WO2015033403A1

WO2015033403A1 - Mounting line

Info

Publication number: WO2015033403A1
Application number: PCT/JP2013/073803
Authority: WO
Inventors: 毅近藤; 実絹田
Original assignee: 富士機械製造株式会社
Priority date: 2013-09-04
Filing date: 2013-09-04
Publication date: 2015-03-12
Also published as: JPWO2015033403A1; JP6334544B2

Abstract

This specification provides a mounting line provided with one or more processing devices that process circuit boards. Said mounting line is also provided with the following: a circuit-board geometry measurement unit that acquires geometry data for the circuit boards; a recipe-table storage unit that stores a recipe table in which categories of circuit-board geometry data are associated with recipes containing one or more operating parameters that prescribe operating states for the processing device(s); and a recipe selection unit that selects a recipe from the recipe table on the basis of the circuit-board geometry data acquired by the circuit-board geometry measurement unit.

Description

Mounting line

This specification relates to the mounting line.

Japanese Laid-Open Patent Publication No. 2001-308596 discloses a mounting line including at least one working device for working on a circuit board. In this mounting line, the operation parameter that defines the operation mode of the work device is switched according to the board type of the circuit board.

形状 Each circuit board may vary in shape even with the same board type. For example, when the circuit board is warped, the warpage of the individual circuit boards is different from each other, thereby causing variations in the shape of the individual circuit boards. For this reason, in the prior art, it has been necessary for an operator to set in advance values of operation parameters that can cope widely with variations in the shape of individual circuit boards based on experience and intuition. A technology that can appropriately operate the working device without relying on the experience and intuition of the worker is expected.

This specification provides a mounting line including at least one working device that performs work on a circuit board. The mounting line is associated with a circuit board shape measuring unit that obtains the shape data of the circuit board, a recipe including at least one operation parameter that defines the classification of the circuit board shape data and the operation mode of the working device. A recipe table storing unit for storing the recipe table, and a recipe selecting unit for selecting a recipe from the recipe table based on the shape data of the circuit board acquired by the circuit board shape measuring unit.

According to the above mounting line, even if there is a variation in the shape of each circuit board, it is possible to determine the optimum operating parameters according to the shape of each circuit board. Thereby, the quality of the work in the work device can be improved. In addition, since the recipe selection unit automatically selects an appropriate recipe, the burden on the operator can be reduced, and work on a stable and high-quality work device can be performed without relying on the operator's experience and intuition. It can be performed.

The figure which shows typically the structure of the mounting line 2 of an Example. The side view which shows typically the structure of the screen printer 4 of an Example. The figure which shows the outline of the printing recipe table 80 of an Example. The side view which shows typically the structure of the surface mounting machine 6 of an Example.

The mounting line according to an embodiment can be configured to include a screen printer as the working device. In this case, in the mounting line, the operation parameters include the number of stages of the plate separating operation from the screen mask of the circuit board, the descending distance in each stage of the plate separating operation, and the descending speed in each stage of the plate separating operation. The squeegee speed may be selected from the group including the squeegee printing pressure. In addition, the mounting line includes a screen mask shape measuring unit that acquires screen mask shape data, and the recipe table storage unit classifies the shape data of the circuit board and the shape data of the screen mask. The circuit that stores the recipe table in which at least one operation parameter that defines classification and the operation mode of the screen printing machine is associated is stored, and the recipe selection unit acquires the circuit acquired by the circuit board shape measurement unit The recipe table may be selected based on the substrate shape data and the screen mask shape data acquired by the screen mask shape measuring unit.

The mounting line according to an embodiment can be configured to include a surface mounter as the working device. In this case, in the mounting line, the operation parameter includes the amount of rise of the circuit board when positioning the circuit board, the amount of lowering of the nozzle when mounting the electronic component on the circuit board, and the circuit board. It can comprise so that it may be selected from the group containing the pressing force of the said nozzle at the time of mounting | wearing with the said electronic component.

(Example)
Below, the mounting line 2 of an Example is demonstrated, referring drawings. As shown in FIG. 1, the mounting line 2 includes a screen printing machine 4, a plurality of surface mounting machines 6, and a production management computer 8. The screen printer 4 screen-prints cream solder on the circuit board C. In the surface mounter 6, the electronic component is mounted on the circuit board C on which the cream solder is printed. Although not shown, the mounting line 2 is further arranged on the downstream side of the screen printing machine 4, and a solder printing inspection device for inspecting the state of cream solder printed on the circuit board C or a plurality of surface mountings It is arranged on the downstream side of the machine 6 and is arranged on the downstream side of the board appearance inspection apparatus for inspecting the state of the circuit board C on which the electronic component is mounted, or on the downstream side of the board appearance inspection apparatus, and heats the circuit board C. And a reflow furnace for reflow soldering electronic components. The production management computer 8 controls the operation of various devices incorporated in the mounting line 2 and manages the mounting operation of electronic components on the circuit board C in the mounting line 2.

As shown in FIG. 2, the screen printer 4 mainly includes a control device 20, an interface device 22, a circuit board identification device 23, a circuit board positioning device 24, an imaging measurement device 26, and a screen mask 28. The squeegee device 30 is provided. The screen printing machine 4 receives the circuit board C from the upstream side of the mounting line 2, screen-prints a desired pattern of cream solder on the circuit board C, and then sends the circuit board C to the downstream side of the mounting line 2. In the following description, in the screen printing machine 4, the conveyance direction of the circuit board C is the X direction, the direction orthogonal to the X direction in the horizontal plane is the Y direction, and the direction orthogonal to the X direction and the Y direction is the Z direction. And

The control device 20 can communicate with the production management computer 8. The control device 20 controls the operation of each component of the screen printer 4 in accordance with instructions from the production management computer 8. In addition, the control device 20 transmits data indicating the state of the solder printing operation in the screen printer 4 to the production management computer 8.

The interface device 22 presents the setting state and working state of the screen printing machine 4 to the worker via a monitor or the like, and accepts various inputs from the worker via a switch or the like.

The circuit board identification device 23 recognizes the identification mark attached to the upper surface of the circuit board C and acquires the identification information of the circuit board C. The circuit board identification device 23 transmits the identification information of the circuit board C to the control device 20. The control device 20 specifies the board type of the circuit board C based on the identification information transmitted from the circuit board identification device 23.

The circuit board positioning device 24 includes a Y direction moving mechanism 40, an X direction moving mechanism 42, a rotating mechanism 44, an elevating mechanism 46, an X direction transport mechanism 48, a clamp mechanism 50, and a support mechanism 52. .

The Y-direction moving mechanism 40 is supported on the base of the screen printing machine 4. The Y-direction moving mechanism 40 can be moved relative to the base of the screen printing machine 4 in the Y direction by driving an actuator (not shown).

The X direction moving mechanism 42 is supported by the Y direction moving mechanism 40. The X-direction moving mechanism 42 can be moved relative to the Y-direction moving mechanism 40 in the X direction by driving an actuator (not shown).

The rotating mechanism 44 is supported by the X-direction moving mechanism 42. The rotation mechanism 44 can be rotated around the Z axis with respect to the X-direction movement mechanism 42 by driving a motor (not shown).

The elevating mechanism 46 is supported by the rotating mechanism 44. The lifting mechanism 46 can be moved relative to the rotating mechanism 44 in the Z direction by driving an actuator (not shown).

The X-direction transport mechanism 48, the clamp mechanism 50, and the support mechanism 52 are supported by the lifting mechanism 46. The X-direction transport mechanism 48 includes a pair of conveyor belts 54 arranged along the X direction and servo motors (not shown) that drive the respective conveyor belts 54. The X-direction transport mechanism 48 can transport the circuit board C in the X direction by placing both ends of the circuit board C in the Y direction on a pair of conveyor belts 54 and driving a servo motor. Depending on the size of the circuit board C, the distance between the pair of conveyor belts 54 can be adjusted.

The clamp mechanism 50 can hold the circuit board C with a desired width by sandwiching the circuit board C from both ends in the Y direction. The support mechanism 52 can support the circuit board C from the lower surface side by bringing the tips of the support pins 56 into contact with the lower surface of the circuit board C held by the clamp mechanism 50.

The screen mask 28 is a metal plate-like member formed in a rectangular shape, and is supported on four sides by a mask support frame 66 whose position is fixed with respect to the base of the screen printing machine 4. At the center of the screen mask 28, an opening is formed corresponding to the pattern of cream solder to be printed on the circuit board C. Hereinafter, the opening formed in the central portion of the screen mask 28 is also referred to as a print pattern.

A fiducial mark serving as a reference for alignment with the circuit board C is attached to the lower surface of the screen mask 28. A fiducial mark serving as a reference for alignment with the screen mask 28 is attached to the upper surface of the circuit board C. In the screen printer 4, the circuit board C and the screen mask 28 are aligned based on the fiducial mark of the circuit board C and the fiducial mark of the screen mask 28.

The imaging measuring device 26 includes an XY direction moving mechanism 60, a circuit board imaging device 62a, a screen mask imaging device 62b, a circuit board measuring device 64a, and a screen mask measuring device 64b. The XY direction moving mechanism 60 can be moved relative to the base of the screen printing machine 4 in the X direction and the Y direction by driving an actuator (not shown). The circuit board imaging device 62a, the screen mask imaging device 62b, the circuit board measuring device 64a, and the screen mask measuring device 64b are held by the XY direction moving mechanism 60.

The circuit board imaging device 62a includes illumination and a camera for imaging the circuit board C, and can image the upper surface of the circuit board C. The control device 20 can process the image data picked up by the circuit board imaging device 62a and specify the position of the fiducial mark on the circuit board C.

The screen mask imaging device 62b includes illumination and a camera for imaging the screen mask 28, and can image the lower surface of the screen mask 28. The control device 20 can process the image data picked up by the screen mask image pickup device 62b and specify the position of the fiducial mark of the screen mask 28.

The circuit board measuring device 64a is a laser length measuring device that measures the distance in the Z direction from the imaging measuring device 26 to the circuit board C. By moving the XY direction moving mechanism 60 in the XY direction and measuring the distance in the Z direction from the imaging measurement device 26 to the circuit board C by the circuit board measurement device 64a, the control device 20 allows the upper surface of the circuit board C to be measured. Shape data can be acquired.

The screen mask measuring device 64b is a laser length measuring device that measures the distance in the Z direction from the imaging measuring device 26 to the screen mask 28. By moving the XY direction moving mechanism 60 in the XY direction and measuring the distance in the Z direction from the imaging measuring device 26 to the screen mask 28 by the screen mask measuring device 64b, the control device 20 causes the lower surface of the screen mask 28 to move. Shape data can be acquired.

The squeegee device 30 includes a Y-direction moving mechanism 72, a squeegee head 74, and

squeegees

76a and 76b.

The Y-direction moving mechanism 72 is supported on the base of the screen printing machine 4. The Y-direction moving mechanism 72 can be moved relative to the base of the screen printing machine 4 in the Y direction by driving an actuator (not shown).

The squeegee head 74 is supported by the Y-direction moving mechanism 72. The squeegee head 74 can be moved relative to the Y-direction moving mechanism 72 in the Z direction by driving an actuator (not shown).

The

squeegees

76a and 76b are supported by the squeegee head 74. The

squeegees

76a and 76b can be tilted with respect to the squeegee head 74 by driving a servo motor (not shown). The

squeegees

76a and 76b squeeze the cream solder supplied to the upper surface of the screen mask 28 from a solder supply device (not shown) on the print pattern.

Although not shown, the screen printing machine 4 further includes a receiving and conveying device and a sending and conveying device. The receiving and conveying device receives the circuit board C sent from the substrate conveying device on the upstream side of the screen printing machine 4 and sends the circuit board C to the X-direction conveying mechanism 48 of the circuit board positioning device 24. The sending / conveying device receives the circuit board C sent from the X-direction carrying mechanism 48 of the circuit board positioning device 24 and sends it out to the substrate conveying device on the downstream side of the screen printing machine 4.

In the present embodiment, the control device 20 includes a recipe table storage unit 82 that stores a print recipe table 80 as illustrated in FIG. 3, and a recipe that selects a print recipe to be applied to the circuit board C from the print recipe table 80. A selection unit 84 is provided. Here, the printing recipe is, for example, the number of operation stages of the plate separation operation from the screen mask 28 of the circuit board C, the lowering distance and the lowering speed of the circuit board C in each stage of the plate separation operation, A combination of one or more operation parameters that define the operation mode of the screen printing machine 4, such as the squeegee speed and the printing pressure of the

squeegees

76a and 76b during printing. As shown in FIG. 3, in the print recipe table 80, the print recipe corresponding to the board type of the circuit board C, the flatness classification of the circuit board C, the flatness classification of the screen mask 28, and combinations thereof. Are associated.

In this embodiment, when printing on the circuit board C, the recipe selection unit 84 of the control device 20 sets the board type of the circuit board C, the flatness of the circuit board C, and the flatness of the screen mask 28. Based on the print recipe table 80, a print recipe is selected. The control device 20 controls the operation of various components of the screen printing machine 4 according to the selected printing recipe. By adopting such a configuration, even when there are variations in individual shapes in the circuit board C of the same substrate type, it is possible to determine optimum operation parameters according to the shape of each circuit board C. it can. Thereby, the quality of solder printing can be improved. In addition, since the recipe selection unit 84 automatically selects an appropriate printing recipe, the burden on the operator can be reduced, and stable and high-quality solder printing can be performed without relying on the operator's experience and intuition. Can be realized.

The operation of the screen printer 4 will be described. When the circuit board C is sent from the upstream board transfer device, the control device 20 drives the receiving transfer device to receive the circuit board C and obtains the identification information of the circuit board C by the circuit board identification device 23. Thus, the board type of the circuit board C is specified. The control device 20 includes a Y-direction moving mechanism 40, an X-direction moving mechanism 42, a rotating mechanism 44, and an elevating mechanism so that the X-direction conveying mechanism 48 is in a position where the circuit board C can be received from the receiving and conveying device. 46 is driven. Then, the control device 20 drives the receiving transport device and the X-direction transport mechanism 48 to deliver the circuit board C from the receiving transport device to the X-direction transport mechanism 48.

When the circuit board C is delivered to the X-direction transport mechanism 48, the control device 20 drives the X-direction transport mechanism 48 to transport the circuit board C to the X-direction position corresponding to the print pattern of the screen mask 28. Then, the control device 20 drives the clamp mechanism 50 and the support mechanism 52 to hold the circuit board C. Then, the control device 20 moves the XY direction moving mechanism 60 of the imaging measurement device 26 in the XY direction, images the upper surface of the circuit board C by the circuit board imaging device 62a, and the circuit board C by the circuit board measurement device 64a. The acquisition of the shape data of the upper surface, the imaging of the lower surface of the screen mask 28 by the screen mask imaging device 62b, and the acquisition of the shape data of the lower surface of the screen mask 28 by the screen mask measuring device 64b are performed.

The control device 20 processes the image data captured by the circuit board imaging device 62a, specifies the position of the fiducial mark of the circuit board C, and processes the image data captured by the screen mask imaging device 62b. The position of the fiducial mark on the screen mask 28 is specified, and the positional deviation between the two is detected. When the positional deviation is detected, the control device 20 drives the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44 to finely adjust the position of the circuit board C.

Further, the control device 20 calculates the flatness of the circuit board C from the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a, and at the same time the lower surface of the screen mask 28 acquired by the screen mask measuring device 64b. The flatness of the screen mask 28 is calculated from the shape data. Then, the control device 20 selects a print recipe to be applied to the circuit board C from the print recipe table 80 based on the board type of the circuit board C, the flatness of the circuit board C, and the flatness of the screen mask 28. To do. When the printing recipe to be applied to the circuit board C is selected, the control device 20 drives the elevating mechanism 46 to raise the circuit board C toward the screen mask 28 and screen the upper surface of the circuit board C. It is brought into contact with the lower surface of the mask 28.

In parallel with the positioning of the circuit board C as described above, the control device 20 supplies cream solder to the upper surface of the screen mask 28 by a solder supply device (not shown). When the circuit board C comes into contact with the lower surface of the screen mask 28 and the cream solder is supplied to the upper surface of the screen mask 28, the control device 20 drives the squeegee head 74 to move one squeegee (for example, the squeegee 76a) to the screen. After contacting the upper surface of the mask 28, the Y-direction moving mechanism 72 is driven to perform squeezing on the print pattern of the screen mask 28. The operations of the Y-direction moving mechanism 72, the squeegee head 74, and the like at this time are controlled so that the squeegee speed and printing pressure defined by the selected printing recipe are realized. As a result, solder printing is performed on the circuit board C held in contact with the lower surface of the screen mask 28 with a pattern corresponding to the print pattern.

When the solder printing on the circuit board C is completed, the control device 20 drives the lifting mechanism 46 to separate the circuit board C from the screen mask 28. The operation of the elevating mechanism 46 at this time is such that the number of operation stages of the plate separating operation specified by the selected printing recipe and the descending distance and descending speed of the circuit board C at each stage of the plate separating operation are realized. Controlled. Further, the control device 20 drives the Y-direction moving mechanism 72 and the squeegee head 74 to return the squeegee device 30 to the standby position.

When the plate separation operation of the circuit board C from the screen mask 28 is completed, the control device 20 drives the clamp mechanism 50 and the support mechanism 52 to deliver the circuit board C to the X-direction transport mechanism 48 again. Further, the control device 20 drives the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44 so that the X-direction conveying mechanism 48 is in a position where the circuit board C can be delivered to the sending and conveying device. To do. Then, the control device 20 drives the X-direction transport mechanism 48 and the sending-out transport device, and delivers the circuit board C from the X-direction transport mechanism 48 to the sending-out transport device. Thereafter, the control device 20 drives the delivery / conveyance device to deliver the circuit board C to the downstream substrate conveyance device.

In the present embodiment, the control device 20 identifies the circuit board C so that the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a can be used also by the device downstream of the mounting line 2. The information is associated with the shape data of the upper surface of the circuit board C and transmitted to the production management computer 8. The production management computer 8 associates the identification information of the circuit board C and the shape data of the upper surface of the circuit board C, and transmits them to a device on the downstream side of the screen printing machine 4 in the mounting line 2, for example, the surface mounting machine 6. be able to.

As shown in FIG. 4, the surface mounter 6 mainly includes a control device 102, an interface device 104, a circuit board identification device 106, a circuit board positioning device 108, a component supply device 110, and a mounting head device 112. And a component imaging device 114. The surface mounter 6 receives the circuit board C from the upstream side of the mounting line 2, mounts the electronic component supplied from the component supply device 110 on the circuit board C, and then sends the circuit board C to the downstream side of the mounting line 2. . In the following description, in the surface mounter 6, the conveyance direction of the circuit board C is the X direction, the direction orthogonal to the X direction in the horizontal plane is the Y direction, and the direction orthogonal to the X direction and the Y direction is the Z direction. And

The control device 102 can communicate with the production management computer 8. The control device 102 controls the operation of each component of the surface mounter 6 in accordance with instructions from the production management computer 8. In addition, the control device 102 transmits data indicating the state of component mounting work in the surface mounter 6 to the production management computer 8.

The interface device 104 presents the setting state and working state of the surface mounter 6 to the worker via a monitor or the like, and accepts various inputs from the worker via a switch or the like.

The circuit board identification device 106 recognizes the identification mark attached to the upper surface of the circuit board C and acquires the identification information of the circuit board C. The circuit board identification device 106 transmits the identification information of the circuit board C to the control device 102. The control apparatus 102 specifies the board type of the circuit board C based on the identification information transmitted from the circuit board identification apparatus 106.

The circuit board positioning device 108 includes an elevating mechanism 116, an X-direction transport mechanism 118, and a clamp mechanism 120.

The elevating mechanism 116 is supported on the base of the surface mounter 6. The lifting mechanism 116 can be moved relative to the base of the surface mounter 6 in the Z direction by driving an actuator (not shown).

The X direction transport mechanism 118 and the clamp mechanism 120 are supported by the lifting mechanism 116. The X-direction transport mechanism 118 includes a pair of conveyor belts 122 arranged along the X direction and servomotors (not shown) that drive the respective conveyor belts 122. The X-direction transport mechanism 118 can transport the circuit board C in the X direction by placing both ends of the circuit board C in the Y direction on the pair of conveyor belts 122 and driving a servo motor. The distance between the pair of conveyor belts 122 can be adjusted according to the size of the circuit board C. The clamp mechanism 120 can hold the circuit board C with a desired width by sandwiching the circuit board C from both ends in the Y direction.

The component supply device 110 accommodates a plurality of electronic components, and sequentially supplies the electronic components to be mounted on the circuit board C. The component supply device 110 according to the present embodiment is a tape-type component supply device that houses a plurality of electronic components on a carrier tape. However, the component supply device 110 may be a tray-type component supply device that houses a plurality of electronic components on a tray.

The mounting head device 112 includes an XY direction moving mechanism 124 and a mounting head 126. The XY direction moving mechanism 124 is supported on the base of the surface mounter 6. The XY direction moving mechanism 124 can be moved relative to the base of the surface mounter 6 in the X direction and the Y direction by driving an actuator (not shown).

The mounting head 126 is held by the XY direction moving mechanism 124 so as to be rotatable around the Z axis. A plurality of nozzle holders are attached to the mounting head 126. A plurality of corresponding suction nozzles are attached to each of the plurality of nozzle holders. The plurality of nozzle holders can slide the corresponding plurality of suction nozzles in the Z direction with respect to the mounting head 126. At the tip of the suction nozzle, the electronic component can be sucked by negative pressure. Whether or not negative pressure is supplied to the tip of the suction nozzle can be switched by the mounting head 126. Therefore, the mounting head 126 can suck the electronic component supplied by the component supply device 110 by the suction nozzle, and can mount the electronic component sucked by the suction nozzle on the circuit board C. The mounting head 126 reciprocates between the component supply device 110 and the circuit board C, and repeatedly picks up the electronic component from the component supply device 110 and mounts the electronic component on the circuit board C, whereby the circuit board C An electronic component can be mounted on.

The component imaging device 114 includes an illumination and a camera, and images the mounting head 126 in a state where the electronic components are attracted to a plurality of suction nozzles from below. The control device 102 can process the image data captured by the component imaging device 114 and specify the position and orientation of the electronic component sucked by the suction nozzle.

Although not shown, the surface mounter 6 further includes an accepting and conveying device and a sending and conveying device. The receiving and conveying apparatus receives the circuit board C sent from the board conveying apparatus on the upstream side of the surface mounter 6 and sends the circuit board C to the X-direction conveying mechanism 118 of the circuit board positioning apparatus 108. The sending / conveying device receives the circuit board C sent from the X-direction carrying mechanism 118 of the circuit board positioning device 108 and sends it to the substrate carrying device on the downstream side of the surface mounting machine 6.

In this embodiment, the control device 102 includes a recipe table storage unit 130 that stores a mounting recipe table, and a recipe selection unit 132 that selects a mounting recipe to be applied to the circuit board C from the mounting recipe table. Here, the mounting recipe refers to, for example, the rising amount when the circuit board C is positioned by the circuit board positioning device 108, the lowering amount of the suction nozzle when the mounting head 126 mounts the electronic component on the circuit board C, and the pressing amount. It refers to a combination of one or more operation parameters that define the operation mode of the surface mounter 6 such as pressure. In the mounting recipe table, the board type of the circuit board C, the classification of the flatness of the circuit board C, and the mounting recipe corresponding to the combination thereof are associated with each other.

In this embodiment, when the component mounting operation is performed on the circuit board C, the recipe selection unit 132 of the control device 102 performs the mounting recipe table based on the board type of the circuit board C and the flatness of the circuit board C. Select the mounting recipe from. The flatness of the circuit board C can be calculated by obtaining shape data of the upper surface of the circuit board C associated with the identification information of the circuit board C from the production management computer 8. The control device 102 controls the operation of various components of the surface mounter 6 according to the selected mounting recipe. By adopting such a configuration, even when there are variations in individual shapes in the circuit board C of the same substrate type, it is possible to determine optimum operation parameters according to the shape of each circuit board C. it can. Thereby, the precision of component mounting can be improved. In addition, since the recipe selection unit 132 automatically selects an appropriate mounting recipe, the burden on the operator can be reduced, and the component can be stably and highly accurate without relying on the experience and intuition of the operator. Implementation can be realized.

In the above-described embodiment, the configuration in which the shape data of the upper surface of the circuit board C is acquired by the circuit board measuring device 64a moving integrally with the circuit board imaging device 62a in the screen printing machine 4 has been described. The shape data of the upper surface of the circuit board C may be acquired by a circuit board measuring device provided separately from the device 62a. Similarly, in the above embodiment, the screen printer 4 has been described with respect to the configuration in which the shape data of the lower surface of the screen mask 28 is acquired by the screen mask measuring device 64b that moves integrally with the screen mask imaging device 62b. The shape data of the lower surface of the screen mask 28 may be acquired by a screen mask measuring device provided separately from the screen mask imaging device 62b.

In the above-described embodiment, the case where a laser length measuring device is used as the circuit board measuring device 64a and the screen mask measuring device 64b has been described. However, the circuit board measuring device 64a and the screen mask measuring device 64b determine the distance to the object. Other length measuring devices such as an ultrasonic length measuring device may be used as long as they can be measured. Alternatively, the imaging measuring device 26 may be further provided with a Z-direction moving mechanism to measure the distance to the circuit board C and the screen mask 28 by focusing the image. In this case, the control device 20 images the circuit board C or the screen mask 28 with the circuit board imaging device 62a or the screen mask imaging device 62b while changing the position of the imaging measuring device 26 in the Z direction, and the imaging at the time when the focus is achieved. Based on the position of the measuring device 26 in the Z direction, the distance to the circuit board C or the screen mask 28 is calculated.

In the above-described embodiment, the distribution in the XY plane of the distance in the Z direction from the circuit board measuring device 64a to the upper surface of the circuit board C, obtained by the circuit board measuring device 64a, and the shape data of the upper surface of the circuit board C However, any data may be used as the shape data of the upper surface of the circuit board C as long as the shape of the upper surface of the circuit board C can be recognized. Similarly, in the above-described embodiment, the distribution in the XY plane of the distance in the Z direction from the screen mask measuring device 64b to the lower surface of the screen mask 28, which is obtained by the screen mask measuring device 64b, is represented by the lower surface of the screen mask 28. However, the shape data of the lower surface of the screen mask 28 may be any data as long as the shape of the lower surface of the screen mask 28 can be recognized.

In the above embodiment, the control device 20 selects the print recipe of the screen printer 4 based on the shape data of the upper surface of the circuit board C acquired by the screen printer 4. However, the shape data of the upper surface of the circuit board C for selecting the printing recipe of the screen printing machine 4 may be acquired at another location. For example, an apparatus for acquiring shape data of the upper surface of the circuit board C may be arranged upstream of the screen printer 4.

In the above embodiment, the control device 102 selects the mounting recipe of the surface mounting machine 6 based on the shape data of the upper surface of the circuit board C acquired by the screen printing machine 4. However, the shape data of the upper surface of the circuit board C for selection of the mounting recipe of the surface mounting machine 6 may be acquired at another location. For example, an apparatus for acquiring shape data of the upper surface of the circuit board C may be disposed upstream of the screen printing machine 4, and the shape of the upper surface of the circuit board C may be disposed between the screen printing machine 4 and the surface mounter 6. A device for acquiring data may be arranged, or a device for acquiring shape data of the upper surface of the circuit board C may be incorporated in the surface mounter 6.

In the above embodiment, the configuration in which the control device 20 of the screen printing machine 4 includes the recipe table storage unit 82 and the recipe selection unit 84 has been described. However, the production control computer 8 or the control device 102 of the surface mounter 6 may have the recipe table. It is good also as a structure provided with one or both of the storage part 82 and the recipe selection part 84. FIG. Similarly, in the above-described embodiment, the configuration in which the control device 102 of the surface mounter 6 includes the recipe table storage unit 130 and the recipe selection unit 132 has been described, but the production management computer 8 or the control device 20 of the screen printing machine 4 Alternatively, one or both of the recipe table storage unit 130 and the recipe selection unit 132 may be provided.

Specific and non-limiting specific examples of the present invention have been described in detail with reference to the drawings. This detailed description is intended merely to present those skilled in the art with the details for practicing the preferred embodiments of the present invention and is not intended to limit the scope of the invention. Also, the disclosed additional features and inventions can be used separately from or in conjunction with other features and inventions to provide further improved mounting lines.

Further, the combinations of features and steps disclosed in the above detailed description are not indispensable when practicing the present invention in the broadest sense, and are only for explaining representative specific examples of the present invention. It is described. Moreover, various features of the representative embodiments described above, as well as various features of what is recited in the claims, are described herein in providing additional and useful embodiments of the present invention. They do not have to be combined in the specific examples or in the order listed.

All the features described in the specification and / or claims are described in the disclosure and the claims at the beginning of the application separately from the configuration of the features described in the embodiments and / or claims. It is intended that the specific details provided be disclosed separately and independently of one another. Further, all numerical ranges and descriptions regarding groups or groups are intended to disclose intermediate configurations thereof as a limitation to the specific matters described in the original disclosure and the claims.

Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

Claims

A mounting line comprising at least one working device for working on a circuit board,
A circuit board shape measuring unit for obtaining shape data of the circuit board;
A recipe table storage unit for storing a recipe table associated with a classification including at least one operation parameter that defines the classification of the circuit board shape data and the operation mode of the working device;
A mounting line including a recipe selection unit that selects a recipe from the recipe table based on the shape data of the circuit board acquired by the circuit board shape measurement unit.
The mounting line according to claim 1, wherein a screen printing machine is provided as the working device.
The operating parameters include the number of stages of plate separation operation from the screen mask of the circuit board, the descending distance in each stage of the plate separating operation, the descending speed in each stage of the plate separating operation, the squeegee speed, and the squeegee speed. The mounting line according to claim 2, wherein the mounting line is selected from a group including printing pressure.
It has a screen mask shape measurement unit that acquires screen mask shape data,
The recipe table in which the recipe table storage unit is associated with at least one operation parameter that defines a classification of the circuit board shape data, a shape data of the screen mask, and an operation mode of the screen printing machine. And store
The recipe selection unit selects the recipe table based on the circuit board shape data acquired by the circuit board shape measurement unit and the screen mask shape data acquired by the screen mask shape measurement unit. The mounting line according to claim 2.
The mounting line according to claim 1, comprising a surface mounting machine as the working device.
The operating parameters are the amount of rise of the circuit board when positioning the circuit board, the amount of descent of the nozzle when attaching the electronic component to the circuit board, and the time when attaching the electronic component to the circuit board. The mounting line according to claim 5, wherein the mounting line is selected from a group including a pressing force of a nozzle.