JP7063995B2 - Parts recognition device and parts recognition method - Google Patents

Description

This specification discloses a technique relating to a component recognition device and a component recognition method.

The mounting machine described in Patent Document 1 photographs a first candidate region in which a feature portion is located by a camera. A feature portion is a portion of an area of a part or part containing container that indicates the orientation of the part or part containing container when the part or part containing container is arranged in the proper orientation. Further, in the mounting machine described in Patent Document 1, when the feature portion is not recognized in the first candidate region, the feature portion is located when the component or the component storage container is arranged in a non-regular orientation. Take a picture of the candidate area of.

Japanese Unexamined Patent Publication No. 2008-021946

The position of the predetermined portion (for example, the above-mentioned feature portion) of the component held by the holding member differs depending on the holding posture of the component. Therefore, in the mounting machine described in Patent Document 1, it is difficult to specify the position of a predetermined portion (for example, the above-mentioned feature portion) of the component held by the holding member.

In view of such circumstances, the present specification discloses a component recognition device and a component recognition method capable of acquiring the position of a predetermined portion of a component held by a holding member.

The present specification discloses a component recognition device including a first acquisition unit and a second acquisition unit. The first acquisition unit acquires the holding posture of the component in the holding member based on the first image taken by imaging the component held by the holding member. The second acquisition unit acquires the position of a predetermined portion of the component based on the second image taken by photographing at least a part of the component after the holding posture of the component is acquired. The second acquisition unit sets a plurality of specific areas in which the predetermined portion is expected to exist based on the holding posture of the component acquired by the first acquisition unit, and the plurality of specific areas . When the presence or absence of the predetermined portion is determined to acquire the position of the predetermined portion and it is determined that there is a possibility of erroneous recognition in the determination of the presence or absence of the predetermined portion, when the second image is imaged. The presence or absence of the predetermined portion is determined again by changing the imaging conditions or the method of image processing of the second image .

Further, the present specification discloses a component recognition method including a first acquisition step and a second acquisition step. In the first acquisition step, the holding posture of the component in the holding member is acquired based on the first image taken by imaging the component held by the holding member. In the second acquisition step, after the holding posture of the component is acquired, at least a part of the component is imaged and the position of a predetermined portion of the component is acquired based on the captured second image. In the second acquisition step, a plurality of specific regions in which the predetermined portion is expected to exist are set based on the holding posture of the component acquired by the first acquisition step, and the plurality of specific regions are set . When the presence or absence of the predetermined portion is determined, the position of the predetermined portion is acquired , and it is determined that there is a possibility of erroneous recognition in the determination of the presence or absence of the predetermined portion, when the second image is imaged. The presence or absence of the predetermined portion is determined again by changing the imaging conditions or the method of image processing of the second image .

According to the above-mentioned component recognition device, the first acquisition unit and the second acquisition unit are provided. In particular, the second acquisition unit sets a plurality of specific areas in which a predetermined part is expected to exist based on the holding posture of the part acquired by the first acquisition unit, and the predetermined part is set for the plurality of specific areas. If the presence or absence is judged and the position of the predetermined part is acquired , and it is judged that there is a possibility of erroneous recognition in the judgment of the presence or absence of the predetermined part, the imaging conditions for capturing the second image or the second image The image processing method is changed, and the existence or nonexistence of the predetermined part is judged again . As a result, the component recognition device can acquire the position of a predetermined portion of the component held by the holding member, and can reduce erroneous recognition of the predetermined portion . The above-mentioned matters regarding the component recognition device can be applied to the component recognition method as well.

It is a top view which shows the structural example of the component mounting machine 10. It is a top view which shows an example of a part 80. It is a schematic diagram which shows the structural example of the component camera 14 which is an image pickup apparatus CD1. It is a block diagram which shows an example of the control block of a component recognition apparatus 70. It is a flowchart which shows an example of the control procedure by a part recognition apparatus 70. It is a schematic diagram which shows an example of the 1st image PC1. It is a schematic diagram which shows an example of the 2nd image PC2 which imaged the specific area SA1 shown in FIG. It is a schematic diagram which shows an example of the 2nd image PC2 which imaged the specific area SA2 shown in FIG. It is a schematic diagram which shows an example of the 2nd image PC2 which imaged the specific area SA3 shown in FIG. It is a schematic diagram which shows an example of the 2nd image PC2 which imaged the specific area SA4 shown in FIG. It is a top view which shows an example of the mounting state of the component 80 when the mounting position is not corrected. It is a top view which shows an example of the mounting state of the component 80 when the mounting position is corrected by the correction unit 73. It is a top view which shows another example of a part 80. It is a schematic diagram which shows another example of the 1st image PC1.

1. 1. Embodiment 1-1. Configuration Example of Parts Mounting Machine 10 As shown in FIG. 1, the parts mounting machine 10 includes a board transfer device 11, a parts supply device 12, a parts transfer device 13, a parts camera 14, a board camera 15, and a control device 16. There is. The substrate transfer device 11 is composed of a belt conveyor or the like, and conveys the substrate 90 in the transfer direction (X-axis direction). The substrate 90 is a circuit board and forms at least one of an electronic circuit and an electric circuit. The board transfer device 11 carries the board 90 into the machine of the component mounting machine 10 and positions the board 90 at a predetermined position in the machine. The board transfer device 11 carries out the board 90 to the outside of the component mounting machine 10 after the mounting process of the component 80 by the component mounting machine 10 is completed.

The component supply device 12 supplies the component 80 to be mounted on the substrate 90. Specifically, the component supply device 12 includes a plurality of feeders 121 provided along the transport direction (X-axis direction) of the substrate 90. Each of the plurality of feeders 121 feeds the carrier tape containing the plurality of parts 80 at a pitch, and supplies the parts 80 so that the parts 80 can be collected at the collection position provided on the tip end side of the feeder 121. The component supply device 12 can also supply electronic components (for example, lead components) that are relatively large in size compared to chip components and the like in a state of being arranged on the tray.

The component transfer device 13 includes a head drive device 131 and a moving table 132. The head drive device 131 is configured to be able to move the moving table 132 in the X-axis direction and the Y-axis direction by a linear motion mechanism. The moving table 132 is provided with a component mounting head 20 detachably (replaceably) by a clamp member (not shown). The component mounting head 20 mounts the component 80 on the substrate 90 in which the component 80 is collected and positioned. Specifically, the component mounting head 20 collects the component 80 supplied by the component supply device 12 by the holding member 30, and mounts the component 80 at a predetermined mounting position of the positioned substrate 90.

As the component camera 14 and the substrate camera 15, for example, a digital image pickup device having an image pickup element 141 can be used. As the image pickup device 141, for example, an image sensor such as a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) can be used. The component camera 14 and the board camera 15 perform imaging based on a control signal transmitted from the control device 16. The component camera 14 and the board camera 15 send the image data acquired by imaging to the control device 16.

The component camera 14 is fixed to the base of the component mounting machine 10 so that the optical axis faces upward (vertically upward) in the Z-axis direction. The component camera 14 can take an image of the component 80 held by the holding member 30 from below. The board camera 15 is provided on the moving table 132 of the component transfer device 13 so that the optical axis faces downward (vertically downward) in the Z-axis direction. The board camera 15 can take an image of the board 90 from above.

The control device 16 includes a central processing unit 161 and a storage device 162 and an interface 163, which are electrically connected via a bus 164. The central processing unit 161 is a CPU (Central Processing Unit) and can perform various arithmetic processes. The storage device 162 includes a volatile storage device 162a, a first non-volatile storage device 162b, and a second non-volatile storage device 162c.

The volatile storage device 162a is a volatile storage device (RAM: Random Access Memory), and can temporarily store various data in a state where power is supplied. The data includes the calculation result processed by the central processing unit 161. As the volatile storage device 162a, for example, a volatile storage device such as a DRAM (Dynamic Random Access Memory) or a SRAM (Static Random Access Memory) can be used.

The first non-volatile storage device 162b is a non-volatile storage device (ROM: Read Only Memory), and can store various data even when power is not supplied. The first non-volatile storage device 162b stores, for example, a control program and predetermined mounting conditions set in advance. Therefore, the first non-volatile storage device 162b can use, for example, a mask ROM in which the stored data cannot be rewritten. Further, as the first non-volatile storage device 162b, for example, a non-volatile storage device such as a flash memory or an EEPROM (Electrically Erasable Programmable Read Only Memory) that can rewrite stored data can be used. In this case, the manager of the component mounting machine 10 can easily respond to, for example, version upgrade of the control program.

The second non-volatile storage device 162c is a non-volatile storage device, and for example, a magnetic storage device such as a hard disk drive (HDD: Hard Disk Drive), an optical storage device such as an optical disk, or the like can be used. The second non-volatile storage device 162c is a non-volatile storage device in which data can be rewritten. The second non-volatile storage device 162c can store a large amount of large amounts of data as compared with the first non-volatile storage device 162b. The data may include image data captured by the component camera 14 and the substrate camera 15. As the second non-volatile storage device 162c, for example, a non-volatile storage device such as a flash memory or EEPROM can be used.

The interface 163 is a device that electrically connects the device inside the component mounting machine 10 and the control device 16, and for example, a communication interface, an input / output interface, or the like can be used. The control device 16 is electrically connected to the board transfer device 11, the component supply device 12, the component transfer device 13, the component camera 14, and the substrate camera 15 via the interface 163. Further, the interface 163 can also electrically connect the device outside the machine of the component mounting machine 10 and the control device 16.

In the mounting process of mounting the component 80 on the substrate 90, the control device 16 is input with information output from a plurality of various sensors provided in the component mounting machine 10 and the result of recognition processing by image processing or the like. The control device 16 sends a control signal to the component transfer device 13 based on a control program, preset mounting conditions, and the like. The control device 16 can control, for example, the position and rotation angle of the holding member 30.

Specifically, the control device 16 uses the component camera 14 to take an image of the component 80 held by the holding member 30. The control device 16 recognizes the holding posture of the component 80 in the holding member 30 based on the image data acquired by the image pickup of the component camera 14. At this time, the control device 16 recognizes the holding posture of the component 80 by, for example, grasping the portion of the component 80 that is the reference for positioning with respect to the substrate 90, the portion characteristic of the appearance of the component 80, and the like by image processing. be able to.

Next, the control device 16 moves the component mounting head 20 toward the upper side of the predetermined position on the substrate 90. At this time, the control device 16 corrects the position and rotation angle of the holding member 30 based on the holding posture of the component 80 recognized by the image processing. Then, the control device 16 lowers the holding member 30 to mount the component 80 on the substrate 90. The component 80 mounted on the substrate 90 is held by, for example, a tack force due to the viscosity of the bonding material (for example, cream solder) previously applied to the upper surface of the substrate 90. The control device 16 executes a mounting process for mounting a plurality of components 80 on the substrate 90 by repeating the above-mentioned pick-and-place cycle. The time required for the above-mentioned pick-and-place cycle is called cycle time.

1-2. Configuration Example of the Component Camera 14 The component 80 shown in FIG. 2 is a BGA (Ball Grid Array), and includes a direction check mark 81 and a plurality of solder balls 82. The direction check mark 81 is a portion capable of determining the correctness of the mounting direction of the component 80 when the component 80 is mounted on the substrate 90, and is included in the predetermined portion PP1 described later. The direction check mark 81 is formed at one of the four corners of the outer edge of the component 80. The plurality of solder balls 82 are arranged in a grid pattern (17 × 18 in the figure), and electrodes are formed. As shown in FIG. 3, the solder ball 82 is formed in a hemispherical shape. In the figure, eight solder balls 82 are shown for convenience of illustration.

FIG. 3 shows a configuration example of a component camera 14 capable of capturing the above-mentioned component 80. The component camera 14 includes an image pickup element 141, a lens 142, and a light source 143. As described above, as the image pickup device 141, an image sensor such as a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) can be used. The image pickup element 141 is a two-dimensional image sensor, and includes a plurality of light receiving elements arranged in a plane. As a result, the component camera 14 has a two-dimensional imaging field of view. In the example shown in FIG. 2, each imaging region of the plurality (4) unit images PU1 to PU4 corresponds to the imaging field of view of the component camera 14.

As the lens 142, a known condensing lens can be used, and a plurality of convex lenses and concave lenses can be combined to form an optical system. As the lens 142, for example, an aspherical lens with reduced spherical aberration or a low-dispersion lens with reduced light dispersion and reduced chromatic aberration can be used. The focal length of the lens 142 is set so that the focal length of the lens 142 matches the component 80.

The light source 143 includes a first light source 143a, an epi-illumination generation unit 143b, and a second light source 143c. The first light source 143a and the second light source 143c irradiate the component 80 with light. As the first light source 143a and the second light source 143c, for example, a known light emitting diode (Light Emitting Diode) can be used, and the wavelength of the light to be irradiated is not limited. The epi-illumination generation unit 143b generates coaxial epi-illumination light from the light emitted from the first light source 143a. For the epi-illumination generation unit 143b, for example, a half mirror can be used.

The direction check mark 81 is arranged so as to be recognizable by specular reflection. Therefore, the first light source 143a irradiates light toward the epi-illumination generation unit 143b in the Y-axis direction (arrow L11). The light emitted from the first light source 143a is reflected by the epi-illumination generation unit 143b and travels toward the direction check mark 81 (arrow L12). The reflection angle is set to 90 degrees. The light reflected again by the direction check mark 81 travels toward the lens 142 (arrow L13). The light that reaches the lens 142 passes through the lens 142 and travels toward the image pickup device 141 (arrow L14). The optical path at this time is referred to as the first optical path OP1.

The solder ball 82 is a hemispherical protrusion (bump), and the second light source 143c irradiates light from diagonally below the solder ball 82 so that the solder ball 82 can be easily recognized (arrow L21). The light reflected by the solder ball 82 travels toward the lens 142 (arrow L22). The light that reaches the lens 142 passes through the lens 142 and travels toward the image pickup device 141 (arrow L23). The optical path at this time is referred to as the second optical path OP2. The focal position on the component 80 side is defined as the focal position FP1, and the focal position on the image sensor 141 side is defined as the focal position FP0.

1-3. Configuration Example of Parts Recognition Device 70 The parts recognition device 70 includes a first acquisition unit 71 and a second acquisition unit 72 when viewed as a control block. It is preferable that the component recognition device 70 further includes at least one of the correction unit 73 and the storage unit 74. As shown in FIG. 4, the component recognition device 70 of the present embodiment includes a first acquisition unit 71, a second acquisition unit 72, a correction unit 73, and a storage unit 74. Further, the component recognition device 70 of the present embodiment is provided in the control device 16.

Further, the component recognition device 70 executes the control program according to the flowchart shown in FIG. The first acquisition unit 71 performs the process shown in step S11. The second acquisition unit 72 performs the process shown in step S12. The correction unit 73 performs the process shown in step S13. The storage unit 74 performs the process shown in step S14. The order of the processes shown in steps S13 and S14 can be changed.

1-3-1. First acquisition department 71
The first acquisition unit 71 acquires the holding posture of the component 80 in the holding member 30 based on the first image PC1 in which the component 80 held by the holding member 30 is imaged and captured (step S11). It is preferable that the first acquisition unit 71 acquires the first image PC1 by synthesizing a plurality of (for example, four) unit images PU1 to PU4 which are images obtained by capturing a part of the component 80 and have different imaging regions. ..

Specifically, the first acquisition unit 71 moves the component mounting head 20 shown in FIG. 3, for example, aligns the imaging field of view of the component camera 14 with the region shown by the unit image PU1 shown in FIG. Then, the first acquisition unit 71 outputs an image pickup start signal to the image pickup element 141 and the second light source 143c shown in FIG. When the image pickup start signal is output, the second light source 143c irradiates the component 80 (plurality of solder balls 82) with light for a predetermined exposure time. Then, the image pickup device 141 simultaneously captures a plurality of solder balls 82 in the region indicated by the unit image PU1.

Next, the first acquisition unit 71 moves the component mounting head 20 so that, for example, the imaging field of view of the component camera 14 is aligned with the region indicated by the unit image PU2. Then, the first acquisition unit 71 outputs an image pickup start signal to the image pickup element 141 and the second light source 143c. When the image pickup start signal is output, the second light source 143c irradiates the component 80 (plurality of solder balls 82) with light for a predetermined exposure time. Then, the image pickup device 141 simultaneously captures a plurality of solder balls 82 in the region indicated by the unit image PU2. Similarly, the first acquisition unit 71 causes the component camera 14 to image the regions indicated by the unit image PU3 and the unit image PU4, respectively. The first acquisition unit 71 can image a plurality of (four) unit images PU1 to PU4 in an arbitrary order.

The first acquisition unit 71 performs image processing on each of the plurality (four) unit images PU1 to PU4 captured, and acquires the shape data of the plurality of solder balls 82. Various methods can be adopted for image processing. The image processing may be one processing such as binarization and edge processing, or may be a plurality of processing in which these processings are combined. As shown in FIG. 6, the plurality (4) unit images PU1 to PU4 have a portion where the imaging regions overlap. The first acquisition unit 71 acquires the first image PC1 by synthesizing the captured unit images PU1 to PU4 based on the shape data of the plurality of solder balls 82 in the portion where the imaging regions overlap.

The first acquisition unit 71 acquires the holding posture of the component 80 in the holding member 30 based on the first image PC1. The first non-volatile storage device 162b shown in FIG. 1 stores in advance a regular holding posture (arrangement of a plurality of solder balls 82) of the component 80. The first acquisition unit 71 has a regular holding posture of the component 80 (arrangement of the plurality of solder balls 82) and a holding posture of the component 80 acquired based on the first image PC1 (arrangement of the plurality of solder balls 82). To compare. As a result, the first acquisition unit 71 can acquire the holding posture (rotation angle) of the component 80.

When acquiring a deviation from the regular holding position as the holding posture of the component 80, it is preferable that the component mounting head 20 includes an imaging reference unit (not shown). Then, the first acquisition unit 71 may image the image pickup reference unit together with the component 80 (plurality of solder balls 82) in at least one of the plurality (four) unit images PU1 to PU4. As a result, the first acquisition unit 71 can acquire, for example, the distance between the image pickup reference unit and the center position of the component 80 (plurality of solder balls 82), and the regular holding position is based on the distance. The deviation from can be obtained.

When the focal position of the imaging reference unit is different from the focal position FP1 of the component 80, it is preferable to arrange a refraction member (not shown) whose focal position can be adjusted on the lens 142. As the refraction member, for example, various lenses such as columnar optical glass, plastic, fluorite, and an aspherical lens can be used. As a result, the component camera 14, which is the image pickup apparatus CD1, can simultaneously image the image pickup reference unit and the component 80 (plurality of solder balls 82) having different focal positions.

1-3-2. Second acquisition department 72
The second acquisition unit 72 acquires the position of the predetermined portion PP1 of the component 80 based on the second image PC2 in which at least a part of the component 80 is imaged and captured after the holding posture of the component 80 is acquired. Further, the second acquisition unit 72 sets specific regions SA1 to SA4 in which the predetermined region PP1 is expected to exist based on the holding posture of the component 80 acquired by the first acquisition unit 71, and sets the predetermined region PP1. (Step S12 shown in FIG. 5). The predetermined portion PP1 may be any portion as long as it can be specified in the component 80, and is not limited. The predetermined portion PP1 of the present embodiment is a direction check mark 81 capable of determining whether or not the mounting direction of the component 80 is correct when the component 80 is mounted on the substrate 90.

As described above, the direction check mark 81 is formed at one of the four corners of the outer edge of the component 80. Therefore, when the predetermined portion PP1 is the direction check mark 81, the specific regions SA1 to SA4 are regions shown in FIGS. 2 and 6. In the specific regions SA1 to SA4 shown in FIG. 6, the specific regions SA1 to SA4 shown in FIG. 2 rotate counterclockwise according to the holding posture of the component 80. The second acquisition unit 72 can know the rotation angle of the component 80 at this time based on the holding posture of the component 80 acquired by the first acquisition unit 71, and can obtain the specific regions SA1 to SA4 shown in FIG. Can be set.

It is preferable that the second acquisition unit 72 determines the presence or absence of the predetermined portion PP1 based on the second image PC2 that images the specific regions SA1 to SA4. Further, it is preferable that the second acquisition unit 72 sets the specific regions SA1 to SA4 in the regions of interest IA1 to IA4 for the image pickup apparatus CD1 and images the specific regions SA1 to SA4 using the image pickup apparatus CD1. The second acquisition unit 72 of the present embodiment causes the component camera 14, which is the image pickup apparatus CD1, to set the specific regions SA1 to SA4 shown in FIG. 6 in the regions of interest IA1 to IA4, respectively. Then, the second acquisition unit 72 images the specific regions SA1 to SA4 using the component camera 14, and acquires the position of the predetermined portion PP1 based on the imaged second image PC2.

Specifically, the component camera 14 which is the image pickup apparatus CD1 sets the region of interest IA1 for the specific region SA1 shown in FIG. 6, for example. The region of interest IA1 is a known ROI (Region Of Interest) and can be set by the component camera 14. Then, the second acquisition unit 72 outputs an image pickup start signal to the image pickup element 141 and the first light source 143a. When the image pickup start signal is output, the first light source 143a irradiates the direction check mark 81 with light for a predetermined exposure time. Then, the image pickup device 141 takes an image of the specific region SA1.

FIG. 7A shows an example of the second image PC2 in which the specific region SA1 shown in FIG. 6 is imaged. A direction check mark 81, which is a predetermined portion PP1, is present in the second image PC2 that captures the specific region SA1. Therefore, the second acquisition unit 72 can determine that the position of the predetermined portion PP1 (direction check mark 81) is the specific region SA1. If the predetermined portion PP1 (direction check mark 81) does not exist in the second image PC2, the second acquisition unit 72 may use the predetermined portion PP1 based on, for example, the second image PC2 in which the specific region SA4 is imaged. Judge the existence. Further, the second acquisition unit 72 causes the component camera 14 to set the specific region SA4 to the region of interest IA4, and uses the component camera 14 to take an image of the specific region SA4. In the present embodiment, the arrangement of the plurality of solder balls 82 is rectangular, and there is a high possibility that the predetermined portion PP1 (direction check mark 81) exists in the second image PC2 in which the specific region SA4 is imaged.

When the predetermined portion PP1 (direction check mark 81) does not exist in the second image PC2 in which the specific region SA4 is imaged, the second acquisition unit 72 may use the predetermined portion 72 based on, for example, the second image PC2 in which the specific region SA2 is imaged. Determine the presence or absence of PP1. The second acquisition unit 72 causes the component camera 14 to set the specific region SA2 to the region of interest IA2, and uses the component camera 14 to image the specific region SA2. Further, when the predetermined portion PP1 (direction check mark 81) does not exist in the second image PC2 in which the specific region SA2 is imaged, the second acquisition unit 72 determines the predetermined portion based on the second image PC2 in which the specific region SA3 is imaged. Determine the presence or absence of PP1. The second acquisition unit 72 causes the component camera 14 to set the specific region SA3 to the region of interest IA3, and uses the component camera 14 to image the specific region SA3.

The above can be said for the specific regions SA1 as well for the specific regions SA2 to SA4. Further, the above-mentioned matters regarding the region of interest IA1 can be similarly applied to the regions of interest IA2 to IA4. The order in which the presence or absence of the predetermined portion PP1 is determined is not limited. For example, when the arrangement of the plurality of solder balls 82 is square, the second acquisition unit 72 can determine the presence / absence of the predetermined portion PP1 (direction check mark 81) in any order for the specific regions SA1 to SA4. ..

7B to 7D show an example of the second image PC2 in which the specific regions SA2 to SA4 shown in FIG. 6 are imaged. The direction check mark 81, which is a predetermined portion PP1, does not exist in the second image PC2 that images the specific regions SA2 to SA4. Therefore, it can be said that the determination that the position of the predetermined portion PP1 (direction check mark 81) described above is the specific region SA1 is valid. As described above, the second acquisition unit 72 determines the existence or nonexistence of the predetermined portion PP1 in the plurality of specific regions SA1 to SA4 in which the predetermined portion PP1 is expected to exist, for example, due to the adhesion of foreign matter or the like. It is possible to reduce the erroneous recognition of the predetermined portion PP1.

For example, if the predetermined portion PP1 (direction check mark 81) is present in the second image PC2 for both the specific region SA1 and the specific region SA4, there is a possibility that the predetermined portion PP1 (direction check mark 81) is erroneously recognized. In this case, the second acquisition unit 72 changes, for example, the imaging conditions when acquiring the second image PC2, the image processing method of the second image PC2, and the like, and the presence or absence of the predetermined portion PP1 (direction check mark 81). It is good to judge again.

Further, the second acquisition unit 72 can also extract the specific regions SA1 to SA4 from the second image PC2 and determine the presence or absence of the predetermined portion PP1. Specifically, the second acquisition unit 72 moves the component mounting head 20 shown in FIG. 3, for example, to align the imaging field of view of the component camera 14 with the region shown by the unit image PU1 shown in FIG. Then, the second acquisition unit 72 outputs an image pickup start signal to the image pickup element 141 and the first light source 143a. When the image pickup start signal is output, the first light source 143a irradiates the direction check mark 81 with light for a predetermined exposure time. Then, the image pickup device 141 takes an image of the region indicated by the unit image PU1. The second acquisition unit 72 can extract the specific region SA1 from the second image PC2 and determine the presence or absence of the predetermined portion PP1 (direction check mark 81). The above can be said for the specific regions SA1 as well for the specific regions SA2 to SA4.

1-3-3. Correction unit 73
The correction unit 73 corrects at least one of the mounting position P2 and the mounting angle θ1 of the component 80 when the component 80 is mounted on the substrate 90, based on the position of the predetermined portion PP1 acquired by the second acquisition unit 72. (Step S13 shown in FIG. 5). As described above, the holding posture (rotation angle) of the component 80 acquired by the first acquisition unit 71 is acquired based on the arrangement of the plurality of solder balls 82. Therefore, when the arrangement of the plurality of solder balls 82 is rectangular, two holding postures in which the rotation angles differ by 180 degrees are assumed. By acquiring the position of the predetermined portion PP1 (direction check mark 81) by the second acquisition unit 72, the holding posture (rotation angle) of the component 80 held by the holding member 30 is determined. When the arrangement of the plurality of solder balls 82 is square, four holding postures with rotation angles of 0 degrees, 90 degrees, 180 degrees, and 270 degrees are assumed.

The component 80 shown by the broken line in FIG. 8A is held by the holding member 30 without rotating at the center position 80a of the component 80, and is mounted at the mounting position P1 of the substrate 90 without being corrected by the correction unit 73. It shall be. The holding posture at this time is defined as the first holding posture, and the mounting state at this time is defined as the first mounting state. Further, the first holding posture is the regular holding posture, and the first mounting state is the regular mounting state.

As shown by the solid line in FIG. 8A, the component 80 is rotated counterclockwise by a deviation ΔX minutes from the center position 80a of the component 80 in the direction opposite to the X-axis direction (negative direction of the X-axis) by a mounting angle θ1 minutes at the moved position. It is assumed that the component 80 is held by the holding member 30 in this state. The holding posture at this time is defined as the second holding posture. If the correction unit 73 does not perform correction when the holding posture is the second holding posture, the component 80 will be mounted on the substrate 90 in the state shown by the solid line in FIG. 8A.

Therefore, as shown in FIG. 8B, the correction unit 73 sets the position moved from the mounting position P1 in the direction opposite to the X-axis direction (negative direction of the X-axis) by a deviation ΔX as the mounting position P2. Further, the correction unit 73 sets the correction rotation angle of the holding member 30 as the mounting angle θ1 (clockwise). As a result, the holding member 30 is lowered at the mounting position P2 in a state of being rotated clockwise for a mounting angle of θ1 minutes. As a result, the component 80 is mounted on the substrate 90 as shown by the solid line in FIG. 8B. The mounting state at this time is the same as the first mounting state shown in FIG. 8A. In this way, the correction unit 73 can correct at least one of the mounting position P2 and the mounting angle θ1 of the component 80 based on the position of the predetermined portion PP1 acquired by the second acquisition unit 72.

1-3-4. Preservation unit 74
The storage unit 74 stores the position of the predetermined portion PP1 acquired by the second acquisition unit 72 in the storage device 162 (step S14 shown in FIG. 5). Specifically, the storage unit 74 can store the position of the predetermined portion PP1 acquired by the second acquisition unit 72 in the second non-volatile storage device 162c shown in FIG.

For example, when a defect occurs in the component mounting machine 10, the manager who manages the component mounting machine 10 may analyze the defect. In this case, the administrator saves the operating state during the operation of the component mounting machine 10, and traces (tracks) the operation of the component mounting machine 10 based on the saved operation history. In the present embodiment, the second acquisition unit 72 acquires the position of the predetermined portion PP1 (direction check mark 81). Therefore, the storage unit 74 stores the position of the predetermined portion PP1 (direction check mark 81) in the storage device 162 (second non-volatile storage device 162c), so that the administrator can change the holding state of the component 80 by the holding member 30. Can be traced.

Further, the storage unit 74 can also store the image data used when acquiring the position of the predetermined portion PP1 (direction check mark 81) in the storage device 162 (second non-volatile storage device 162c). It is preferable that the image data includes at least the image data related to the second image PC2 of the first image PC1 and the second image PC2. When the second image PC2 is an image obtained by capturing the specific areas SA1 to SA4, the data capacity at the time of storing the image data is reduced as compared with the image obtained by capturing the entire component 80. Further, when the second image PC2 is an image obtained by capturing the specific areas SA1 to SA4, the image data transmitted from the component camera 14 which is the image pickup device CD1 to the control device 16 is compared with the image obtained by capturing the entire component 80. Data capacity is reduced.

The storage unit 74 can sequentially store the position of the predetermined part PP1 each time the position of the predetermined part PP1 (direction check mark 81) is acquired by the second acquisition unit 72. Further, when the positions of the predetermined parts PP1 for the predetermined number of parts 80 are accumulated, the storage unit 74 may store the positions of the predetermined number of the predetermined parts PP1 at one time or in a plurality of times. can. In this case, the control device 16 may include, for example, a ring buffer that can temporarily store a plurality of data. Further, in order to reduce the load on the central processing unit 161 shown in FIG. 1, the control device 16 may be provided with, for example, a DMA (Direct Memory Access) controller or the like. The storage unit 74 stores the component 80 in the storage device 162 (second non-volatile storage device 162c) together with the unique information that can identify the component 80, the acquisition date, the acquisition time, the version information of the control program, and the like. Suitable.

2. 2. Deformation form 2-1. First deformation form The predetermined portion PP1 may be an identification code 83 indicating unique information of the component 80. It is preferable that the unique information includes, for example, a part type, a part name, a model, a manufacturer name, a production lot, and the like. Further, the identification code 83 may be a one-dimensional code or a two-dimensional code. FIG. 9 schematically shows a state in which the identification code 83 of the two-dimensional code is attached to the central portion of the component 80. Also in this case, similarly to the embodiment, the first acquisition unit 71 acquires the holding posture of the component 80 in the holding member 30 based on the first image PC1. Further, the second acquisition unit 72 sets a specific region SA1 in which the predetermined region PP1 is expected to exist based on the holding posture of the component 80 acquired by the first acquisition unit 71, and positions the predetermined region PP1. To get.

As shown in the figure, the identification code 83 is attached to the central portion of the component 80, and the second acquisition unit 72 can set one specific area SA1. Therefore, the second acquisition unit 72 can determine the presence or absence of the predetermined portion PP1 based on the second image PC2 that has captured the specific region SA1. Further, the second acquisition unit 72 can set the specific region SA1 to the region of interest IA1 with respect to the component camera 14, and can image the specific region SA1 using the component camera 14.

Specifically, the second acquisition unit 72 moves the component mounting head 20 shown in FIG. 3 to align the imaging field of view of the component camera 14 with the specific region SA1 shown in FIG. Then, the second acquisition unit 72 outputs an image pickup start signal to the image pickup element 141 and the first light source 143a. When the image pickup start signal is output, the first light source 143a irradiates the identification code 83 with light for a predetermined exposure time. Then, the image pickup device 141 takes an image of the specific region SA1. The second acquisition unit 72 acquires the position of the identification code 83, which is the predetermined portion PP1, when the unique information of the component 80 can be read. The second acquisition unit 72 can also extract the specific region SA1 from the second image PC2 in which at least a part of the component 80 is imaged, and determine the presence or absence of the predetermined portion PP1.

2-2. The second modified form component recognition device 70 can also be applied to the component mounting machine 10 in which a plurality of holding members 30 are detachably provided on the component mounting head 20. As the component mounting head 20, for example, a rotary head in which a plurality of holding members 30 are provided in an annular shape can be used. Further, as the component mounting head 20, for example, a line head in which a plurality of holding members 30 are provided in a straight line can be used. In either case, it is preferable that the first acquisition unit 71 simultaneously captures a plurality of parts 80 held by the plurality of holding members 30 to acquire the first image PC1.

FIG. 10 shows an example of a first image PC1 in which a plurality of (12 in the figure) parts 80 held by a plurality of (12 in the figure) holding members 30 are simultaneously imaged. In this case, the component mounting head 20 is a rotary head in which a plurality of (12) holding members 30 are provided in an annular shape. Further, the plurality (12 pieces) of the parts 80 are smaller than the parts 80 of the embodiment and the first modified form, and the first image PC 1 is the imaging field of view (for example, the unit described above) of the component camera 14. It can be imaged in the area (corresponding to the area indicated by the image PU1). Further, at least one component 80 (one component 80 in the figure) among the plurality (12) components 80 includes a recess 84 which is a predetermined portion PP1. The recess 84 is a portion where a part of the component 80 is depressed, and is arranged so as to be recognizable by specular reflection, like the direction check mark 81 described above.

The first acquisition unit 71 can acquire the first image PC1 by one imaging without synthesizing a plurality of (for example, four) unit images PU1 to PU4. Also in this case, similarly to the embodiment, the first acquisition unit 71 is the component 80 held by the holding member 30 (the component 80 including the recess 84 which is the predetermined portion PP1) based on the first image PC1. Acquire the holding posture. Further, the second acquisition unit 72 sets a specific region SA1 in which the predetermined region PP1 is expected to exist based on the holding posture of the component 80 acquired by the first acquisition unit 71, and positions the predetermined region PP1. To get.

Further, the second acquisition unit 72 can determine the existence or nonexistence of the predetermined portion PP1 based on the second image PC2 in which the specific region SA1 is imaged. Further, the second acquisition unit 72 can set the specific region SA1 to the region of interest IA1 with respect to the component camera 14, and can image the specific region SA1 using the component camera 14. The second acquisition unit 72 can also extract the specific region SA1 from the second image PC2 in which at least a part of the component 80 is imaged, and determine the presence or absence of the predetermined portion PP1.

2-3. In the other embodiment and the first modification, the first acquisition unit 71 acquires the first image PC1 by synthesizing a plurality (four) unit images PU1 to PU4 having different imaging regions. However, the number of unit images is not limited. When the number of unit images increases, a unit image in which a specific area is not set occurs. In this case, the second acquisition unit 72 may determine the presence or absence of the predetermined portion PP1 based on the second image PC2 that images the specific region. As a result, the second acquisition unit 72 takes an image when acquiring the second image PC2 as compared with the case where the area corresponding to all the unit images is imaged and the second image PC2 is acquired to extract the specific area SA1. The number of times can be reduced.

3. 3. Parts recognition method The same applies to the parts recognition method described above for the parts recognition device 70. Specifically, the component recognition method includes a first acquisition step and a second acquisition step. In the first acquisition step, the holding posture of the component 80 in the holding member 30 is acquired based on the first image PC1 in which the component 80 held by the holding member 30 is imaged and captured. In the second acquisition step, after the holding posture of the component 80 is acquired, at least a part of the component 80 is imaged and the position of the predetermined portion PP1 of the component 80 is acquired based on the imaged second image PC2. In the second acquisition step, based on the holding posture of the component 80 acquired in the first acquisition step, specific regions SA1 to SA4 in which the predetermined portion PP1 is expected to exist are set and the position of the predetermined portion PP1 is acquired. do. Further, it is preferable that the component recognition method includes at least one of a correction step and a storage step. The correction step corresponds to the control performed by the correction unit 73. The storage step corresponds to the control performed by the storage unit 74.

4. An example of the effect of the embodiment According to the component recognition device 70, the first acquisition unit 71 and the second acquisition unit 72 are provided. In particular, the second acquisition unit 72 sets specific regions SA1 to SA4 in which the predetermined region PP1 is expected to exist based on the holding posture of the component 80 acquired by the first acquisition unit 71, and sets the predetermined region PP1. Get the position of. As a result, the component recognition device 70 can acquire the position of the predetermined portion PP1 of the component 80 held by the holding member 30. The above-mentioned matters regarding the component recognition device 70 can be applied to the component recognition method as well.

10: Parts mounting machine, 162: Storage device,
20: Parts mounting head, 30: Holding member,
70: Parts recognition device,
71: First acquisition department, 72: Second acquisition department,
73: Correction unit, 74: Storage unit,
80: Parts, 81: Direction check mark, 83: Identification code,
90: Substrate,
CD1: Imaging device, IA1-IA4: Region of interest,
PC1: 1st image, PC2: 2nd image, PP1: Predetermined part,
PU1 to PU4: unit image, SA1 to SA4: specific area,
P2: mounting position, θ1: mounting angle.

Claims (11)

A first acquisition unit that acquires the holding posture of the component in the holding member based on the first image captured by imaging the component held by the holding member.
A second acquisition unit that acquires the position of a predetermined portion of the component based on a second image obtained by imaging at least a part of the component after the holding posture of the component is acquired.
Equipped with
The second acquisition unit sets a plurality of specific areas in which the predetermined portion is expected to exist based on the holding posture of the component acquired by the first acquisition unit, and the plurality of specific areas . When the presence or absence of the predetermined portion is determined to acquire the position of the predetermined portion and it is determined that there is a possibility of erroneous recognition in the determination of the presence or absence of the predetermined portion, when the second image is imaged. A component recognition device that redetermines the existence or nonexistence of the predetermined portion by changing the imaging conditions or the image processing method of the second image . The component recognition device according to claim 1, wherein the second acquisition unit determines the presence or absence of the predetermined portion based on the second image obtained by imaging the specific region. The component recognition device according to claim 2, wherein the second acquisition unit causes the image pickup device to set the specific area as an area of interest, and uses the image pickup device to image the specific area. The component recognition device according to claim 1, wherein the second acquisition unit extracts the specific area from the second image and determines the presence or absence of the predetermined portion. The first acquisition unit is any one of claims 1 to 4, wherein a plurality of unit images, which are images obtained by capturing a part of the component and have different imaging regions, are combined to acquire the first image. The component recognition device described in. It is applied to a component mounting machine in which a plurality of the holding members are detachably provided on the component mounting head.
The component recognition according to any one of claims 1 to 4, wherein the first acquisition unit simultaneously images a plurality of the components held by the plurality of holding members to acquire the first image. Device. Claim 1 is provided with a correction unit that corrects at least one of the mounting position and mounting angle of the component when the component is mounted on a substrate based on the position of the predetermined portion acquired by the second acquisition section. The component recognition device according to any one of claims 6. The component recognition device according to any one of claims 1 to 7, further comprising a storage unit that stores the position of the predetermined portion acquired by the second acquisition unit in a storage device. The component recognition device according to any one of claims 1 to 8, wherein the predetermined portion is a direction check mark capable of determining whether or not the mounting direction of the component is correct when the component is mounted on a substrate. The component recognition device according to any one of claims 1 to 8, wherein the predetermined portion is an identification code indicating unique information of the component. The first acquisition step of acquiring the holding posture of the component in the holding member based on the first image captured by imaging the component held by the holding member.
A second acquisition step of acquiring the position of a predetermined portion of the component based on a second image taken by imaging at least a part of the component after the holding posture of the component is acquired.
Equipped with
In the second acquisition step, a plurality of specific regions in which the predetermined portion is expected to exist are set based on the holding posture of the component acquired by the first acquisition step, and the plurality of specific regions are set . When the presence or absence of the predetermined portion is determined, the position of the predetermined portion is acquired , and it is determined that there is a possibility of erroneous recognition in the determination of the presence or absence of the predetermined portion, the second image is imaged. A component recognition method for redetermining the existence or nonexistence of the predetermined portion by changing the imaging conditions or the method of image processing of the second image .

Images