JP7061220B2 - Component mounting device - Google Patents

Description

The present invention relates to a component mounting device and a component mounting system.

Conventionally, in a component mounting device for mounting components on a board, a device that inspects the mounting state of the components mounted on the board has been known. For example, in the component mounting device of Patent Document 1, when a board on which some components are mounted is carried in in the previous process, the board is inspected, and if the mounting state of the components is defective, the board is inspected in the subsequent process. Determine if it can be modified. Then, if it is determined that the modification is not possible in the subsequent process, the component is not mounted on the board, and if it is determined that the modification is possible in the subsequent process, the component is mounted on the board. As a result, when the mounting state of the component is irreparably defective, it is prevented from further mounting the component, so that the component is prevented from being wasted.

Japanese Unexamined Patent Publication No. 2011-9605

Since some such component mounting devices are expensive depending on the type of component, it is an important issue to prevent waste of the component. In the above-mentioned component mounting device, the presence or absence of defects is determined for each process, and if an uncorrectable defect occurs, it is stated that the component will not be mounted in the subsequent process, but multiple components can be mounted in one process. When mounting, no consideration is given to defects that occur in the middle of the process. Therefore, if a defect occurs in the middle of the process, all the parts mounted after that may be wasted.

An object of the present invention is to appropriately prevent waste of parts.

The present invention has taken the following measures to achieve the above-mentioned main object.

The component mounting device of the present invention is
Mounting means for mounting components on the board,
An inspection means for inspecting the mounting state of the components mounted on the board, and
Equipped with
The components include parts that do not require confirmation of the mounting status of other components before mounting and components that require confirmation that require confirmation of the mounting status of other components before mounting.
The mounting means mounts the confirmation-unnecessary component on the substrate, confirms that the mounting state of the confirmation-unnecessary component is normal based on the inspection result of the inspection means, and then mounts the confirmation-necessary component on the substrate. The gist is to mount it on the board.

In the component mounting device of the present invention, after the confirmation-unnecessary component is mounted on the substrate, it is confirmed that the mounting state of the confirmation-unnecessary component is normal based on the inspection result, and then the confirmation-necessary component is mounted on the substrate. As a result, when the mounting state of the parts requiring confirmation is not normal, the parts requiring confirmation are not mounted on the board, so that it is possible to prevent the parts requiring confirmation from being unnecessarily consumed. Therefore, it is possible to appropriately prevent the parts from being wasted when a defect occurs in the mounting state of the parts in the middle of one mounting process.

Further, the component mounting device of the present invention includes an image pickup means capable of imaging a component mounted on the substrate, and the inspection means inspects the mounting state of the component based on the image captured by the image pickup means. The mounting means may mount the next non-confirmation component on the substrate once the image of the non-confirmation component to be inspected is imaged. By doing so, it is possible to mount the next non-confirmation component on the board without waiting for the completion of the inspection of the mounted component that does not require confirmation, so that it is possible to suppress a decrease in mounting efficiency.

In the component mounting apparatus of the present invention of this aspect, when a plurality of confirmation-unnecessary parts are included in the same field of view, the imaging means mounts the plurality of confirmation-unnecessary components on a substrate and then performs the plurality of confirmations. It is also possible to image unnecessary parts. By doing so, it is possible to shorten the time required for imaging the parts that do not require confirmation, and it is possible to further suppress the decrease in mounting efficiency.

Further, in the component mounting apparatus of the present invention, the inspection means omits the inspection of some of the confirmation-unnecessary parts mounted on the substrate, and the mounting means does not require confirmation of some of the confirmation-unnecessary parts. After confirming that the mounting state of the remaining confirmation-unnecessary parts excluding the parts is normal, the confirmation-required parts can be mounted on the board. By doing so, it is possible to mount the parts requiring confirmation without inspecting all the parts requiring confirmation, so that the inspection time can be shortened as compared with the case of inspecting all the parts requiring confirmation.

Further, in the component mounting apparatus of the present invention, when the mounting means mounts a plurality of the components required for confirmation, the mounting state of the components required for confirmation previously mounted based on the inspection result is normal. It is also possible to mount the parts required for confirmation later on the board after confirming. By doing so, when a plurality of parts requiring confirmation are mounted, it is possible to appropriately prevent the parts requiring confirmation to be mounted later from being wasted.

The component mounting system of the present invention is
A component mounting system including any of the above-mentioned component mounting devices and a management device that manages the mounting order of the components in the component mounting device.
The management device is
A setting receiving means for accepting a setting as to whether the component is a confirmation-unnecessary component or a confirmation-required component.
A storage means for storing the accepted settings in association with each component,
As the mounting order, a mounting order setting means for mounting the confirmation-unnecessary component first and then mounting the confirmation-required component, and a mounting order setting means.
An output means for outputting the set mounting order to the component mounting device, and
The gist is to prepare.

In the component mounting system of the present invention, the management device accepts the setting of whether the component is a confirmation-unnecessary component or a confirmation-necessary component, and in the component mounting order, the confirmation-unnecessary component is first mounted and then confirmed. Set to mount the necessary parts, and output the mounting order to the parts mounting device. In addition, the component mounting device mounts the components that do not require confirmation on the board based on the mounting order, confirms that the mounting state of the components that do not require confirmation is normal based on the inspection results, and then mounts the components that do not require confirmation on the board. Implement. As a result, when the mounting state of the parts requiring confirmation is not normal, the parts requiring confirmation are not mounted on the board, so that it is possible to prevent the parts requiring confirmation from being unnecessarily consumed. In addition, since it is possible to set whether the parts do not need to be confirmed or the parts need to be confirmed, it is possible to narrow down the target parts that do not want to be wasted. Therefore, if a defect occurs in the mounting state of a component in the middle of one mounting process, it is possible to appropriately prevent the component requiring confirmation from being wasted.

Further, in the component mounting system of the present invention, the storage means can store the importance of the component stored as the confirmation-required component, and the mounting order setting means is the confirmation-required component in the mounting order. It is also possible to set the mounting order so that the ones with the lowest importance are mounted first. By doing so, it is possible to prevent the parts that need to be confirmed from being wasted, so that it is possible to prevent the parts from being wasted more appropriately. The importance of the parts can be, for example, the parts price or the number of parts in stock, and the one with a low part price or the one with a large number of parts in stock corresponds to the one with low importance.

It is a block diagram which shows the outline of the structure of the component mounting apparatus 10 of the component mounting system 1. It is explanatory drawing which shows the electrical connection relationship between the control device 70 of the component mounting apparatus 10 and the management apparatus 80. It is a block diagram which shows the outline of the structure of the substrate 60. It is explanatory drawing which shows an example of the part type setting screen. It is explanatory drawing which shows an example of the importance setting screen. It is explanatory drawing which shows an example of the component information stored in HDD 83 of management apparatus 80. It is a flowchart which shows an example of the mounting order setting process executed by the CPU 81 of the management apparatus 80. It is explanatory drawing which shows an example of the mounting order stored in HDD 83 of management apparatus 80. It is a flowchart which shows an example of the component mounting process executed by the CPU 71 of the control device 70. It is a flowchart which shows an example of the inspection process during mounting executed by the CPU 71 of the control device 70. It is a flowchart which shows the inspection process during implementation of a modification. It is explanatory drawing which shows an example of the setting screen of the inspection necessity after mounting.

Next, an embodiment of the present invention will be described. FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting device 10 of the component mounting system 1, and FIG. 2 is an explanation showing an electrical connection relationship between the control device 70 of the component mounting device 10 and the management device 80. It is a figure.

As shown in FIG. 1, the component mounting system 1 includes a component mounting device 10 for mounting components on a board, and a management device 80 for managing the entire component mounting system. The component mounting device 10 is configured to be able to execute a process of mounting a relatively small chip component or the like on a substrate and a process of mounting a relatively large component or a die component on the substrate. Although not shown, the component mounting system 1 may include a plurality of component mounting devices 10.

As shown in FIG. 1, the component mounting device 10 is composed of a component supply device 14 for supplying components, a substrate transfer device 20 for transporting a substrate 60 from left to right in the X-axis direction of FIG. 1, and a substrate transfer device 20. A backup device 30 that backs up the conveyed board 60 from the back surface side, and a head 50 that can be attached with a plurality of (for example, four) suction nozzles 51 and pick up parts by the suction nozzles 51 and mount them on the board 60. An XY robot 40 that moves the head 50 in the XY direction, a mark camera 46 that can capture various marks attached to the surface of the substrate 60, and various nozzles such as a small-diameter suction nozzle 51 and a large-diameter suction nozzle 51. It includes a nozzle station 49 to be stocked and a control device 70 (see FIG. 2) that controls the entire component mounting device 10. A plurality of component supply devices 14 are arranged and compared with a tray feeder 16 that supplies components by a tray containing relatively large plate-shaped components (including die components) so as to be arranged in the left-right direction (X-axis direction). A tape feeder 18 for supplying parts by a tape containing small parts is provided.

FIG. 3 is a configuration diagram showing an outline of the configuration of the substrate 60. In the present embodiment, the substrate 60 is a collective substrate having a plurality of child substrates 65 (working areas) separated by dividing grooves. The component mounting system 1 can manufacture a plurality of child boards 65 on which the components are mounted by mounting the components on each child board 65 by the component mounting device 10 and then dividing the board 60 along the dividing groove. .. The substrate 60 is not limited to the one having a plurality of child substrates 65, and may be manufactured as one substrate.

The substrate 60 is provided with a substrate position reference mark 62 at two diagonal corners (upper left portion and lower right portion in FIG. 3). Further, the plurality of child boards 65 are provided with child board position reference marks 66 at two diagonal corners (upper left portion and lower right portion in FIG. 3). These board position reference marks 62 and child board position reference marks 66 are captured by the mark camera 46 when the board 60 is positioned by the backup device 30, and the position information of the board 60 and the child board 65 is acquired. Used for. Further, in the present embodiment, the chip components a to c and the die components X and Y will be described as being mounted on each child substrate 65. A plurality of chip parts a (two pieces a1 and a2) are mounted, and the other parts are mounted one by one.

As shown in FIG. 2, the control device 70 is configured as a microprocessor centered on a CPU 71, and includes a ROM 72, an HDD 73, a RAM 74, and an input / output interface 75 in addition to the CPU 71, which are via a bus 76. Is electrically connected. A position signal of the head 50 from the XY robot 40, an image signal from the mark camera 46, and the like are input to the control device 70 via the input / output interface 75. On the other hand, from the control device 70, a control signal to the component supply device 14, a control signal to the board transfer device 20, a control signal to the backup device 30, a drive signal to the XY robot 40, a drive signal to the head 50, and the like are transmitted. It is output via the input / output interface 75. Further, the control device 70 is connected to the management device 80 via a communication network 90 so as to be capable of bidirectional communication, and exchanges data and control signals with each other.

The management device 80 is, for example, a general-purpose computer, and as shown in FIG. 2, includes a CPU 81, a ROM 82, an HDD 83, a RAM 84, an input / output interface 85, and the like, and these are electrically connected via a bus 86. .. An input signal is input to the management device 80 from an input device 87 such as a mouse or a keyboard via the input / output interface 85, and an image signal to the display 88 is output from the management device 80 via the input / output interface 85. Has been done. The HDD 83 stores various information regarding the mounting process of the component on the board 60. The various information includes nozzle information regarding the type of the suction nozzle 51 used for the mounting process, component information regarding each component such as position information regarding the mounting position, mounting order of the components to be mounted, and the like. Here, the components mounted in this embodiment include components that do not require confirmation (parts that do not require prior confirmation) that can be mounted without confirming whether or not the mounting state of the other components mounted earlier is normal. There are some parts that need to be confirmed (parts that need to be confirmed in advance) that can be mounted after confirming that the mounting state of the parts that have been mounted earlier is normal.

In the management device 80 of the present embodiment, the operator can set whether each component to be mounted is a component that does not require confirmation or a component that requires confirmation. This setting is performed using the setting screen displayed on the display 88. FIG. 4 is an explanatory diagram showing an example of a component type setting screen. As shown in the figure, on the component type setting screen, "YES" that requires confirmation or "NO" that does not require confirmation for each of the chip components a to c and the die components X and Y, which are the components to be mounted. Either can be set. The operator moves the selection cursor 88a on the component type setting screen in the vertical direction by operating the input device 87 in the vertical direction to select the component to be set, and operates the input device 87 in the horizontal direction to select the component to be set. Select "YES" or "NO" for. Further, the operator can determine the setting on the component type setting screen by moving the selection cursor 88a onto the "determine" button and then performing the determination operation of the input device 87. FIG. 4 shows how the chip parts a to c are set as the parts that do not need to be confirmed, and the die parts X and Y are set as the parts that need to be confirmed. The chip component may be set as a check-required component, or the die component may be set as a check-unnecessary component.

Further, the management device 80 can set the importance of the parts set as the parts required for confirmation on the part type setting screen. FIG. 5 is an explanatory diagram showing an example of the importance setting screen. As shown in the figure, on the importance setting screen, one of two levels of importance, "high" and "low", can be set for each of the die parts X and Y set as the parts required for confirmation. can. Since the operation method (setting method) of the importance setting screen is the same as that of the component type setting screen, the description thereof will be omitted. Here, the worker can set relatively important parts such as high parts price as the parts to be confirmed, but among them, the importance of the particularly expensive parts is set to "high". The importance of low-priced parts can be set to "low". FIG. 5 shows how the importance of the die component X is set to “high” and the importance of the die component Y is set to “low”.

The management device 80 stores the component information including the contents set on the component type setting screen and the importance setting screen in the HDD 83. FIG. 6 is an explanatory diagram showing an example of component information stored in the HDD 83 of the management device 80. The HDD 83 stores the necessity of confirmation of each component and the importance of the component requiring confirmation, and also stores the position information regarding the mounting position of the component in the child board 65.

Next, the operation of the component mounting system 1 configured in this way will be described. First, a process of setting the mounting order of components in the management device 80 will be described. FIG. 7 is a flowchart showing an example of the mounting order setting process executed by the CPU 81 of the management device 80. When this mounting order setting process is executed, the CPU 81 of the management device 80 first reads the component information stored in the HDD 83 (S100), and extracts the component information of the components that do not need to be confirmed (chip components a to c). (S110). Next, the CPU 81 sets the mounting order of the parts that do not need to be confirmed based on the position information among the parts information of the parts that do not need to be confirmed (S120). The CPU 81 sets the mounting order so that the moving distance of the head 50 is shortened based on the position information of each component. In the present embodiment, the CPU 81 sets the mounting order of the parts that do not require confirmation in the order of the upper left chip component a (a1), the chip component c, the chip component b, and the lower right chip component a (a2).

Next, the CPU 81 extracts the part information of the parts required for confirmation (die parts X and Y) (S130), and based on the importance of the extracted part information of the parts required for confirmation, the parts with low importance are first of importance. Check the order of the parts with the highest number. Set the mounting order of the required parts (S140). In the present embodiment, the importance of the die component X is "high" and the importance of the die component Y is "low". Therefore, the CPU 81 mounts the components requiring confirmation in the order of the die component Y and the die component X. Set. When there are a plurality of parts having the same importance, the CPU 81 sets the mounting order so that the moving distance of the head 50 is shorter among the plurality of parts having the same importance.

When the CPU 81 sets the mounting order of the parts that do not need to be confirmed and the mounting order of the parts that need to be confirmed, the CPU 81 sets the mounting order so that the parts that do not need to be confirmed are mounted first and the parts that need to be confirmed are mounted later, and is stored in the HDD 83. (S150). FIG. 8 is an explanatory diagram showing an example of the mounting order in the child substrate 65. As shown in the figure, the mounting order is from the parts that do not need to be confirmed to the parts that need to be confirmed, in the order of the parts that do not need to be confirmed, the order in which the movement efficiency of the head 50 is good, and in the order of the parts that need to be confirmed, the order of less importance. The CPU 81 outputs the mounting information including the set mounting order to the component mounting device 10 via the communication network 90 (S160), and ends the mounting order setting process. The mounting information includes nozzle information, component information (position information of components), and the like, in addition to the mounting order. Further, since the substrate 60 has a plurality of child substrates 65, the component mounting device 10 of the present embodiment mounts the components requiring confirmation on each child substrate 65, and then mounts the components requiring confirmation. ..

Next, a process of mounting components by the component mounting device 10 based on the set mounting order will be described. FIG. 9 is a flowchart showing an example of a component mounting process executed by the CPU 71 of the control device 70. When this component mounting process is executed, the CPU 71 of the control device 70 first acquires the mounting information output from the management device 80 via the communication network 90 (S200), and carries in the board 60 (S210). .. In S210, the CPU 71 controls the board transport device 20 to transport the board 60 to a predetermined position on the backup device 30, and controls the backup device 30 to fix the board 60 at a predetermined position. Next, the CPU 71 acquires the position information of the substrate 60 (S220). In S220, the CPU 71 controls the XY robot 40 and the mark camera 46 to image the substrate position reference mark 62 attached to the substrate 60 and the child substrate position reference mark 66 attached to the child substrate 65. Position information is acquired by processing the image. Subsequently, the CPU 71 determines whether or not the component to be mounted this time to be attracted to the suction nozzle 51 is a component that needs to be confirmed (S230). As described above, the mounting order of the parts is set so that the parts that do not need to be confirmed are mounted first. Therefore, the CPU 71 determines in S230 that the component does not need to be confirmed until the mounting of the component requiring confirmation is completed, and sucks the component to the suction nozzle 51 without confirming the mounting state of other components (S240). .. In S240, the CPU 71 controls the parts supply device 14 to supply the parts to the supply position, and controls the XY robot 40 and the head 50 to suck the parts supplied to the supply position to the suction nozzle 51. When it is necessary to replace the suction nozzle 51 mounted on the head 50, the CPU 71 replaces the suction nozzle 51 with a nozzle type required by the nozzle station 49 before sucking the parts. For example, when the component to be mounted is switched from a chip component to a large component or a die component, the small diameter suction nozzle 51 is replaced with a large diameter suction nozzle 51 or a die component suction nozzle 51.

When the component is sucked by the suction nozzle 51, the CPU 71 mounts the component on the substrate 60 (S250) and determines whether or not the mounted component is in the imaging waiting state (S260). In S250, the CPU 71 controls the XY robot 40 and the head 50 to mount the component at a position based on the position information. Here, in the present embodiment, the CPU 71 performs an in-mounting inspection process for inspecting the mounting state of the mounted component in parallel while the component mounting process is being executed. Therefore, in the mounting inspection process, the CPU 71 determines in S260 that the component is waiting for imaging until the imaging required for the inspection is performed. Hereinafter, the inspection process during mounting will be described. FIG. 10 is a flowchart showing an example of the inspection process during mounting.

In the mounting inspection process, the CPU 71 first determines whether or not a component is mounted on the board 60 (S400), and if it is determined that the component is not mounted on the board 60, the CPU 71 ends the mounting inspection process as it is. On the other hand, when it is determined that the component is mounted on the substrate 60, the mounted component is imaged (S410). In S410, the CPU 71 controls the mark camera 46 to take an image of the components mounted on the substrate 60. In this way, the image of the component in the inspection process during mounting is performed while the head 50 immediately after the component is mounted is stopped by using the mark camera 46 for acquiring the position information of the substrate 60. be. When the CPU 71 takes an image of the component in S410, it determines that it is not in the image waiting state in S260 described above. When the image is captured in this way, the CPU 71 inspects the mounting state of the component based on the captured image (S420), stores the inspection result in the RAM 74 (S430), and ends the mounting inspection process. In S420, the CPU 71 processes the obtained image to detect the amount of misalignment of the parts, and determines whether or not they are within the permissible range, so that the mounting state of the parts is normal. Inspect whether or not. Further, the inspection result stored in the RAM 74 is associated with the identification information of the child board 65 and the identification information of the component, and whether or not it is normal is stored. As described above, in the present embodiment, the mounting state of the component is inspected using the image captured by the mark camera 46. When the mounted component is the last component in the child board 65, that is, when the mounted component is the last die component X in the child board 65, the CPU 71 is an image of the component. The inspection of the mounting state of the component may be omitted without imaging the image. This is because the components required for confirmation are not subsequently mounted in the same child substrate 65, and inspection is not required.

Returning to the description of the component mounting process of FIG. 9, when the CPU 71 determines in S260 that it is not in the image pickup waiting state, it determines whether or not there is an adsorbed component in the adsorption nozzle 51 (S270), and the adsorbed component is released. If there is, it returns to S250 and performs processing. Further, when the CPU 71 determines in S270 that there are no components that have been adsorbed, it determines whether or not there are unmounted components on the substrate 60 (S280), and when it determines that there are unmounted components, it returns to S230. Perform processing. When the mounting of the parts that do not need to be confirmed (chip parts a to c) in each child board 65 is completed while the mounting process is repeated, the CPU 71 determines in S230 that the parts to be mounted are the parts that need to be confirmed (die parts Y). Then, the inspection results of the mounted components in the child board 65 to be mounted are acquired from the RAM 74 (S290), and it is determined whether or not the mounting states of all the components are normal based on the inspection results (S300). .. If there is a component for which the inspection result has not been acquired, the CPU 71 waits until the determination result of the component is acquired. Then, when the CPU 71 determines that the mounting state of all the components in the child board 65 to be mounted is normal, the CPU 71 sucks the components required for confirmation in S240 and S250 to the suction nozzle 51 and mounts them on the board 60. In addition, for example, when a component suction failure occurs, a recovery process for mounting the suctioned component again may be executed after the component is discarded. In this embodiment, since the determination based on the inspection result is performed before the parts to be confirmed are sucked to the suction nozzle 51, it is confirmed that the mounting of the parts to be recovered is completed (inspection result of the parts to be recovered). After that, the parts that need to be confirmed can be sucked onto the suction nozzle 51 and mounted.

In this way, components that do not require confirmation, such as chip components a to c, are first mounted in the child board 65, and after confirming that the mounted state of each component is normal based on the inspection results of those components, the die is used. Parts that need to be confirmed, such as component Y, are attracted to the suction nozzle 51 and mounted in the child substrate 65. For this reason, since there are parts whose mounting state is not normal, there is no need to newly mount parts requiring confirmation such as die parts Y on the child board 65 which is likely to be discarded in the inspection process in the subsequent process. , It is possible to prevent wasteful consumption of parts that need to be confirmed. Further, when the die component Y having a low importance is mounted, the mounting state of the die component Y is also inspected by the inspection process during mounting. Then, when the die component Y is mounted on each child substrate 65, the die component X having a high importance is mounted. Therefore, when mounting the die component X, it is confirmed in S290 and S300 that the die component Y in the child board 65 to be mounted is normally mounted based on the inspection result of the die component Y. The die component X can be mounted. Therefore, when the mounting state of the low-importance die component Y is not normal, the high-importance die component X is not mounted, so that the high-importance die component X is not wasted. Since it has already been confirmed that the mounting state of the components (chip components a to c) that do not need to be confirmed is normal when the die component Y is mounted, in S290 and S300 when the die component X is mounted, It suffices to determine whether or not the mounting state is normal only for the other unconfirmed parts (only the die part Y).

If the CPU 71 determines that even one of the mounted components in the child board 65 to be mounted is not in a normal mounting state, the CPU 71 performs error processing (S310) and then proceeds to S280. As an error process, the CPU 71 performs, for example, a process of setting the child board 65 to be mounted this time to a skip board on which components are not mounted.

Then, when the CPU 71 determines in S280 that there are no unmounted components, the CPU 71 carries out the board 60 (S320) and ends the component mounting process. In S320, the CPU 71 controls the backup device 30 to release the fixing of the board 60, and then controls the board transfer device 20 to carry the board 60 out of the device. The component mounting system 1 may include an inspection-dedicated device for inspecting the mounting state of each component in a post-process after the mounting process in the component mounting device 10. Although the component mounting device 10 of the present embodiment inspects the components in the child board 65, the inspection-dedicated device may inspect the mounting state of all the components. Alternatively, if there is an uninspected part in the component mounting device 10 (for example, the last component in the child board 65), the inspection-dedicated device inspects only that component and inspects the inspected component in the component mounting device 10. May be omitted.

Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the present invention will be clarified. The CPU 71, the XY robot 40, and the head 50 of the control device 70 of the component mounting device 10 that executes the component mounting process of FIG. 9 of the present embodiment correspond to the mounting means of the present invention, and the mounting means of the present invention corresponds to S420 of the inspection process during mounting of FIG. The CPU 71 of the control device 70 that executes the processing of the above corresponds to the inspection means. Further, the mark camera 46 and the CPU 71 of the control device 70 that executes the processes of the inspection processes S400 and S410 during mounting correspond to the image pickup means. Further, the display 88 for displaying the component type setting screen of FIG. 4, the input device 87, and the CPU 81 of the management device 80 correspond to the setting receiving means, and the HDD 83 of the management device 80 corresponds to the storage means, and the mounting order of FIG. The CPU 81 of the management device 80 that executes the processing of S100 to S150 of the setting processing corresponds to the mounting order setting means, and the CPU 81 of the management device 80 that executes the processing of S160 of the mounting order setting processing and the communication network 90 serve as the output means. Equivalent to.

The component mounting device 10 of the present embodiment described above requires confirmation-free components (chip components a to c) that do not require confirmation of the mounting state of other components before mounting, and confirmation of the mounting status of other components before mounting. When mounting the parts that need to be confirmed (die parts X and Y) on the board 60, first, the parts that do not need to be checked are mounted on the board 60 and the mounting state of each part is inspected, and then the parts that do not need to be checked are checked based on the inspection results. After confirming that the mounting state of the parts required for confirmation is normal, the parts requiring confirmation are mounted on the board 60. Therefore, if the mounting state of the parts requiring confirmation is not normal, the parts requiring confirmation are not mounted on the board 60 and are wasted. Can be prevented from being consumed.

Further, when the component mounting device 10 mounts the component on the substrate 60, the mark camera 46 takes an image of the component, and inspects the mounting state of the component based on the obtained image. On the other hand, when the component is imaged, the next component is imaged on the substrate 60. Since it is implemented in, the inspection process and the implementation process can be performed in parallel.

Further, the component mounting device 10 confirms that the mounting state of the component (die component Y) whose mounting order is earlier is normal based on the inspection result, and then the component whose mounting order is later confirmed (die). Since the component X) is mounted on the board 60, when a plurality of components requiring confirmation are mounted, it is possible to prevent the components to be mounted later from being wasted. Further, since the management device 80 stores the importance of the parts set as the parts requiring confirmation and sets the mounting order so that the parts with the lowest importance are mounted first, the parts with the higher importance are wasted. It can be prevented from becoming.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be carried out in various embodiments as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the image pickup of the mounted component is performed while the head 50 is stopped, but the image is not limited to this, and may be performed while the head 50 is moving. .. For example, if the mounted component and the identification information (child board reference mark 66, etc.) are included in the same field of view of the mark camera 46, even if the component is imaged by the mark camera 46 while the head 50 is moving. Based on the position of the identification information (child board reference mark 66) in the image, it is possible to grasp the mounting position and the amount of misalignment of the component and inspect the mounting state. As a result, it is possible to shorten the time of the image waiting state and suppress the decrease in mounting efficiency.

In the above-described embodiment, the image pickup of the mounted component is performed immediately after the component is mounted, but the image is not limited to this, and may be performed while the next component is mounted. For example, a component (chip component c) mounted at an adjacent position such as a chip component b and a chip component c and mounted earlier when mounting a later component (chip component b) is the field of view of the mark camera 46. If it is included in the range, the previously mounted component may be imaged during the later mounting of the component. As a result, it is possible to shorten the time of the image waiting state and suppress the decrease in mounting efficiency.

In the above-described embodiment, the component is imaged each time the component is mounted, but the present invention is not limited to this, and a plurality of components may be imaged together. FIG. 11 is a flowchart showing an inspection process during mounting of the modified example. In the flowchart of the modified example, the same process as that of the embodiment is assigned the same step number, and detailed description thereof will be omitted. In the mounting inspection process of the modified example, when the CPU 71 determines that the parts have been mounted in S400, whether or not there are standby parts waiting to be collectively imaged (S440), and the parts to be mounted next time. It is determined whether or not there is (next part) (S450, S480). When the CPU 71 determines that there is no standby component and there is a next component, the current component and the next component have the same field of view of the mark camera 46 based on the position information of the component (current component) mounted this time and the position information of the next component. It is determined whether or not it is included in (S460). When the CPU 71 determines that the current component and the next component are not included in the same field of view of the mark camera 46, or determines that there are no standby components and no next component in S440 and S450, the CPU 71 captures the component this time with the mark camera 46. Then, the mounting state is inspected, the inspection result is stored in the RAM 74 (S410 to S430), and the mounting inspection process is terminated. On the other hand, when the CPU 71 determines in S460 that the current component and the next component are included in the same field of view of the mark camera 46, the CPU 71 sets the component as a standby component (S470) and ends the mounting inspection process. When the component is set as the standby component this time, it is determined in S260 of the component mounting process of FIG. 10 that the component is not in the image waiting state. Here, for example, when the CPU 71 first mounts the upper left chip component a1 in the child board 65, it determines that there is no standby component, and the upper left chip component a1 and the chip component c have the same field of view of the mark camera 46. If it is determined that the chip component a1 is not included in the range, imaging and inspection of the chip component a1 are performed. On the other hand, when the CPU 71 determines that there is no standby component when the chip component c in the child board 65 is mounted, and determines that the chip component c and the chip component b are included in the same field of view of the mark camera 46, the chip The component c is set as a standby component.

When the CPU 71 executes the mounting inspection process after setting the standby component in S470, it determines that there is a standby component in S440, and if it determines that there is a next component in S480, the standby component, the current component, and the next component are marked. It is determined whether or not the camera 46 is included in the same field of view (S490). When the CPU 71 determines that the standby component, the current component, and the next component are included in the same field of view of the mark camera 46, the CPU 71 newly sets the standby component as the standby component (S470), and ends the mounting inspection process. On the other hand, when the CPU 71 determines in S490 that the standby component, the current component, and the next component are not included in the same field of view of the mark camera 46, or determines in S480 that there is no next component, the mark camera 46 determines that the standby component is a standby component. This time, the parts are collectively imaged (S410a), the standby parts and the mounting state of the parts are inspected based on the obtained images (S420a), the inspection results are stored in the RAM 74 (S430a), and the inspection process during mounting is performed. To finish. For example, when the chip component b is mounted in a state where the chip component c is set as a standby component, the CPU 71 has a chip component c which is a standby component, a chip component b which is a component this time, and a chip at the lower right which is a next component. If it is determined that the component a2 is not included in the same field of view of the mark camera 46, the chip component c, which is a standby component, and the chip component b, which is a component this time, are collectively imaged and inspected. In this way, by collectively imaging and inspecting the parts included in the same visual field range of the mark camera 46, it is possible to shorten the time in the imaging waiting state. Therefore, it is possible to suppress a decrease in mounting efficiency due to inspection during mounting.

In the above-described embodiment, the mounting state of all the confirmation-free parts is inspected, but the present invention is not limited to this, and the inspection of the mounting state of some confirmation-free parts may be omitted. When the inspection is omitted, the management device 80 may accept the setting of whether or not to inspect. FIG. 12 is an explanatory diagram showing an example of a setting screen for checking necessity after mounting. As shown in FIG. 12A, it is possible to set whether or not to inspect each part type. For example, the chip parts a and c may be inspected and the chip part b may be omitted. Alternatively, as shown in FIG. 12B, it is possible to set whether or not to inspect based on the mounting order, and the chip components (chip component a1 and chip component c) having the first and second mounting order are inspected. Inspection may be omitted for the chip components (chip component b and chip component a2) whose mounting order is the third and fourth. It may be possible to set whether or not to inspect by combining the component type and the mounting order. For example, the second chip component a2 among the chip components a mounted on the child board 65 may omit the inspection. good. The management device 80 stores the setting of whether or not to perform the inspection received via the inspection necessity setting screen in the HDD 83, includes it in the mounting information, and transmits it to the component mounting device 10. When the inspection of some parts is omitted, in the mounting inspection process of FIG. 10, when the CPU 71 determines that the parts are mounted in S400, if the parts are subject to inspection omission, the mounting inspection process is performed as it is. It may be determined in S260 of FIG. 9 that the state is not waiting for imaging. Further, in the mounting inspection process of the modification of FIG. 11, the CPU 71 may use the next component that is not the target of omission of inspection (inspection) as the next component. Then, in S300 of the component mounting process of FIG. 9, if the mounted state of the inspected component is normal, the CPU 71 has the mounted state of all the components in the child board 65 to be mounted including the component whose inspection is omitted. Judge as normal. By doing so, the inspection time can be shortened as compared with the case of inspecting all the parts that do not require confirmation (chip parts a to c). In addition, excessive inspection is suppressed when it is not necessary to inspect the mounting status of all parts, such as mounting multiple parts of the same type or mounting parts that are relatively unlikely to cause mounting defects. At the same time, it is possible to prevent the parts that need to be confirmed from being wasted.

In the above-described embodiment, two levels of importance, "high" and "low", are set, but the present invention is not limited to this, and a plurality of levels of three or more levels may be set. Alternatively, a more specific numerical value may be set as the importance, and for example, the price of the component may be set. When setting the price of a part, the management device 80 can accept the price of each part and the standard price (threshold value), and the part whose price is less than the standard price is set as a less important part, and the price is the standard. Parts above the price may be set as parts of high importance. Alternatively, it may be possible to set the importance based on the number of parts in stock, and the parts in which the number of parts in stock is equal to or higher than the threshold value and the parts have a margin in stock are set as the parts of low importance, and the number of parts in stock is less than the threshold value. Parts that are not in stock may be set as parts of high importance. It should be noted that these prices, the number of stocks, and the like are not limited to the setting of importance, and may be used for setting whether the parts do not require confirmation or the parts need to be confirmed. That is, in the management device 80, low-priced parts may be set as confirmation-unnecessary parts, high-priced parts may be set as confirmation-needed parts, and parts with a large inventory quantity may be set as confirmation-unnecessary parts, and the number of stocks may be set. Parts with a small number of parts may be set as parts that require confirmation.

In the above-described embodiment, the camera for imaging the mounted component is also used as the mark camera 46 for imaging various marks attached to the substrate, but the present invention is not limited to this, and the mounted component is imaged. A dedicated camera (imaging means) for this purpose may be provided.

The present invention can be used in the manufacturing industry of component mounting devices and the like.

1 component mounting system, 10 component mounting device, 12 main body frame, 14 component supply device, 16 tray feeder, 18 tape feeder, 20 board transfer device, 30 backup device, 40 XY robot, 46 mark camera, 49 nozzle station, 50 head , 51 suction nozzle, 60 board, 62 board position reference mark, 65 child board, 66
Child board position reference mark, 70 control device, 71 CPU, 72 ROM, 73 HDD, 74 RAM, 75 input / output interface, 76 bus, 80 management device, 81
CPU, 82 ROM, 83 HDD, 84 RAM, 85 input / output interfaces, 86 buses, 87 input devices, 88 displays, 90 communication networks.

Claims (3)

A parts supply device that supplies parts and
A board transfer device that transports boards and
A head that attracts components supplied from the component supply device to a plurality of nozzles and mounts them on a substrate conveyed by the substrate transfer device.
An XY robot that moves the head in the X direction that conveys the substrate and in the Y direction that intersects the X direction at a right angle in a horizontal plane.
A mark camera that captures a mark attached to the surface of the substrate and also captures a component mounted on the substrate by the head.
A CPU that acquires position information by processing the image of the mark captured by the mark camera and inspects the mounting state of the component based on the image of the component captured by the mark camera. Prepare,
The image of the component by the mark camera is performed while the head is stopped immediately after the component is mounted, and when the imaging of the component is completed, a process of inspecting the mounting state of the component and the plurality of processes are performed. A component mounting device that performs the process of mounting the next component on the board among the components adsorbed on the nozzle in parallel . The component mounting device according to claim 1.
When the CPU determines that the current component and the next component are included in the same field of view of the mark camera, the CPU does not inspect the mounting state of the current component, but performs an inspection together with the inspection of the next component. .. A parts supply device that supplies parts and
A board transfer device that transports boards and
A head that picks up and mounts the components supplied from the component supply device on the substrate conveyed by the substrate transfer device.
A mark camera that captures a mark attached to the surface of the substrate and also captures a component mounted on the substrate by the head.
An XY robot that moves the head and the mark camera in the X direction that conveys the substrate and in the Y direction that intersects the X direction at a right angle in a horizontal plane.
A CPU that acquires position information by processing the image of the mark captured by the mark camera and inspects the mounting state of the component based on the image of the component captured by the mark camera. Prepare,
After controlling the XY robot to move the head to the mounting position and mounting the component on the substrate, the mounted component is imaged by the mark camera without moving from the mounting position. If the component and the identification information are included in the same viewing range of the mark camera, the component is imaged by the mark camera while the head is moving.
Component mounting device.

Images