CN102307430A - Circuit board with realization of electric connection between right side and reverse side through binding post and welding method thereof - Google Patents

Circuit board with realization of electric connection between right side and reverse side through binding post and welding method thereof Download PDF

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Publication number
CN102307430A
CN102307430A CN201110247314A CN201110247314A CN102307430A CN 102307430 A CN102307430 A CN 102307430A CN 201110247314 A CN201110247314 A CN 201110247314A CN 201110247314 A CN201110247314 A CN 201110247314A CN 102307430 A CN102307430 A CN 102307430A
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CN
China
Prior art keywords
circuit board
binding post
scolder
connecting hole
flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110247314A
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Chinese (zh)
Inventor
吴华夏
江祝苗
任振国
张丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui East China Institute of Optoelectronic Technology
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Anhui East China Institute of Optoelectronic Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui East China Institute of Optoelectronic Technology filed Critical Anhui East China Institute of Optoelectronic Technology
Priority to CN201110247314A priority Critical patent/CN102307430A/en
Publication of CN102307430A publication Critical patent/CN102307430A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a circuit board with realization of electric connection between a right side and a reverse side through a binding post and a welding method thereof. A connection hole (5) that is used for placing a binding post (3) is arranged on a circuit board (1); the binding post (3) passes through the connection hole (5) and is in brazing connection with metallization portions (2) through solders (4), wherein the metallization portions (2) are at two sides of the circuit board (1) and are also at a circumferential position of the connection hole (5); the binding post (3) comprises a big end (3a) with a large size and a small end (3b) with a small size; the stepped binding post (3) is formed by the big end (3a) and the small end (3b); and the solders (4) are between the big end (3a) and the metallization portions (2) at one side of the circuit board (1). According to the circuit board provided in the invention, a binding post is heated at one side of the circuit board; solders are melted and flow; and then, the melted solders flow to the other side of the circuit board by the effect of a capillary tube; therefore, brazing connection between the right side and the reverse side of the circuit board can be completed only by one-time brazing.

Description

A kind of circuit board and welding method thereof through being electrically connected between the binding post positive and negative
Technical field
The present invention relates to a kind of making field of circuit board, especially relate to a kind of circuit board and welding method thereof through being electrically connected between the binding post realization positive and negative.
Background technology
Along with electronic device and equipment constantly advance towards the direction of miniaturization, requiring has conductive channel between the tow sides of printed circuit board (PCB).Form through connecting hole and binding post soldering after metallizing by passing circuit board at the passage that is electrically connected between the circuit board tow sides, or be electrically connected by striding across the double-edged connector of circuit board.
Being metallized in hole on the circuit board is very time-consuming technology, earlier from one side soldering binding post again from other one side again soldering primary connection terminal will make efficient very low uneconomical again, yet these two steps soldering processes can not dispense again.It is only feasible in the marginal portion of circuit board to utilize connector to connect, but a large amount of tie points can not all be arranged in the marginal portion of circuit board, has therefore limited the use of circuit board.
Summary of the invention
Technical problem to be solved by this invention is to the problem that exists in the prior art a kind of circuit board and welding method thereof through being electrically connected between the binding post positive and negative to be provided; Its objective is just can accomplish binding post is connected with the tow sides soldering of circuit board through a soldering; Technology is simple, and efficient is high.
Technical scheme of the present invention is the circuit board of this kind through being electrically connected between the binding post positive and negative; Circuit board is provided with the connecting hole of placing binding post; Binding post passes connecting hole, and is connected through the scolder soldering with circuit board both sides and the metalized portion that is positioned at connecting hole circumference place.
Described binding post comprises larger-size big end and the less small end of size, and big end and small end are formed step-like binding post, and scolder is between the metalized portion of big end and circuit board one side.
Described scolder is the annular cup that has at the bottom of the no cup of flange flange, and flange flange is positioned on the metalized portion.
Described binding post passes the centre bore of scolder.
After the scolder heat fused, scolder is filled connecting hole, forms semi-moon shaped solder sphere in the both sides of circuit board.
A kind of welding method that is used to make the foregoing circuit plate comprises:
1) scolder is made into annular cup at the bottom of the no cup that has flange flange, the flange flange of scolder is placed on the metalized portion that circuit board need connect down;
2) with the small end of binding post down, push down the top of scolder and pass the connecting hole on the circuit board;
3) the big end of heating splicing ear, scolder begins fusing, because action of gravity, binding post moves down, scolder is filled in the space between connecting hole and the small end;
4) after heat welded is accomplished, form semi-moon shaped solder sphere, thereby accomplish the electrical connection between the circuit board tow sides in the both sides of circuit board.
Described solder fusing metapedes is to fill up the space between connecting hole and the small end.
Having a kind of of said structure has the following advantages through circuit board and the welding method thereof that is electrically connected between the binding post positive and negative:
1. this kind heats binding post through the circuit board that is electrically connected between the binding post positive and negative through the side at circuit board; Solder fusing and trickling; Pass through capillarity; Scolder trickles to an other side of circuit board, so just can accomplish through a soldering binding post is connected with the tow sides soldering of circuit board.
2. this kind is simple through the circuit board technology that is electrically connected between the binding post positive and negative; Preprepared scolder melts through the end heating of giving binding post; Upper surface at circuit board forms half-moon-shaped solder ball; The process metalized is partly soaked into and is trickled and just accomplished whole technical process to other one side of circuit board on solder ball and the circuit board, and cost is low, efficient is high.
Description of drawings
Below in conjunction with accompanying drawing the present invention is described further:
Fig. 1 is a structural representation of the present invention.
Fig. 2 is the structural representation after the scolder heating and melting of the present invention.
In Fig. 1-2,1: circuit board; 2: metalized portion; 3: binding post; 3a: big end; 3b: small end; 4: scolder; 4a, 4b: solder sphere; 5: connecting hole.
Embodiment
Combine and to know by structure shown in Fig. 1-2; The circuit board of the present invention through being electrically connected between the binding post positive and negative; Circuit board 1 is provided with the connecting hole 5 of placing binding post 3; Binding post 3 passes connecting hole 5, and is connected through scolder 4 solderings with circuit board 1 both sides and the metalized portion 2 that is positioned at connecting hole 5 circumference places; Binding post 3 comprises larger-size big end 3a and the less small end 3b of size, holds 3a and small end 3b to form step-like binding post 3 greatly, and scolder 4 is between the metalized portion 2 of big end 3a and circuit board 1 one sides.Scolder 4 annular cup at the bottom of for the no cup that has flange flange, flange flange is positioned on the metalized portion 2, and binding post 3 passes the centre bore of scolder 4.
After scolder 4 heat fused, scolder 4 is filled connecting hole 5, forms semi-moon shaped solder sphere 4a, 4b in the both sides of circuit board 1.
Concrete welding method is: welding method comprises:
1) scolder 4 is made into annular cup at the bottom of the no cup that has flange flange, the flange flange of scolder 4 is placed on the metalized portion 2a that circuit board 1 needs to connect down;
2) with the small end 3b of binding post 3 down, push down the top of scolder 4 and pass the connecting hole 5 on the circuit board 1;
3) the big end 3a of heating splicing ear 3, scolder 4 begins fusing, because action of gravity, binding post 3 moves down, scolder 4 is filled in the space between connecting hole 5 and the small end 3b;
4) after heat welded is accomplished, form semi-moon shaped solder sphere 4a, 4b, thereby accomplish the electrical connection between circuit board 1 tow sides in the both sides of circuit board 1.
Scolder 4 fusing metapedes are to fill up the space between connecting hole 5 and the small end 3b.
On printed circuit board (PCB), open the connecting hole 5 that some place binding post 3 and brazing solder 4, binding post 3 passes these connecting holes 5, and is connected with metalized portion 2 solderings on circuit board 1 both sides, accomplishes the electrical connection between circuit board 1 tow sides.Through side heating binding post 3 at circuit board 1, scolder 4 fusings and trickling, through capillarity, scolder 4 trickles to an other side of circuit board 1, so just can accomplish through a soldering binding post 3 is connected with the tow sides soldering of circuit board 1.
Major advantage of the present invention is exactly that technology is simple; Preprepared scolder melts through the end heating of giving binding post 3; Upper surface at circuit board 1 forms half-moon- shaped solder ball 4a, 4b; The process metalized is partly soaked into and is trickled and just accomplished whole technical process to other one side of circuit board on solder ball 4a, 4b and the circuit board 1, and cost is low, efficient is high.
Scolder 4 among the present invention adopts solder sheet to make, and solder sheet is processed into the cup shell at the bottom of the no cup of flanged flange, and is porose on the cup shell central shaft.The size of solder sheet is pre-designed, makes it can fill up circuit, the solder apertures on 1, accomplish the electrical connection of binding post after, semi-moon shaped solder ball 4a, the 4b that has enough scolders to form at the upper surface of circuit board 1 still.

Claims (7)

1. circuit board through being electrically connected between the binding post positive and negative; It is characterized in that: circuit board (1) is provided with the connecting hole (5) of placing binding post (3); Binding post (3) passes connecting hole (5), and is connected through scolder (4) soldering with circuit board (1) both sides and the metalized portion (2) that is positioned at connecting hole (5) circumference place.
2. a kind of circuit board according to claim 1 through being electrically connected between the binding post positive and negative; It is characterized in that: described binding post (3) comprises larger-size big end (3a) and the less small end (3b) of size; Big end (3a) and small end (3b) are formed step-like binding post (3), and scolder (4) is positioned between the metalized portion (2) of big end (3a) and circuit board (1) one side.
3. a kind of circuit board through being electrically connected between the binding post positive and negative according to claim 1 and 2 is characterized in that: described scolder (4) is for having the annular cup at the bottom of the no cup of flange flange, and flange flange is positioned on the metalized portion (2).
4. a kind of circuit board through being electrically connected between the binding post positive and negative according to claim 3 is characterized in that: described binding post (3) passes the centre bore of scolder (4).
5. a kind of circuit board through being electrically connected between the binding post positive and negative according to claim 4 is characterized in that: after scolder (4) heat fused, scolder (4) is filled connecting hole (5), forms semi-moon shaped solder sphere (4a, 4b) in the both sides of circuit board (1).
6. welding method that is used to make the described circuit board of each claim of claim 1-5, it is characterized in that: described welding method comprises:
1) scolder (4) is made into annular cup at the bottom of the no cup that has flange flange, the flange flange of scolder (4) is placed on the metalized portion (2a) that circuit board (1) needs to connect down;
2) with the small end (3b) of binding post (3) down, push down the top of scolder (4) and pass the connecting hole (5) on the circuit board (1);
3) the big end (3a) of heating splicing ear (3), scolder (4) begins fusing, because action of gravity, binding post (3) moves down, scolder (4) is filled in the space between connecting hole (5) and the small end (3b);
4) after heat welded is accomplished, form semi-moon shaped solder sphere (4a, 4b) in the both sides of circuit board (1), thereby accomplish the electrical connection between circuit board (1) tow sides.
7. welding method according to claim 6 is characterized in that: described scolder (4) fusing metapedes is to fill up the space between connecting hole (5) and the small end (3b).
CN201110247314A 2011-08-25 2011-08-25 Circuit board with realization of electric connection between right side and reverse side through binding post and welding method thereof Pending CN102307430A (en)

Priority Applications (1)

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CN201110247314A CN102307430A (en) 2011-08-25 2011-08-25 Circuit board with realization of electric connection between right side and reverse side through binding post and welding method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110247314A CN102307430A (en) 2011-08-25 2011-08-25 Circuit board with realization of electric connection between right side and reverse side through binding post and welding method thereof

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CN102307430A true CN102307430A (en) 2012-01-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103457067A (en) * 2012-06-01 2013-12-18 欣兴电子股份有限公司 Pin structure and electronic assembly with pin structures
CN110121922A (en) * 2016-12-28 2019-08-13 株式会社自动网络技术研究所 Circuit structure and electric circuit connection container

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017142A (en) * 1975-03-14 1977-04-12 E. I. Du Pont De Nemours And Company Self-staking circuit board pin contact
US6338632B1 (en) * 2000-07-05 2002-01-15 Hon Hai Precision Ind. Co., Ltd. Compliant, press fit electrical contact having improved retention
CN201893997U (en) * 2010-11-19 2011-07-06 上海光汇半导体照明有限公司 Welding structure for plug-in components of LED driver on circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017142A (en) * 1975-03-14 1977-04-12 E. I. Du Pont De Nemours And Company Self-staking circuit board pin contact
US6338632B1 (en) * 2000-07-05 2002-01-15 Hon Hai Precision Ind. Co., Ltd. Compliant, press fit electrical contact having improved retention
CN201893997U (en) * 2010-11-19 2011-07-06 上海光汇半导体照明有限公司 Welding structure for plug-in components of LED driver on circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103457067A (en) * 2012-06-01 2013-12-18 欣兴电子股份有限公司 Pin structure and electronic assembly with pin structures
CN110121922A (en) * 2016-12-28 2019-08-13 株式会社自动网络技术研究所 Circuit structure and electric circuit connection container
CN110121922B (en) * 2016-12-28 2022-02-11 株式会社自动网络技术研究所 Circuit structure and electrical junction box

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Application publication date: 20120104