JP2010118388A - Component mounting method and system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently and more stably produce a component mounting substrate with high mounting precision. <P>SOLUTION: A component mounting method of a component mounting system including a screen printer and a mounting device includes image-recognizing the position of an opening of a mask sheet and correcting mounting coordinate data of a component on the basis of the image data, and prestoring the mounting coordinate data having been corrected in respective mounting devices 3 to 5 before a step of producing a substrate. In the stage of producing the substrate, the screen printer 2 acquires relative position data between the substrate and mask sheet in solder printing and transmits it to the first mounting device 3, which computes final mounting coordinates of the components by further correcting the mounting coordinate data on the basis of the relative position data, and controls driving of a mounting head according to the mounting coordinates to mount the component on the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a component mounting method and a component mounting system for mounting an electronic component on a substrate.

  Conventionally, a printing process in which paste-like solder is printed on a board while a board (printed wiring board (PWB)) is conveyed in the order of a screen printing device, a mounting device, and a reflow device. A component mounting system that manufactures an electronic component mounting board (PCB: Printed Circuit Board) by sequentially going through a mounting process for mounting and a reflow process for bonding components onto lands by melting solder. Are known.

In this type of system, it is known that solder printing on the electrode (land) occurs due to individual expansion and contraction and distortion of the substrate. However, in recent years, the behavior of components in the reflow process, that is, the component mounting position is Even if it is slightly deviated from the electrode, if the component is mounted on the solder, it is possible to realize a good soldering quality by utilizing the so-called self-alignment effect that the component automatically follows the electrode as the solder melts. It has been broken. For example, Patent Document 1 discloses image recognition of solder printed on a component mounting point on a substrate after screen printing, obtains a deviation between the solder printing position and the electrode at the component mounting point, and uses the deviation data as a substrate. A component mounting system is disclosed in which a component mounting position is aligned with the printing position of each solder as a target by transferring it to a mounting apparatus together with conveyance.
JP 2002-134899 A

  However, in the conventional component mounting system as described above, it is necessary to image-recognize the solder printing positions of all component mounting points for each board and transfer the deviation data of all the component mounting points to the mounting apparatus for each board. Therefore, it takes time to acquire and transmit the deviation data, and it is difficult to increase the productivity of the substrate.

  Also, it is conceivable that a recognition error occurs between the substrates or between the component mounting points, and therefore it is difficult to stably produce an electronic component mounting substrate with high mounting accuracy.

  The present invention has been made in view of the above circumstances, and an object thereof is to enable efficient production of a component mounting board with good soldering quality.

  In order to solve the above problems, the present invention provides a screen printing apparatus that prints solder on electrodes on the substrate through an opening formed in the printing mask by overlapping the printing mask and the substrate, and component mounting A component mounting method in a component mounting system including a mounting device for mounting a component on the substrate on which the solder is printed, and the position of the opening in the printing mask is imaged Recognizing and obtaining the mounting coordinate calculation data for determining the component mounting coordinates so that the component is mounted at the solder printing position based on the recognition result, and storing the mounting coordinate calculation data in the mounting apparatus A board production process including printing a solder on the board by each of the devices and mounting the component on the board after the production preparation process. The relative position data transmitting step for obtaining the relative position between the substrate and the printing mask at the time of solder printing and transmitting the relative position data from the screen printing apparatus to the mounting apparatus, and after the solder printing, the mounting apparatus A mounting coordinate calculation step for obtaining component mounting coordinates by the head based on the relative position data and the mounting coordinate calculation data of the board carried into the head, and the head according to the component mounting coordinates determined in the mounting coordinate calculation step. And a component mounting step of mounting components on the substrate.

  In this method, the position of the opening of the printing mask is regarded as the solder printing position, and the position of the opening in the printing mask is recognized in advance, and the component is mounted at the solder printing position based on the recognition result. The mounting coordinate calculation data for determining the component mounting coordinates is obtained and stored in the mounting apparatus, and in the board production process, the mounting coordinate calculation data and the relative position calculated in the screen printing apparatus are obtained in the mounting apparatus. The component mounting coordinates are obtained based on the data (relative position between the substrate and the printing mask). According to such a method, it is possible to mount components satisfactorily at the solder printing position without measuring the solder printing position every time (for each substrate) after solder printing as in the conventional method. . Therefore, even if a solder printing shift occurs with respect to the electrodes due to individual expansion and contraction or distortion of the substrate, it is possible to improve the productivity of the substrate while realizing good soldering quality by mounting the component at the solder printing position. It becomes possible.

  More specifically, in the production preparation step, the mounting coordinate data in which the component mounting coordinates on the substrate are determined based on the position of the electrode is converted into the mounting coordinate data based on the solder printing position based on the image recognition result. The corrected mounting coordinate data is stored in the mounting apparatus as the mounting coordinate calculation data.

  In this component mounting method, the component mounting coordinate data is corrected to data that takes into account errors in the solder printing position due to processing errors and deformations in the opening of the printing mask, and this corrected mounting is performed during board production. The component mounting coordinates by the head are obtained from the coordinate data and the relative position data. For this reason, it is possible to satisfactorily mount the component at the solder printing position on the substrate.

  Further, depending on the position of the component mounting point and the type of component mounted thereon, the self-alignment effect in the so-called reflow process may not be expected. Therefore, in the above method, the component mounting coordinates are determined with reference to the component mounting point on the substrate or the electrode position on the substrate with respect to the component mounted on the point, and the solder printing position. It is preferable to determine in advance the component mounting coordinates of each component mounting point in accordance with the setting.

  According to this method, it is possible to mount a component at a more optimal position in consideration of the self-alignment effect according to the position of the component mounting point and the type of component mounted thereon.

  On the other hand, the component mounting system of the present invention includes a screen printing apparatus for printing solder on electrodes on the substrate through an opening formed in the printing mask by superimposing the printing mask and the substrate, and component mounting And a mounting apparatus that mounts a component on the substrate on which the solder is printed, and the screen printing apparatus captures the image data by imaging the printing mask. A mask imaging means for acquiring image data, a substrate imaging means for acquiring image data by imaging the substrate, and a relative position between the substrate for printing and the mask for printing based on each image data of the printing mask and the substrate Relative position calculation means for determining the relative position data as the relative position data obtained by the relative position calculation means Transmitting means for transmitting, the mounting apparatus, substrate imaging means for acquiring the image data by imaging the substrate, substrate position calculation means for obtaining the position of the substrate based on the image data of the substrate, Data for determining the component mounting position so that the component is mounted at the solder printing position, and for the mounting coordinate calculation obtained based on the recognition result by recognizing the position of the opening in the printing mask in advance. Based on the position of the board, the relative position data of the board, and the mounting coordinate calculation data before the component mounting operation of the board carried into the mounting apparatus after solder printing Mounting coordinate calculation means for obtaining component mounting coordinates by the head, and driving of the head according to the component mounting coordinates determined by the mounting coordinate calculation means Drive control means for controlling, in which comprises a.

  Further, in this component mounting system, the mounting coordinate calculation data is determined by using mounting coordinate data in which component mounting coordinates on the substrate are determined based on the electrode position as a solder printing position based on the image recognition result of the printing mask. Is corrected to the mounting coordinate data with reference to.

  Such a component mounting system is useful for producing a component mounting board based on the above-described component mounting method.

  As described above, according to the present invention, as in the conventional method, after solder printing, it is possible to place a component well at the solder printing position without measuring the solder printing position every time (each board). It can be installed. Therefore, it is possible to improve the productivity of the component mounting board while realizing good soldering quality by mounting the component at the solder printing position.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 schematically shows a component mounting system according to the present invention (a component mounting system to which a component mounting method according to the present invention is applied). This component mounting system manufactures a component mounting board (printed circuit board (PCB)) while conveying a printed wiring board (PWB; Printed wiring board; hereinafter simply referred to as a board P). The loader 1, the screen printing device 2, the first mounting device 3, the second mounting device 4, the third mounting device 5, the reflow furnace 6 and the unloader 7 are arranged in series in that order from the upstream side in the transport direction. Yes. The substrate P is sent out from the loader 1, and solder paste printing, component mounting (mounting), and solder bonding (melting / curing) are sequentially performed on the substrate P and taken out to the unloader 7.

  The devices 1 to 7 are communicably connected to each other via a communication network 8, and their operation states are managed in an integrated manner by a management computer 9 connected to the communication network 8. .

  FIG. 2 schematically shows the configuration of the screen printing apparatus 2.

  As shown in this figure, a printing stage 13 is provided on a base 11 of a screen printing apparatus 2 (hereinafter abbreviated as a printing apparatus 2). The printing stage 13 is for holding the substrate P and stacking it on the mask sheet 35, which will be described later, from below, and is composed of a conveyor 12, a clamping mechanism 14, a support mechanism 30, and the like. .

  The printing stage 13 is supported on the base 11 via the four-axis unit 20, and the X axis, the Y axis, the Z axis, and the R axis (rotation about the Z axis) with respect to the base 11 by the operation of the unit 20. It is designed to move in the direction. The X-axis direction is the board P transport direction (the board P transport direction in the component mounting system; the left-right direction in FIG. 1), and the Y-axis direction is the direction orthogonal to the X-axis direction on the horizontal plane. The Z-axis direction is a direction orthogonal to both the X-axis direction and the Y-axis direction.

  The four-axis unit is supported so as to be movable in the Y-axis direction along a rail 21 fixed on the base 11, and is driven by a Y-axis direction drive mechanism, and the Y-axis table 22 An X-axis table 24 supported so as to be movable in the X-axis direction along a rail 23 fixed on the X-axis and driven by an X-axis drive mechanism, and rotatably supported on the X-axis table 24 and a motor Each of the tables 22, 24, 26, and 28, and an R-axis table 26 driven by the Z-axis drive mechanism and a lift table 28 supported on the R-axis table 26 so as to be movable up and down and driven by a Z-axis drive mechanism. The printing stage 13 is configured to move in the X axis, Y axis, Z axis, and R axis (rotation about the Z axis). Although not shown in detail, each drive mechanism in the X-axis, Y-axis, and Z-axis directions is constituted by, for example, a screw feed mechanism using a motor as a drive source.

  The printing stage 13 is configured by providing the conveyor 12, the clamp mechanism 14, the support mechanism 30, and the like on the lifting table 28 of the four-axis unit 20.

  The conveyor 12 is assembled on an elevating table 28, and the elevating table 28 is a home position (a descent end position and predetermined origin positions in the X-axis, Y-axis, and R-axis directions; FIG. The board P can be carried in from the loader 1 and carried out to the first mounting apparatus 3 in the state set in the position shown in FIG.

  The clamp mechanism 14 and the support mechanism 30 fix the substrate P to the conveyor 12. The clamp mechanism 14 has a pair of clamp pieces 14a that can be contacted and separated in the Y-axis direction. The clamp pieces 14a sandwich the substrate P from both sides in the Y-axis direction. On the other hand, the support mechanism 30 includes a support tail 31 in which support pins (not shown) are erected in a predetermined arrangement, and a drive unit such as an air cylinder for driving the support pin 31 up and down. Is lifted from the conveyor 12 and the substrate P is pressed against the predetermined positioning plate of the conveyor 12 from below.

  On the other hand, a mask holding unit 16, a squeegee unit 17, an imaging unit 18, and the like are arranged above the printing stage 13.

  The mask holding unit 16 holds a mask sheet 35 for printing (corresponding to the printing mask of the present invention), has a mask clamp (not shown), and has a rectangular mask sheet 35 (plan view) by this mask clamp. 8B) is held detachably in a state where it is stretched horizontally above the printing stage 13. As shown in FIG.

  The squeegee unit 17 moves the solder paste supplied on the mask sheet 35 along the mask sheet 35, and is provided so as to be movable in the Y-axis direction by driving means such as a screw feed mechanism. The squeegee unit 17 includes a pair of squeegees 33, 33 that are aligned in the Y-axis direction and inclined in the opposite direction, and an elevating mechanism that individually raises and lowers the squeegees 33, 33. By arranging the squeegees 33 and 33 alternately at predetermined height positions, the solder paste is moved on the mask sheet 35 while sliding the squeegee 33 along the mask sheet 35.

  The imaging unit 18 is for imaging the substrate P and the mask sheet 35 and is provided below the mask holding unit 16. The imaging unit 18 includes a mask recognition camera 36 (corresponding to the mask imaging means of the present invention) provided upward for imaging the mask sheet 35 and a substrate recognition camera 37 (provided downward for imaging the substrate P). And a camera head 38 that is integrally provided with the camera head 38 so as to be movable in the X-axis direction and the Y-axis direction. Driving means for driving, and the camera head 38 moves in the X-axis direction and the Y-axis direction in a state where the printing stage 13 is set at the home position. The position can be picked up by the cameras 36 and 37.

  Although not shown in detail, each of the cameras 36 and 37 includes an imaging device such as a CCD area sensor and a lighting device, and the camera head so that the optical axes of the cameras 36 and 37 are aligned on the same axis. 38 is incorporated symmetrically. That is, the camera head 38 is configured to be able to simultaneously image the mask sheet 35 and the substrate P at the same coordinate position on the XY coordinate system of the printing apparatus 2.

  The outline of the printing operation of the printing apparatus 2 as described above is as follows. First, the substrate P carried from the loader 1 to the printing stage 13 (conveyor 12) is loaded on the mask sheet 35 from below by driving the four-axis unit 20. Then, by driving the squeegee unit 17 in this state, the paste is moved on the mask sheet 35, and solder is formed through the opening 35a (shown in FIG. 8B) formed in the mask sheet 35 along with this movement. The paste is printed on the substrate P. After printing, the substrate P is separated from the mask sheet 35 by driving the four-axis unit 20, the printing stage 13 is reset to the home position, and then the substrate P is transported to the first mounting apparatus 3.

  Next, the configuration of the first mounting apparatus 3 will be described with reference to FIG.

  FIG. 3 is a plan view showing a schematic configuration of the first mounting apparatus 3. As shown in this figure, a conveyor 42 extending in the X-axis direction is disposed on the base 41 of the first mounting apparatus 3, and the substrate P is transported by the conveyor 42 so as to have a predetermined mounting work position (the position shown in the figure). ).

  A substrate P positioning mechanism (not shown) is provided at this mounting work position. This positioning mechanism is similar to the support mechanism 30 in the printing stage 13 of the printing apparatus 2. That is, the positioning mechanism includes a support table in which support pins are erected in a predetermined arrangement and a driving means such as an air cylinder for driving the support pin up and down, and lifts the substrate P from the conveyor 42 while the support table is raised. The substrate P is pressed against and fixed to a predetermined positioning plate of the conveyor 42 from below.

  Component supply units 44 are provided on both sides of the conveyor 42. In each component supply section 44, a plurality of tape feeders 44a capable of supplying small chip components such as ICs, transistors and capacitors are arranged along the conveyor 42.

  On the other hand, a head unit 45 for mounting components is provided above the base 41. The head unit 45 picks up components from the tape feeder 44a and conveys them onto the substrate P and mounts them on a predetermined position on the substrate P. The head unit 45 moves in a predetermined area in the X-axis direction and the Y-axis direction, respectively. It is possible. That is, a support member 51 extending in the X-axis direction is provided above the base 41, and the head unit 45 is movably supported with respect to a guide member 53 fixed to the support member 51. The support member 51 is supported by a fixed rail 47 whose both end portions extend in the Y-axis direction, and is movable along the fixed rail 47 in the Y-axis direction. The head unit 45 is driven in the X-axis direction by the X-axis servo motor 55 via the ball screw shaft 54, while the support beam 51 is driven in the Y-axis direction by the Y-axis servo motor 49 via the ball screw shaft 48. It has come to be.

  The head unit 45 is equipped with a plurality of heads 45a for component mounting. In this embodiment, a total of six heads 45a are arranged in the X-axis direction. Each head 45a includes a component suction nozzle at the tip (lower end) of a drive shaft extending in the Z-axis direction. The nozzle is connected to the negative pressure generator via an internal passage of the drive shaft and a switching valve (not shown), and when sucking the component, the negative pressure suction force is applied from the negative pressure generator to the tip of the nozzle. Can be adsorbed.

  The head unit 45 further includes a board recognition camera 46 (corresponding to board imaging means of the mounting apparatus of the present invention). The board recognition camera 46 includes an image pickup device such as a CCD area sensor and an illumination device, and picks up images of various marks and the like attached on the board P positioned at the mounting work position.

  A component recognition camera 56 is disposed on the base 41 between each component supply unit 44 and the conveyor 42. These component recognition cameras 56 include an imaging element such as a CCD linear sensor, an illumination device, and the like. When the head unit 45 moves above the component recognition camera 56, the suction component of each head 45a is imaged from the base 41 side.

  The outline of the mounting operation of the first mounting apparatus 3 as described above is as follows.

  First, the substrate P carried from the printing apparatus 2 by the conveyor 42 is positioned and fixed at the mounting work position by the positioning mechanism. Then, after the head unit 45 moves to the component supply unit 44 and the components are sucked by the heads 45a, the head unit 45 moves from the component supply unit 44 onto the substrate P. During this movement, the head unit 45 passes over the component recognition camera 56 to pick up images of the components sucked by the heads 45a. Based on the images, the suction state (suction displacement) of the components by the heads 45a is recognized. Is done. When the head unit 45 reaches the substrate P, the head unit 15 mounts the suction component on the substrate P by each head 45a while intermittently moving to the component mounting point.

  Although the first mounting apparatus 3 has been described here, the configurations and mounting operations of the second mounting apparatus 4 and the third mounting apparatus 5 are basically the same as those of the first mounting apparatus 3, and accordingly, the second mounting apparatus 3 Description of the device 4 and the third mounting device 5 is omitted.

  On the other hand, although a detailed view of the reflow furnace 6 is omitted, for example, the reflow furnace 6 has a substrate transfer conveyor, a hot air blower, and the like, and melts the solder paste by performing a heat treatment on the substrate P after component mounting. Accordingly, the component is joined to the electrode on the substrate P.

  Next, a control system of the component mounting system will be described with reference to FIG. FIG. 4 shows a control system of the printing apparatus 2 and the mounting apparatus 3 (˜5) in the component mounting system.

  The control device 2A of the printing apparatus 2 includes a main control unit 201, a print program storage unit 202, a data storage unit 203, a drive control unit 204, an image processing unit 205, a communication control unit 206, and the like, as shown in FIG.

  The main control unit 201 includes a well-known CPU that executes logical operations, a ROM that stores various programs, a RAM that temporarily stores various data during operation of the apparatus, and the like, which are stored in the print program storage unit 202 in advance. By controlling the driving of the printing stage 13, the four-axis unit 20, the squeegee unit 17, the camera head 38, etc. via the drive control unit 204 based on the printing program being stored and various data stored in the data storage unit 203 The operation of the printing apparatus 2 is comprehensively controlled.

  In addition, the main control unit 201 performs various arithmetic processes necessary for this printing operation. For example, the position of the mask sheet 35 (opening 35a), the position of the substrate P, and the like based on image data captured by the mask recognition camera 36 and the substrate recognition camera 37 and subjected to image processing by the image processing unit 205. Calculation (measurement) processing is performed.

  The main control unit 201 is connected to the communication control unit 206, and transmits and receives various data to and from the management computer 9 and the mounting apparatuses 3 to 5 through the communication network 8 based on the control of the communication control unit 206. . For example, as described later, during the production of the substrate P, the relative position between the substrate P and the mask sheet 35 (described later relative position data) is transmitted to the first mounting device 3 for each printing process of the substrate P.

  In the present embodiment, the main control unit 201 functions as a relative position calculation unit according to the present invention, and the communication control unit 206 and the communication network 8 function as a transmission unit according to the present invention.

  As shown in the figure, the control device 3A of the first mounting device 3 includes a main control unit 301, a mounting program storage unit 302, a data storage unit 303, a drive control unit 304, an image processing unit 305, a communication control unit 306, and the like. Including.

  The main control unit 301 includes a well-known CPU that executes logical operations, a ROM that stores various programs, a RAM that temporarily stores various data during operation of the apparatus, and the like, which are stored in the mounting program storage unit 302 in advance. The operation of the first mounting device 3 is controlled by controlling the driving of the conveyor 42, the head unit 45, and the like via the drive control unit 304 based on the mounting program and the various data stored in the data storage unit 303. Control.

  The main control unit 301 performs various arithmetic processes necessary for the mounting operation. For example, calculation processing such as the position of the substrate P and the component adsorption deviation with respect to the head 45a based on image data captured by the substrate recognition camera 46 and the component recognition camera 56 and subjected to image processing by the image processing unit 305. I do.

  The main control unit 301 is connected to the communication control unit 306, and based on the control of the communication control unit 306, it communicates with the management computer 9, the printing apparatus 2, the other mounting apparatuses 4, 5, etc. through the communication network 8. Send and receive various data. For example, during production of the substrate P, the relative position data described later transmitted from the printing apparatus 2 is received, and the relative position data corresponding to the substrate P is secondly synchronized with the unloading of the substrate P after the completion of the mounting process. Transmit to the mounting apparatus 4.

  In this embodiment, the main control unit 301 functions as a substrate position calculation unit and a mounting coordinate calculation unit according to the present invention, and a data storage unit 303 corresponds to the storage unit according to the present invention. The drive control unit 304 and the like correspond to drive control means according to the present invention.

  The control device 3A of the first mounting device 3 has been described above. However, the control devices of the second mounting device 4 and the third mounting device 5 basically have the same configuration, and therefore here the control is performed. A description of the devices 4A and 5A is omitted. Further, since the control devices for the loader 1, the reflow furnace 6 and the unloader 7 have little relation to the present invention, the description of these control devices will be omitted.

  Next, a component mounting method by the component mounting system will be described with reference to the flowcharts of FIGS. In this component mounting method, a component mounting board is produced according to the respective steps in the order of the production preparation process and the board production process. Hereinafter, details of each process will be described based on operation control of the printing apparatus 2 and the mounting apparatuses 3 to 5.

<Production preparation process>
This process is a process for acquiring data for correcting the component mounting coordinates based on the actual solder printing position. As shown in the flowchart of FIG. 5, in this production preparation process, first, the mask sheet 35 is fixed to the printing apparatus 2 (step S1). In this embodiment, the mask sheet 35 is fixed manually by an operator.

  After the mask sheet 35 is fixed, the following mask recognition processing is executed by the operator operating input means such as a keyboard.

  That is, when the input operation is performed, the control device 2A (main control unit 201) of the printing apparatus 2 drives and controls the camera head 38, and moves the mask recognition camera 36 to a position below the mask sheet 35, thereby causing the mask. A pair of mask fiducial marks Fm (shown in FIG. 8 (b); hereinafter referred to as marks Fm) attached to the lower surface of the sheet 35 are imaged, and on the coordinate system in the printing apparatus 2 (referred to as apparatus coordinate system). The position of the mark Fm is measured (recognized) (step S3).

  Next, the main control unit 201 images each opening 35a (shown in FIG. 8B) of the mask sheet 35 with the mask recognition camera 36, and based on the image data, each of the openings 35a on the apparatus coordinate system. The position and size are measured (recognized) (step S5). At this time, the main control unit 201 measures the position of each opening 35a on a coordinate system (hereinafter referred to as a mask coordinate system) defined based on the mark Fm.

  When the measurement of the position and size of each opening 35a of the mask sheet 35 is completed, the main control unit 201 transfers the data (referred to as mask opening data) to the data creation tool via the communication network 8 (step S7). . In this embodiment, the management computer 9 corresponds to a data creation tool, and therefore the mask opening data is transferred to the management computer 9.

  Although not shown, the management computer 9 includes a well-known CPU that executes logical operations, a ROM that stores various programs, a calculation unit including a RAM that temporarily stores various data during operation of the device, and various data. When the mask opening data is transmitted from the printing apparatus 2, the management computer 9 includes the component mounting stored in the data storage unit. The data of the substrate P using the mask sheet 35 relating to the mask opening data is read into the calculation unit, and the mounting coordinates of each component mounting point included in the component mounting data are corrected based on the mask opening data. (Steps S9 and S11).

  More specifically, in the data storage unit of the management computer 9, component mounting data as shown in FIG. This component mounting data is data that is the basis for mounting components on the board P in each of the mounting apparatuses 3 to 5, and as shown in the figure, corresponds to the component mounting point ("silk name" in the figure). Data such as “mounting coordinates”, “head number”, “part number” and “solder on / off correction” are recorded. The mounting coordinate data is determined based on the position of the electrode Ed (see FIG. 8A) on the substrate P, and is shown on the substrate fiducial mark Fb (see FIG. 8A) attached to the substrate P. ; Hereinafter referred to as mark Fb) as a reference, that is, as coordinates on the substrate coordinate system.

  In the processing of steps S9 and S11, the calculation unit links the mounting coordinate data of each component mounting point with the corresponding mask opening data, and then maps the mounting coordinate data of each component mounting point to the corresponding mask opening data. Correct based on This correction is performed after the mask opening data on the mask coordinate system defined with reference to the mark Fm is converted into the data on the substrate coordinate system defined with reference to the mark Fb. That is, assuming that the position of the opening 35a of the mask sheet 35 (hereinafter simply referred to as the mask opening position) is the solder printing position, the mounting coordinate data is corrected so that the component can be mounted at this solder printing position.

  As shown in FIG. 9, the component mounting data includes the “solder on / off correction” data, and the calculation unit corrects the component mounting data in consideration of the data. This “solder on / off correction” data specifies whether or not the component mounting coordinates are corrected to the solder printing position. Among the component mounting points, the so-called self-alignment effect due to the solder melting in the reflow furnace 6 occurs. For parts mounting points that can be expected, for example, parts mounting points where lightweight parts are mounted, the “solder on / off correction” data is set to “Yes”, and parts mounting points where self-alignment effects cannot be expected, such as heavy parts are mounted. For the component mounting point, the “solder correction on / off” data is set to “do not”. Accordingly, in the process of step S11, the calculation unit corrects the mounting coordinate data only for the component mounting points for which the “on-solder correction presence / absence” data is recorded as “Yes”, and for the other component mounting points, the original component mounting points are corrected. Holds the mounting coordinate data.

  When the mounting coordinate data for each component mounting point is corrected in this way, the calculation unit transmits the correction result (corrected mounting coordinate data) to the mounting devices 3 to 5 through the communication network 8, whereby each mounting device 3. To 5 in the data storage unit 303 (step S13). Here, in the data storage unit 303 of each of the mounting apparatuses 3 to 5, the same component mounting data as in FIG. 9 is stored for each type of the board P. Therefore, the mounting coordinate data corrected in the processing of step S13. Is transmitted to each of the mounting apparatuses 3 to 5, the main control unit 301 or the like overwrites and saves the component mounting data (mounting coordinate data) of the corresponding board P on the corrected data. This completes the production preparation process. In this embodiment, the corrected mounting coordinate data corresponds to mounting coordinate calculation data according to the present invention.

  This production preparation process may be performed before the production of the substrate P. Accordingly, it is a matter of course that the production plan of the substrate P is not specifically determined, for example, immediately before the production of the mask sheet 35, or the like. After mounting on the board 2, it may be carried out before starting the production of the substrate P (before performing the solder printing process using the mask sheet 35).

<Board production process>
This step is a step of producing a component mounting board by sequentially performing solder printing, component mounting and reflow processes on the substrate P by the printing apparatus 2, the mounting apparatuses 3 to 5, and the reflow furnace 6. Hereinafter, operation control of the printing apparatus 2 and the mounting apparatuses 3 to 5 will be described.

[Printer 2]
When the production of the substrate P is started, the control device 2 </ b> A (main control unit 201) of the printing device 2 carries the substrate P into the printing stage 13. Then, as shown in the flowchart of FIG. 6, first, the camera head 38 is driven and controlled so that the mask recognition camera 36 images the mark Fm of the mask sheet 35, and the position of the mask sheet 35 on the apparatus coordinate system is determined. Recognize (step S21). At this time, the main control unit 201 sets the printing stage 13 at the home position by driving and controlling the 4-axis unit 20 and the like.

  As schematically shown in FIG. 8B, the mark Fm is attached to, for example, a corner portion of the mask sheet 35 on a common diagonal line, and an intermediate position of a line segment connecting both marks Fm is set. It is the mask center Om. Therefore, the main control unit 201 calculates the mask center Om and the inclination of the line segment based on the image data of both marks Fm, and uses the result as mask position data (Xm, Ym, θm) on the apparatus coordinate system. Store in the storage unit 203.

  Next, the main control unit 201 drives and controls the camera head 38 to image a pair of substrate fiducial marks attached to the upper surface of the substrate P by the substrate recognition camera 37, and the substrate P on the apparatus coordinate system. Is recognized (step S23).

  The fiducial mark Fb (hereinafter, abbreviated as the mark Fb) is, for example, a corner portion of the substrate P and attached to a common diagonal line as shown schematically in FIG. The center position of the line segment connecting Fb is the substrate center Ob. Accordingly, in step S23, the main control unit 201 calculates the inclination of the substrate center Ob and the line segment based on the image data of both marks Fb, and sets the result as substrate position data (Xb, Yb, θb).

  Next, the main control unit 201 determines in advance the relative position (Xp, Yp, θp) of the substrate P with respect to the mask sheet 35 on the apparatus coordinate system when the substrate P is overlaid on the mask sheet 35. The calculation is performed in accordance with the registration algorithm (program) (step S25).

  Here, when the substrate P is overlaid on the mask sheet 35, as shown in FIG. 8C, the substrate P is placed on the mask sheet 35 so that the center position and the inclination of both coincide with each other. , The opening 35a of the mask sheet 35 and the electrode Ed of the substrate P should be completely coincident with each other, but actually, the expansion and contraction of the substrate P and the mask sheet 35, or the electrode Ed and the opening Due to the position error of 35a and the like, as shown in FIG. 8D, the opening 35a and the electrode Ed may be displaced. The above algorithm incorporates correction parameters (Xi, Yi, θi) for correcting such a deviation, and the relative position (Xp, Yp, θp) is calculated according to the algorithm. For example, FIG. 8 (e) incorporates correction parameters that preferentially correct the deviation between a part of the electrodes Ed of the substrate P (the range indicated by the alternate long and short dash line in the figure) and the openings 35a. In this example, the relative position of the substrate P with respect to the mask sheet 35 on the apparatus coordinate system is calculated in step S25.

  When the relative position data (Xp, Yp, θp) of the substrate P with respect to the mask sheet 35 is obtained, the main control unit 201 controls the driving of the four-axis unit 20 based on the data, thereby controlling the substrate with respect to the mask sheet 35. The solder paste is printed on the substrate P by superposing P and further driving and controlling the squeegee unit 17 (step S27).

  In parallel with this printing operation, the main control unit 201 obtains the relative position data (Xp, Yp, θp) from the data in the apparatus coordinate system of the printing apparatus 2 with respect to the substrate, that is, the mark Fb. Conversion into relative position data (Xc, Yc, θc) on the substrate coordinate system defined as a reference (step S29).

  When the printing of the solder paste on the substrate P is completed, the main control unit 201 resets the substrate P to the home position while separating the substrate P from the mask sheet 35 by controlling the driving of the four-axis unit 20, and then printing. The board P is carried out from the apparatus 2 to the first mounting apparatus 3 and the relative position data (Xc, Yc, θc) of the board P is transmitted to the control apparatus 3A of the first mounting apparatus 3 in synchronization with this (step) S31: corresponds to the relative position data transmission step of the present invention). Thereby, the printing operation in the printing apparatus 2 is completed.

[First mounting device 3]
When the board P on which the solder printing is performed is conveyed to the first mounting apparatus 3, the control apparatus 3A (main control unit 301) drives and controls the conveyor 42 and the positioning mechanism, so that the printed board P is printed. Carry it into the mounting work position and fix it.

  Then, as shown in the flowchart of FIG. 7, the main control unit 301 drives the head unit 45 to pick up the mark Fb on the board P by the board recognition camera 46 and, based on the image data, the first mounting apparatus 3. The position of the substrate P on the coordinate system (hereinafter referred to as the apparatus coordinate system) is recognized (step S41). Specifically, as in the printing apparatus 2, the substrate center Ob and the inclination of the line segment are calculated based on the image data of both marks Fb, and the result is set as substrate position data (Xb, Yb, θb).

  Next, the main control unit 301 determines the first position based on the relative position data (Xc, Yc, θc) corresponding to the board P, that is, the relative position data transmitted to the first mounting apparatus 3 in step S31 of FIG. A virtual position of the mask sheet 35 on the apparatus coordinate system of the mounting apparatus 3 (hereinafter referred to as virtual mask position data) is calculated (step S43).

  Further, the main control unit 301 reads the mounting coordinate data of the board P stored in the data storage unit 303, and sets the mounting coordinate data of each component mounting point as the board position data (Xb, Yb, θb) and the relative position. Correction is performed based on the position data (Xc, Yc, θc) (step S45; corresponding to the mounting coordinate calculation step of the present invention). At this time, the main control unit 301 follows the component mounting data (see FIG. 9), and among the component mounting points, for the component mounting points whose “solder on / off correction” data is “Yes”, the mounting coordinate data is set to the board position data ( Xb, Yb, θb) and relative position data (Xc, Yc, θc) are corrected, and other component mounting points, that is, component mounting points whose “solder on / off correction” data is “not” are mounted. The coordinate data is corrected based on the substrate position data (Xb, Yb, θb).

  When the component mounting coordinates at each component mounting point are determined in this way, the process proceeds to step S47, and the main control unit 301 mounts the component on the substrate P by driving and controlling the head unit 45 according to the mounting coordinate data ( When the mounting of all components is completed, the substrate P is unloaded to the second mounting apparatus 4 and the relative position data (Xc, Yc) of the substrate P is synchronized with this unloading operation. , Θc), that is, the same data as the relative position data transmitted from the printing apparatus 2 to the first mounting apparatus 3 in step S31 of FIG. 6 is transmitted from the first mounting apparatus 3 to the second mounting apparatus 4. This completes a series of mounting operations.

  Here, the example of the operation control by the control device 3A of the first mounting device 3 has been described, but the control of the mounting operation by the control device 4A of the second mounting device 4 and the control device 5A of the third mounting device 5 is substantially the same. It is. Therefore, description of the control of the control devices 4A and 5A is omitted.

  As described above, in this component mounting system (component mounting method), prior to board production, the position of each opening 35a in the mask sheet 35 is image-recognized to obtain mask opening data, and the component is based on the mask opening data. By correcting the mounting coordinate data, the component mounting coordinate data is corrected in advance in consideration of the processing error of the opening 35a of the mask sheet 35 and the error of the solder printing position due to deformation, etc. (production preparation process), During production, only the relative position data of the substrate P and the mask sheet 35 at the time of solder printing is transferred from the printing apparatus 2 to each of the mounting apparatuses 3 to 5, and the component mounting coordinate data is corrected based on the relative position data. Thus, the final component mounting coordinates are determined. Therefore, like this conventional component mounting system (component mounting method), after solder printing, each part (for each board) does not need to measure the printing position of each solder, it is a good component at the solder printing position. Can be installed. Therefore, compared with the conventional component mounting system (component mounting method), the number of data to be acquired and transmitted after solder printing and before component mounting can be greatly reduced, and as a result, the productivity of the board P is improved. .

  Moreover, according to this component mounting system (component mounting method), as described above, the component mounting data is corrected based on the mask opening data, and thereby the solder printing position due to the processing error or deformation of the opening 35a of the mask sheet 35. Since the component mounting data is corrected in consideration of the above error and the like in advance, there is also an advantage that variations in mounting positions of components between the boards are reduced. That is, in the conventional component mounting system (component mounting method), the component mounting position between the substrates is determined by the image recognition error because image recognition is performed to calculate the component mounting coordinates for each solder printing position for each substrate. However, according to the component mounting system (component mounting method) of the embodiment, the component mounting data is corrected in advance based on the mask opening data as described above. There is no. Therefore, according to this component mounting system (component mounting method), it is possible to more stably produce a component mounting substrate with good soldering quality without variations in component mounting positions between the substrates. .

  Further, in this component mounting system, the solder printing position is not uniformly determined as the mounting coordinates for all the component mounting points, but as described above, the electrode Ed on the board P is included in the component mounting points as described above. What determines the component mounting coordinates as a reference and what determines the component mounting coordinates based on the solder printing position on the substrate P are determined in advance (see FIG. 9: “solder correction on / off” data). Since the component mounting coordinates are determined based on this data, the component is mounted on the solder printing position at the mounting point where the self-alignment effect in the reflow furnace 6 cannot be expected. As a result, for example, the component and the electrode Ed Can avoid the inconvenience of being incompletely joined. Therefore, there is an advantage that the components can be more appropriately soldered onto the board P than when the solder printing position is uniformly set as the mounting coordinates for all the component mounting points.

  By the way, the component mounting system (component mounting method) described above is an example of a preferred embodiment of the component mounting system (component mounting method) according to the present invention. The configuration of the component mounting system and the printing apparatus 2 included therein are included. In addition, the specific configuration of each of the mounting devices 3 to 5 and the component mounting method implemented in the component mounting system can be appropriately changed without departing from the gist of the present invention.

  For example, in this embodiment, by applying the management computer 9 as a data creation tool, the mounting coordinate data correction process (the processes in steps S9 to S13 in FIG. 5) is performed by the management computer 9, and the result is displayed on each mounting apparatus. However, the mounting coordinate data correction processing may be performed by the control devices 3A to 5A of the mounting devices 3 to 5, for example. In this case, the mask opening data acquired by the printing apparatus 2 may be transmitted to the mounting apparatuses 3 to 5 via the communication network 8. In this case, the mask opening data corresponds to the mounting coordinate calculation data according to the present invention.

  Also, in the embodiment, a correction presence / absence parameter (“solder correction presence / absence”) is incorporated in the component mounting data (see FIG. 9), and whether or not the component is mounted on the solder printing position for each component mounting point is determined in advance. Thus, during the mounting coordinate data correction process (steps S9 to S13 in FIG. 5), the mounting coordinate data is corrected in accordance with the “solder on / off correction” data. The operator may arbitrarily set after the correction process. In this case, in the mounting coordinate data correction process (steps S9 to S13 in FIG. 5), the mounting coordinate data of all the component mounting points is corrected based on the mask opening data, and then the corrected mounting coordinates are corrected. The data (referred to as mask opening reference mounting coordinate data) is included in the component mounting data together with the original mounting coordinate data as shown in FIG. The “on-solder correction presence / absence” data may be input based on the operation of an input means such as a keyboard while comparing the mounting coordinate data and the mask opening reference mounting coordinate data.

  Further, the “solder on / off correction” data may be determined according to the type of component in addition to being determined according to the component mounting point as described above. In this case, as shown in FIG. 10B, it is only necessary to include “soldered correction presence / absence” data in the component data and determine the component mounting coordinates according to the component data. In this case, mounting coordinates on solder printing are corrected for lightweight parts that can be expected to have a self-alignment effect in the reflow furnace 6, and on the contrary, mounting coordinates on solder printing are performed for heavy parts that cannot expect a self-alignment effect. What is necessary is just not to perform correction.

  In the embodiment, the mask opening data is acquired only immediately after the mask sheet 35 is replaced (the processing in steps S3 and S5 in FIG. 5). For example, the number is set in advance. The component mounting data (mounting coordinate data) may be periodically corrected by acquiring mask opening data for each production of a plurality of substrates, and the component mounting data held by each of the mounting apparatuses 3 to 5 may be updated. . According to this method, it is possible to reflect the temporal change of the state of the mask sheet 35, such as slack and deformation of the opening 35a, in the component mounting data, so that a component mounting board with good soldering quality can be provided for a longer period of time. Can be produced stably.

1 is a schematic diagram showing an overall configuration of a component mounting system according to the present invention (a component mounting system in which a component mounting method according to the present invention is used). It is a side view which shows schematic structure of the screen printing apparatus contained in a component mounting system. It is a top view which shows schematic structure of the mounting apparatus contained in a component mounting system. It is a block diagram which shows the control system of a component mounting system. It is a flowchart which shows the correction process (process of a production preparation process) of component mounting (mounting coordinate) data. It is a flowchart which shows an example of the operation control of a screen printing apparatus. It is a flowchart which shows an example of the operation control of a mounting apparatus. (A)-(e) is a plane schematic diagram for demonstrating the algorithm for mounting a board | substrate on a mask sheet | seat. It is a figure which shows an example of the component mounting data stored in the mounting apparatus. It is a figure which shows an example of the data stored in each mounting apparatus ((a) is component mounting data, (b) is component data).

Explanation of symbols

2 screen printing device 3 first mounting device 4 second mounting device 5 third mounting device 6 reflow furnace 8 communication network 9 management computer P substrate

Claims (5)

A screen printing apparatus for printing solder on electrodes on the substrate through an opening formed in the printing mask by overlapping the printing mask and the substrate, and a component mounting head, and the solder printing A component mounting method in a component mounting system including a mounting device for mounting a component on the printed board by the head,
Image recognition of the position of the opening in the printing mask, and obtaining mounting coordinate calculation data for determining component mounting coordinates so that the component is mounted at the solder printing position based on the recognition result, and the mounting coordinate calculation A production preparation step of storing data for use in the mounting device;
After this production preparation step, a board production step of printing solder on the board by each device and mounting components on the board, and
In this board production process,
A relative position data transmission step of obtaining a relative position between the substrate and the printing mask during solder printing and transmitting the relative position data from the screen printing apparatus to the mounting apparatus;
A mounting coordinate calculation step for obtaining component mounting coordinates by the head based on the relative position data of the substrate carried into the mounting apparatus and the mounting coordinate calculation data after solder printing;
A component mounting method comprising: performing a component mounting step of mounting a component on the substrate by the head according to the component mounting coordinates obtained in the mounting coordinate calculation step. In the component mounting method according to claim 1,
In the production preparation step, the mounting coordinate data in which the component mounting coordinates on the substrate are determined based on the position of the electrode is corrected to the mounting coordinate data based on the solder printing position based on the image recognition result, and after this correction Mounting component data is stored in the mounting apparatus as the mounting coordinate calculation data. In the component mounting method according to claim 1 or 2,
Predetermining what determines the component mounting coordinates with respect to the component mounting point on the substrate or the component mounted on the point based on the electrode position on the substrate and what determines the component mounting coordinate based on the solder printing position In addition, in the mounting coordinate calculation step, a component mounting coordinate of each component mounting point is determined according to the setting. A screen printing apparatus for printing solder on electrodes on the substrate through an opening formed in the printing mask by overlapping the printing mask and the substrate, and a component mounting head, and the solder printing In a component mounting system including a mounting device for mounting a component on the printed circuit board by the head,
The screen printing apparatus includes:
Mask imaging means for acquiring the image data by imaging the printing mask;
Substrate imaging means for acquiring image data by imaging the substrate;
A relative position calculating means for obtaining a relative position between the substrate and the printing mask at the time of printing based on each image data of the printing mask and the substrate;
Transmission means for transmitting the relative position obtained by the relative position calculation means to the mounting apparatus as relative position data,
The mounting apparatus is:
Substrate imaging means for acquiring image data by imaging the substrate;
Substrate position calculating means for determining the position of the substrate based on the image data of the substrate;
Data for determining the component mounting position so that the component is mounted at the solder printing position, and for the mounting coordinate calculation obtained based on the recognition result by recognizing the position of the opening in the printing mask in advance. Storage means for storing data;
After the solder printing, prior to the component mounting operation of the board carried into the mounting apparatus, the component mounting coordinates by the head are obtained based on the position of the board, the relative position data of the board, and the mounting coordinate calculation data. Mounted coordinate calculation means;
And a drive control means for controlling the drive of the head according to the component mounting coordinates obtained by the mounting coordinate calculation means. In the component mounting system according to claim 4,
The mounting coordinate calculation data includes mounting coordinate data in which component mounting coordinates on a substrate are determined based on the position of an electrode, as mounting coordinate data based on a solder printing position based on the image recognition result of a printing mask. A component mounting system characterized by being corrected.

Images