a plurality of inspection areas 1a on a transferred circuit board 1, and the transferred circuit board 1 is successively and temporarily stopped by an individual stopper 21 at each shooting position 31 according to the individual camera 13. Every time when the circuit board 1 is temporarily stopped at each shooting position 31, the camera 13 at the shooting position 31 shoots a corresponding inspection area 1a on the circuit board 1 temporarily stopped there, and the mounting state is inspected from the relation between the mounting position information X1, Y1 and the shooting position information X1, Y1 for each camera 13 on the circuit board 1, wherein the stopper position is used as the origin point O. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting state inspection method and apparatus for inspecting a mounting state in a system for mounting a component on a substrate, and, for example, an electronic component for manufacturing an electronic circuit substrate by mounting the electronic component on a circuit substrate It is used for inspecting various mounting work states related to mounting of electronic components including the mounting state.

  A system for manufacturing an electronic circuit board will be described with reference to FIG. 1 (a) showing an embodiment of the present invention. The circuit board 1 is handled as a mounting target board, and the electronic circuit board 8 to be manufactured is processed. Printed wiring corresponding to the type is provided, and a barcode 2 indicating the type is attached to the circuit board 1 so that predetermined electronic components are mounted and handled in the mounting process. The circuit board 1 is first supplied to the solder printer 3 that forms the solder printing process unit 3a, and cream solder is printed on the electrodes. Then, the circuit board 1 is sequentially supplied to one or more chip component mounting process units 4a, 4b,... In which one or more chip mounters 4 are arranged, and predetermined chip components are sequentially mounted to the cream solder. A temporary mounting state due to the adhesiveness of the film is assumed. Thereafter, the circuit board 1 is supplied to the multi-function device 6 constituting the irregular component mounting process unit 6a through the barcode 2 reading section by the barcode reader 5, and the irregular components such as connectors according to the type of the circuit board 1 are mounted. Then, a temporary mounting state due to the adhesiveness of the cream solder is set. Finally, the circuit board 1 is supplied to the reflow furnace 7 forming the joining completion process part 7a, and the soldering of the chip parts and the deformed parts that are temporarily mounted on the circuit board 1 by melting the cream solder and solidifying it thereafter. As a result of the solidification, the mounting of the electrodes on the circuit board 1 and the conductive state is completed, and the manufacture of the predetermined electronic circuit board 8 is completed.

  By the way, in order to manufacture such an electronic circuit board 8, the miniaturization of mounting parts and the increase in density of mounting are progressing due to downsizing and high performance of electronic equipment. Misalignment, attached foreign matter, etc. are likely to lead to poor quality and increase the probability of mounting troubles, leading to a decrease in yield. Various mounting operations performed in the mounting system mounting process are successful. It is hoped that there will be a lot of testing to see if it has been achieved.

  However, such inspection is generally performed by using an independent inspection machine as shown in FIG. Such an inspection machine positions the circuit board a to be carried in with reference to the origin o on the inspection machine, and the position of the positioned circuit board a is adjusted in the XY2 direction with respect to the origin o on the inspection machine. Images are taken by the camera b, and various mounting states with respect to the circuit board a are inspected in a plurality of inspection areas c and d (for example, see Patent Document 1).

On the other hand, for inspecting a plurality of end faces of a polyhedral workpiece, each of the polyhedral workpieces to be inspected is held while the inspection target end face is exposed in two directions or the like in a circumferential conveying means such as a belt or a disk and is conveyed in a circular manner. A technique is known in which an end face can be photographed and inspected by a corresponding individual camera from the exposed side, and can be applied to all end faces as needed with delivery between a plurality of circular conveying means (for example, patents) Reference 2).
JP-A-8-313228 JP 2001-39536 A

  However, an independent inspection machine such as that described in Patent Document 1 uses a plurality of inspection machines that employ a camera with a small field of view, while automatically moving a camera with a small field of view, The inspection equipment can be simplified by switching and photographing a plurality of inspection areas c and d on the object, or by photographing and inspecting while scanning a wide range of areas exceeding the camera field of view. Even with a single inspection machine, it is necessary to have an inspection stage corresponding to the maximum range that can be inspected, and to detect the position and status of various operations based on one origin on the inspection machine Therefore, it is necessary to move the camera automatically and accurately, so that it must be complicated, large and expensive, and the electronic circuit board 8 is manufactured by mounting electronic components as shown in FIG. From the relationship pinching inspection to a position that requires inspection in instrumentation system 11, the design of the mounting system 11, affects the construction. Therefore, it is particularly inconvenient when it is desired to perform inspection at a plurality of locations in the mounting system 11, and the equipment of the mounting system 11 is further complicated and scaled up. Will arise.

  On the other hand, the one described in Patent Document 2 is a polyhedron that is transported while being exposed in various directions by a plurality of cameras arranged and fixed along a transport path by a circular transport unit such as a belt or a disk. However, it is not possible to perform inspection in which the captured image data photographed by each camera is associated with each other.

  An object of the present invention is a system for mounting components on a board, in which a board to be transported is temporarily stopped at different positions, and a plurality of image data photographed from the same side by individual cameras there are associated with each other easily and easily. An object of the present invention is to provide an inspection method and apparatus in a mounting process capable of inspecting a mounting state with high accuracy.

  In order to achieve the above object, according to the present invention, there is provided a mounting state inspection method according to the present invention, in a system for mounting components on a substrate, an individual camera for photographing the substrate to be conveyed from above, and the individual camera According to the present invention, an individual stopper is provided in the substrate transport section, the substrate is temporarily stopped by the stopper, and the mounting state is inspected by photographing with the individual camera.

  In such a configuration, a plurality of areas are individually photographed from above by the cooperation of individual cameras and individual stoppers corresponding to a substrate conveyed with mounting of components, and each captured image is captured. By comparing the stop position by the stopper of the substrate with the mounting position information in association with the reference, the mounting state can be easily and accurately inspected.

  In such a method, one or more mounting operation process units that receive a substrate and mount components and a substrate after the operation in the operation process unit are sent out and supplied to the next operation process unit or carried out. An individual camera for photographing the substrate conveyed to the conveyance unit from above, and an individual stopper corresponding to the individual camera, and the substrate is temporarily stopped by the stopper. This can be achieved automatically and stably by a mounting state inspection apparatus characterized by providing a control means for inspecting the mounting state by photographing with the individual camera.

In particular, the individual cameras are arranged so that the plurality of inspection areas on the substrate to be transported can be photographed, and the substrate to be transported is individually separated by an individual stopper corresponding to the individual camera. Each time the camera is temporarily stopped at each shooting position and the board is paused at each shooting position, the corresponding inspection area on the board that is temporarily stopped by the camera at the shooting position is shot and stopped. Mounting position information image data by specifying the work position in the captured image of each inspection area from the relationship between mounting position information on the board, such as CAD data set in advance with the position as the origin, and the shooting position information of each camera In a further configuration to check the mounting state compared to
Image data taken by individual cameras for a plurality of inspection areas on the board while mounting the parts with one or more mounting work steps for mounting the parts on the board and transport after the board mounting work. Based on this, in order to inspect the predetermined mounting state including the mounting state of parts in each inspection area, multiple cameras are arranged so that multiple inspection areas on the board to be transported can be photographed individually and corresponding to them With the individual stoppers, the substrate to be transported is paused sequentially to each imaging position by the individual camera, and each time the substrate is paused at each imaging position, the corresponding inspection area is imaged by the camera there. Even if multiple inspection areas photographed by the camera and their captured images are at different positions on the board, the shooting conditions for each camera board, that is, the shooting distance and the shooting magnification The working position on the captured image in each inspection area is specified from the image data of the mounting position information with each stopper position as the origin and the shooting position data by each camera, provided that Handle the image with the stopper position on the image data of the mounting position information in common with the origin, and from the relationship with the mounting position information, identify the work position in the captured image of each inspection area and compare it with the image data of the mounting position information, The mounting state can be inspected.

  In such a method, one or more mounting work process units that receive a board and perform a work for mounting, and a board after work in the mounting work process part are sent out and supplied to the next mounting work process part. Alternatively, the position of the camera for photographing the inspection area where the predetermined mounting operation of the substrate being carried by the carrying unit is completed can be adjusted in the carrying direction of the carrying unit. A camera support unit that can support a plurality of cameras and one or more cameras that are individually supported by the camera support unit, and a stopper that temporarily protrudes into the substrate transfer path corresponding to the camera and temporarily stops the substrate in the transfer direction. A stopper supporting portion that can be supported in plural so that the position can be adjusted, and one or a plurality of the stoppers individually supported on the stopper supporting portion, and a base that is temporarily protruded from these stoppers and conveyed there Is temporarily stopped and the inspection area after the assigned work on the board is photographed at two or more places by the corresponding camera, and each inspection area on the board photographed at these two or more places is related. From the relationship between the mounting position information set in advance with the stopper position as the origin and the shooting position information of each camera, the work position in the captured image of each inspection area is identified and compared with the image data of the mounting position information, and the mounting state is inspected This can be achieved automatically and stably by an apparatus characterized in that a control means is provided.

In a further configuration, the cameras for photographing a plurality of inspection areas are sequentially set from the upstream side so as to avoid mutual interference on the same transport path of the mounting work position.
Shooting of multiple inspection areas with multiple cameras is realized, satisfying the relationship that they do not interfere with each other even on the same transport route after work, and to the multiple areas performed before this transport route You can share the inspection of work.

  For this purpose, the camera and the stopper are realized by providing a plurality of sets of cameras and stoppers on the same transport unit from one work process unit.

In a further configuration, the stopper is set to a stop position for stopping the substrate while monitoring a through image capturing the substrate moving in the transport direction with the corresponding arranged camera.
The stopper position that stops the board to the shooting position can be set easily and reliably while viewing the change in the positional relationship with the inspection area on the monitor using the through image taken by the camera while moving the board in the transport direction. The stopper position at that time and the position of the image taken by the substrate and the camera can be known.

In a further configuration in which the mounting position information image data and the corresponding captured image data are superimposed and compared, and the mounting state is inspected,
By superimposing the photographed image data on the image data of the mounting position information, a deviation or difference of the photographed image data with respect to the image data of the mounting position information can be easily visually recognized on the monitor and the data can be determined.

  For this purpose, the apparatus includes a monitor that displays the image data of the mounting position information and the corresponding captured image data on the same screen, and the control means has the captured image data corresponding to the image data of the mounting position information displayed on the monitor. Can be superposed to compare the data and inspect the mounting state.

The superimposition of the image data of the mounting position information and the captured image data is performed by displaying the image data of the mounting position information and the corresponding captured image data on the same screen, and the two captured image movement start points that are feature points on the captured image. The position of the captured image is determined by the position designation by the cursor and the position designation by the cursor of the two captured image movement end points which are the corresponding feature points on the image data of the mounting position information about these two captured image movement start points. In the further configuration in which the two captured image movement start points specified in 1 are moved to the two captured image movement end points specified on the mounting position information image,
Using the relationship between the feature data corresponding to a specific work position and mounting state in the image data of the work position information and the photographed image data, the cursor is set with the two feature points on the photographed image data as the image movement start point. Designation, cursor designation of two feature points on the image data of the work position information corresponding thereto as the image movement end point, and picked-up image movement end point on the image data of the work position information corresponding to the two movement start points on the photographed image In addition to the positional deviation in the XY2 direction with respect to the image data of the mounting position information, it is easy to eliminate these deviations at once, including the case where there is a deviation in the rotation angle θ. Is superimposed.

  For this purpose, the display screen displays two characteristic captured image movement start points on the captured image data displayed on the monitor and two corresponding characteristic captured image movement end points on the image data of the mounting position information. The operation means for moving the image designated by the cursor above is provided, and the control means sets the two photographed image movement start points on the designated photographed image as the photographed image movement end point on the image data of the mounting position information. It is sufficient if the configuration is such that it moves on the display screen so as to reach it.

In addition to moving the captured image from the captured image movement start point specified by the cursor to the captured image movement end point, the captured image is moved in units of display pixels in the specified direction for each key operation that specifies the direction. ,
The superimposition of the mounting position information image data and the captured image data is due to the operator's cursor operation on the display screen, and a slight misalignment is likely to remain or occur. Each time the specified key is operated, the captured image is moved in the specified direction in units of display pixels, and is finely adjusted and superimposed in an accurate positional relationship, so that comparison inspection of the captured image data with respect to the mounting position information can be performed easily and accurately. Can be.

  For this purpose, the apparatus includes fine adjustment direction designating operation means for designating the fine adjustment direction of the captured image data displayed on the monitor, and the control means is designated for each designation operation by the fine adjustment direction designating operation means. It is sufficient that the captured image data is moved minutely in units of display pixels in the selected direction.

In a further configuration, the inspection is also performed for foreign substances not included in the image data of the mounting position information.
Foreign matter that tends to be related to quality and yield, for example, if there is a foreign object in a place where cream solder that mounts circuit board components is densely packed, it will cause poor bonding of the mounted components. It can be detected as an object not in the image data of the mounting position information.

  According to the mounting state inspection method and apparatus of the present invention, the substrate to be transported is individually photographed in cooperation with each camera and each stopper corresponding thereto, and each captured image is referred to the stop position of the substrate. It is suitable for the manufacture of electronic circuit boards that are multifunctional and highly accurate, and can perform various inspections on the entire surface of the board without particularly complicating, increasing the size, and increasing the cost. is there.

  Hereinafter, a mounting state inspection method and an apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5 for understanding of the present invention.

  In the present embodiment, as already described with reference to FIG. 1A, the circuit board 1 is used as a board to mount the components illustrated in FIGS. 2 and 3, specifically, the electronic component 12. The electronic circuit board 8 is manufactured by the equipment line 11 in which the cream solder printing process unit 3a, one or more chip component mounting process units 4a and 4b, the deformed component mounting process unit 6a, and the joining completion process unit 7a are arranged. This is an example of the case. The circuit board 1 is supplied to the reflow furnace 7 to melt and thereafter solidify the cream solder, so that it is mounted on the circuit board 1 and is in a temporarily mounted state due to the adhesiveness of the cream solder. The solder is solidified to achieve a mounting completed state in which the solder is solidified with the electrodes on the circuit board 1 to complete the manufacture of the predetermined electronic circuit board 8.

  The mounting state inspection method according to the present embodiment in such a mounting process is performed while mounting the electronic component 12 with the work for mounting the electronic component 12 on the circuit board 1 and the conveyance after the work. ... A plurality of completed inspection areas 1 a, 1 b... Above are photographed by individual cameras 13, 14,... 17, and mounted states including the mounting state of the electronic component 12 in each inspection area 1 a, 1 b .. 17 are arranged as shown in FIG. 1A so that a plurality of inspection areas 1a, 1b,... On the circuit board 1 to be conveyed can be photographed. deep. Then, the circuit board 1 to be conveyed is shown in FIG. 2 or FIG. 2 by the individual cameras 13, 14... 17 by the individual stoppers 21, 22. 3 each time, the circuit board 1 is temporarily stopped at the respective shooting positions 31, 32,... In the solid and virtual lines in FIG. ... The corresponding inspection areas 1 a, 1 b... On the circuit board 1 temporarily stopped by the cameras 13, 14... At the imaging positions 31, 32. ... Are taken in advance as the origin O (XO, YO), for example, mounting position information X11, Y11, X21, Y21... On the circuit board 1, which is CAD data, and the cameras 13, 14,. Location information X1 .. Are identified from the relationship between Y1, X2, Y2,..., And the mounting positions information X11, as shown in FIGS. Compared with the image data 71 of Y11, X21, Y21..., The mounting state is inspected.

  As described above, in the present embodiment, the electronic component 12 is mounted on the circuit board 1 while mounting the electronic component 12 with one or more operations for mounting the electronic component 12 on the circuit substrate 1 and transporting the circuit substrate 1 after the operation. When inspecting a predetermined mounting state including the mounting state of the electronic component 12 in each inspection area 1a, 1b based on the image data of the captured image 15 taken by the individual cameras 13, 14,. The individual cameras 13, 14,... Are arranged so that the plurality of inspection areas 1a, 1b,... On the circuit board 1 to be conveyed can be individually photographed, and the individual stoppers 21, 22,. The circuit board 1 to be conveyed is paused in order to the respective photographing positions X1, Y1, X2, Y2,... By the individual cameras 13, 14,. Temporarily board 1 Since the corresponding inspection areas 1a, 1b,... Are photographed by the cameras 13, 14,... Each time they are stopped, a plurality of inspection areas 1a, 1b,. Even if the images 15 and 15 are at different positions on the circuit board 1, the imaging conditions of the cameras 13, 14... With respect to the circuit board 1, that is, the field of view size according to the imaging distance and the imaging magnification are common. As a condition, image data of mounting position information X11, Y11, X21, Y21 with each stopper position as an origin O (XO, YO) and photographing position data X1, Y1, X2, Y2,. From the above, work positions on the captured images 15, 15... In the respective inspection areas 1a, 1b are specified, and the respective captured images 15, 15 ... are mounted position information X11, Y11, X2. , Y21, the stopper position on the image data 71 is commonly handled as the origin, and the working positions in the captured images 15, 15 in the inspection areas 1a, 1b are determined from the relationship with the mounting position information X11, Y11, X21, Y21,. Specifically, the mounting state can be inspected by comparing with the mounting position information X11, Y11, X21, Y21.

  As a result, the equipment line 11 can be obtained by simply arranging a set of cameras and stoppers individually at the necessary inspection positions on the transport path 51a without installing the necessary number of independent inspection devices in the equipment line 11 in the mounting process. It is suitable for the manufacture of an electronic circuit board that can perform various inspections while ensuring integrated position conditions without increasing the complexity, size, and cost.

  Summarizing the above, the mounting state inspection method of the present embodiment is such that in the mounting system 11 for mounting the electronic component 12 on the circuit board 1, the individual cameras 13, 14. Are provided on the conveying means 51 of the circuit board 1, and the circuit board 1 is temporarily stopped by the stoppers 21, 22,. It can be said that the photographing is performed with the individual cameras 13, 14..., Whereby the individual cameras 12, 13 are arranged on the circuit board 1 transported with the mounting of the electronic component 12. .., And the corresponding stoppers 21, 22... Corresponding to each of them, a plurality of inspection areas 1 a, 1 b. 22. Mounting position information in association with the reference stop position by X1, Y1, X2, Y2, is compared with ..., it is possible to inspect the mounting state easily and accurately. And such a method sends out the circuit board 1 which receives the circuit board 1 and mounts the electronic component, and the circuit board 1 after the mounting work in the mounting work process part, and sends out the next mounting work. An individual camera 13, 14... For photographing the circuit board 1 transported to the transport unit 51 from above, and an individual camera 13, 14. . Individual stoppers 21, 22... According to the condition, the circuit board 1 is temporarily stopped by the stoppers 21, 22. This can be achieved automatically and stably by a mounting state inspection device characterized in that a control device 47 for inspecting is provided.

  More specifically, the mounting state inspection apparatus according to the present embodiment includes at least one work process unit that receives the circuit board 1 and performs work for mounting as shown in FIG. Sends the circuit board 1 after the work in each process unit to the cream solder printing process unit 3a, chip component mounting process units 4a and 4b, irregular component mounting process unit 6a, and joining completion process unit 7a. Conveying means 51 for supplying or unloading to the process section is provided, and control is started according to the operation of the start key 46 of the operation panel 43 by the control device 47 as shown in FIG. 8 can be automatically and continuously manufactured, and in particular, a camera 13 for photographing inspection areas 1a, 1b,... 14 .... convey means Corresponding to a camera support section 52 capable of supporting a plurality of positions so that the position can be individually adjusted in the transport direction of 1, and one or more cameras 13, 14. A stopper support 53 that can support a plurality of stoppers 21, 22..., Which are positioned at the same time and temporarily protrude into the conveyance path 51 a of the circuit board 1 to temporarily stop the circuit board 1, so that the positions can be individually adjusted in the conveyance direction Are provided with one or a plurality of stoppers 21, 22... Individually supported thereon, and the control device 47 temporarily protrudes the stoppers 21, 22 and temporarily transports the circuit board 1 conveyed thereto. , And the assigned inspection areas 1a, 1b on the circuit board 1 are photographed at two or more locations by the cameras 13, 14,. The mounting position information X11, Y11, X21, Y21 and the cameras 13, 14 with the stopper position for each inspection area 1a, 1b,... On the circuit board 1 taken at two or more locations as the origin O (XO, YO). .., And the mounting position information X11, Y11, X21, Y21... By specifying the work positions in the captured images 15 and 15 of the respective inspection areas 1a and 1b from the relationship with the shooting position information X1, Y1, X2 and Y2. Compared and inspecting the mounting state, it can be automatically and stably achieved simply by providing the required number of pairs of cameras 13, 14... And stoppers 21, 22. it can.

  In this case, the control device 47 handles the captured image data from the cameras 13, 14,... Through the video controller 41 as shown in FIG. 1 (b), and the mounting position information X11, Y11, X21, Y21,. In addition, it is preferable to inspect and process the data while displaying the image together, and the inspection results are organized into a graph or table as shown in FIG. Make it useful for countermeasures.

  The conveying means 51 may be provided individually for each processing step or may be provided in series. Generally, a pair of left and right L-shaped guide rails 51b as shown in FIGS. The circuit board 1 that is received by the transport belt 51c traveling on the guide rail 51b is transported. The camera support means 52 and the stopper support means 53 adjust the position of the cameras 13, 14... That they support in the transport direction XX, and adjust the position of the stoppers 21, 22. Are provided individually so that they can be performed without mutual interference. Specifically, the camera support means 52 and the stopper support means 53 employ guide rails 52a and 53a made of a channel material having a C-shaped cross section, and are attached to the guide rail 51b, so that the cameras 13, 14,.・ Supports individual movement. Specifically, the guide rails 52a and 53a are made of aluminum, and the guide rail 52a is provided upward on the left and right guide rails 51b, and is fitted to the slider 54 fitted so as to be movable in the groove. Both leg portions 55a of 55 are fixed with screws (not shown) and fixed to a predetermined moving position by fastening the screws so that they can be firmly supported. However, the support frame 55 may be one-sided support other than the portal shape. The guide rail 53a is attached inward, for example, below one of the left and right guide rails 51b, and is screwed to a slider 56 fitted so as to be able to move into the groove with a screw (not shown), and the predetermined movement is achieved by fastening the screw. The position can be fixed. Further, the stoppers 21, 22... Are reflective sensors 21 a, 22 a that detect the circuit board 1 conveyed in the vicinity of the upstream side thereof and send a signal for causing the stoppers 21, 22. .. is attached with maintaining a certain positional relationship, and the circuit board 1 being conveyed is surely stopped at the positions of the stoppers 21 and 22, and the circuit board 1 is stopped by the stoppers 21 and 22. The origin O (XO, YO) as the stopper position to be stopped may take a position such as a right angle to the transport direction of the stop position in the transport direction of the circuit board 1, but as described above, the origin of the circuit board 1 to be stopped If it is set at a corner portion or the like, it is preferable to simplify the positional relationship with the photographing positions X1, Y1, X2, Y2, and the like. Further, the cameras 13, 14,... Can be moved and adjusted with respect to the support frame 55 in a direction perpendicular to the conveying direction, and the heads 13b, 14b,. 14.. Makes it easy to set a shooting position that does not interfere with each other. In addition, the cameras 13, 14... Are provided with a micro position adjuster 57 that finely adjusts the head 13 b, 14 b... In the X direction and a micro position adjuster 58 that finely adjusts the position in the Y direction. 14... Is finally set with high accuracy.

  With such support, even when the camera 13, 14,... Is positioned on each of the photographing positions X1, Y1, X2, Y2 with respect to the plurality of inspection areas 1a, 1b on one transport path 51a after the work process. This is realized by satisfying the relationship of not interfering with each other, and the inspections for the work to the plurality of inspection areas 1a, 1b,... This is realized by providing a plurality of sets of cameras 12, 13,... And stoppers 21, 22,... On one transport path 51a. As a positioning procedure, the transport direction in the transport path 51a of the cameras 13, 14,. 2, the position of the corresponding stopper 21 is set as shown in FIG. 2 for the most upstream camera 13 seen in FIG. 2, and then the next camera 13 is positioned as shown by the phantom line in FIG. The corresponding stopper 22 may be positioned and sequentially moved to the downstream camera 14 and the stopper 23. In order to position the cameras 13, 14,... At predetermined positions, the through image captured by the cameras 13, 14 is displayed on the monitor 42 while moving the circuit board 1 in the transport direction, etc. The stopper position for stopping the circuit board 1 to the predetermined photographing positions X1, Y1, X2, and Y2 can be easily and reliably set while visually recognizing the change in the positional relationship with 1b. The relationship between the stopper positions XO, YO, the mounting position information X11, Y11, X21, Y21... And the positions X1, Y1, X2, Y2 of the images 15 and 15 taken by the cameras 13 and 14 of the circuit board 1 is known. As a result, the inspection can be performed.

  Further, in order to superimpose and compare the image data of the mounting position information X11, Y11, X21, Y21,... Shown in FIG. It is preferable to superimpose as shown in FIG. By making such a superposition state, it is possible to easily visually recognize and automatically determine the shift amount and difference of the captured images 15 and 15 with respect to the image data of the mounting position information X11, Y11, X21, Y21. can do. Of course, such a comparison is preferably performed on the screen of the monitor 42, but the present invention is not limited to this, and it can be performed by comparing time-series image data without displaying them.

  For such inspection, the control device 47 superimposes the image data of the mounting position information X11, Y11, X21, Y21... Displayed on the monitor 42 and the corresponding captured images 15 and 15. As the method, the image data of the mounting position information X11, Y11, X21, Y21... And the corresponding image data of the captured images 15 and 15 are displayed on the same screen as shown in FIG. On the image 71 of the mounting position information X11, Y11, X21, Y21,... For the two captured image movement start points A1 and B1, which are feature points on the image 15, with the cursor C, and the two movement start points A1 and B1. By specifying the positions of the two captured image movement end points A2 and B2 that are corresponding feature points of the cursor C, the captured image 15 is moved to the start of the two captured image movements designated thereon. A1 and B1 are moved to the two captured image movement end points A2 and B2 designated on the image data 71 of the mounting / mounting position information X11, Y11, X21, Y21,... As shown in FIG. Become. This is because the mounting position information X11, Y11, X21, Y21... And the data of the captured image 15 coexist with the feature points A1, A2, B1, B2 corresponding to a specific work position and mounting state in an invariable positional relationship. The two feature points A1 and B1 on the data of the photographed image 15 are designated as the image movement start point, and the corresponding mounting position information X11, Y11, X21, Y21,. Two feature points A2 and B2 on 71 are designated as image movement end points, and the two movement start points A1 and B1 on the photographed image 15 correspond to the mounting position information X11, Y11, X21, Y21,. Are moved to the movement end points A2 and B2, so that the data of the photographed image 15 is positioned in the XY2 direction with respect to the image 71 of the mounting position information X11, Y11, X21, Y21. In addition to the shift, when the rotation angle θ as there is a deviation, including, is superimposed on the simple to eliminate their deviations to stroke.

  For such an operation, the two imaged image movement start points A1 and B1 on the data of the imaged image 15 displayed on the monitor 42 and the image 71 of the mounting position information X11, Y11, X21, Y21. A control device using a mouse 45 shown in FIG. 1 (b) as an operation means for moving an image, which designates two photographed image movement end points A2 and B2 corresponding to the above with the cursor C on the monitor 42. 47, so that the two captured image movement start points A1 and B1 on the designated captured image 15 reach the captured image movement end points A2 and B2 on the image 71 of the mounting position information X11, Y11, X21, Y21. The display position of the captured image 15 is moved on the display screen of the monitor 42. Further, the control device 47 moves the captured image 15 from the captured image movement start points A1 and B1 whose positions are specified by the cursor C to the captured image movement end points A2 and B2, and at each operation for which the direction is designated by the direction designation key 44. The captured image is moved in units of display pixels in the designated direction. As a result, the initial superimposition of the image 71 of the mounting position information X11, Y11, X21, Y21... And the captured image 15 is due to the cursor operation of the operator on the display screen of the monitor 42, and a slight positional deviation remains. Even if this happens, every time you operate the direction specification key, you can make fine adjustments by moving the captured image in the specified direction in the specified direction and superimpose them in an accurate positional relationship. Therefore, it is possible to easily and accurately perform comparison inspection of the captured image data with respect to the mounting position information. However, the position designation by the cursor C is performed by clicking the image movement start points A1 and B1 to the image movement end points A2 and B2 after the drag operation, or clicking the related image movement end point A2 after clicking the image movement start point A1. However, it may be performed by operating the enter key 50. In addition, if the two positions are designated and moved one by one, the operation and control are simplified.

  In addition, in the inspection, in addition to inconsistencies of the mounted electronic components 12, inconsistencies in the mounting position and mounting angle, foreign matters that are easily related to quality and yield, for example, cream solder for mounting the electronic components 12 on the circuit board 1 are concentrated. If there is a foreign object in such a place, the electronic component 12 to be mounted will be poorly bonded, and such a foreign object can be detected as an object that is not in the image data of the mounting position information X11, Y11, X21, Y21. . If necessary, the printed state of cream solder can also be inspected. In short, any mounting state relating to mounting of the electronic component 12 can be an inspection target within a range that can be captured as image data. Further, if the circuit board 1 is tilted, the distance in the tilt direction is shortened, so that it can be determined from the comparative inspection. Whether the inclination is upward or downward can be determined by the three-dimensional state of the electronic component 12 on the captured image 15. It is also possible to determine the inclination of the circuit board 1 and the vertical direction thereof from the focusing data at a plurality of locations by the cameras 13, 14.

  Further, the play in the direction perpendicular to the conveyance direction with respect to the circuit board 1 by the guide rails 52a and 52a is about 400 to 500 μm in total in the left and right directions, and the stop posture by the one stopper 21, 22,. Is unstable and affects the inspection accuracy, as shown in FIG. 3, by stopping the eccentric position in the direction perpendicular to the conveyance direction of the circuit board 1, the posture is forced to rotate to a stable angle θ full. Can be made constant. However, when the stoppers 21, 22... Are arranged so as to be distributed to the left and right of the conveyance path 51 a in order to avoid interference during position adjustment, that is, in a direction perpendicular to the conveyance direction, the angle θ of the circuit board 1 depends on the distribution position. Is divided into a clockwise direction and a counterclockwise direction in plan view, but this can also be corrected in the comparative inspection, so there is no problem.

  The present invention can accurately inspect the state of mounting work and other work related to mounting electronic components on a circuit board by manufacturing the electronic circuit board with a simple apparatus.

1 is a schematic view showing a mounting system that employs a mounting state inspection method and apparatus according to an embodiment of the present invention to manufacture an electronic circuit board by mounting electronic components on the circuit board. It is explanatory drawing which shows the position adjustment state of the 1st camera and stopper on the conveyance path | route of a circuit board in the mounting system of FIG. It is explanatory drawing which shows the position adjustment state of the 2nd camera and stopper on the conveyance path | route of the circuit board in the equipment line of FIG. The inspection method of the work state by work position data and a picked-up image is shown, (a) is a parallel display state diagram, (b) is a superimposed display state diagram. It is explanatory drawing which shows the positional relationship of the origin position by a stopper position, a circuit board, and the mounting position on it. It is a schematic perspective view which shows the conventional inspection machine.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board 3 Solder printer 3a Cream solder printing process part 4 Chip mounter 4a, 4b Chip component mounting process part 6 Multifunctional machine 6a Deformed part mounting process part 7 Reflow furnace 7a Joining completion process part 8 Electronic circuit board 11 Equipment line 13 , 14... 17 Camera 15 Captured image 21, 22,... 25 Stopper 21 a, 22 a Sensor 31, 32 Shooting position 41 Video controller 42 Monitor 43 Operation panel 44 Direction designation key 45 Mouse 46 Start key 47 Control device 50 Enter key 51 Conveyance means 51a Conveyance path 52 Camera support means 53 Stopper support means 71 Mounting position information (CAD data)

Claims (14)

In a system for mounting a component on a board, an individual camera for photographing the board to be transported from above, and an individual stopper according to the individual camera are provided in the transport section of the board. A mounting state inspection method, wherein the mounting state is inspected by temporarily stopping the substrate and photographing with the individual camera. The individual cameras are arranged so that the plurality of inspection areas on the substrate to be transported can be photographed, and the substrate to be transported is separated by an individual stopper corresponding to the individual camera. Each time it is paused to each shooting position, and each time the board is paused at each shooting position, the corresponding inspection area on the board that is paused there is shot by the camera at that shooting position, and the stopper position is set. Based on the relationship between the mounting position information on the board and the shooting position information of each camera set in advance as the origin, the work position in the captured image of each inspection area is identified and compared with the image data of the mounting position information to inspect the mounting state The mounting state inspection method according to claim 1, wherein: 3. The mounting state inspection method according to claim 1, wherein the individual cameras for photographing a plurality of inspection areas are sequentially set from the upstream side so as to avoid mutual interference on the same transport path at the mounting work position. 4. The stopper according to claim 1, wherein the stopper is set to a stop position for stopping the substrate while monitoring a through image in which the substrate moving in the transport direction is monitored by a corresponding camera already arranged. The mounting state inspection method described. 3. The mounting state inspection method according to claim 2, wherein the mounting state is inspected by superimposing and comparing the image data of the mounting position information and the corresponding captured image data. The superimposition of the image data of the mounting position information and the captured image data is performed by displaying the image data of the mounting position information and the corresponding captured image data on the same screen, and the two captured image movement start points that are feature points on the captured image. The position of the captured image is determined by the position designation by the cursor and the position designation by the cursor of the two captured image movement end points which are the corresponding feature points on the image data of the mounting position information about the two captured image movement start points. The mounting state inspection method according to claim 5, wherein the two picked-up image movement starting points specified in the step are moved to the two picked-up image moving end points specified on the mounting position information image. 7. In addition to moving a captured image from a captured image movement start point specified by a cursor to a captured image movement end point, the captured image is moved in display pixel units in the specified direction for each key operation that specifies a direction. The mounting state inspection method described. The mounting state inspection method according to any one of claims 1 to 7, wherein the inspection is performed also on a foreign matter not included in the image data of the mounting position information. One or more mounting operation process units that receive a substrate and mount components; and a transport unit that sends out the substrate after the mounting operation in the mounting operation process unit and supplies it to the next mounting operation process unit, or carries it out. An individual camera for photographing the substrate conveyed to the conveyance unit from above, and an individual stopper corresponding to the individual camera, wherein the substrate is temporarily stopped by the stopper, and the individual A mounting state inspection apparatus provided with control means for inspecting a mounting state by photographing with a camera. A camera support unit capable of supporting a plurality of cameras for photographing an inspection area after completing a predetermined mounting operation of the substrate being conveyed so that the position of the camera can be individually adjusted in the conveyance direction of the conveyance unit, and 1 individually supported by the camera support unit Or a plurality of cameras and a stopper support section that can support a plurality of stoppers corresponding to this camera and temporarily projecting into the substrate transport path to temporarily stop the substrate so that the position can be individually adjusted in the transport direction. One or a plurality of the stoppers supported on the substrate are provided in the transport unit, the stoppers are temporarily projected to temporarily stop the substrate transported there, and assigned to the substrate by the corresponding camera. The inspection area after mounting work is imaged at two or more locations, and a stopper for each inspection area on the board imaged at these two or more locations From the relationship between the mounting position information set in advance with the position as the origin and the shooting position information of each camera, the work position in the captured image of each inspection area is identified and compared with the image data of the mounting position information to inspect the mounting state The mounting state inspection apparatus according to claim 9, further comprising a control unit that performs the control. The mounting state inspection apparatus according to claim 10, wherein a plurality of sets of cameras and stoppers are provided in the same transport unit from one mounting operation process unit. A monitor for displaying the image data of the mounting position information and the corresponding captured image data on the same screen is provided, and the control means superimposes the image data of the mounting position information displayed on the monitor and the corresponding captured image data to compare the data. The mounting state inspection apparatus according to claim 10, wherein the mounting state is inspected. An image in which two characteristic shot image movement start points on the shot image data displayed on the monitor and two corresponding characteristic shot image movement end points on the image data of the mounting position information are designated with a cursor on the display screen The control means includes an operation means for movement, and the control means displays the captured image on the display screen so that the two captured image movement start points on the specified captured image reach the captured image movement end point on the image data of the mounting position information. The mounting state inspection device according to claim 12, wherein the mounting state inspection device is moved by the step. Provided with fine adjustment direction designation operation means for designating the fine adjustment direction of the photographed image data displayed on the monitor, and the control means displays the photographed image data in the designated direction at every designation operation by the fine adjustment direction designation operation means. The mounting state inspection device according to claim 113, wherein the mounting state inspection device is finely moved in units of pixels.

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