JP2012248591A - Component mounting system and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting system and a component mounting method capable of achieving the object of mounting inspection work with sufficient accuracy even when a substrate has a deformation, e.g. warpage or distortion.SOLUTION: A printer 11 images a substrate mark 2m and each land 3 provided on a substrate 2 by means of a land imaging camera 25, creates the actual measurement position data of each land 3 with reference to the position of the substrate mark 2m based on the imaging results, and then transmits the actual measurement position data of each land 3 thus created to a mounting inspection machine 14 on the downstream process side. After imaging the substrate mark 2m and each land 3 provided on the substrate 2, the printer 11 performs printing of a paste Pt on each land 3 on the substrate 2, and the mounting inspection machine 14 inspects, for the substrate 2 on which the paste Pt is printed by the printer 11, as to whether or not a component 4 is mounted at the position of each land 3 on the substrate 2 determined by the actual measurement position data of each land 3 created by the printer 11.

Description

  The present invention relates to a component mounting system and a component mounting method for printing a paste such as solder on each land on a substrate and mounting the component on the land of the substrate on which the paste is printed.

  The component mounting system includes a printing machine and a component mounting machine. The printing machine executes a printing operation for printing paste such as solder on each land on the board. The component mounting machine is a board on which paste printing has been performed. The component mounting operation for mounting the component on the land is performed.

  In such a component mounting system, on the downstream process side of the component mounting machine, whether or not the component is mounted at each land position on the substrate with respect to the substrate on which the component is mounted by the component mounting machine. A mounting inspection machine for performing inspection work is installed (for example, Patent Document 1).

  Here, in performing the mounting inspection work, the mounting inspection machine receives the board on which the component is mounted by the component mounting machine and positions the board at the work position of the own machine, and then the board mark provided on the board. After detecting the position of the substrate (a pair of substrate marks provided at the diagonal positions of the substrate), each position on the substrate obtained from the land position data prepared in advance on the substrate design An inspection is made as to whether or not a component is mounted at the land position.

JP 2011-82375 A

  However, in the mounting inspection work executed by the conventional component mounting system, when the board is deformed such as warpage or distortion, the land position obtained from the land position data on the board design and the actual land are determined. Therefore, the purpose of the mounting inspection work of inspecting whether or not a component is mounted at each land position on the board cannot be achieved with sufficient accuracy. There is a problem that it may be difficult to produce a high substrate.

  Accordingly, the present invention provides a component mounting system and a component mounting method that can achieve the purpose of mounting inspection work with sufficient accuracy even when the substrate is deformed such as warping or distortion. For the purpose.

  The component mounting system according to claim 1, wherein the board mark and each land provided on the board are imaged, and the board mark and each land are picked up based on the board mark and each land imaged by the imaging means. Measured position data creation means for creating measured position data of each land with reference to the position, and after the board mark and each land provided on the board are imaged by the imaging means, the paste is printed on each land on the board The printing means that performs the printing, the board on which the paste has been printed by the printing means, the component mounting means that mounts the component at each land position on the board, and the substrate on which the component is mounted by the component mounting means A device for inspecting whether or not a component is mounted at the position of each land on the board obtained from the actually measured position data of each land created by the position data creating means. And a test means.

  The component mounting method according to claim 2 is based on the step of imaging the board mark and each land provided on the board, and the position of the board mark based on the imaged board mark and the imaging result of each land. The process of creating the measured position data of each land, the process of printing the paste on each land on the board after imaging the board mark and each land provided on the board, and the board on which the paste is printed On the other hand, whether the component is mounted at the position of each land on the board determined from the process of mounting the component at each land position on the board and the measured position data of each land created for the board on which the component is mounted. And a step of checking whether or not.

  In the present invention, the board mark and each land provided on the board are imaged to create the actual position data of each land based on the position of the board mark, and the board obtained from the actual position data of each created land Since it is designed to check whether or not a component is mounted at each land position above, each land obtained from the land position data on the board design due to deformation such as warping or distortion of the board occurs. Even if the position of each land does not match the actual position of each land, the purpose of the mounting inspection work of inspecting whether or not a component is mounted at the position of each land on the board is sufficient. This can be achieved with high accuracy, and a high-quality substrate can be produced. Further, in the present invention, the measured position data of each land is created based on the imaging result of each land before the paste is printed by the printing machine, and after the paste is printed Since the land position can be obtained more accurately than the case where the actual position data of each land is created from the imaged result of the land, the work accuracy of the mounting inspection work can be further improved.

The block diagram of the component mounting system in one embodiment of this invention 1 is a perspective view of a main part of a printing machine constituting a component mounting system according to an embodiment of the present invention. (A) (b) The figure which shows the coordinate system used when the printing press in one embodiment of this invention produces measured position data. 1 is a perspective view of a main part of a printing inspection machine constituting a component mounting system according to an embodiment of the present invention. The principal part perspective view of the component mounting machine which comprises the component mounting system in one embodiment of this invention The principal part perspective view of the mounting inspection machine which comprises the component mounting system in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, a component mounting system 1 is a device for mounting a component 4 on a large number of lands 3 provided on a substrate 2 to produce a mounting substrate. In addition, the mounting inspection machine 14 is arranged in this order from the upstream process side. The printing machine 11, the printing inspection machine 12, the component mounting machine 13, and the mounting inspection machine 14 are connected to each other via a host computer 15.

  In FIG. 2, the printing machine 11 includes a substrate holding unit 21, a mask 22 provided above the substrate holding unit 21, a squeegee unit 23 provided above the mask 22, and an area between the substrate holding unit 21 and the mask 22. A camera unit 24 provided, a land imaging camera 25 provided above the mask 22, and a control device 26 that controls the operation of these units are provided.

  The substrate holding unit 21 is provided with a base portion 21a that can freely move in the horizontal plane and move up and down, and a pair that is attached to the base portion 21a and that transports the substrate 2 in one direction (X-axis direction) in the horizontal plane. Conveyor 21b (see also FIG. 1) and a base portion that is provided so as to be movable up and down with respect to the base portion 21a and supports the substrate 2 conveyed from below to a predetermined work position (position shown in FIG. 2) by the conveyor 21b. 21c and a pair of clamp members 21d for clamping the substrate 2 supported by the lower receiving portion 21c from both sides.

  The mask 22 has four sides supported by a rectangular frame-shaped mask frame 22 a, and is provided in a central region on a number of openings 22 b corresponding to the lands 3 on the substrate 2 and on one diagonal line of the substrate 2. Mask marks 22m corresponding to the two substrate marks 2m are provided.

  The squeegee unit 23 is squeegee base 23a provided so as to be movable in a horizontal plane direction (the Y-axis direction and the vertical direction is the Z-axis direction) orthogonal to the transport direction (X-axis direction) of the substrate 2. The squeegee base 23a is provided with two squeegees 23b that can be moved up and down, and two squeegee lift cylinders 23c that individually lift and lower each squeegee 23b with respect to the squeegee base 23a. Here, each squeegee 23b is formed of a bowl-shaped member extending in the X-axis direction, and the two squeegees 23b are provided facing each other in the Y-axis direction.

  The camera unit 24 includes a lower imaging camera 24a whose imaging field is directed downward and an upper imaging camera 24b whose imaging field is directed upward.

  The land imaging camera 25 is provided so as to be movable in the horizontal plane direction and the vertical direction with the imaging visual field facing downward.

  In FIG. 2, the substrate 2 transporting operation by the conveyor 21b provided in the substrate holding unit 21, the raising / lowering operation of the lower receiving portion 21c, and the clamping operation of the substrate 2 by the pair of clamping members 21d are composed of an actuator or the like that is not illustrated by the control device 26. The operation of the substrate holding mechanism 27 is performed, and the movement operation of the substrate holding unit 21 holding the substrate 2 is performed by the control device 26 controlling the operation of a unit moving mechanism 28 including an actuator (not shown).

  In FIG. 2, the reciprocating movement of the squeegee base 23a in the Y-axis direction is performed by the control device 26 controlling the operation of a squeegee base moving mechanism 29 including an actuator (not shown), and each squeegee 23b is moved up and down with respect to the squeegee base 23a. The operation is performed by the control device 26 controlling the operation of the two squeegee lifting cylinders 23c.

  In FIG. 2, the moving operation of the camera unit 24 is performed by the operation control of the camera unit moving mechanism 24R including an actuator or the like (not shown) by the control device 26. The imaging operation by the lower imaging camera 24a and the imaging operation by the upper imaging camera 24b are controlled by the control device 26, and image data obtained by the imaging operation of the lower imaging camera 24a and image data obtained by the imaging operation of the upper imaging camera 24b. Is transmitted to the control device 26 for image recognition processing.

  In FIG. 2, the movement operation of the land imaging camera 25 is performed when the control device 26 controls the operation of the land imaging camera moving mechanism 25R including an actuator (not shown). The image pickup operation by the land image pickup camera 25 is controlled by the control device 26, and the image data obtained by the image pickup operation of the land image pickup camera 25 is transmitted to the control device 26 for image recognition processing.

  When printing a paste such as solder on each land 3 on the board 2 by the printing machine 11, the control device 26 sends the board 2 sent from the upstream process side of the printing machine 11 (outside the component mounting system 1). Is carried in by the conveyor 21b, and the substrate 2 is positioned by being stopped at the predetermined work position. When positioning the substrate 2, the control device 26 of the printing machine 11 raises the lower receiving portion 21c to support the substrate 2 from below, and clamps the substrate 2 by the pair of clamp members 21d. When the substrate 2 is clamped by the pair of clamp members 21d, the control device 26 moves the land imaging camera 25 above the substrate 2, and together with the imaging of the pair of substrate marks 2m on the substrate 2 by the land imaging camera 25, An imaging process for imaging the land 3 is executed.

  When the control device 26 of the printing machine 11 executes the imaging process, it executes a printing process for printing paste on each land 3 on the substrate 2. In this printing process, the control device 26 first moves the camera unit 24 to cause the lower imaging camera 24a to image the substrate mark 2m provided on the substrate 2 and to image the mask mark 22m provided on the mask 22 upward. The camera 24b is imaged. Then, the control device 26 moves the substrate holding unit 21 so that the position of the substrate 2 obtained by imaging the substrate mark 2m and the position of the mask 22 obtained by imaging the mask mark 22m coincide with each other in the vertical direction ( That is, after the substrate 2 is moved), the base portion 21a is raised, and the substrate 2 is brought into contact with the mask 22 so that each land 3 on the substrate 2 and the corresponding opening 22b of the mask 22 are matched. .

  When the control device 26 of the printing press 11 brings the substrate 2 into contact with the mask 22, the paste Pt (FIG. 2) is supplied onto the mask 22 by a paste supply device (not shown), and is moved above the mask 22. The one squeegee 23b is lowered. Then, the control device 26 moves the squeegee base 23a in the Y-axis direction after the lower end of one of the lowered squeegees 23b is in contact with the upper surface of the mask 22, and the mask is moved by the squeegee 23b that is in contact with the mask 22. By scraping the paste Pt on 22, the paste Pt is transferred onto the land 3 of the substrate 2 through the opening 22 b of the mask 22. In this paste Pt transfer operation, when the squeegee base 23a is moved in the opposite direction, the squeegee 23b that is brought into contact with the mask 22 is also changed.

  When the control device 26 of the printing machine 11 transfers the paste Pt onto the land 3 of the substrate 2, the base portion 21 a of the substrate holding unit 21 (that is, the substrate 2) is lowered with respect to the mask 22, and the substrate is removed from the mask 22. Separating 2 and separating the plates. As a result, the paste Pt is printed on each land 3 on the substrate 2. When the paste Pt is printed on each land 3 on the substrate 2, the control device 26 of the printing machine 11 releases the clamp of the substrate 2 by the pair of clamp members 21d and lowers the lower receiving portion 21c. Then, the conveyor 21b is operated to carry out the substrate 2 from the printing machine 11. Thereby, the printing process per board | substrate 2 by the printing machine 11 is complete | finished.

  That is, in the present embodiment, the imaging process by the land imaging camera 25 is a process of imaging the board mark 2m provided on the substrate 2 and each land 3, and the land imaging camera 25 is provided on the substrate 2. In addition, the image pickup means 2m and each land 3 are imaged.

  Further, in the present embodiment, the printing process performed by the printing machine 11 is to print the paste Pt on each land 3 on the substrate 2 after imaging the substrate mark 2 m and each land 3 provided on the substrate 2. In the printing machine 11, after the substrate mark 2m and each land 3 provided on the substrate 2 are imaged by the land imaging camera 25 as imaging means, the paste Pt is applied to each land 3 on the substrate 2. It is a printing means for performing printing.

  The control device 26 of the printing machine 11 executes the actual position data creation process before the printing process or in parallel with the printing process. In this actual position data creation step, the actual position data (each land 3) with reference to the position of the board mark 2m (based on the image of the board mark 2m and each land 3 (captured image) captured by the land imaging camera 25). This is a step of creating (measurement position coordinate data of each land 3), and is executed by the measurement position data creation unit 26a (FIG. 2) of the control device 26.

  That is, in the present embodiment, the measured position data creation unit 26a of the control device 26 of the printing press 11 is based on the substrate mark 2m imaged by the land imaging camera 25 that is an imaging unit and the imaging result of each land 3. Measured position data creating means for creating measured position data of each land 3 with reference to the position of the mark 2m.

  Here, in the measured position data of each land 3, the way of expressing the coordinates of the position of each land 3 with reference to the substrate mark 2m is arbitrary. Therefore, for example, as shown in FIG. 3A, an εη orthogonal coordinate system is set such that a line segment ζ connecting a pair of substrate marks 2m is a line segment of a deviation angle θ from one axis, and the setting is performed. In the εη orthogonal coordinate system, the coordinates P (Δε, Δη) of each land 3 may be obtained. As shown in FIG. 3B, the axis along the line connecting the pair of substrate marks 2m is shown. The ε axis and an axis perpendicular to the ε axis through one of the pair of substrate marks 2m are defined as the η axis, and an εη orthogonal coordinate system including these orthogonal ε axis and η axis is set, and the set εη orthogonal coordinate The coordinates P (Δε, Δη) of each land 3 may be obtained in the system.

  When the actual position data of each land 3 is created by the actual position data creation unit 26 a, the control device 26 of the printing machine 11 sends the created actual position data of each land 3 via the host computer 15 to the print inspection machine 12, It transmits to the component mounting machine 13 and the mounting inspection machine 14 (FIG. 1).

  4, the print inspection machine 12 includes a pair of conveyors 31 (see also FIG. 1) that convey the substrate 2 in the X-axis direction, a print inspection camera 32 and a control device 33 provided above the conveyor 31. . The print inspection camera 32 is provided so as to be movable in the horizontal plane direction and the vertical direction with the imaging visual field facing downward.

  The substrate 2 is transported by the pair of conveyors 31 when the control device 33 controls the operation of a substrate transport mechanism 31R (FIG. 4) including an actuator (not shown).

  In FIG. 4, the movement operation of the print inspection camera 32 is performed by the control device 33 controlling the operation of a print inspection camera moving mechanism 32R including an actuator (not shown). The image pickup operation by the print inspection camera 32 is controlled by the control device 33, and the image data obtained by the image pickup operation of the print inspection camera 32 is transmitted to the control device 33 for image recognition processing.

  When performing inspection on the substrate 2 (substrate 2 on which the paste Pt has been printed by the printing machine 11) by the printing inspection machine 12, the control device 33 carries the board 2 sent from the printing machine 11 by the conveyor 31. Then, the substrate 2 is positioned at a predetermined work position (position shown in FIG. 4). After positioning the substrate 2, the control device 33 of the print inspection machine 12 moves the print inspection camera 32 above the substrate 2 and causes the print inspection camera 32 to image the pair of substrate marks 2 m on the substrate 2. Then, the position of the obtained pair of substrate marks 2m and the actual position data of each land 3 received from the printing machine 11 (that is, created in the actual position data creation unit 26a of the control device 26 of the printing machine 11) Based on the above, the position of each land 3 on the substrate 2 positioned by the conveyor 31 is obtained.

  When the control device 33 of the printing inspection machine 12 obtains the position of each land 3 on the substrate 2 positioned by the conveyor 31, the printing inspection process is executed. This printing inspection process is performed on the position of each land 3 on the substrate 2 obtained from the measured position data of each land 3 created by the printing machine 11 with respect to the board 2 on which the paste Pt is printed by the printing machine 11. This is a process for inspecting how much the paste Pt is printed.

  That is, in the present embodiment, the control device 33 of the printing inspection machine 12 controls the printing machine 11 that is the actual position data creation unit for the substrate 2 on which the paste Pt is printed by the printing machine 11 that is the printing unit. An inspection is performed to determine how much the paste Pt is printed with respect to the position of each land 3 on the substrate 2 obtained from the measured position data of each land 3 created by the measured position data creation unit 26a of the apparatus 26. It is a printing inspection means.

  Here, the control device 33 of the printing inspection machine 12 actually measures each land 3 sent from the printing machine 11 as coordinate data of the position of each land 3 on the substrate 2 used in the printing inspection work (printing inspection process). Since the position data is used, the position of each land 3 obtained from the position data of the land 3 on the board design and the actual position of the land 3 do not coincide with each other because deformation such as warpage or distortion occurs in the board 2. Even in such a case, the purpose of the print inspection work of how much the paste Pt is printed with respect to the position of each land 3 on the substrate 2 can be achieved with sufficient accuracy.

  When the printing inspection for the substrate 2 is completed, the control device 33 operates the conveyor 31 to carry out the substrate 2 from the printing inspection machine 12.

  In FIG. 5, the component mounting machine 13 includes a substrate holding unit 41, a component supply unit 42 that supplies components 4, and a mounting head 43 that is movably provided above the substrate holding unit 41 by a head moving robot 43 </ b> R composed of an XY robot. A substrate camera 44 attached to the mounting head 43, a component camera 45 and a control device 46 provided between the substrate holding unit 41 and the component supply unit 42 are provided.

  In FIG. 5, the mounting head 43 is provided with a plurality of suction nozzles 43 a extending downward to suck the component 4 supplied from the component supply unit 42.

  In FIG. 5, the board camera 44 is provided with the imaging field of view facing downward, and the component camera 45 is provided with the imaging field of view facing upward.

  In FIG. 5, the substrate holding unit 41 is a pair of conveyors 41 a (see also FIG. 1) that conveys the substrate 2 in the X-axis direction, and the substrate 2 that has been conveyed to a predetermined position (position shown in FIG. 5) by the conveyor 41 a. A lower receiving portion 41b supported from below and a pair of substrate end contact members 41c with which both side portions of the substrate 2 supported by the lower receiving portion 41b contact from below are provided. The conveying operation of the substrate 2 and the raising / lowering operation of the lower receiving portion 41b by the pair of conveyors 41a are performed by the control device 46 controlling the operation of the substrate conveying and holding mechanism 47 including an actuator (not shown).

  In FIG. 5, the component supply part 42 consists of a tape feeder, for example, and supplies the component 4 with which the board | substrate 2 is mounted | worn to the component supply port 42a. The supply operation of the component 4 by the component supply unit 42 is performed when the control device 46 controls the operation of a component supply mechanism 48 including an actuator (not shown).

  In FIG. 5, the movement operation of the mounting head 43 is performed when the control device 46 controls the operation of the head moving robot 43R. Further, the suction operation of the component 4 through the suction nozzle 43a by the mounting head 43 is performed by the control device 46 controlling the operation of a suction mechanism 49 including an actuator (not shown), and the suction nozzle 43a is moved up and down with respect to the mounting head 43. The rotation operation is performed by the control device 46 controlling the operation of the suction nozzle driving mechanism 50 including an actuator (not shown).

  In FIG. 5, the imaging operation by the board camera 44 and the imaging operation by the component camera 45 are controlled by the control device 46, and the image data obtained by the imaging operation of the board camera 44 and the image data obtained by the imaging operation of the component camera 45. Is transmitted to the control device 46 for image recognition processing.

  When the component 4 is mounted on the substrate 2 (the substrate 2 on which the paste Pt is printed on each land 3 and the print inspection is performed on each land 3 on which the paste Pt is printed) by the component mounting machine 13, the control is performed. The apparatus 46 carries in the board | substrate 2 sent from the printing inspection machine 12 of the upstream process side of the component mounting machine 13 with the conveyor 41a, and positions the board | substrate 2 by making it still at the said predetermined | prescribed working position. After positioning the substrate 2, the control device 46 raises the lower receiving portion 41 b and pushes up the substrate 2 while supporting the substrate 2 from below, thereby bringing the two end portions of the substrate 2 into contact with the pair of substrate end contact members 41 c. The substrate 2 is held.

  When the control device 46 holds the substrate 2 by bringing both ends of the substrate 2 into contact with the pair of substrate end contact members 41c, the mounting head 43 is moved to position the substrate camera 44 above the substrate 2, The substrate camera 44 is caused to image the pair of substrate marks 2m on the substrate 2. Then, the position of the obtained pair of substrate marks 2m and the actual position data of each land 3 received from the printing machine 11 (that is, created in the actual position data creation unit 26a of the control device 26 of the printing machine 11) Based on the above, the position of each land 3 on the substrate 2 positioned by the substrate holding part 41 is obtained.

  When the control device 46 of the component mounting machine 13 obtains the position of each land 3 on the substrate 2 positioned by the substrate holding unit 41, the component mounting process is executed. This component mounting step is a step of mounting the component 4 at the position of each land 3 on the substrate 2 on the substrate 2 on which the paste Pt is printed by the printing machine 11.

  That is, in the present embodiment, the component mounting machine 13 mounts the component 4 for mounting the component 4 at the position of each land 3 on the board 2 on the board 2 on which the paste Pt is printed by the printing machine 11 as a printing unit. It is a means.

  In the component mounting process, the control device 46 controls the operation of the component supply unit 42 to supply the component 4 to the component supply port 42 a and positions the mounting head 43 above the component supply unit 42, thereby mounting the mounting head 43. After the component 4 is attracted to the suction nozzle 43 a, the mounting head 43 is moved so that the component 4 sucked by the suction nozzle 43 a passes above the component camera 45. Then, the component 4 is picked up by the component camera 45, the posture of the component 4 with respect to the suction nozzle 43a is grasped, the mounting head 43 is positioned above the substrate 2, and the component 4 sucked by the suction nozzle 43a. Is mounted on the land 3 on the substrate 2.

  When the component 4 sucked by the suction nozzle 43 a is mounted on the land 3 of the substrate 2, the control device 46 of the component mounting machine 13 receives each piece of data received from the printing machine 11 as position data of the land 3 on the substrate 2. The component 4 is mounted at the position of each land 3 on the board 2 obtained from the measured position data of the land 3.

  Here, the control device 46 of the component mounting machine 13 actually measures each land 3 sent from the printing machine 11 as coordinate data of the position of each land 3 on the board 2 used in the component mounting operation (component mounting process). Since the position data is used, the position of each land 3 obtained from the position data of the land 3 on the board design and the actual position of the land 3 do not coincide with each other because deformation such as warpage or distortion occurs in the board 2. Even if it exists, the objective of the component mounting operation | work which mounts the component 4 in the position of each land 3 on the board | substrate 2 can be achieved with sufficient precision.

  When the mounting of the component 4 on the board 2 is completed, the control device 46 operates the conveyor 41 a to carry the board 2 out of the component mounting machine 13.

  In FIG. 6, the mounting inspection machine 14 includes a pair of conveyors 51 (see also FIG. 1) for transporting the substrate 2 in the X-axis direction, a mounting inspection camera 52 and a control device 53 provided above the conveyor 51. . The mounting inspection camera 52 is provided so as to be movable in the horizontal plane direction and the vertical direction with the imaging visual field facing downward.

  In FIG. 6, the transfer operation of the substrate 2 by the pair of conveyors 51 is performed by the control device 53 controlling the operation of the substrate transfer mechanism 51R including an actuator or the like (not shown).

  In FIG. 6, the movement operation of the mounting inspection camera 52 is performed when the control device 53 controls the operation of a mounting inspection camera moving mechanism 52R including an actuator (not shown). The imaging operation by the mounting inspection camera 52 is controlled by the control device 53, and the image data obtained by the imaging operation of the mounting inspection camera 52 is transmitted to the control device 53 for image recognition processing.

  The mounting inspection machine 14 performs the inspection of the substrate 2 (the paste 2 is printed on each land 3, the printing inspection on each land 3 on which the paste Pt is printed, and the mounting of the component 4 on each land 3). When performing, the control apparatus 53 carries in the board | substrate 2 sent from the component mounting machine 13 with the conveyor 51, makes it stand still at a predetermined | prescribed working position (position shown in FIG. 6), and positions the board | substrate 2. FIG. After positioning the substrate 2, the control device 53 of the mounting inspection machine 14 moves the mounting inspection camera 52 above the substrate 2 and causes the mounting inspection camera 52 to image a pair of substrate marks 2 m on the substrate 2. Then, the position of the obtained pair of substrate marks 2m and the actual position data of each land 3 received from the printing machine 11 (that is, created in the actual position data creation unit 26a of the control device 26 of the printing machine 11) Based on the above, the position of each land 3 on the substrate 2 positioned by the conveyor 51 is obtained.

  When the control device 53 of the mounting inspection machine 14 obtains the position of each land 3 on the substrate 2 positioned by the conveyor 51, the mounting inspection process is performed. In this mounting inspection process, each land 3 on the board 2 obtained from the measured position data of each land 3 created by the measured position data creating unit 26a of the control device 26 of the printing machine 11 with respect to the board 2 on which the component 4 is mounted. This is a step of inspecting whether or not the part 4 is mounted at the position.

  In other words, in the present embodiment, the mounting inspection machine 14 measures the actual measurement of the control device 26 of the printing press 11 that is the actual position data creation unit with respect to the board 2 on which the component 4 is mounted by the component mounting unit 13 that is the component mounting unit. This is a mounting inspection means for inspecting whether or not the component 4 is mounted at the position of each land 3 on the board 2 obtained from the actually measured position data of each land 3 created by the position data creating unit 26a.

  Here, the control device 53 of the mounting inspection machine 14 actually measures each land 3 sent from the printing machine 11 as coordinate data of the position of each land 3 on the substrate 2 used in the mounting inspection work (mounting inspection process). Since the position data is used, the position of each land 3 obtained from the position data of the land 3 on the board design and the actual position of the land 3 do not coincide with each other because deformation such as warpage or distortion occurs in the board 2. Even if it exists, the objective of the mounting | wearing inspection operation | work of whether the components 4 are mounted | worn in the position of each land 3 on the board | substrate 2 can be achieved with sufficient precision.

  When the printing inspection for the board 2 is completed, the control device 53 operates the conveyor 51 to carry the board 2 out of the component mounting system 1 from the mounting inspection machine 14.

  As described above, in the component mounting system 1 (component mounting method using the component mounting system 1) according to the present embodiment, the board mark 2m and each land 3 provided on the board 2 are imaged and the position of the board mark 2m is captured. Measured position data of each land 3 is created with reference to the above, and an inspection is performed as to whether or not the component 4 is mounted at the position of each land 3 on the board 2 obtained from the created measured position data of each land 3. Therefore, the position of each land 3 obtained from the position data of the land 3 on the board design coincides with the actual position of each land 3 because deformation such as warpage or distortion occurs in the board 2. Even if not, the purpose of the mounting inspection work of inspecting whether or not the component 4 is mounted at the position of each land 3 on the substrate 2 can be achieved with sufficient accuracy, and the quality is high. substrate It is possible to produce.

  Further, the actual position data of each land 3 is created based on the imaging result of each land 3 before the paste Pt is printed by the printing machine 11, and after the paste Pt is printed. Since the position of the land 3 can be obtained more accurately than the case where the measured position data of each land 3 is created from the imaging result of the land 3, the work accuracy of the mounting inspection work can be further improved.

  In the above-described embodiment, the image pickup means (land image pickup camera 25) for picking up the board mark 2m and each land 3 provided on the board 2 and the image pickup of the board mark 2m and each land 3 picked up by the image pickup means. Based on the results, the printing machine 11 is provided with both actual position data creating means (actual position data creating unit 26a of the control device 26) for creating actual position data of each land 3 based on the position of the board mark 2m. However, the printing machine 11 may not necessarily be provided. For example, an apparatus including the imaging unit and the measured position data creation unit may be provided on the upstream process side of the printing machine 11 and separate from the printing machine 11. You may make it provide as.

  Provided are a component mounting system and a component mounting method capable of achieving the purpose of mounting inspection work with sufficient accuracy even when the substrate is deformed such as warping or distortion.

DESCRIPTION OF SYMBOLS 1 Component mounting system 2 Board | substrate 2m Board | substrate mark 3 Land 4 Parts 11 Printing machine (printing means)
13 Component mounting machine (component mounting means)
14 Mounting inspection machine (mounting inspection means)
25 Land imaging camera (imaging means)
26a Actual position data creation unit (actual position data creation means)
Pt paste

Claims (2)

Imaging means for imaging a board mark and each land provided on the board;
Actual position data creating means for creating actual position data of each land based on the position of the board mark based on the image of the board mark and each land imaged by the imaging means;
Printing means for printing a paste on each land on the substrate after the image of the substrate mark and each land provided on the substrate by the imaging means;
Component mounting means for mounting a component at each land position on the substrate for the substrate on which the paste is printed by the printing means,
For the board on which the component is mounted by the component mounting means, an inspection is performed as to whether or not the component is mounted at the position of each land on the board obtained from the measured position data of each land created by the measured position data creating means. A component mounting system comprising: a mounting inspection means for performing. Imaging a board mark and each land provided on the board;
A step of creating measured position data of each land based on the position of the board mark based on the imaged board mark and the imaging result of each land;
After imaging the substrate mark and each land provided on the substrate, printing a paste on each land on the substrate;
A process for mounting components to the positions of each land on the board for the board on which the paste is printed,
Component mounting, including a step of inspecting whether or not the component is mounted at the position of each land on the substrate obtained from the actually measured position data of each land with respect to the substrate on which the component is mounted Method.

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